CY22150
One-PLL General-Purpose Flash-Programmable
and I2C Programmable Clock Generator
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document #: 38-07104 Rev. *L Revised October 11, 2011
Features
■Integrated phase-locked loop (PLL)
■Commercial and industrial operation
■Flash programmable
■Field programmable
■Two-wire I2C interface
■Low skew, low jitter, high accuracy outputs
■3.3 V operation with 2.5 V output option
■16-pin TSSOP
Benefits
■Internal PLL to generate six outputs up to 200 MHz. Able to
generate custom frequencies from an external crystal or
a driven source.
■Performance guaranteed for applications that require an
extended temperature range.
■Nonvolatile reprogrammable technology allows easy custom-
ization, quick turnaround on design changes and product
performance enhancements, and better inve ntory control.
Parts can be reprogrammed up to 100 times, reducing
inventory of custom parts and providing an easy method for
upgrading existing designs.
■The CY22150 can be programmed at the package level.
In-house programming of samples and prototype quantities is
available using the CY3672 Development Kit. Production
quantities are available through Cypress’s value added distri-
bution partners or by using third party programmers from BP
Microsystems™, HiLo Systems™, and others.
■The CY22150 provides an industry standard interface for
volatile, system level customization of unique frequencies and
options. Serial programming and reprogramming allows quick
design changes and product enhan cements, eliminates
inventory of old design parts, and simplifies manufacturing.
■High performance suited for commercial, industrial,
networking, telecom, and other general purpose applications.
■Application compatibility in standard and low power systems.
■Industry standard packaging saves on board space.
Part Number Outputs Input Frequency Range Output Frequency Range Specifications
CY22150KFZXC 6 8 MHz to 30 MHz (external crystal)
1 MHz to 133 MHz (driven clock) 80 kHz to 200 MH z (3.3 V)
80 KHz to 166.6 MHz (2.5 V) Field programmable
Serially programmable
Commercial temperature
CY22150KFZXI 6 8 MHz to 30 MHz (external crystal)
1 MHz to 133 MHz (driven clock) 80 kHz to 166.6 MH z (3.3 V)
80 KHz to 150 MHz (2.5 V) Field programmable
Serially programmable
Industrial temperature
Logic Block Diagram
I2C
Control
VDDLAVDDVSS AVSS
SDAT
SCLK
VSSLVDD
XIN
XOUT
LCLK1
Divider
PLL
OSC. LCLK3
Q
P
VCO
Φ
LCLK2
LCKL4
CLK5
CLK6
Bank 1
Divider
Bank 2
Crosspoint
Switch
I2C
Interface
Matrix
CY22150
Document #: 38-07104 Rev. *L Page 2 of 18
Contents
Pin Configuration .............................................................3
Frequency Calculation and Register Definitions ...........4
Default Startup Condition for the CY22150 ....................5
Frequency Calculations and Register
Definitions using the I2C Interface .................................5
Reference Frequency ..................................................5
PLL Frequency, Q Counter [42H(6..0)] .......................6
PLL Frequency, P Counter [40H(1..0)],
[41H(7..0)], [42H(7) ................... ... ... .............. .. ............6
PLL Post Divider Options [0CH(7..0)], [47H(7..0)] .......7
Charge Pump Settings [40H(2..0)] ..............................7
Clock Output Settings: CLKSRC –
Clock Output Crosspoint Switch Matrix
[44H(7..0)], [45H(7..0)], [46H(7..6)] ................. ............8
Test, Reserved, and Blank Registers ..........................8
I2C Interface Timing .........................................................9
Data Valid ............................... ... .............. ... .............. ...9
Data Frame ....................... .. .............. ... .............. ... ......9
Acknowledge Pulse .....................................................9
Applications .................................................................... 11
Controlling Jitter ........................................................11
Absolute Maximum Conditions .....................................12
Recommended Operating Conditions ..........................12
DC Electrical Characteristics ................................ ........12
AC Electrical Characteristics ................................ ........13
Device Characteristics ...................................................13
Ordering Information ......................................................14
Possible Configurations ........... ............................. .. ...14
Ordering Code Definitions .........................................15
Package Diagram ............................................................15
Acronyms ........................................................................ 16
Document Conventions .................. ... ... .............. ... ........16
Units of Measure ............. .............. ... ... .............. ... .. ...16
Document History Page ........................ ... .............. ... .. ...17
Sales, Solutions, and Legal Information ......................18
Worldwide Sales and Design Support .......................18
Products .................................................................... 18
PSoC Solutions ...................................... .. ... ..............18
CY22150
Document #: 38-07104 Rev. *L Page 3 of 18
Pin Configuration
Figure 1. 16-Pin TSSOP
1
2
3
4
5
6
7
89
10
11
12
13
14
15
16
VSS
VSSL
SCLK
LCLK1
XIN XOUT
VDD
SDAT
AVSS
LCLK3
LCLK2
CLK6
CLK5
AVDD
VDDL
LCLK4
Table 1. Pin Definitions
Name Number Description
XIN 1 Reference Input. Driven by a crystal (8 MHz to 30 MHz) or external clock (1 MHz to 133 MHz).
