1. General description
The PCA9624 is an I2C-bus controlled 8-bit LED driver optimized for voltage switch
dimming and blinking 100 mA Red/Green/Blue/Amber (RGBA) LEDs. Each LED output
has its own 8-bit resolution (256 steps) fixed frequency individual PWM controller that
operates at 97 kHz with a duty cycle that is adjustable from 0 % to 99.6 % to allow the
LED to be set to a specific brightness value. An additional 8-bit resolution (256 steps)
group PWM controller has both a fixed frequency of 190 Hz and an adjustable frequency
between 24 Hz to once every 10.73 seconds with a duty cycle that is adjustable from 0 %
to 99.6 % that is used to either dim or blink all LEDs with the same value.
Each LED output can be off, on (no PWM control), set at its individual PWM controller
value or at both ind ivi dual an d group PWM controller values. The PCA9624 oper ates with
a supply voltage range of 2.3 V to 5.5 V and the 100 mA open-drain outputs allow
voltages up to 40 V.
The PCA9624 is one of the first LED controller devices in a new Fast-mode Plus (Fm+)
family. Fm+ devices offer higher frequency (up to 1 MHz) and more densely populated
bus operatio n (u p to 40 00 pF).
The active LOW Output Enable input pin (OE) blinks all the LED output s and can be u sed
to externally PWM the outputs, which is useful when multiple devices need to be dimmed
or blinked together without using software control.
Software programmable LED Group and three Sub Call I2C-bus addresses allow all or
defined groups of PCA9624 devices to respond to a common I2C-bus address, allowing
for example, all red LEDs to be turned on or off at the same time or marq ue e ch as ing
effect, thus minimizing I2C-bus commands. Seven hardware address pins allow up to
126 devices on the same bus.
The Software Reset (SWRST) Call allows the master to perform a reset of the PCA9624
through the I2C-bus, identical to the Power-On Reset (POR) that initializes the registers to
their default state causing the outputs to be set HIGH (LED off). This allows an easy and
quick way to reconfigure all device registers to the same condition.
The PCA9624 and PCA9634 software is identical and if the PCA9624 on-chip 100 mA
NAND FETs do not provide enough current or voltage to drive the LEDs, then the
PCA9634 with larger current or higher voltage external drivers can be used.
PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
Rev. 3 — 6 September 2012 Product data sheet
PCA9624 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3 — 6 September 2012 2 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
2. Features and benefits
8 LED drivers. Each output programmable at:
Off
On
Programmable LED brightness
Programmable group dimming/blinking mixed with individual LED brightness
1 MHz Fast-mode Plus compatible I2C-bus interface with 30 mA high drive capability
on SDA output for driving high capacitive buses
256-step (8-bit) linear programmable brightness per LED output varying from fully off
(default) to maximum brightness using a 97 kHz PWM signal
256-step group brightness control allows general dimming (using a 190 Hz PWM
signal) from fully off to maximum brightness (default)
256-step group blinkin g with freq ue ncy pr ogram mab le from 24 Hz to 10.73 s and duty
cycle from 0 % to 99.6 %
Eight open-drain outputs can sink between 0 mA to 100 mA and are tolerant to a
maximum off state voltage of 40 V. No input function.
Output state change programmable on the Acknowledge or the STOP Command to
update outputs byte-by-byte or all at the same time (default to ‘Change on STOP’).
Active LOW Output Enable (OE) input pin allows for hardware blinking and dimming of
the LEDs
7 hardware address pins allow 126 PCA9624 devices to be connected to the same
I2C-bus and to be individually programmed
4 software programmable I2C-bus addresses (one LED Group Call address and three
LED Sub Call addresses) allow groups of devices to be addressed at th e same time in
any combination (for example, one register used for ‘All Call’ so that all the PCA9624s
on the I2C-bus can be addressed at the same time and the second register used for
three different addresses so that 13 of all devices on the bus can be addressed at the
same time in a group). Software enable and disable for I2C-bus address.
Software Reset feature (SWRST Call) allows the device to be reset through the
I2C-bus
25 MHz internal oscillator requires no external components
Internal power- on res et
Noise filter on SDA/SCL inputs
No glitch on power-up
Supports hot insertion
Low standby current
Operating power supply voltage (VDD) range of 2.3 V to 5.5 V
5.5 V tolerant inputs on non-LED pins
40 C to +85 C operation
ESD protection exceeds 2000 V HBM per JESD22- A114 and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Packages offered: TSSOP24, HVQFN24
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Product data sheet Rev. 3 — 6 September 2012 3 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
3. Applications
RGB or RGBA LED drivers
LED status information
LED displays
LCD backlights
Keypad backlights for cellular phones or handheld devices
4. Ordering information
5. Block diagram
Table 1. Ordering information
Type number Topside mark Package
Name Description Version
PCA9624BS 9624 HVQFN24 plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4 40.85 mm SOT616-3
PCA9624PW PCA9624PW TSSOP24 plastic thin shrink small outline package; 24 leads;
body width 4.4 mm SOT355-1
Remark: Only one LED output shown for clarity.
