ams Datasheet Page 1
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TSL2771
Light-to-Digital Converter with
Proximity Sensing
The TSL2771 family of devices provides both ambient light
sensing (ALS) and proximity detection (when coupled with an
external IR LED). The ALS approximates human eye response to
light intensity under a variety of lighting conditions and
through a variety of attenuation materials. The proximity
detection feature allows a large dynamic range of operation for
use in short distance detection behind dark glass such as in a
cell phone or for longer distance measurements for
applications such as presence detection for monitors or
laptops. The programmable proximity detection enables
continuous measurements across the entire range. In addition,
an internal state machine provides the ability to put the device
into a low power mode in between ALS and proximity
measurements providing very low average power
consumption.
While useful for general purpose light sensing, the device is
particularly useful for display management with the purpose of
extending battery life and providing optimum viewing in
diverse lighting conditions. Display panel and keyboard
backlighting can account for up to 30 to 40 percent of total
platform power. The ALS features are ideal for use in tablets,
notebook PCs, LCD monitors, flat-panel televisions, and cell
phones.
The proximity function is targeted specifically towards cell
phone, LCD monitor, laptop, and flat-panel television
applications. In cell phones, the proximity detection can detect
when the user positions the phone close to their ear. The device
is fast enough to provide proximity information at a high
repetition rate needed when answering a phone call. It can also
detect both close and far distances so the application can
implement more complex algorithms to provide a more robust
interface. In laptop or monitor applications, the product is
sensitive enough to determine whether a user is in front of the
laptop using the keyboard or away from the desk. This provides
both improved green power saving capability and the added
security to lock the computer when the user is not present.
Ordering Information and Content Guide appear at end of
datasheet.
General Description
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TSL2771 − General Description
Key Benefits & Features
The benefits and features of TSL2771, Light-to-Digital
Converter with Proximity Sensing are listed below:
Figure 1:
Added Value of Using TSL2771
•Ambient Light Sensing and Proximity Detection in a Single
Device
•Ambient Light Sensing (ALS)
• Approximates Human Eye Response
• Programmable Analog Gain
• Programmable Integration Time
• Programmable Interrupt Function with Upper and
Lower Threshold
• Resolution Up to 16 Bits
• Very High Sensitivity — Operates Well Behind
Darkened Glass
• Up to 1,000,000:1 Dynamic Range
•Proximity Detection
• Programmable Number of IR Pulses
• Programmable Current Sink for the IR LED — No
Limiting Resistor Needed
• Programmable Interrupt Function with Upper and
Lower Threshold
• Covers a 2000:1 Dynamic Range
•Programmable Wait Timer
• Programmable from 2.72 ms to > 8 Seconds
• Wait State — 65 mA Typical Current
•I²C Interface Compatible
• Up to 400 kHz (I²C Fast Mode)
• Dedicated Interrupt Pin
•Sleep Mode – 2.5 mA Typical Current
Benefits Features
•Enables Operation in IR Light Environments •Patented Dual-Diode Architecture
•Enables Operation in 10k Lux Sunlight and Accurate
Sensing Behind Spectrally Distorting Materials •1M:1 Dynamic Range
•Allows Multiple Power-Level Selection Without
External Passives •Programmable LED Drive Current
•Reduces Micro-Processor Interrupt Overhead •Programmable Interrupt Function
•Reduces board Space Requirements while Simplifying
Designs
•Area Efficient 2mm x 2mm Dual Flat No-Lead
(FN) Package
ams Datasheet Page 3
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TSL2771 − General Description
Applications
TSL2771, Light-to-Digital Converter with Proximity Sensing is
ideal for:
•Cell Phone Backlight Dimming
•Cell Phone Touch Screen Disable
•Notebook/Monitor Security
•Automatic Speakerphone Enable
•Automatic Menu Popup
Functional Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL2771 Block Diagram
CH0
SDA
VDD
INT
SCL
LDR
CH1
ADC
ALS Control
CH1
Data
Wait Control
Prox
ADC
Prox Control
Prox
Data
IR LED Constant
Current Sink
CH0
ADC
CH0
Data
Prox
Integration
CH1
Upper Limit
Upper Limit
Lower Limit
Lower Limit
Interrupt
I2C Interface
GND
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TSL2771 − Detailed Description
The TSL2771 light-to-digital device provides on-chip
photodiodes, integrating amplifiers, ADCs, accumulators,
clocks, buffers, comparators, a state machine, and an I²C
interface. Each device combines a Channel 0 photodiode (CH0),
which is responsive to both visible and infrared light, and a
channel 1 photodiode (CH1), which is responsive primarily to
infrared light. Two integrating ADCs simultaneously convert the
amplified photodiode currents into a digital value providing up
to 16 bits of resolution. Upon completion of the conversion
cycle, the conversion result is transferred to the data registers.
This digital output can be read by a microprocessor through
which the illuminance (ambient light level) in Lux is derived
using an empirical formula to approximate the human eye
response.
Communication to the device is accomplished through a fast
(up to 400 kHz), two-wire I²C serial bus for easy connection to
a microcontroller or embedded controller. The digital output of
the device is inherently more immune to noise when compared
to an analog interface.
The device provides a separate pin for level-style interrupts.
When interrupts are enabled and a pre-set value is exceeded,
the interrupt pin is asserted and remains asserted until cleared
by the controlling firmware. The interrupt feature simplifies and
improves system efficiency by eliminating the need to poll a
sensor for a light intensity or proximity value. An interrupt is
generated when the value of an ALS or proximity conversion
exceeds either an upper or lower threshold. In addition, a
programmable interrupt persistence feature allows the user to
determine how many consecutive exceeded thresholds are
necessary to trigger an interrupt. Interrupt thresholds and
persistence settings are configured independently for both ALS
and proximity.
Proximity detection requires only a single external IR LED. An
internal LED driver can be configured to provide a constant
current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of current. No
external current limiting resistor is required. The number of
proximity LED pulses can be programmed from 1 to 255 pulses.
Each pulse has a 16-μs period. This LED current, coupled with
the programmable number of pulses, provides a 2000:1
contiguous dynamic range.