Programmable input load capacitors allow for maximum flexibility in selecting a crystal,
regardless of manufacturer, pr ocess, performance, or quality
VDD 2 3.3 V Voltage Supply
AVDD 3 3.3 V Analog Voltage Supply
SDAT 4 I2C Serial Data Input
AVSS 5 Analog Ground
VSSL 6 LCLK Ground
LCLK1 7 Configurable Clock Output 1 at VDDL level (3.3 V or 2.5 V)
LCLK2 8 Configurable Clock Output 2 at VDDL level (3.3 V or 2.5 V)
LCLK3 9 Configurable Clock Output 3 at VDDL level (3.3 V or 2.5 V)
SCLK 10 I2C Serial Clock Output
VDDL 11 LCLK Voltage Supply (2.5 V or 3.3 V)
LCLK4 12 Configurable Clock Outp ut 4 at VDDL level (3.3 V or 2.5 V)
VSS 13 Ground
CLK5 14 Configurable Clock Output 5 (3.3 V)
CLK6 15 Configurable Clock Output 6 (3.3 V)
XOUT[1] 16 Reference Output
Note
1. Float XOUT if XIN is driven by an external clock source.
CY22150
Document #: 38-07104 Rev. *L Page 4 of 18
Frequency Calculation and Register Definitions
The CY22150 i s an extremely flexible clock g enerator with four
basic variables that are used to determine the final output
frequency. They are the input reference frequency (REF), the
internally calculated P and Q dividers, and the post divider, which
can be a fixed or calculated value. There are three formulas to
determine the final output frequency of a CY22150 based
design:
■CLK = ((REF * P)/Q)/Post Divider
■CLK = REF/Post Divider
■CLK = REF.
The basic PLL block diagram is shown in Figure 2. Each of the
six clock outputs on the CY22150 has a total of seven output
options available to it. There are six post divider options
available: /2 (two of these), /3, /4, /DIV1N and /DIV2N. DIV1N
and DIV2N are independently calculated and are applied to
individual output groups. The post divider options can be applied
to the calculated VCO frequency ((REF*P)/Q) or to the REF
directly.
In addition to the six post divider output options, the seventh
option bypasses the PLL and passes the REF directly to the
crosspoint switch matrix.
Figure 2. Basic Block Diagram of CY22150 PLL
(Q+2) VCO
(2(PB+4)+PO)
/2
/3
/2
LCLK1
LCLK2
LCLK3
LCLK4
CLK5
CLK6
CLKSRC
Crosspoint
Switch Matrix
[44H]
[44H]
[44H,45H]
[45H]
[45H,46H]
DIV2CLK
REF PFD
Divider Bank 1
[45H]
DIV1SRC [OCH]
/4
DIV2SRC [47H]
Divider Bank 2
DIV1N [OCH]
DIV2N [47H]
DIV1CLK
/DIV1N
1
0
1
0
[42H]
[40H], [41H ], [42H]
/DIV2N
Qtotal
Ptotal
CLKOE [09H]
CY22150
Document #: 38-07104 Rev. *L Page 5 of 18
Default Startup Condition for the CY22150
The default (programmed) condition of the device is generally set
by the distributor who programs the device using a customer
specific JEDEC file produced by CyClocksRT™. Parts shipped
from the factory are blank and unprogrammed. In this condition,
all bits are set to 0, all outputs are three -stated, and the crystal
oscillator circuit is active.
While you can develo p your own subroutine to program a ny or
all of the individual registers describe d in the following pages, it
may be easier to use CyClocksRT to produce the required
register setting file.
The serial interface address of the CY22150 is 69H. If there is a
conflict with any other devices in your system, then this can also
be changed using CyClocksRT.
Frequency Calculations and Register Defini-
tions usin g the I2C Interface
The CY22150 provides an industry standard serial interface for
volatile, in-system programming of unique frequencies and
options. Serial programming and reprogramming allows for quick
design changes and product enhancements, eliminates
inventory of old design parts, and simplifies manufacturing.
The I2C Interface provides volatile programming. This means
when the target system is powered down, the CY22150 reverts
to its pre-I2C state, as defined above (programmed or unpro-
grammed). When the system is powered back up again, the I2C
registers must be reconfigured again.
All programmable regi sters in the CY22150 are addressed with
eight bits and contain eight bits of data. The CY22150 is a slave
device with an address of 1101001 (69H).
Table 2 lists the I2C registers and their definitions. Specific
register definitions and their al lowable values are listed below.
Reference Frequency
The REF can be a crystal or a driven frequency. For crystals, the
frequency range must be between 8 MHz and 30 MHz. For a
driven frequency, the frequen cy range must be between 1 M Hz
and 133 MHz.
Using a Crystal as the Reference Input
The input crystal oscillator of the CY22150 is an important
feature because of the flexibili ty it allo ws the user in selecting a
crystal as a REF source. The input oscillator has programmable
gain, allowing maximum compatibility with a reference crystal,
regardless of manufacturer, process, performance, and quality.
Programmable Crystal Input Oscillator Gain Settin gs
The Input crystal oscillator gain (XDRV) is controlled by two bits
in register 12H and are set according to Table 3 on page 6. The
parameters controlling the gain are the crystal frequency, the
internal crystal parasitic resistance (ESR, available from the
manufacturer), and the CapLoad setti ng during crystal startup.
Bits 3 and 4 of register 12H control the input crystal oscillator gain
setting. Bit 4 is the MSB of the setting, and bit 3 is the LSB. The
setting is pr o grammed ac cording to Table 3 on page 6. All other
bits in the register are reserved and should be programmed as
shown in Table 4 on page 6.
Using an External Clock as the Reference Input
The CY22150 also accepts an external clock a s reference, wi th
speeds up to 133 MHz. With an external clock, the XDRV
(register 12H) bits must be set according to Table 5 on page 6.