Fig 1. Block diagram of PCA9624
A0 A1 A2 A3 A4 A5 A6
002aad591
I
2
C-BUS
CONTROL
INPUT FILTER
PCA9624
POWER-ON
RESET
SCL
SDA
V
DD
V
SS
LED
STATE
SELECT
REGISTER
PWM
REGISTER X
BRIGHTNESS
CONTROL
GRPFREQ
REGISTER GRPPWM
REGISTER
MUX/
CONTROL
OE
'0' – permanently OFF
'1' – permanently ON
LEDn
190 Hz
24.3 kHz
97 kHz
25 MHz
OSCILLATOR
FET
DRIVER
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Product data sheet Rev. 3 — 6 September 2012 4 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
6. Pinning information
6.1 Pinning
6.2 Pin description
Fig 2. Pin configuration for TSSOP Fig 3. Pin configuration for HVQFN24
VDD
SDA
SCL
A6
A5
OE
VSS
LED7
LED6
LED5
LED4
VSS
VSS
A0
A1
A2
A3
A4
VSS
LED0
LED1
LED2
LED3
VSS
PCA9624PW
002aad593
1
2
3
4
5
6
7
8
9
10
11
12
14
13
16
15
18
17
20
19
22
21
24
23
002aad594
PCA9624BS
Transparent top view
LED6
LED0
LED1
LED7
VSS VSS
A4 OE
A3 A5
A2 A6
LED2
LED3
VSS
VSS
LED4
LED5
A1
A0
VSS
VDD
SDA
SCL
terminal 1
index area
613
514
4 15
3 16
2 17
118
7
8
9
10
11
12
24
23
22
21
20
19
Table 2. Pin description
Symbol Pin Type Description
TSSOP24 HVQFN24
VSS 1, 7, 12, 13, 18 4, 9, 22, 10, 15 [1] power supply supply ground
A0 2 23 I address input 0
A1 3 24 I address input 1
A2 4 1 I address input 2
A3 5 2 I address input 3
A4 6 3 I address input 4
LED0 8 5 O LED driver 0
LED1 9 6 O LED driver 1
LED2 10 7 O LED driver 2
LED3 11 8 O LED driver 3
LED4 14 11 O LED driver 6
LED5 15 12 O LED driver 7
LED6 16 13 O LED driver 8
LED7 17 14 O LED driver 9
OE 19 16 I active LOW output enable
A5 20 17 I address input 5
A6 21 18 I address input 6
SCL 22 19 I serial clock line
SDA 23 20 I/O serial data line
VDD 24 21 power supply supply voltage
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Product data sheet Rev. 3 — 6 September 2012 5 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
[1] HVQFN24 package supply ground is connected to both VSS pins and exposed center pad. VSS pins must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
7. Functional description
Refer to Figure 1 “Block dia gram of PCA9624.
7.1 Device addresses
Following a START condition, the bus master mus t ou tpu t th e ad dr es s of th e slav e it is
accessing.
There are a maximum of 128 possible programmable addresses using the 7 hardware
address pins. Two of these addresses, Software Reset and LED All Call, cannot be used
because their default power-up state is ON, leaving a maximum of 126 addresses. Using
other reserved addresses, as well as any other Sub Call address, will reduce the total
number of possible addresses even further.
7.1.1 Regular I2C-bus slave address
The I2C-bus slave address of the PCA9 62 4 is shown in Figure 4. To conserve power, no
internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.
Remark: Using reserved I2C-bus addresses will interfere with other devices, but only if
the devices are on the bus and/or the bus will be open to other I2C-bus systems at some
later date. In a closed system where the designer controls the address assignment these
addresses can be used since the PCA9624 treats them like any other address. The
LED All Call, Software Rest and PCA9 564 or PCA9665 slave address (if on the bus) can
never be used for individual device addresses.