Detailed Description
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TSL2771 − Pin Assignments
The TSL2771 pin assignments are described below:
Figure 3:
Package FN Dual Flat No-Lead (Top View)
Figure 4:
Terminal Functions
Terminal
Type Description
Name No
VDD 1 Supply voltage.
SCL 2 I I²C serial clock input terminal — clock signal for I²C serial data.
GND 3 Power supply ground. All voltages are referenced to GND.
LDR 4 O LED driver for proximity emitter — up to 100 mA, open drain.
INT 5 O Interrupt — open drain (active low).
SDA 6 I/O I²C serial data I/O terminal — serial data I/O for I²C
Pin Assignments
V
DD
1
SCL 2
GND 3
6 SDA
5 INT
4 LDR
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TSL2771 − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure
to absolute-maximum-rated conditions for extended periods
may affect device reliability.
Figure 5:
Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
Note(s):
1. All voltages are with respect to GND.
Figure 6:
Recommended Operating Conditions
Symbol Parameter Min Max Units
VDD(1) Supply voltage 3.8 V
VODigital output voltage range -0.5 3.8 V
IODigital output current -1 20 mA
Tstg Storage temperature range -40 85 ºC
ESDHBM ESD tolerance, human body model ±2000 V
Symbol Parameter Min Nom Max Unit
VDD Supply voltage 2.6 3 3.6 V
TAOperating free-air
temperature -30 70 ºC
Absolute Maximum Ratings
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TSL2771 − Absolute Maximum Ratings
Figure 7:
Operating Characteristics; VDD = 3 V, TA = 25ºC (unless otherwise noted)
Symbol Parameter Test Conditions Min Typ Max Unit
IDD Supply current
Active — LDR pulse OFF 175 250
μA Wait mode 65
Sleep mode - no I²C activity 2.5 4
VOL INT, SDA output low
voltage
3 mA sink current 0 0.4
V
6 mA sink current 0 0.6
ILEAK Leakage current, SDA,
SCL, INT pins −5 5 μA
ILEAK Leakage current, LDR
pin ±10 μA
VIH SCL, SDA input high
voltage
TSL27711, TSL27715 0.7 VDD
V
TSL27713, TSL27717 1.25
VIL SCL, SDA input low
voltage
TSL27711, TSL27715 0.3 VDD
V
TSL27713, TSL27717 0.54
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TSL2771 − Absolute Maximum Ratings
Figure 8:
ALS Characteristics; VDD = 3 V, TA = 25ºC, Gain = 16, AEN = 1 (unless otherwise noted) (1) (2) (3)
Note(s):
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 625 nm LEDs
and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production.
2. The 625 nm irradiance Ee is supplied by an AlInGaP light-emitting diode with the following typical characteristics: peak wavelength
λp = 625 nm and spectral halfwidth Δλ½ = 20 nm.
3. The 850 nm irradiance Ee is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength
λp = 850 nm and spectral halfwidth Δλ½ = 42 nm.
Parameter Test Conditions Channel Min Typ Max Unit
Dark ADC count value Ee = 0, AGAIN = 120x,
ATIME = 0xDB (100 ms)
CH0 0 1 5
counts
CH1 0 1 5
ADC integration time step
size ATIME = 0xFF 2.58 2.72 2.9 ms
ADC Number of integration
steps 1 256steps
ADC counts per step ATIME = 0xFF 0 1024 counts
ADC count value ATIME = 0xC0 0 65535 counts
ADC count value
λp = 625 nm,
Ee = 171.6 μW/cm2,
ATIME = 0xF6 (27 ms) (2)
CH0 4000 5000 6000
counts
CH1 790
λp = 850 nm,
Ee = 219.7 μW/cm2
ATIME = 0xF6 (27 ms) (3)
CH0 4000 5000 6000
CH1 2800
ADC count value ratio:
CH1/CH0
λp = 625 nm, ATIME 0xF6 (27 ms) (2) 10.8 15.8 20.8
%
λp = 850 nm, ATIME 0xF6 (27 ms) (3) 41 56 68
Re
Irradiance responsivity
λp = 625 nm,
ATIME = 0xF6 (27 ms) (2)
CH0 29.1
counts/
(μW/cm2)
CH1 4.6
λp = 850 nm,
ATIME = 0xF6 (27 ms) (3)
CH0 22.8
CH1 12.7
Gain scaling, relative to 1x
gain setting
8x −10 10
%16x −10 10
120x −10 10
ams Datasheet Page 9
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TSL2771 − Absolute Maximum Ratings
Figure 9:
Proximity Characteristics; VDD = 3 V, TA = 25°C, PEN = 1 (unless otherwise noted)
Note(s):
1. Proximity Operating Distance is dependent upon emitter properties and the reflective properties of the proximity surface. The
nominal value shown uses an IR emitter with a peak wavelength of 850nm and a 20º half angle. The proximity surface used is a 90%
reflective (white surface) 16 × 20-inch Kodak Gray Card. 60 mw/SR, 100 mA, 64 pulses, open view (no glass). Note: Greater distances
are achievable with appropriate system considerations.
Figure 10:
Wait Characteristics; VDD = 3 V, TA = 25°C, WEN = 1 (unless otherwise noted)
Parameter Test Conditions Condition Min Typ Max Unit
IDD
Supply current LDR pulse ON 3 mA
ADC conversion time step size PTIME = 0xFF 2.58 2.72 2.9 ms
ADC number of integration
steps 1 256 steps
ADC counts per step PTIME = 0xFF 0 1023 counts
IR LED pulse count 0 255 pulses
pulse period Two or more pulses 16 μs
LED pulse width — LED ON time 7.3 μs
LED drive current ISINK sink current @
600 mV, LDR pin
PDRIVE=0 75 100 125
mA
PDRIVE=1 50
PDRIVE=2 25
PDRIVE=3 12.5
Operating distance (1) 18 inches
Parameter Test
Conditions Channel Min Typ Max Unit
Wait step size WTIME = 0xFF 2.58 2.72 2.9 ms
Wait number of integration steps 1 256 steps
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TSL2771 − Absolute Maximum Ratings
Figure 11:
AC Electrical Characteristics; VDD = 3 V, TA = 25°C, (unless otherwise noted)
Note(s):