Table 2. Summary Table – CY22150 Programmable Registers
Register Description D7 D6 D5 D4 D3 D2 D1 D0
09H CLKOE control 0 0 CLK6 CLK5 LCLK4 LCLK3 LCLK2 LCLK1
OCH DIV1SRC mux and
DIV1N divider DIV1SRC DIV1N(6) DIV1N(5) DIV1N(4) DIV1N(3) DIV1N(2) DIV1N(1) DIV1N(0)
12H Input crystal oscillator
drive control 0 0 1 XDRV(1) XDRV(0) 0 0 0
13H Input load capacitor
control CapLoad
(7) CapLoad
(6) CapLoad
(5) CapLoad
(4) CapLoad
(3) CapLoad
(2) CapLoad
(1) CapLoad
(0)
40H Charge pump and PB
counter 1 1 0 Pump(2) Pump(1) Pump(0) PB(9) PB(8)
41H PB(7) PB(6) PB(5) PB(4) PB(3) PB(2) PB(1) PB(0)
42H PO counter, Q counter PO Q(6) Q(5) Q(4) Q(3) Q(2) Q(1) Q(0)
44H Crosspoint switch
matrix control CLKSRC2
for LCLK1 CLKSRC1
for LCLK1 CLKSRC0
for LCLK1 CLKSRC2
for LCLK2 CLKSRC1
for LCLK2 CLKSRC0
for LCLK2 CLKSRC2
for LCLK3 CLKSRC1
for LCLK3
45H CLKSRC0
for LCLK3 CLKSRC2
for LCLK4 CLKSRC1
for LCLK4 CLKSRC0
for LCLK4 CLKSRC2
for CLK5 CLKSRC1
for CLK5 CLKSRC0
for CLK5 CLKSRC2
for CLK6
46H CLKSRC1
for CLK6 CLKSRC0
for CLK6 111111
47H DIV2SRC mux and
DIV2N divider DIV2SRC DIV2N(6) DIV2N(5) DIV2N(4) DIV2N(3) DIV2N(2) DIV2N(1) DIV2N(0)
CY22150
Document #: 38-07104 Rev. *L Page 6 of 18
Input Load Capacitors
Input load capacitors allo w the user to set the load capacitance
of the CY22150 to match the input load capacitance from a
crystal. The value of the input load capacitors is determined by
8 bits in a programmable register [13H]. Total load capacitance
is determined by th e formula:
CapLoad = (CL– CBRD – CCHIP)/0.09375 pF
where:
■CL = specified load capacitance of your crystal.
■CBRD = the total board capacitance, due to external capacitors
and board trace capacitance. In CyClocksRT, this value
defaults to 2 pF.
■CCHIP = 6 pF.
■0.09375 pF = the step resolution availabl e due to the 8-bit
register.
In CyclocksRT, only the crystal capacitance (CL) is specified.
CCHIP is set to 6 pF and CBRD defaults to 2 pF. If your board
capacitance is higher or lower than 2 pF , the formula given earlier
is used to calculate a new CapLoad value and programmed into
register 13H.
In CyClocksRT, enter the crystal capacitance (CL). The value of
CapLoad is determined automatically an d programmed into the
CY22150. Through th e SDAT and SCLK pins, the value can be
adjusted up or down if your board capacitance is greater or less
than 2 pF. For an extern al clock sou rce, CapLoad defa ults to 0.
See Table 6 on page 7 for CapLoad bit locations and values.
The input load capacitors are placed on the CY22150 die to
reduce external component cost. These capacitors are true
parallel-plate capacitors, designed to reduce the frequency shift
that occurs when nonlinear load capacitance is affected by load,
bias, supply, and temperature changes.
PLL Frequency, Q Counter [42H(6..0)]
The first counter is known as the Q counter. The Q counter
divides REF by its calculated value. Q is a 7 bit divider with a
maximum value of 127 and minimum value of 0. The primary
value of Q is determined by 7 bits in register 42H (6..0), but 2 is
added to this register value to achieve the total Q, or Qtotal. Qtotal
is defined by the formula:
Qtotal = Q + 2
The minimum value of Qtotal is 2. T he maximum va lue of Qtotal is
129. Register 42H is defined in the table.
Stable operation of the CY22150 cannot be guaranteed if
REF/Qtotal falls below 250 kHz. Qtotal bit locations and values are
defined in Table 7 on page 7.
PLL Frequency, P Counter [40H(1..0)], [41H(7..0)],
[42H(7)
The next counter definition is the P (product) counter. The P
counter is multiplied with the (REF/Qtotal) value to achieve the
VCO frequency. The product coun ter, defined as Ptotal, is made
up of two internal variables, PB and PO. The formula for calcu-
lating Ptotal is:
Ptotal = (2(PB + 4) + PO)
PB is a 10-bit variable, defined by registers 40H(1:0) and
41H(7:0). The 2 LSBs of register 40H are the two MSBs of
variable PB. Bits 4..2 of register 4 0H are used to dete rmine the
charge pump settings. The 3 MSBs of register 40H are preset
and reserved and cannot be changed. PO is a single bit variable,
defined in register 42H(7). This allows for odd numbers in Ptotal.
The remaining seven bits of 42H are used to define the Q
counter, as shown in Table 7.
The minimum value of Ptotal is 8. The maximum value of Ptotal is
2055. To achieve the minimum value of Ptotal, PB and PO should
both be programmed to 0. To achieve the maximum value of
Ptotal, PB should be programmed to 1023, and PO should be
programmed to 1.