PCA9624 LED All Call address (1110 000) and Sof tware Reset (0000 01 10) which are
active on start-up
PCA9564 (0000 000) or PCA9665 (1110 000) slave address which is active on
start-up
‘reserved for future use’ I2C- bus addresses (0000 011, 1111 1XX)
slave devices that use the 10-bit addressing scheme (1111 0XX)
slave devices that are designed to respond to the General Call address (0000 000)
High-speed mode (Hs-mode) master code (0000 1XX)
Fig 4. Slave address
R/W
002aab319
A6 A5 A4 A3 A2 A1 A0
hardware selectable
slave address
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Product data sheet Rev. 3 — 6 September 2012 6 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
The last bit of the addre ss byte defines the op eration to be per formed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
7.1.2 LED All Call I2C-bus address
Default power-up value (ALLCALLADR register): E0h or 1110 000
Programmable through I2C-bus (volatile programming)
At power-up, LED All Call I2C-bus address is ena bled. PCA9624 se nds an ACK whe n
E0h (R/W = 0) or E1h (R/W = 1) is sent by the master.
See Section 7.3.8 “ALLCALLADR, LED All Call I2C-bus address for more detail.
Remark: The default LED All Call I2C-bus address (E0h or 1110 000) must not be used as
a regular I2C-bus slave address since this address is enabled at power-up. All the
PCA9624s on the I2C-bus will acknowledge the address if sent by the I2C-bus master.
7.1.3 LED Sub Call I2C-bus addresses
3 different I2C-bus addresses can be used
Default power-up values:
SUBADR1 register: E2h or 1110 001
SUBADR2 register: E4h or 1110 010
SUBADR3 register: E8h or 1110 100
Programmable through I2C-bus (volatile programming)
At power-up, Sub Call I2C-bus addresses are disabled. PCA9624 does not send an
ACK when E2h (R/W =0) or E3h (R/W= 1), E4h (R/W = 0) or E5h (R/W =1), or
E8h (R/W = 0) or E9h (R/W = 1 ) is sen t by th e ma st er.
See Section 7.3.7 “SUBADR1 to SUBADR3, I2C-bus su ba dd r ess 1 to 3 for more detail.
Remark: The default LED Sub Call I2C-bus addresses may be used as regular I2C-bus
slave addresses as long as they are disabled.
7.1.4 Software Reset I2C-bus address
The address shown in Figure 5 is used when a re set of the PCA9624 needs to be
performed by the master. The Software Reset address (SWRST Call) must be used with
R/W = logic 0. If R/W = logic 1, the PCA9624 does not acknowledge the SWRST. See
Section 7.6 “Software reset for more detail.
Remark: The Software Reset I2C-bus address is a rese rved address and ca nnot be used
as a regular I2C-bus slave address or as an LED All Call or LED Sub Call address.
Fig 5. Software Reset address
0
002aab416
0000011
R/W
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Product data sheet Rev. 3 — 6 September 2012 7 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.2 Control register
Following the successful acknowledgement of the slave address, L ED All Call address or
LED Sub Call address, the bus master will send a byte to the PCA9624, which will be
stored in the Control register.
The lowest 5 bits are used as a pointer to determine which register will be accessed
(D[4:0]). The highest 3 bits are used as Auto-Increment flag and Auto-Increment options
(AI[2:0]).
When the Auto-Increment flag is set (AI2 = logic 1), the five low order bits of the Control
register are au to ma tic ally incre m en te d after a read or write. This allows the user to
program the registers sequentially. Four different types of Auto-Increme nt ar e po ssible,
depending on AI1 and AI0 values.
Remark: Other combinations not shown in Table 3 (AI[2:0] = 001, 010, and 011) are
reserved and must not be used for proper device operation.
AI[2:0] = 000 is used when the same register must be accessed several times during a
single I2C-bus communication, for exa mple, changes the brightness of a single LED. Dat a
is overwritten each time the register is accessed during a write operation.
AI[2:0] = 100 is used when all the registers must be sequentially accessed, for example,
power-up programming.
AI[2:0] = 101 is used when the 16 LED drivers must be individually programmed with
different values during the same I2C-bus communication, for example, changing color
setting to another color setting.
reset state = 80h
Remark: The Control register does not apply to the Software Reset I2C-bus address.
Fig 6. Control register
Table 3. Auto-Increment options
AI2 AI1 AI0 Function
0 0 0 no Auto-Increment
1 0 0 Auto-Increment for al l registers. D[4:0] roll over to 00h after the last
register (11h) is accessed.
1 0 1 Auto-Increment for individual brightness registers only. D[4:0] roll over to
02h after the last register (11h) is accessed.