1. Specified by design and characterization; not production tested.
Symbol Parameter (1) Test Conditions Min Typ Max Unit
f(SCL) Clock frequency (I²C only) 0 400 kHz
t(BUF) Bus free time between start and stop
condition 1.3 μs
t(HDSTA)
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6 μs
t(SUSTA) Repeated start condition setup time 0.6 μs
t(SUSTO) Stop condition setup time 0.6 μs
t(HDDAT) Data hold time 0 μs
t(SUDAT) Data setup time 100 ns
t(LOW) SCL clock low period 1.3 μs
t(HIGH) SCL clock high period 0.6 μs
tF Clock/data fall time 300 ns
tR Clock/data rise time 300 ns
Ci Input pin capacitance 10 pF
ams Datasheet Page 11
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TSL2771 − Absolute Maximum Ratings
Parameter Measurement Information
Figure 12:
Timing Diagrams
SDA
SCL
StopStart
SCLACK
t(LOWMEXT) t(LOWMEXT)
t(LOWSEXT)
SCLACK
t(LOWMEXT)
Start
Condition
Stop
Condition
P
SDA
t(SUSTO)
t(SUDAT)
t(HDDAT)
t(BUF)
VIH
VIL
SCL
t(SUSTA)
t(HIGH)
t(F)
t(R)
t(HDSTA)
t(LOW)
VIH
VIL
PSS
Page 12 ams Datasheet
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TSL2771 − Typical Operating Characteristics
Figure 13:
Spectral Responsivity
Figure 14:
Typical LDR Current vs. Voltage
Typical Operating
Characteristics
λ − Wavelength − nm
0
400
0.2
0.4
0.6
0.8
1
500 600 700 800 900 1000 1100
Normalized Responsivity
300
Ch 0
Ch 1
25 mA
12.5 mA
LDR Voltage − V
LDR Current — mA
50 mA
100 mA
0 0.5 1 1.5 2 2.5
0
20
40
60
80
100
120
140
160
3
ams Datasheet Page 13
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TSL2771 − Typical Operating Characteristics
Figure 15:
Normalized IDD vs.VDD and Temperature
Figure 16:
Normalized Responsivity vs. Angular Displacement
VDD
and
TEMPERATURE
VDD — V
IDD Normalized @ 3 V, 25C
94%
96%
98%
100%
102%
104%
106%
108%
110%
92%
2.7 2.8 2.9 3 3.1 3.2 3.3
75C
50C 25C
0C
Q − Angular Displacement − °
Normalized Responsivity
0
0.2
0.4
0.6
0.8
1.0
−90 −60 −30 0 30 60 90
Optical Axis
-Q +Q
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TSL2771 − Principles Of Operation
System State Machine
The device provides control of ALS, proximity detection, and
power management functionality through an internal state
machine (Figure 17). After a power-on-reset, the device is in the
sleep mode. As soon as the PON bit is set, the device will move
to the start state. It will then continue through the Prox, Wait,
and ALS states. If these states are enabled, the device will
execute each function. If the PON bit is set to 0, the state
machine will continue until all conversions are completed and
then go into a low power sleep mode.
Figure 17:
Simplified State Diagram
Note(s): In this document, the nomenclature uses the bit field
name in italics followed by the register number and bit number
to allow the user to easily identify the register and bit that
controls the function. For example, the power ON (PON) is in
register 0, bit 0. This is represented as PON (r0:b0).
Principles Of Operation
Sleep
Start
Wait
ALS
Prox
PON = 1 (r0:b0) PON = 0 (r0:b0)
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TSL2771 − Principles Of Operation
Photodiodes
Conventional silicon detectors respond strongly to infrared
light, which the human eye does not see. This can lead to
significant error when the infrared content of the ambient light
is high (such as with incandescent lighting) due to the
difference between the silicon detector response and the
brightness perceived by the human eye.
This problem is overcome through the use of two photodiodes.
The Channel 0 photodiode, referred to as the CH0 channel, is
sensitive to both visible and infrared light, while the Channel 1
photodiode, referred to as CH1, is sensitive primarily to infrared
light. Two integrating ADCs convert the photodiode currents to
digital outputs. The ADC digital outputs from the two channels
are used in a formula to obtain a value that approximates the
human eye response in units of lux.
ALS Operation
The ALS engine contains ALS gain control (AGAIN) and two
integrating analog-to-digital converters (ADC) for the Channel
0 and Channel 1 photodiodes. The ALS integration time (ATIME)
impacts both the resolution and the sensitivity of the ALS
reading. Integration of both channels occurs simultaneously
and upon completion of the conversion cycle, the results are
transferred to the data registers (C0DATA and C1DATA). This
data is also referred to as channel count. The transfers are
double-buffered to ensure data integrity.
Figure 18:
ALS Operation
CH1
ADC
ALS Control
CH1
Data
CH0
ALS
CH0
Data
AGAIN(r 0x0F, b1:0)
1, 8, 16, 120 Gain
CH0
CH1
C0DATAH(r0x15), C0DATA(r0x14)
C1DATAH(r0x17), C1DATA(r0x16)
ATIME(r 1)
2.72 ms to 696 ms
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The registers for programming the integration and wait times
are a 2’s compliment values. The actual time can be calculated
as follows:
ATIME = 256 - Integration Time / 2.72 ms
Inversely, the time can be calculated from the register value as
follows:
Integration Time = 2.72 ms × (256 - ATIME)
In order to reject 50/60-Hz ripple strongly present in fluorescent
lighting, the integration time needs to be programmed in
multiples of 10 / 8.3 ms or the half cycle time. Both frequencies
can be rejected with a programmed value of 50 ms
(ATIME = 0xED) or multiples of 50 ms (i.e. 100, 150, 200, 400,
600).