Table 3. Programmable Crystal Input Oscillator Gain Setting s
Cap Register Settings 00H – 80H 80H – C0H C0H – FFH
Effective Load Ca pacit an ce
(CapLoad) 6 pF to 12 pF 12 pF to 18 pF 18 pF to 30 pF
Crystal ESR 30Ω60Ω30Ω60Ω30Ω60Ω
Crystal Input
Frequency 8 to 15 MHz 0001011001 10
15 to 20 MHz 011001101010
20 to 25 MHz 011010101011
25 to 30 MHz 10 10 10 11 11 N/A
Table 4. Cryst al Os ci llato r Gain Bit Locati ons and Values
Address D7 D6 D5 D4 D3 D2 D1 D0
12H001XDRV(1)XDRV(0)000
Table 5. Programmable External Reference Input Oscillator Drive Settings
Reference Frequency 1 to 25 MHz 25 to 50 MHz 50 to 90 MHz 90 to 133 MHz
Drive Setting 00 01 10 11
CY22150
Document #: 38-07104 Rev. *L Page 7 of 18
Stable operation of the CY22150 cannot be guaranteed if the
value of (Ptotal*(REF/Qtotal)) is above 400 MHz or below
100 MHz.
PLL Post Divider Opti o ns [0C H(7 .. 0) ], [4 7H (7 ..0 ) ]
The output of the VCO is routed through two independent
muxes, then to two divider banks to determine the final clock
output frequency . The mux determines if the clock signal feeding
into the divider banks i s the calculated VCO frequency or REF.
There are two select muxes (DIV1SRC and DIV2SRC ) and two
divider banks (Divider Bank 1 and Divider Bank 2) used to
determine this clock signal. The clock signal passing through
DIV1SRC and DIV2SRC is referred to as DIV1CLK and
DIV2CLK, respectively.
The divider banks have four unique divider options available: /2,
/3, /4, and /DIVxN. DIVxN is a variable that can be independently
programmed (DIV1N and DIV2N) for each of the two divider
banks. The minimum value of DIVxN i s 4. The maximum value
of DIVxN is 127. A value of DIVxN below 4 is not guaranteed to
work proper l y.
DIV1SRC is a single bit variable, controlled by register 0CH. The
remaining seven bits of register 0CH determine the value of post
divider DIV1N.
DIV2SRC is a single bit variable, controlled by register 47H. The
remaining seven bits of register 47H determine the value of post
divider DIV2N.
Register 0CH and 47H are defined in Table 8.
Charge Pump Settings [40H(2..0)]
The correct pump setting is important for PLL stability. Charge
pump settings are controlled by bits (4..2) of register 40H, and
are dependent on internal variable PB (see “PL L Frequency, P
Counter[40H(1..0)], [41H(7..0)], [42H(7)]”). Table 9 on page 7
summarizes the proper charge pump settings, based on Ptotal.
See T able 10 on page 7 for register 40H bit locations and values.
Although using the above table guarantees s tability, it is recommended to use the Print Preview function in CyClocksRT to determine
the correct charge pump settings for optimal jitter performance.
PLL stability cannot be guaranteed for values below 16 and above 1023. If values above 1023 are needed, use CyClocksRT to
determine the best charge pump setting.
Table 6. Input Load Capacitor Register Bit Settings
Address D7 D6 D5 D4 D3 D2 D1 D0
13H CapLoad(7) CapLoad(6) CapLoad(5) CapLoad(4) CapLoad(3) CapLoad(2) CapLoad(1) CapLoad(0)
Table 7. P Counter and Q Counter Register Definition
Address D7 D6 D5 D4 D3 D2 D1 D0
40H 1 1 0 Pump(2) Pump(1) Pump(0) PB(9) PB(8)
41H PB(7) PB(6) PB(5) PB(4) PB(3) PB(2) PB(1) PB(0)
42H PO Q(6) Q(5) Q(4) Q(3) Q(2) Q(1) Q(0)
Table 8. PLL Post Divider Options
Address D7 D6 D5 D4 D3 D2 D1 D0
0CH DIV1SRC DIV1N(6) DIV1N(5) DIV1N(4) DIV1N(3) DIV1N(2) DIV1N(1) DIV1N(0)
47H DIV2SRC DIV2N(6) DIV2N(5) DIV2N(4) DIV2N(3) DIV2N(2) DIV2N(1) DIV2N(0)
Table 9. Charge Pump Settings
Charge Pump Setting – Pump(2..0) Calculated Ptotal
000 16 – 44
001 45 – 479
010 480 – 639
011 640 – 799
100 800 – 1023
101, 110, 111 Do not use – device will be unstable
Table 10. Register 40H Change Pump Bit Settings
Address D7 D6 D5 D4 D3 D2 D1 D0
40H 1 1 0 Pump(2) Pump(1) Pump(0) PB(9) PB(8)
CY22150
Document #: 38-07104 Rev. *L Page 8 of 18
Clock Output Settings: CLKSRC – Clock Output
Crosspoint Switch Matrix [44H(7..0)], [4 5H(7..0)],
[46H(7..6)]
Every clock output can be defined to come from one of seven
unique frequency sources. The CLKSRC(2..0) crosspoint switch
matrix defines which source is attached to each individual clock
output. CLKSRC(2..0) is set in Registers 44H, 45H, and 46H.
The remainder of register 46H(5:0) must be written with the
values stated in the register table when writing register values
46H(7:6).
When DIV1N is divisible by four, then CLKSRC(0,1,0) is
guaranteed to be rising edge phase-aligned with
CLKSRC(0,0,1). When DIV1N is six, then CLKSRC(0,1,1) is
guaranteed to be rising edge phase-aligned with
CLKSRC(0,0,1).
When DIV2N is divisible by four, then CLKSRC(1,0,1) is
guaranteed to be rising edge phase-aligned with
CLKSRC(1,0,0). When DIV2N is divisible by eight, then
CLKSRC(1,1,0) is guaranteed to be rising edge phase-aligned
with CLKSRC(1,0,0).
CLKOE – Clock Ou t put Enab le Control [09H(5..0)]
Each clock output has its own output enable, controlled by
register 09H(5..0). To enable an output, set the corresponding
CLKOE bit to 1. CLKOE settings a re in Table 13 on page 8.