1 1 0 Auto-Increment fo r global control registers only. D[4:0] roll over to 0Ah’
after the last register (0Bh) is accessed.
1 1 1 Auto-Increment for individual and global control registers only. D[4:0] roll
over to 02h after the last register (0Bh) is accessed.
002aac147
AI2 AI1 AI0 D4 D3 D2 D1 D0
Auto-Increment flag
register address
Auto-Increment options
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Product data sheet Rev. 3 — 6 September 2012 8 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
AI[2:0] = 110 is used when the LED drivers must be globally programmed with different
settings during the same I2C-bus communication, for example, global brightness or
blinking change.
AI[2:0] = 111 is used when individual and global changes must be performed during the
same I2C-bus communication, for exam ple, ch angi ng a color and global brightness at the
same time.
Only the 5 least signific an t bits D[4:0] are affected by the AI[2:0] bits.
When the Control register is written, the register entry point determined by D[4:0] is the
first register that will be addres sed (read or write operation), and can be anywhere
between 0 0000 and 1 0001 (as defined in Table 4). When AI[2] = 1, the Auto-Increment
flag is set and the rollover value at which the register increment stop s and goes to the next
one is determined by AI[2:0]. See Table 3 for rollover values. For example, if the Control
register = 1110 0100 (E4h), then the register addressing sequence will be (in
hexadecimal):
04 0B 02 0B 02 0B 02 0B 02 … as long
as the master keeps sending or reading data.
7.3 Register definitions
[1] Only D[4:0] = 0 0000 to 1 0001 are allowed and will be acknowledged. D[4:0] = 1 0010 to 1 1111 are reserved and will not be
acknowledged.
[2] When writing to the Control register, bit 4 must be programmed with logic 0 for proper device operation.
Table 4. Register summary[1][2]
Register number D4 D3 D2 D1 D0 Name Type Function
00h 0 0 0 0 0 MODE1 read/write Mode register 1
01h 0 0 0 0 1 MODE2 read/write Mode register 2
02h 0 0 0 1 0 PWM0 read/write brightness control LED0
03h 0 0 0 1 1 PWM1 read/write brightness control LED1
04h 0 0 1 0 0 PWM2 read/write brightness control LED2
05h 0 0 1 0 1 PWM3 read/write brightness control LED3
06h 0 0 1 1 0 PWM4 read/write brightness control LED4
07h 0 0 1 1 1 PWM5 read/write brightness control LED5
08h 0 1 0 0 0 PWM6 read/write brightness control LED6
09h 0 1 0 0 1 PWM7 read/write brightness control LED7
0Ah 0 1 0 1 0 GRPPWM read/write group duty cycle control
0Bh 0 1 0 1 1 GR PF REQ read/write group frequency
0Ch 0 1 1 0 0 LEDOUT0 read/write LED output state 0
0Dh 0 1 1 0 1 LEDOUT1 read/write LED output state 1
0Eh 01110SUBADR1 read/writeI
2C-bus subaddress 1
0Fh 01111SUBADR2 read/writeI
2C-bus subaddress 2
10h 10000SUBADR3 read/writeI
2C-bus subaddress 3
11h 1 0 0 0 1 ALLCALLADR read/write LED All Call I2C-bus address
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Product data sheet Rev. 3 — 6 September 2012 9 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.3.1 Mode register 1, MODE1
[1] It takes 500 s max. for the oscillator to be up and running once SLEEP bit has been set to logic 0. T imings
on LEDn outputs are not guaranteed if PWMx, GRPPWM or GRPFREQ registers are accessed within the
500 s window.
[2] No blinking or dimming is possible when the oscillator is off.
7.3.2 Mode register 2, MODE2
[1] Change of the outputs at the STOP command allows synchronizing outputs of more than one PCA9624.
Applicable to registers from 02h (PWM0) to 08h (LEDOUT) only.
[2] Remark: If you change these bits from their default values, the device will not perform as expected.
Table 5. MODE1 - Mode regis te r 1 (address 00h) bit description
Legend: * default value.
Bit Symbol Access Value Description
7 AI2 read only 0 Register Auto-Increment disabled.
1* Register Auto-Increment enabled.
6 AI1 read only 0* Auto-Increment bit 1 = 0 .
1 Auto-Increment bit 1 = 1.
5 AI0 read only 0* Auto-Increment bit 0 = 0 .
1 Auto-Increment bit 0 = 1.
4 SLEEP R/W 0 Normal mode[1].
1* Low power mode. Oscillator off[2].