The registers for programming the AGAIN hold a two-bit value
representing a gain of 1×, 8×, 16×, or 120×. The gain, in terms
of amount of gain, will be represented by the value AGAINx, i.e.
AGAINx = 1, 8, 16, or 120.
Lux Equation
The lux calculation is a function of CH0 channel count (C0DATA),
CH1 channel count (C1DATA), ALS gain (AGAINx), and ALS
integration time in milliseconds (ATIME_ms). If an aperture,
glass/plastic, or a light pipe attenuates the light equally across
the spectrum (300 nm to 1100 nm), then a scaling factor referred
to as glass attenuation (GA) can be used to compensate for
attenuation. For a device in open air with no aperture or
glass/plastic above the device, GA = 1. If it is not spectrally flat,
then a custom lux equation with new coefficients should be
generated. (See ams application note).
Counts per Lux (CPL) needs to be calculated only when ATIME
or AGAIN is changed, otherwise it remains a constant. The first
segment of the equation (Lux1) covers fluorescent and
incandescent light. The second segment (Lux2) covers dimmed
incandescent light. The final lux is the maximum of Lux1, Lux2,
or 0.
CPL = (ATIME_ms × AGAINx) / (GA × 53)
Lux1 = (C0DATA - 2 × C1DATA) / CPL
Lux2 = (0.6 × C0DATA - C1DATA) / CPL
Lux = MAX(Lux1, Lux2, 0)
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TSL2771 − Principles Of Operation
Proximity Detection
Proximity sensing uses an external light source (generally an
infrared emitter) to emit light, which is then viewed by the
integrated light detector to measure the amount of reflected
light when an object is in the light path (Figure 19). The amount
of light detected from a reflected surface can then be used to
determine an object’s proximity to the sensor.
Figure 19:
Proximity Detection
The device has controls for the number of IR pulses (PPCOUNT),
the integration time (PTIME), the LED drive current (PDRIVE),
and the photodiode configuration (PDIODE) (Figure 20). The
photodiode configuration can be set to CH1 diode
(recommended), CH0 diode, or a combination of both diodes.
At the end of the integration cycle, the results are latched into
the proximity data (PDATA) register.
Figure 20:
Proximity Detection Operation
IR LED
Prox
Sensor
Surface Reflectivity (SR)
Background Energy (BGE) Optical Crosstalk (OC)
Glass Attenuation (GA)
Distance (D)
CH1
Prox
Integration
Prox Control
Prox
ADC
IR LED Constant
Current Sink
CH0
PDATAH(r 0x019), PDATAL(r 0x018)
PDRIVE(r 0x0F, b7:6)
Prox
Data
IR
LED
PTIME(r 2)
PPCOUNT(r 0x0E)
VDD
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TSL2771 − Principles Of Operation
The LED drive current is controlled by a regulated current sink
on the LDR pin. This feature eliminates the need to use a current
limiting resistor to control LED current. The LED drive current
can be configured for 12.5 mA, 25 mA, 50 mA, or 100 mA. For
higher LED drive requirements, an external P type transistor can
be used to control the LED current.
The number of LED pulses can be programmed to any value
between 1 and 255 pulses as needed. Increasing the number of
LED pulses at a given current will increase the sensor sensitivity.
Sensitivity grows by the square root of the number of pulses.
Each pulse has a 16-μs period.
Figure 21:
Proximity IR LED Waveform
The proximity integration time (PTIME) is the period of time that
the internal ADC converts the analog signal to a digital count.
It is recommend that this be set to a minimum of PTIME = 0xFF
or 2.72 ms.
The combination of LED power and number of pulses can be
used to control the distance at which the sensor can detect
proximity. Figure 22 shows an example of the distances covered
with settings such that each curve covers 2x the distance.
Counts up to 64 pulses provide a 16x range.
LED On LED Off
16 ms
IR LED Pulses
Subtract
Background
Add IR +
Background
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TSL2771 − Principles Of Operation
Figure 22:
Proximity ADC Count vs. Relative Distance
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for light intensity or
proximity values outside of a user-defined range. While the
interrupt function is always enabled and it’s status is available
in the status register (0x13), the output of the interrupt state
can be enabled using the proximity interrupt enable (PIEN) or
ALS interrupt enable (AIEN) fields in the enable register (0x00).
Four 16-bit interrupt threshold registers allow the user to set
limits below and above a desired light level and proximity
range. An interrupt can be generated when the ALS CH0 data
(C0DATA) falls outside of the desired light level range, as
determined by the values in the ALS interrupt low threshold
registers (AILTx) and ALS interrupt high threshold registers
(AIHTx). Likewise, an out-of-range proximity interrupt can be
generated when the proximity data (PDATA) falls below the
proximity interrupt low threshold (PILTx) or exceeds the
proximity interrupt high threshold (PIHTx). It is important to
note that the low threshold value must be less than the high
threshold value for proper operation.
To further control when an interrupt occurs, the device provides
a persistence filter. The persistence filter allows the user to
specify the number of consecutive out-of-range ALS or
proximity occurrences before an interrupt is generated. The
persistence register (0x0C) allows the user to set the ALS
persistence (APERS) and the proximity persistence (PPERS)
values. See the persistence register for details on the
persistence filter values. Once the persistence filter generates
Proximity ADC Count
Relative Distance
124816
0
200
400
600
800
1000
100 mA,
64 Pulses
100 mA,
16 Pulses
100 mA,
4 Pulses
100 mA,
1 Pulse
25 mA,
1 Pulse
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TSL2771 − Principles Of Operation
an interrupt, it will continue until a special function interrupt
clear command is received (seeCommand Register).
Figure 23:
Programmable Interrupt
Prox
ADC
Prox
Data
CH0
ADC
CH0
Data
Prox
Integration
CH0
CH1
Upper Limit
Upper Limit
Lower Limit
Lower Limit
Prox Persistence
PILTH(r 09), PILTL(r 08)
AIHTH(r 07), AIHTL(r 06)
ALS Persistence
AILTH(r 05), AILTL(r 04)
PIHTH(r 0x0B), PIHTL(r0x0A) PPERS(r 0x0C, b7:4)
APERS(r 0x0C, b3:0)
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TSL2771 − Principles Of Operation
State Diagram
Figure 24 shows a more detailed flow for the state machine. The
device starts in the sleep mode. The PON bit is written to enable
the device. A 2.72-ms delay will occur before entering the start
state. If the PEN bit is set, the state machine will step through
the proximity states of proximity accumulate and then
proximity ADC conversion. As soon as the conversion is
complete, the state machine will move to the following state.