The output swing of LCLK1 through LC LK4 is set by VDDL. The
output swing of CLK5 and CLK6 is set by VDD.
Test, Reserved, and Blank Registers
Writing to any of the following registers causes the part to exhibit
abnormal behavior, as follows.
[00H to 08H] – Reserved
[0AH to 0BH] – Reserved
[0DH to 11H] – Reserved
[14H to 3FH] – Reserved
[43H] – Reserved
[48H to FFH] – Reserved.
Table 11. Clock Output Setting
CLKSRC2 CLKSRC1 CLKSRC0 Definition and Notes
0 0 0 Reference input.
0 0 1 DIV1CLK/DIV1N. DIV1N is defined by register [OCH]. Allowable values for DIV1N are 4
to 127. If Divider Bank 1 is not being used, set DIV1N to 8.
0 1 0 DIV1CLK/2. Fixed /2 divider option. If this option is used, DIV1N must be divisibl e by 4.
0 1 1 DIV1CLK/3. Fixed /3 divider option. If this option is used, set DIV1N to 6.
1 0 0 DIV2CLK/DIV2N. DIV2N is defined by Register [47H]. Allowable values for DIV2N are 4
to 127. If Divider Bank 2 is not being used, set DIV2N to 8.
1 0 1 DIV2CLK/2. Fixed /2 divider option. If this option is used, DIV2N must be divisibl e by 4.
1 1 0 DIV2CLK/4. Fixed /4 divider option. If this option is used, DIV2N must be divisibl e by 8.
1 1 1 Reserved – do not use.
Table 12. Clock Output Register Setting
Address D7 D6 D5 D4 D3 D2 D1 D0
44H CLKSRC2 for
LCLK1 CLKSRC1 for
LCLK1 CLKSRC0 for
LCLK1 CLKSRC2 for
LCLK2 CLKSRC1 for
LCLK2 CLKSRC0 for
LCLK2 CLKSRC2 for
LCLK3 CLKSRC1 for
LCLK3
45H CLKSRC0 for
LCLK3 CLKSRC2 for
LCLK4 CLKSRC1 for
LCLK4 CLKSRC0 for
LCLK4 CLKSRC2 for
CLK5 CLKSRC1 for
CLK5 CLKSRC0 for
CLK5 CLKSRC2 for
CLK6
46H CLKSRC1 for
CLK6 CLKSRC0 for
CLK6 111111
Table 13. CLKOE Bit Setting
Address D7 D6 D5 D4 D3 D2 D1 D0
09H 0 0 CLK6 CLK5 LCLK4 LCLK3 LCLK2 LCLK1
CY22150
Document #: 38-07104 Rev. *L Page 9 of 18
I2C Interface Timing
The CY22150 uses a two-wire I2C-in terface that operates up to
400 kbits/second in Read or Write mode. The basic Write serial
format is as follows.
Start Bit; seven-bit Device Address (DA); R/W Bit; Slave Clock
Acknowledge (ACK); eight-bit Memory Address (MA); ACK;
eight-bit data; ACK; eight-bit data in MA + 1 if desired; ACK;
eight-bit data in MA+2; ACK; and so on until ST OP bit.The basic
serial format is illustrated in Figure 4 on page 9.
Data Valid
Data is valid when the Clock is HIGH, and may only be transi-
tioned when the clock is LOW, as illustrated in Figure 3.
Data Frame
Every new data frame is indicated by a start and stop sequence,
as illustrated in Figure 5 on page 10.
Start Sequence – Start frame is indicated by SDAT goi ng LOW
when SCLK is HIGH. Every time a S tart signal is given, the next
eight-bit data must be the device address (seven bits) and a R/W
bit, followed by register address (eight bits) and register data
(eight bits).
Stop Sequence – Stop frame is indicated by SDAT going HIGH
when SCLK is HIGH. A Stop frame frees the bus for writing to
another part on the same bus or writing to another random
register address.
Acknowledge Pulse
During Write mode, the CY22150 responds with an ACK pulse
after every eight bits. This is accomplished by pulling the SDAT
line LOW during the N*9th clock cycle, as illustrated in Figure 6
on page 10. (N = the number of eight-bit segments transmitted.)
During Read mode, the ACK pulse after the data packet is sent
is generated by the master
.
Figure 3. Data Valid and Data Transition Periods
SDAT
SCLK
Data valid Transition to next bit
CLKLOW
CLKHIGH
VIH
VIL
tSU
tDH
Figure 4. Data Frame Architecture
CY22150
Document #: 38-07104 Rev. *L Page 10 of 18
Figure 5. Start and Stop Frame
Figure 6. Frame Format (Device Address, R/W, Register Address, Register Data
SDAT
SCLK
START Transition
to next bit STOP
SDAT
SCLK
DA6 DA5DA0 R/W ACK RA7 RA6RA1 RA0 ACK STOP
START ACK D7 D6 D1 D0
+++
+++
Parameter Description Min Max Unit
fSCLK Frequency of SCLK – 400 kHz
Start mode time from SDA LOW to SCL LOW 0.6 – μs
CLKLOW SCLK LOW period 1.3 – μs
CLKHIGH SCLK HIGH period 0.6 – μs
tSU Data transition to SCLK HIGH 100 – ns
tDH Data hold (SCLK LOW to data transition) 100 – ns
Rise time of SCLK and SDAT – 300 ns
Fall time of SCLK and SDAT – 300 ns
Stop mode time from SCLK HIGH to SDAT HIGH 0.6 – μs
Stop mode to Start mode 1.3 – μs
CY22150
Document #: 38-07104 Rev. *L Page 11 of 18
Applications
Controlling Jitter
Jitter is defined in many ways including: phase n oise, long term
jitter, cycle to cycle jitter, period jitter, absolute jitter, and deter-
ministic. These jitter terms are usually given in terms of rms,
peak to peak, or in the case of phase noise dBC/Hz with respect
to the fundamental frequency.