3 SUB1 R/W 0* PCA9624 does not respo nd to I2C-bus subaddress 1.
1 PCA9624 responds to I2C-bus subaddress 1.
2 SUB2 R/W 0* PCA9624 does not respo nd to I2C-bus subaddress 2.
1 PCA9624 responds to I2C-bus subaddress 2.
1 SUB3 R/W 0* PCA9624 does not respo nd to I2C-bus subaddress 3.
1 PCA9624 responds to I2C-bus subaddress 3.
0 ALLCALL R/W 0 PCA9624 does not respond to LED All Call I2C-bus
address.
1* PCA9624 responds to LED All Call I2C-bus address.
Table 6. MODE2 - Mode regis te r 2 (address 01h) bit description
Legend: * default value.
Bit Symbol Access Value Description
7 - read only 0* reserved
6 - read only 0* reserved
5 DMBLNK R/W 0* group control = dimming.
1 group control = blinking.
4 INVRT R/W 0* reserved; write must always be a logic 0
3 OCH R/W 0* outputs change on STOP command[1]
1 outputs change on ACK
2 - R/W 1* reserved; write must always be a logic 1[2]
1 - R/W 0* reserved; write must always be a logic 0[2]
0 - R/W 1* reserved; write must always be a logic 1[2]
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Product data sheet Rev. 3 — 6 September 2012 10 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.3.3 PWM0 to PWM7, individual brightness control
A 97 kHz fixed frequency signal is used for each output. Duty cycle is controlled through
256 linear steps from 00h (0 % duty cycle = LED output off) to FFh
(99.6 % duty cycle = LED output at maximum brightness). Applicable to LED outputs
programmed with LDRx = 10 or 11 (LEDOUT0 to LEDOUT3 registers).
(1)
7.3.4 GRPPWM, group duty cycle control
When DMBLNK bit (MODE2 register) is programmed with logic 0, a 190 Hz fixed
frequency signa l is supe rim p os ed with the 97 kHz individual brightness control signal.
GRPPWM is then used as a global brightness control allowing the LED outputs to be
dimmed with the same value. The value in GRPFREQ is then a ‘Don’t care’.
General brightness for the 16 outputs is controlled through 256 linear steps from 00h
(0 % duty cycle = LED output off) to FFh (99.6 % duty cycle = maximum brightness).
Applicable to LED outputs programmed with LDRx = 11 (LEDOUT0 to LEDOUT3
registers).
When DMBLNK bit is programmed with logic 1, GRPPWM and GRPFREQ registers
define a global blinking pattern, where GRPFREQ contains the blinking period (from
24 Hz to 10.73 s) and GRPPWM the duty cycle (ON/OFF ratio in %).
(2)
Table 7. PWM0 to PWM7 - PWM registers 0 to 7 (address 02h to 09h) bit description
Legend: * default value.
Address Register Bit Symbol Access Value Description
02h PWM0 7:0 IDC0[7:0] R/W 0000 0000* PWM0 Individual Duty Cycle
03h PWM1 7:0 IDC1[7:0] R/W 0000 0000* PWM1 Individual Duty Cycle
04h PWM2 7:0 IDC2[7:0] R/W 0000 0000* PWM2 Individual Duty Cycle
05h PWM3 7:0 IDC3[7:0] R/W 0000 0000* PWM3 Individual Duty Cycle
06h PWM4 7:0 IDC4[7:0] R/W 0000 0000* PWM4 Individual Duty Cycle
07h PWM5 7:0 IDC5[7:0] R/W 0000 0000* PWM5 Individual Duty Cycle
08h PWM6 7:0 IDC6[7:0] R/W 0000 0000* PWM6 Individual Duty Cycle
09h PWM7 7:0 IDC7[7:0] R/W 0000 0000* PWM7 Individual Duty Cycle
duty cycle IDCx 7:0
256
---------------------------
=
Table 8. GRPPWM - Group brightness control register (address 0Ah) bit descriptio n
Legend: * default value
Address Register Bit Symbol Access Value Description
0Ah GRPPWM 7:0 GDC[7:0] R /W 11111111 GRPPWM re gister
duty cycle GDC 7:0
256
--------------------------
=
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Product data sheet Rev. 3 — 6 September 2012 11 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.3.5 GRPFREQ, group frequency
GRPFREQ is used to program the global blinking period when DMBLNK bit (MODE2
register) is equal to 1. Value in this register is a ‘Don’t care’ when DMBLNK = 0.
Applicable to LED outputs programmed with LDRx = 11 (LEDOUT0 to LEDOUT3
registers).
Blinking period is controlled through 256 linear steps from 00h (41 ms, frequency 24 Hz)
to FFh (10.73 s).