If the WEN bit is set, the state machine will then cycle through
the wait state. If the WLONG bit is set, the wait cycles are
extended by 12× over normal operation. When the wait counter
terminates, the state machine will step to the ALS state.
The AEN should always be set, even in proximity-only operation.
In this case, a minimum of 1 integration time step should be
programmed. The ALS state machine will continue until it
reaches the terminal count at which point the data will be
latched in the ALS register and the interrupt set, if enabled.
Figure 24:
Expanded State Diagram
Prox
Check
PON = 1 PON = 0
Sleep
ALS
Check
Wait
Check
Start
Wait
WEN = 1
Prox
Accum
Prox
ADC
ALS
ALS
Delay
PEN = 1
AEN = 1
Up to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16 ms − 4.2 ms
Maximum 4.2ms
Up to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
120 Hz Minimum − 8 ms
100 Hz Minimum − 10 ms
Counts up to 256 steps
Step: 2.72 ms
Time: 2.72 mS − 696 ms
Recommended − 2.72 ms 1024 Counts
WLONG = 0
Counts up to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
Minimum − 2.72 ms
WLONG = 1
Counts up to 256 steps
Step: 32.64 ms
Time: 32.64 ms − 8.35 s
Minimum − 32.64 ms
Time: 2.72 ms
Prox
Delay
2.72 ms
Page 22 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Principles Of Operation
Power Management
Power consumption can be controlled through the use of the
wait state timing because the wait state consumes only 65 μA
of power. Figure 25 shows an example of using the power
management feature to achieve an average power
consumption of 155 μA current with four 100-mA pulses of
proximity detection and 50 ms of ALS detection.
Figure 25:
Power Consumption Calculations
4 IR LED Pulses
64 ms (32 ms LED On Time)
2.72 ms
47 ms
50 ms
Prox ADC
Prox Accum
WAIT
ALS
Avg = ((0.032 100) + (2.72 0.175) + (47 0.065) + (50 0.175)) / 100 = 155 mA
State Duration (ms) Current (mA)
Prox Accum (LED On) 0.064 (0.032) 100.0
Prox ADC 2.7 0.175
Wait 47 0.065
ALS 50 0.175
Example: 100 ms Cycle TIme
ams Datasheet Page 23
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Principles Of Operation
I²C Protocol
Interface and control are accomplished through an I²C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I²C addressing protocol.
The I²C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 26). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification at
http://www.i2c-bus.org/references/.
A
N
P
R
S
S
W
...
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
Page 24 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Principles Of Operation
Figure 26:
I²C Protocols
W
7
Data ByteSlave AddressS
1
AAA
811 1 8
Command Code
1
P
1
...
I2C Write Protocol
I2C Read Protocol
I2C Read Protocol — Combined Format
R
7
DataSlave AddressS
1
AAA
811 1 8
Data
1
P
1
...
W
7
Slave AddressSlave AddressS
1
ARA
811 1 7 11
Command Code S
1
A
Data AA
81 8
Data
1
P
1
...
ams Datasheet Page 25
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Register Set
The TSL2771 is controlled and monitored by data registers and
a command register accessed through the serial interface.
These registers provide for a variety of control functions and
can be read to determine results of the ADC conversions. The
register set is summarized in Figure 27.
Figure 27:
Register Address
Address Register Name R/W Register Function Reset Value
−− COMMAND W Specifies register address 0x00
0x00 ENABLE R/W Enables states and interrupts 0x00
0x01 ATIME R/W ALS ADC time 0xFF
0x02 PTIME R/W Proximity ADC time 0xFF
0x03 WTIME R/W Wait time 0xFF
0x04 AILTL R/W ALS interrupt low threshold low byte 0x00
0x05 AILTH R/W ALS interrupt low threshold high byte 0x00
0x06 AIHTL R/W ALS interrupt high threshold low byte 0x00
0x07 AIHTH R/W ALS interrupt high threshold high byte 0x00
0x08 PILTL R/W
Proximity interrupt low threshold low
byte 0x00
0x09 PILTH R/W
Proximity interrupt low threshold high
byte 0x00
0x0A PIHTL R/W
Proximity interrupt high threshold low
byte 0x00
0x0B PIHTH R/W
Proximity interrupt high threshold
high byte 0x00
0x0C PERS R/W Interrupt persistence filters 0x00
0x0D CONFIG R/W Configuration 0x00
0x0E PPCOUNT R/W Proximity pulse count 0x00
0x0F CONTROL R/W Control register 0x00
0x12 ID R Device ID ID
0x13 STATUS R Device status 0x00
0x14 C0DATA R CH0 ADC low data register 0x00
0x15 C0DATAH R CH0 ADC high data register 0x00
0x16 C1DATA R CH1 ADC low data register 0x00
0x17 C1DATAH R CH1 ADC high data register 0x00
Register Set
Page 26 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Register Set
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I²C Protocols on the
previous pages. In general, the COMMAND register is written
first to specify the specific control/status register for following
read/write operations.
0x18 PDATA R Proximity ADC low data register 0x00
0x19 PDATAH R Proximity ADC high data register 0x00
Address Register Name R/W Register Function Reset Value
ams Datasheet Page 27
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Register Set
Command Register
The command registers specifies the address of the target
register for future read and write operations.
Figure 28:
Command Register
76543210
COMMAND TYPE ADD
Field Bits Description
COMMAND 7 Select Command Register. Must write as 1 when addressing COMMAND register.
TYPE 6:5 Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE DESCRIPTION
00 Repeated byte protocol transaction
01 Auto-increment protocol transaction
10 Reserved — Do not use
11 Special function — See description below
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive
register bytes.