Power supply noise and clock output loading are two major
system sources of clock jitter . Power supply noise is mitigated by
proper power supply decoupling (0.1 μF ceramic cap 0.25”) of
the clock and ensuring a low impedance ground to the chip.
Reducing capacitive clock output loading to a minimum lowers
current spikes on the clock edges and thus reduces jitter.
Reducing the total number of a ctive outpu ts also reduce jitte r in
a linear fashion. However, it is better to use two outputs to drive
two loads than one output to drive two loads.
The rate and magnitude that the PLL corrects the VCO frequency
is directly related to jitter performance. If the rate is too slow, then
long term jitter and phase noise is poor. Therefore, to improve
long term jitter and phase noise, reducing Q to a minimum is
advisable. This technique increases the speed of the Phase
Frequency Detector which in turn drive th e input voltage of the
VCO. In a similar manner increasing P till the VCO is near its
maximum rated speed also decreases long term jitter and phase
noise. For example: Input Refe rence of 12 MH z; desired ou tput
frequency of 33.3 MHz. The following solution is possible: Set
Q = 3, P = 25, Post Div = 3. However, the best jitter results is
Q = 2, P = 50, Post Div = 9.
For more information, contact your local Cypress field applica-
tions engineer.
Figure 8. Duty Cycle Definition; DC = t2/t1 Figure 9. Rise and Fall Time Definitions
Figure 10. Peak-to-Peak Jitter
Figure 7. Test Circuit
0.1 mF
VDD
0.1 mF
AVDD
CLK out
CLOAD
GND
OUTPUTS
VDDL
0.1 μF
t3
CLK
80%
20%
t4
t1
t2
CLK 50% 50%
t6
CY22150
Document #: 38-07104 Rev. *L Page 12 of 18
Absolute Maximum Conditions
Parameter Description Min Max Unit
VDD Supply Voltage –0.5 7.0 V
VDDL I/O Supply Voltage –0.5 7.0 V
TSStorage Temperature[2] –65 125 °C
TJJunction Temperature – 125 °C
Package Power Dissipation – Commercial Temp – 450 mW
Package Power Dissipation – Industrial Temp – 380 mW
Digital Inputs AVSS – 0.3 AVDD + 0.3 V
Digital Outputs Referred to VDD VSS – 0.3 VDD + 0.3 V
Digital Outputs Referred to VDDL VSS – 0.3 VDDL +0.3 V
ESD Static Discharge V oltage per MIL-STD-833, Method 3015 – 2000 V
Recommended Operating Conditions
Parameter Description Min Typ. Max Unit
VDD Operating Voltage 3.135 3.3 3.465 V
VDDLHI[3] Operating Voltage 3.135 3.3 3.4 65 V
VDDLLO[3] Operating Voltage 2.375 2.5 2.6 25 V
TAC Ambient Commercial Temp 0 – 70 °C
TAI Ambient Industrial Temp –40 – 85 °C
CLOAD Max. Load Capacitance, VDD/VDDL = 3. 3 V – – 15 pF
CLOAD Max. Load Capacitance, VDDL = 2.5 V – – 15 pF
fREFD Driven REF 1 – 133 MHz
fREFC Crystal REF 8 – 30 MHz
tPU Power up time for all VDDs to reach minimum
specified voltage (power ramps must be monotonic) 0.05 – 500 ms
DC Electrical Characteristics
Parameter[4] Name Description Min Typ. Max Unit
IOH3.3 Output Hig h Current VOH = VDD – 0.5, VDD/VDDL = 3.3 V (sink) 12 24 – mA
IOL3.3 Output Low Current VOL = 0.5, VDD/VDDL = 3.3 V (source) 12 24 – mA
IOH2.5 Output Hig h Current VOH = VDDL – 0.5, VDDL = 2.5 V (source) 8 16 – m A
IOL2.5 Output Low Current VOL = 0.5, VDDL = 2.5 V (sink) 8 16 – mA
VIH Input High Voltage CMOS levels, 70% of VDD 0.7 – – VDD
VIL Input Low Voltage CMOS levels, 30% of VDD ––0.3V
DD
CIN Input Capacitance SCLK and SDAT Pins – – 7 pF
IIZ Input Leakage Current SCLK and SDAT Pins – 5 – μA
VHYS Hysteresis of Schmi tt
triggered inputs SCLK and SDAT Pins 0.05 – – VDD
IVDD[5,6] Supply Current AVDD/VDD Current – 45 – mA
IVDDL3.3[5,6] Supply Current VDDL Current (VDDL = 3.465 V) – 25 – mA
IVDDL2.5[5,6] Supply Current VDDL Current (VDDL = 2.625 V) – 17 – mA
Notes
2. Rated for 10 years.
3. VDDLis only specified and characterized at 3.3 V ± 5% and 2.5 V ± 5%. VDDLmay be powered at any value between 3.465 V and 2.375 V.
4. Not 100 % te sted.
5. IVDD currents specified for two CLK outputs running at 125 MHz, two LCLK outputs running at 80 MHz, and two LCLK outputs running at 66.6 MHz.