(3)
7.3.6 LEDOUT0 and LEDOUT1, LED driver output state
LDRx = 00 — LED driver x is off (default power-up state ).
LDRx = 01 — LED driver x is fully on (individual brightness and group dimming/blinking
not controlled ).
LDRx = 10 — LED driver x individual brightness can be controlled through its PWMx
register.
LDRx = 11 — LED driver x individual brightness and group dimming/blinking can be
controlled through its PWMx register and the GRPPWM registers.
Table 9. GRPFREQ - Group Frequency re gister (address 0Bh) bit description
Legend: * default value.
Address Register Bit Symbol Access Value Description
0Bh GRPFREQ 7:0 GFRQ[7:0] R/W 0000 0000* GRPFREQ register
global blinking period GFRQ 7:01+
24
----------------------------------------s=
Table 10. LEDOUT0 to LEDOUT1 - LED driver output state register (address 0Ch to 0Dh)
bit description
Legend: * default value.
Address Register Bit Symbol Access Value Description
0Ch LEDOUT0 7:6 LDR3 R/W 00* LED3 output state control
5:4 LDR2 R/W 00* LED2 output state control
3:2 LDR1 R/W 00* LED1 output state control
1:0 LDR0 R/W 00* LED0 output state control
0Dh LEDOUT1 7:6 LDR7 R/W 00* LED7 output state control
5:4 LDR6 R/W 00* LED6 output state control
3:2 LDR5 R/W 00* LED5 output state control
1:0 LDR4 R/W 00* LED4 output state control
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Product data sheet Rev. 3 — 6 September 2012 12 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.3.7 SUBADR1 to SUBADR3, I2C-bus subaddress 1 to 3
Subaddresses are programmable through the I2C-bus. Default power-up va lues are E2h,
E4h, E8h, and the device(s) will not acknowledge these addresses right after power-up
(the corresponding SUBx bit in MODE1 register is equal to 0).
Once subaddresses have been programmed to their right values, SUBx bits need to be
set to logic 1 in order to have the device acknowledging these addresses (MODE1
register).
Only the 7 MSBs representing the I2C-bus subaddress are valid. The LSB in SUBADRx
register is a read-only bit (0).
When SUBx is set to logic 1, the corresponding I2C-bus subaddress can be used during
either an I2C-bus re ad or writ e se qu en ce .
7.3.8 ALLCALLADR, LED All Call I2C-bus address
The LED All Call I2C-bus address allows all the PCA9624s on the bus to be programmed
at the same time (ALLC A LL bit in re gist er MOD E 1 m ust be eq ua l to 1 (p ow er -u p de fa ult
state)). This address is programmable through the I2C-bus and can be used during either
an I2C-bus read or write sequence. The register address can also be programmed as a
Sub Call.
Only the 7 MSBs representing the All Call I2C-bus address are valid. The LSB in
ALLCALLADR register is a read-only bit (0).
If ALLCALL bit = 0, the device does n ot acknowledge the ad dress programmed in register
ALLCALLADR.
Table 11. SUBADR1 to SUBADR3 - I2C-bus subad dress registers 0 to 3 (address 0Eh to
10h) bit description
Legend: * default value.
Address Register Bit Symbol Access Value Description
0Eh SUBADR1 7:1 A1[7:1] R/W 1110 001* I2C-bus subaddress 1
0 A1[0] R only 0* reserved
0Fh SUBADR2 7:1 A2[7:1] R/W 1110 010* I2C-bus subaddress 2
0 A2[0] R only 0* reserved
10h SUBADR3 7:1 A3[7:1] R/W 1110 100* I2C-bus subaddress 3
0 A3[0] R only 0* reserved
Table 12. ALLCALLADR - LED All Call I2C-bus address register (address 11h )
bit description
Legend: * default value.
Address Register Bit Symbol Access Value Description
11h ALLCALLADR 7:1 AC[7:1] R/W 1110 000* ALLCALL I2C-bus
address register
0 AC[0] R only 0* reserved
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Product data sheet Rev. 3 — 6 September 2012 13 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.4 Active LOW output enable input
The active LOW output enable (OE) pin, allows to e nable or disable all the LED output s at
the same time.
When a LOW level is applied to OE pin, all the LED outputs are ena bled.
When a HIGH level is applied to OE pin, all the LED outputs are high-impedance.
The OE pin can be used as a synchron izat i on si gnal to switch on/off several PCA9624
devices at the same time . T his requir es an external clock reference that provides blinking
period and the duty cycle.