ADD 4:0 Address register/special function field. Depending on the transaction type, see above,
this field either specifies a special function command or selects the specific
control-status-register for the following write and read transactions. The field values
listed below apply only to special function commands:
FIELD VALUE DESCRIPTION
00000 Normal - no action
00101 Proximity interrupt clear
00110 ALS interrupt clear
00111 Proximity and ALS interrupt clear
other Reserved — Do not write
ALS/Proximity Interrupt Clear clears any pending ALS/Proximity interrupt. This special
function is self clearing.
Page 28 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Register Set
Enable Register (0x00)
The ENABLE register is used to power the device ON/OFF, enable
functions, and interrupts.
Figure 29:
Enable Register
Note(s):
1. See Power Management section for more information.
2. A minimum interval of 2.72 ms must pass after PON is asserted before either a proximity or ALS can be initiated. This required time
is enforced by the hardware in cases where the firmware does not provide it.
76543210
Reserved PIEN AIEN WEN PEN AEN PON
Field Bits Description
Reserved 7:6 Reserved. Write as 0.
PIEN 5 Proximity interrupt mask. When asserted, permits proximity interrupts to be generated.
AIEN 4 ALS interrupt mask. When asserted, permits ALS interrupts to be generated.
WEN 3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer.
Writing a 0 disables the wait timer.
PEN 2 Proximity enable. This bit activates the proximity function. Writing a 1 enables
proximity. Writing a 0 disables proximity.
AEN 1
ALS Enable. This bit actives the two channel ADC. Writing a 1 activates the ALS. Writing
a 0 disables the ALS.
PON(1)(2) 0
Power ON. This bit activates the internal oscillator to permit the timers and ADC
channels to operate. Writing a 1 activates the oscillator. Writing a 0 disables the
oscillator.
ams Datasheet Page 29
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Register Set
ALS Timing Register (0x01)
The ALS timing register controls the internal integration time
of the ALS channel ADCs in 2.72 ms increments.
Figure 30:
ALS Timing Register
Proximity Time Control Register (0x02)
The proximity timing register controls the integration time of
the proximity ADC in 2.72 ms increments. It is recommended
that this register be programmed to a value of 0xFF (1
integration cycle).
Figure 31:
Proximity Time Control Register
Field Bits Description
ATIME 7:0 VALUE INTEG_CYCLES TIME MAX COUNT
0xFF 1 2.72 ms 1024
0xF6 10 27.2 ms 10240
0xDB 37 101 ms 37888
0xC0 64 174 ms 65535
0x00 256 696 ms 65535
Field Bits Description
PTIME 7:0 VALUE INTEG_CYCLES TIME MAX COUNT
0xFF 1 2.72 ms 1023
Page 30 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Register Set
Wait Time Register (0x03)
Wait time is set 2.72 ms increments unless the WLONG bit is
asserted in which case the wait times are 12x longer. WTIME is
programmed as a 2’s complement number.
Figure 32:
Wait Time Register
Note(s):
1. The Proximity Wait Time Register should be configured before PEN and/or AEN is/are asserted.
ALS Interrupt Threshold Registers (0x04 - 0x07)
The ALS interrupt threshold registers provides the values to be
used as the high and low trigger points for the comparison
function for interrupt generation. If C0DATA crosses below the
low threshold specified, or above the higher threshold, an
interrupt is asserted on the interrupt pin.
Figure 33:
ALS Interrupt Threshold Register
Field Bits Description
WTIME 7:0 REGISTER
VALUE
WAIT TIME TIME (WLONG = 0) TIME (WLONG = 1)
0xFF 1 2.72 ms 0.032 s
0xB6 74 201 ms 2.4 s
0x00 256 696 ms 8.3 s
Register Address Bits Description
AILTL 0x04 7:0 ALS low threshold lower byte
AILTH 0x05 7:0 ALS low threshold upper byte
AIHTL 0x06 7:0 ALS high threshold lower byte
AIHTH 0x07 7:0 ALS high threshold upper byte
ams Datasheet Page 31
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Register Set
Proximity Interrupt Threshold Registers (0x08 - 0x0B)
The proximity interrupt threshold registers provide the values
to be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by
proximity channel crosses below the lower threshold specified,
or above the higher threshold, an interrupt is signaled to the
host processor.
Figure 34:
Proximity Interrupt Threshold Registers
Register Address Bits Description
PILTL 0x08 7:0 Proximity low threshold lower byte
PILTH 0x09 7:0 Proximity low threshold upper byte
PIHTL 0x0A 7:0 Proximity high threshold lower byte
PIHTH 0x0B 7:0 Proximity high threshold upper byte
Page 32 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Register Set
Persistence Register (0x0C)
The persistence register controls the filtering interrupt
capabilities of the device. Configurable filtering is provided to
allow interrupts to be generated after each ADC integration
cycle or if the ADC integration has produced a result that is
outside of the values specified by threshold register for some
specified amount of time. Separate filtering is provided for
proximity and ALS functions. ALS interrupts are generated
using C0DATA.
Figure 35:
Persistence Register
76543210
PPERS APERS
Field Bits Description
PPERS 7:4 Proximity interrupt persistence. Controls rate of proximity interrupt to the host
processor
FIELD VALUE MEANING INTERRUPT PERSISTENCE FUNCTION
0000 ----- Every proximity cycle generates an interrupt
0001 1 1 proximity value out of range
0010 2 2 consecutive proximity values out of range
... ... ...
1111 15 15 consecutive proximity values out of range
ams Datasheet Page 33
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Register Set
APERS 3:0 Interrupt persistence. Controls rate of interrupt to the host processor.