6. Use CyClocksRT to calculate actu al IVDD and IVDDL for specific output frequency configurations.
CY22150
Document #: 38-07104 Rev. *L Page 13 of 18
AC Electrical Characteristics
Parameter[7] Name Description Min Typ. Max Unit
t1 Output Frequency,
Commercial Temp Clock output limit, 3.3 V 0.08 (80 kHz) – 200 MHz
Clock output limit, 2.5 V 0.08 (80 kHz) – 166.6 MHz
Output Frequency,
Industrial Temp Clock output limit, 3.3 V 0.08 (80 kHz) – 166.6 MHz
Clock output limit, 2.5 V 0.08 (80 kHz) – 150 MHz
t2LO Output Duty Cycle Duty cycle is defined in Figure 8 on page 11;
t1/t2
fOUT < 166 MHz, 50% of VDD
45 50 55 %
t2HI Output Duty Cycle Duty cycle is defined in Figure 8; t1/t2
fOUT > 166 MHz, 50% of VDD 40 50 60 %
t3LO Rising Edge Slew
Rate (VDDL = 2.5 V) Output clock rise time, 20% to 80% of VDDL.
Defined in Figure 9 0.6 1.2 – V/ns
t4LO Falling Edge Slew
Rate (VDDL = 2.5 V) Output dlock fall time, 80% to 20% of VDDL.
Defined in Figure 9 0.6 1.2 – V/ns
t3HI Rising Edge Slew
Rate (VDDL = 3.3 V) Output dlock rise time, 20% to 80% of
VDD/VDDL. Defined in Figure 9 0.8 1.4 – V/ns
t4HI Falling Edge Slew
Rate (VDDL = 3.3 V) Output dlock fall time, 80% to 20% of VDD/VDDL.
Defined in Figure 9 0.8 1.4 – V/ns
t5[8] Skew Output-output skew between related outputs – – 250 ps
t6[9] Clock Jitter Peak-to-peak period jitter – 250 – ps
t10 PLL Lock Time – 0.30 3 ms
7. Not 100% tested, guaranteed by design.
8. Skew value guaranteed when outputs are generated from the same divider bank. See Logic Block Diagram on p age 1 for more information.
9. Jitter measurements vary. Actual jitter is dependent on XIN jitter and edge rate, number of active outputs, output frequencies, VDDL, (2.5 V or 3.3 V jitter).
Device Characteristics
Parameter Name Value Unit
θJA Theta JA 115 °C/W
Complexity Transistor Count 74,600 Transistors
CY22150
Document #: 38-07104 Rev. *L Page 14 of 18
Some product offerings are factory programmed customer specific devices with customized part numbers. The Possible Configu ra-
tions table shows the available device types, but not complete part numbers. Contact your local Cypress F AE or Sales Representative
for more information.
Ordering Information
Ordering Code Package Type Operating Range Operatin g Voltage
Pb-Free
CY22150FZXC[11] 16-Pin TSSOP Commercial (0 to 70°C) 3.3 V
CY22150FZXCT[11] 16-Pin TSSOP - Tape and Re el Commercial (0 to 70°C) 3.3 V
CY22150FZXI[11] 16-Pin TSSOP Industrial (–40 to 85°C) 3.3 V
CY22150FZXIT[11] 16-Pin TSSOP - Tape and Reel Industrial (–40 to 85°C) 3.3 V
CY22150KFZXC 16-Pin TSSOP Commercial (0 to 70°C) 3.3 V
CY22150KFZXCT 16-Pin TSSOP - Tape and Reel Commercial (0 to 70°C) 3.3 V
CY22150KFZXI 16-Pin TSSOP Industrial (–40 to 85°C) 3.3 V
CY22150KFZXIT 16-Pin TSSOP - Tape and Reel Industrial (–40 to 85°C) 3.3 V
Programmer
CY3672-USB Programmer with USB interface
CY3695 CY22150 Adapter Socket for CY3672-USB
Possible Configurations
Ordering Code Package Type Operating Range Operatin g Voltage
CY22150ZXC-xxx[10, 11] 16-Pin TSSOP Commercial (0 to 70°C) 3.3 V
CY22150ZXC-xxxT[10, 11] 16-Pin TSSOP - Tape and Reel Commercial (0 to 70°C) 3.3 V
CY22150ZXI-xxx[10, 11] 16-Pin TSSOP Industrial (–40 to 85°C) 3.3 V
CY22150ZXI-xxxT[10, 11] 16-Pin TSSOP - Tape and Reel Industrial (–40 to 85°C) 3.3 V
CY22150ZI-xxxT[10, 11] 16-Pin TSSOP - Tape and Reel Industrial (–40 to 85°C) 3.3 V
CY22150KZI-xxx[10] 16-Pin TSSOP Industrial (–40 to 85°C) 3.3 V
CY22150KZI-xxxT[10] 16-Pin TSSOP - Tape and Reel Industrial (–40 to 85°C) 3.3 V
CY22150KZXI-xxxT[10] 16-Pin TSSOP - Tape and Reel Industrial (–40 to 85°C) 3.3 V
Notes
10.The CY22150ZC-xxx and CY22150ZI-xxx are factory programmed configurations. Factory programming is available for high volume design opportunities of 100
Ku/year or more in production. For more details, contact your local Cypress FAE or Cypress Sales Representative.