The OE pin can also be used as an e xterna l dim ming con tr ol signal. T he fr equen cy o f th e
external clock must be high enough not to be seen by the human eye, and the duty cycle
value determines the brightness of the LEDs.
Remark: Do not use OE as an external blinking control signal when internal global
blinking is selected (DMBLNK = 1, MODE2 register) since it will result in an undefined
blinking pattern. Do not use OE as an externa l dimming control signal when internal global
dimming is selected (DMBLNK = 0, MODE2 register) since it will result in an undefined
dimming pattern.
Remark: During power-down, slow decay of volt age supplies may keep LEDs illuminated.
Consider disabling LED outputs using HIGH level applied to OE pin.
7.5 Power-on reset
When power is applied to VDD, an internal power-on reset holds the PCA9624 in a reset
condition until VDD has reached VPOR. At this point, the re set condition is released and the
PCA9624 registers and I2C-bus state machine are initialized to their default states (all
zeroes) causing all the chann els to be deselected. Thereaf ter , V DD must be lowered below
0.2 V to reset the device.
7.6 Software reset
The Software Reset Call (SWRST Call) allows all the devices in the I2C-bus to be reset to
the power-up st ate value through a specific formatted I2C-bus comman d. To be performe d
correctly, it implies that the I2C-bus is functional and that there is no device hanging the
bus.
The SWRST Call function is defined as the following:
1. A START command is sent by the I2C-bus master.
2. The reserved SWRST I2C-bus address ‘0000 011’ with the R/W bit set to ‘0’ (write) is
sent by the I2C-bus master.
3. The PCA9624 device(s) acknowledge(s) after seeing the SWRST Call address
‘0000 0110’ (06h) o nly. If the R/W bit is set to ‘1’ (read), no acknowled ge is returned to
the I2C-bus master.
4. Once the SWRST Call address has been sent and acknowledged, the master sends
2 bytes w ith 2 sp ecif ic valu es (SWRST da ta byte 1 and byte 2):
a. Byte 1 = A5h: the PCA9624 acknowledges this value only. If byte 1 is not equal to
A5h, the PCA9624 does not acknowledge it.
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Product data sheet Rev. 3 — 6 September 2012 14 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
b. Byte 2 = 5Ah: the PCA9624 acknowledges this value only. If byte 2 is not equal to
5Ah, then the PCA9624 does not acknowledge it.
If more than 2 bytes of data are sent, the PCA9624 does not acknowledge any more.
5. Once the right 2 bytes (SWRST data byte 1 and byte 2 only) have been sent and
correctly acknowledged, the master sends a STOP command to end the
SWRST Call: the PCA9624 then resets to the default value (power-up value) and is
ready to be addressed again within the specified bus free time (tBUF).
The I2C-bus master must interpret a non- acknowledge from th e PCA9624 (at any time) a s
a ‘SWRST Call Abort’. The PCA9624 does not initiate a reset of its registers. This
happens only when the format of the SWRST Call sequence is not correct.
7.7 Individual brightness control with group dimming/blinking
A 97 kHz fixed frequency signal with programmable duty cycle (8 bits, 256 steps) is used
to control individually the brightness for each LED.
On top of this signal, one of the following si gnals can be super imposed (this sig nal can be
applied to the 4 LED outputs):
A lower 190 Hz fixe d fr eq ue n cy sign a l with prog ra m ma b le du ty cyc le (8 bits,
256 steps) is used to provide a global br ightness control.
A programmable frequency signal from 24 Hz to 110.73 Hz (8 bits, 256 steps) with
programmable duty cycle (8 bits, 256 steps) is used to provide a global blinking
control.
Minimum pulse width for LEDn Brightness Control is 40 ns.
Minimum pulse width for Group Dimming is 20.48 s.
When M = 1 (GRPPWM register value), the resulting LEDn Brightness Control + Group D imming signal will have 2 pulses of
the LED Brightness Control signal (pulse width = N 40 ns, with ‘N’ defined in PWMx register).
This resulting Brightness + Group Dimming signal above shows a resulting Control signal with M = 4 (8 pulses).
Fig 7. Brightness + Group Dimming signals
123456789101112 507508509510511512 1234567891011
Brightness Control signal (LEDn)
M × 256 × 2 × 40 ns
with M = (0 to 255)
(GRPPWM Register)
N × 40 ns
with N = (0 to 255)
(PWMx Register)
256 × 40 ns = 10.24 μs
(97.6 kHz)
1234567812345678
Group Dimming signal
resulting Brightness + Group Dimming signal
256 × 2 × 256 × 40 ns = 5.24 ms (190.7 Hz)
002aab417
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Product data sheet Rev. 3 — 6 September 2012 15 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
8. Characteristics of the I2C-bus
The I2C-bus is for 2 -way, 2-line communication between differe nt ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
8.1 Bit transfer
One data bi t is transferred durin g each clock pulse . The data o n the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 8).