FIELD VALUE MEANING INTERRUPT PERSISTENCE FUNCTION
0000 Every Every proximity cycle generates an interrupt
0001 1 1 value outside of threshold range
0010 2 2 consecutive values out of range
0011 3 3 consecutive values out of range
0100 5 5 consecutive values out of range
0101 10 10 consecutive values out of range
0110 15 15 consecutive values out of range
0111 20 20 consecutive values out of range
1000 25 25 consecutive values out of range
1001 30 30 consecutive values out of range
1010 35 35 consecutive values out of range
1011 40 40 consecutive values out of range
1100 45 45 consecutive values out of range
1101 50 50 consecutive values out of range
1110 55 55 consecutive values out of range
1111 60 60 consecutive values out of range
Field Bits Description
Page 34 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Register Set
Configuration Register (0x0D)
The configuration register sets the wait long time.
Figure 36:
Configuration Register
Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity
pulses that will be transmitted. When proximity detection is
enabled, a proximity detect cycle occurs after each ALS cycle.
PPULSE defines the number of pulses to be transmitted at a
62.5-kHz rate.
Note(s): The ATIME register will be used to time the interval
between proximity detection events even if the ALS function is
disabled.
Figure 37:
Proximity Pulse Count Register
76 5 4321 0
Reserved WLONG Reserved
Field Bits Description
Reserved 7:2 Reserved. Write as 0.
WLONG 1
Wait Long. When asserted, the wait cycles are increased by a factor 12x from that
programmed in the WTIME register.
Reserved 0 Reserved. Write as 0.
76 5 4321 0
PPULSE
Field Bits Description
PPULSE 7:0 Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
ams Datasheet Page 35
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Register Set
Control Register (0x0F)
The Control register provides eight bits of miscellaneous
control to the analog block. These bits typically control
functions such as gain settings and/or diode selection.
Figure 38:
Control Register
76543210
PDRIVE PDIODE Reserved AGAIN
Field Bits Description
PDRIVE 7:6 LED Drive Strength.
FIELD VALUE LED STRENGTH
00 100 mA
01 50 mA
10 25 mA
11 12.5 mA
PDIODE 5:4 Proximity Diode Select.
FIELD VALUE DIODE SELECTION
00 Reserved
01 Proximity uses the CH0 diode
10 Proximity uses the CH1 diode
11 Proximity uses both diodes
Reserved 3:2 Reserved. Write bits as zero (0:0)
AGAIN 1:0 ALS Gain Control.
FIELD VALUE ALS GAIN VALUE
00 1x gain
01 8x gain
10 16x gain
11 120x gain
Page 36 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Register Set
ID Register (0x12)
The ID Register provides the value for the part number. The ID
register is a read-only register.
Figure 39:
ID Register
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 40:
Status Register
76543210
ID
Field Bits Description
ID 7:0 Part number identification
0x00 = TSL27711 & TSL27715
0x09 = TSL27713 & TSL27717
76543210
Reserved PINT AINT Reserved AVALID
Field Bit Description
Reserved 7:6 Reserved.
PINT 5 Proximity Interrupt. Indicates that the device is asserting a proximity
interrupt.
AINT 4 ALS Interrupt. Indicates that the device is asserting an ALS interrupt.
Reserved 3:1 Reserved.
AVALID 0 ALS Valid. Indicates that the ALS channel has completed an
integration cycle.
ams Datasheet Page 37
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Register Set
ADC Channel Data Registers (0x14 - 0x17)
ALS data is stored as two 16-bit values. To ensure the data is
read correctly, a two-byte read I²C transaction should be used
with auto increment protocol bits set in the command register.
With this operation, when the lower byte register is read, the
upper eight bits are stored in a shadow register, which is read
by a subsequent read to the upper byte. The upper register will
read the correct value even if additional ADC integration cycles
end between the reading of the lower and upper registers.
Figure 41:
ADC Channel Data Registers
Proximity Data Registers (0x18 - 0x19)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte read I²C transaction should be
utilized with auto increment protocol bits set in the command
register. With this operation, when the lower byte register is
read, the upper eight bits are stored into a shadow register,
which is read by a subsequent read to the upper byte. The upper
register will read the correct value even if the next ADC cycle
ends between the reading of the lower and upper registers.
Figure 42:
PDATA Registers
Register Address Bits Description
C0DATA 0x14 7:0 ALS CH0 data low byte
C0DATAH 0x15 7:0 ALS CH0 data high byte
C1DATA 0x16 7:0 ALS CH1 data low byte
C1DATAH 0x17 7:0 ALS CH1 data high byte
Register Address Bits Description
PDATAL 0x18 7:0 Proximity data low byte
PDATAH 0x19 7:0 Proximity data high byte
Page 38 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Application Information Hardware
LED Driver Pin with Proximity Detection
In a proximity sensing system, the IR LED can be pulsed by the
TSL2771 with more than 100 mA of rapidly switching current,
therefore, a few design considerations must be kept in mind to
get the best performance. The key goal is to reduce the power
supply noise coupled back into the device during the LED
pulses.
The first recommendation is to use two power supplies; one for
the device VDD and the other for the IR LED. In many systems,
there is a quiet analog supply and a noisy digital supply. By
connecting the quiet supply to the VDD pin and the noisy supply
to the LED, the key goal can be meet. Place a 1-μF low-ESR
decoupling capacitor as close as possible to the VDD pin and
another at the LED anode, and a 22-μF capacitor at the output
of the LED voltage regulator to supply the 100-mA current
surge.
Figure 43:
Proximity Sensing Using Separate Power Supplies
Application Information
Hardware
TSL2771 INT
SDA
SCL
VDD
LDR
1 mF
Voltage
Regulator
Voltage
Regulator
22 mF
* Cap Value Per Regulator Manufacturer Recommendation
IR LED
GND
VBUS
RPRPRPI
C*
1 mF
ams Datasheet Page 39
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Application Information Hardware
If it is not possible to provide two separate power supplies, the
device can be operated from a single supply. A 22-Ω resistor in
series with the VDD supply line and a 1-μF low ESR capacitor
effectively filter any power supply noise. The previous capacitor
placement considerations apply.
Figure 44:
Proximity Sensing Using Single Power Supply
VBUS in the above figures refers to the I²C bus voltage which is
either VDD or 1.8 V. Be sure to apply the specified I²C bus voltage
shown in the Ordering Information for the specific device being
used.
The I²C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (RP) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for the
interrupt line.