11. Not recommended for new designs.
CY22150
Document #: 38-07104 Rev. *L Page 15 of 18
Ordering Code Definitions
Package Diagram
Figure 11. 16-Pin TSSOP 4.40 mm Body Z16.173
CY 22150 K F -Z X
Lead-free
16-pin TSSOP package
Field programmable device
Indicates foundry manufacturing
Base part number
Company Code: CY = Cypress
C
Temperature range: C =
Commercial; I = Industrial
XXX T
Tape and reel
Dash code. For factory-
programmed devices only
51-85091 *D
CY22150
Document #: 38-07104 Rev. *L Page 16 of 18
Acronyms
Document Conventions
Units of Measure
Table 14. Acronyms Used in this Docu mnent
Acronym Description Acronym Description
ACK acknowledge LSB least significant bit
BSC ba sic spacing between centers MA memory address
CLKOE clock output enable MSB most significant bit
CMOS complementary metal oxide semiconductor PFD phase frequency detector
DA device address PLL phase locked loop
ESD electrostatic discharge SCLK serial interface clock
ESR eq uivalent series resistance SDAT serial interfac e da ta
FAE field applications engine er TSSOP thin shrunk small outline package
I/O input / output USB universal serial bus
I2C inter integrated circuit VCO voltage-controlled oscillator
JEDEC joint electron device engineering council
Table 15. Units of Measure
Symbol Unit of Measure Symbol Unit of Measure
°C degrees Celsius µVrms microvolts root-mean-square
dB decibels µW microwatt
dBc/Hz decibels relative to the carrier per Hertz mA milliampere
fC femto Coulomb mm millimeter
fF femto Farad ms millisecond
Hz hertz mV millivolt
KB 1024 bytes nA nano ampere
Kbit 1024 bits ns nanosecond
kHz kilohertz nV nano volt
kΩkilohm Ωohm
MHz megah ertz pA pico ampere
MΩmegaohm pF picofarad
µA microampere pp peak-to-peak
µF microfarad ppm parts per million
µH micro henry ps picosecond
µs microsecond sps samples per second
µV microvolt σsigma: one standard deviation
CY22150
Document #: 38-07104 Rev. *L Page 17 of 18
Document History Page
Document Title: CY22150 One-PLL General-Purpose Flash-Programmable and I2C Programmable Clock Generator
Document Number: 38-07104
Revision ECN Orig. o f
Change Submission
Date Description of Cha ng e
** 107498 CKN 08/08/01 New Data Sheet
*A 110043 CKN 02/06/02 Preliminary to Final
*B 113514 CKN 05/01/02 Removed overline on Figure 6 Register Address Register Data
Changed CLKHIGH unit from ns to μs in parameter description table
Added (sink) to rows 1 and 4 and added (source) to rows 2 and 3 in the DC
Electrical Characteristics table (Figure )
*C 121868 RBI 12/14/02 Power up requirements added to Operating Conditions Information
*D 125453 CKN 05/19/03 Changed 0 to 1 under 12H/D5 of Table 2 and Table 4.
Reworded and reformatted Programmable Crystal Input Oscillator Gain
Settings text.
*E 242808 RGL See ECN Minor Change: Fixed the broken line in the block diagram
*F 252352 RGL See ECN Corrected Table 2 specs.
*G 296084 RGL S ee ECN Added Pb-Free Devices
*H 2440846 AESA See ECN Updated template. Added Note “Not recommended for new designs.”
Added part number CY22150KFC, CY22150KFCT, CY22150KFI,
CY22150KFZXC, CY22150KFZXCT, CY22150KFZXI, CY22150KFZXIT,
CY22150KZXI-xxxT, and CY22150KZI-xxxT in ordering information t able.
Replaced Lead Free with Pb-Free.
*I 2649578 KVM/PYRS 01/29/09 Removed reference to note “Not recommended for new designs” for the
following parts: CY22150KFC, CY22150KFCT, CY22150KFI
Added CY22150KZI-xxx to the Ordering Information Table
Removed CY22150ZC-xxx, CY22150ZC-xxxT and CY22150ZI-xxx from the
Ordering Information Table
Changed CY3672 to CY3672-USB, and moved to the bottom of the table
*J 2900690 KVM 03/29/2010 Changed title from "One-PLL General-Purpose Flash-Programmable and
2-Wire Serially Programmable Clock Generator" to “One-PLL
General-Purpose Flash-Programmable and I2C Programmable Clock
Generator”
Updated table on page 1.
Changed references to Serial Programming Interface (SPI) to I2C Interface
in Features and Logic Block Dia gram.
Removed inactive parts from Ordering Information.
Added Possible Configurations table for “xxx” parts.
*K 3210225 CXQ 03/30/2011 Changed tDH min spec from 0 ns to 100 ns.
Updated package diagram.
Added ordering code definitions, Acronyms and units of measure.
*L 3402048 AJU 10/11/2011 Removed the pruned part CY22150KFI from the Ordering Information table.
Document #: 38-07104 Rev. *L Revised October 11, 2011 Page 18 of 18
BP Microsystems is a trademark of BP Microsystems. HiLo Systems is a trademark of Hi-Lo Systems, Inc. CyClocks is a trademark of Cypress Semiconductor. All product and company names
mentioned in this document are the trademarks of their respective holders.
CY22150
© Cypress Semico nducto r Co rpor ation , 20 01-2 011. The infor mation cont ai ned he rein is subject to cha nge wi thou t notice. Cy press S emiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypre ss prod uc ts are n ot war r ant ed no r inte nd ed to be used fo r
medical, life supp or t, l if e savin g, cr it ical control or saf ety ap pl ic at io ns, unless pursuant to a n express written ag re em en t with Cypress. Furthermor e, Cyp ress doe s not author iz e its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypr ess products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protect ion (Unit ed States and fore ign),
United S t ates copyright laws and international treaty provis ions. Cyp ress he reby gr ant s to l icense e a pers onal, no n-excl usive , non-tr ansfer able license to copy, use, modify, create derivative wor ks of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee pr oduct to be used only i n conjunction with a Cyp ress
integrated circui t as specified in the applicab le agreement. Any r eproduction, mod ification, translati on, compilatio n, or represent ation of this Sour ce Code except a s specified abo ve is prohibit ed without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTAB ILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials describ ed herein. Cy press does n ot
assume any liabil ity ar ising ou t of the a pplic ation or use o f any pr oduct or circ uit descri bed herein . Cypress d oes not a uthor ize its p roducts fo r use as critical componen ts in life-su pport systems whe re
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
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