TSL2771 INT
SDA
SCL
V
DD
LDR
1 mF
Voltage
Regulator
22 mF
IR LED
GND
V
BUS
R
P
R
P
R
PI
1 mF
22 W
* Cap Value Per Regulator Manufacturer Recommendation
Page 40 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Application Information Hardware
PCB Pad Layouts
Suggested PCB pad layout guidelines for the Dual Flat No-Lead
(FN) surface mount package are shown in Figure 45.
Note(s): Pads can be extended further if hand soldering is
needed.
Figure 45:
Suggested FN Package PCB Layout
Note(s):
1. All linear dimensions are in micrometers.
2. This drawing is subject to change without notice.
400
2500
400
1000
1700
650
1000
650
ams Datasheet Page 41
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Mechanical Data
Figure 46:
Package FN — Dual Flat No-Lead Packaging Configuration
Note(s):
1. All linear dimensions are in micrometers. Dimension tolerance is ± 20μm unless otherwise noted.
2. The die is centered within the package within a tolerance of ±3 mils.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Mechanical Data
2
2
PACKAGE FN Dual Flat No-Lead
203 8
6 SDA
5 INT
4 LDR
VDD 1
SCL 2
GND 3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Lead Free
Pb
300
50
650
2000
100
2000 100
PIN 1
PIN 1
END VIEW
650 50
PIN OUT
TOP VIEW
750 150
Photodiode Array Area
295
Nominal
466
10
466 10
C
Lof Solder Contacts
C
Lof Photodiode Array Area
(Note B) 20 Nominal
C
Lof Solder Contacts
of Photodiode Array Area (Note B)
C
L
140 Nominal
2
2
Green
RoHS
Page 42 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Mechanical Data
Figure 47:
Package FN Carrier Tape
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
TOP VIEW
DETAIL A
2.18 0.05
Ao
0.254
0.02
5 Max
4.00
8.00
3.50 0.05
1.50
4.00
2.00 0.05
+ 0.30
− 0.10
1.75
B
B
AA
1.00
0.25
DETAIL B
2.18 0.05
Bo
5 Max
0.83 0.05
Ko
ams Datasheet Page 43
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Manufacturing Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 48:
Soldier Reflow Profile
Figure 49:
Solder Reflow Profile Graph
Note(s):
1. Note to scale – for reference only.
Parameter Reference Device
Average temperature gradient in preheating 2.5°C/s
Soak time tsoak 2 to 3 minutes
Time above 217°C (T1)t
1 Max 60 s
Time above 230°C (T2) t2 Max 50 s
Time above Tpeak −10°C (T3)t
3 Max 10 s
Peak temperature in reflow Tpeak 260°C
Temperature gradient in cooling Max −5°C/s
Manufacturing Information
t3
t2
t1
tsoak
T3
T2
T1
Tpeak
Not to scale — for reference o
Time (s)
Temperature (C)
Page 44 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The FN package has been assigned a moisture sensitivity level
of MSL 3 and the devices should be stored under the following
conditions:
•Temperature Range: 5ºC to 50ºC
•Relative Humidity: 60% maximum
•Total Time: 12 months from the date code on the
aluminized envelope — if unopened
•Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 12 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking
is required, it should be done at 50ºC for 12 hours.
ams Datasheet Page 45
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Ordering & Contact Information
Figure 50:
Ordering Information
Note(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Ordering Code Device Address Package - Leads Interface Description
TSL27711FN TSL27711 0x39 FN−6 I²C Vbus = VDD Interface
TSL27713FN TSL27713 0x39 FN−6 I²C Vbus = 1.8 V Interface
TSL27715FN TSL27715 (1) 0x29 FN−6
I²C Vbus = VDD Interface
TSL27717FN TSL27717 (1) 0x29 FN−6 I²C Vbus = 1.8 V Interface
Ordering & Contact Information
Page 46 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
RoHS Compliant & ams Green
Statement
ams Datasheet Page 47
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Copyrights & Disclaimer
Page 48 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Document Status
Document Status Product Status Definition
Product Preview Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Preliminary Datasheet Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Datasheet Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Datasheet (discontinued) Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Document Status
ams Datasheet Page 49
[v1-00] 2016-Mar-22 Document Feedback
TSL2771 − Revision Information
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision
2. Correction of typographical errors is not explicitly mentioned.
Changes from 100B (2011-Feb) to current revision 1-00 (2016-Mar-22) Page
Content of TAOS datasheet was updated to latest ams design
Revision Information
Page 50 ams Datasheet
Document Feedback [v1-00] 2016-Mar-22
TSL2771 − Content Guide
1 General Description
2 Key Benefits & Features
2 Applications
3 Functional Block Diagram
4 Detailed Description
5 Pin Assignments
6Absolute Maximum Ratings
11 Parameter Measurement Information
12 Typical Operating Characteristics
14 Principles Of Operation
14 System State Machine
15 Photodiodes
15 ALS Operation
16 Lux Equation
17 Proximity Detection
19 Interrupts
21 State Diagram
22 Power Management
23 I²C Protocol
25 Register Set
27 Command Register
28 Enable Register (0x00)
29 ALS Timing Register (0x01)
29 Proximity Time Control Register (0x02)
30 Wait Time Register (0x03)
30 ALS Interrupt Threshold Registers (0x04 - 0x07)
31 Proximity Interrupt Threshold Registers (0x08 - 0x0B)
32 Persistence Register (0x0C)
34 Configuration Register (0x0D)
34 Proximity Pulse Count Register (0x0E)
35 Control Register (0x0F)
36 ID Register (0x12)
36 Status Register (0x13)
37 ADC Channel Data Registers (0x14 - 0x17)
37 Proximity Data Registers (0x18 - 0x19)
38 Application Information Hardware
38 LED Driver Pin with Proximity Detection
40 PCB Pad Layouts
41 Mechanical Data
43 Manufacturing Information
44 Moisture Sensitivity
45 Ordering & Contact Information
46 RoHS Compliant & ams Green Statement
47 Copyrights & Disclaimer
48 Document Status
49 Revision Information
Content Guide