8.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HI GH is defined as the STAR T condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 9).
8.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 10).
Fig 8. Bit transfer
mba607
data line
stable;
data valid
change
of data
allowed
SDA
SCL
Fig 9. Definition of START and STOP conditions
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Product data sheet Rev. 3 — 6 September 2012 16 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
8.3 Acknowledge
The number of data bytes transferre d be twe en the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addresse d must gener ate an acknowledg e af ter the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocke d ou t of th e sla ve tr an smitter. The device that acknowledges has to
pull down the SDA line during the acknowledge cl ock pulse , so that the SDA line is st able
LOW during the HIGH period of the acknowledge related clock pulse; set-up time a nd hold
time must be taken into account.
A master receiver must signal an end of data to the transmitter by not gener ating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter mus t leave the data line HIGH to enable the master to generate a ST OP
condition.
Fig 10. System configuration
002aaa966
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER MASTER
TRANSMITTER/
RECEIVER
SDA
SCL
I2C-BUS
MULTIPLEXER
SLAVE
Fig 11. Acknowledgement on the I2C-bus
002aaa987
S
START
condition
9821
clock pulse for
acknowledgement
not acknowledge
acknowledge
data output
by transmitter
data output
by receiver
SCL from master
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Product data sheet Rev. 3 — 6 September 2012 17 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
9. Bus transactions
(1) See Table 4 for register definition.
Fig 12. Write to a specific register
A5 A4 A3 A2 A1 A0 0 AS A6
slave address
START condition R/W
acknowledge
from slave
002aac148
data for register D[4:0](1)
X X D4 D3 D2 D1 D0X
control register
Auto-Increment flag
Auto-Increment options
A
acknowledge
from slave
A
acknowledge
from slave
P
STOP
condition
Fig 13. Write to all registers using the Auto-Increment feature
A5 A4 A3 A2 A1 A0 0 AS A6
slave address
START condition R/W
acknowledge
from slave
002aac149
MODE1 register
0 0 0 0 0 0 01
control register
Auto-Increment on
Auto-Increment
on all registers
A
acknowledge
from slave
A
acknowledge
from slave
P
STOP
condition
(cont.)
(cont.)
MODE1
register
selection
MODE2 register
A
acknowledge
from slave
SUBADR3 register
A
acknowledge
from slave
ALLCALLADR register
A
acknowledge
from slave
Fig 14. Multiple writes to Individual Brightness registers only using the Auto-Increment feature
A5 A4 A3 A2 A1 A0 0 AS A6
slave address
START condition R/W
acknowledge
from slave
002aad597
PWM0 register
0 1 0 0 0 1 01
control register
Auto-Increment on
increment
on Individual
brightness
registers only
A
acknowledge
from slave
A
acknowledge
from slave
P
STOP
condition
(cont.)
(cont.)
PWM0
register
selection
PWM1 register
A
acknowledge
from slave
PWM6 register
A
acknowledge
from slave
PWM7 register
A
acknowledge
from slave
PWM0 register
A
acknowledge
from slave
PWMx register
A
acknowledge
from slave
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Product data sheet Rev. 3 — 6 September 2012 18 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
Fig 15. Read all registers using the Auto-Increme nt feature
A5 A4 A3 A2 A1 A0 0 AS A6
slave address
START condition R/W
acknowledge
from slave
002aac151
0 0 0 0 0 0 01
control register
Auto-Increment on
Auto-Increment
on all registers
A
acknowledge
from slave
(cont.)
(cont.)
MODE1
register
selection
data from MODE1 register
A
acknowledge
from master
Sr
ReSTART
condition
A5 A4 A3 A2 A1 A0 1 AA6
slave address
R/W
acknowledge
from slave
data from MODE2 register
A
acknowledge
from master
data from PWM0
A
acknowledge
from master
data from
ALLCALLADR register
A
acknowledge
from master
data from
MODE1 register
A
acknowledge
from master
(cont.)
(cont.)
data from last read byte
A
not acknowledge
from master
P
STOP
condition
(1) In this example, several PCA9624s are used and the same sequence (A) (above) is sent to each of them.
(2) ALLCALL bit in MODE1 register is equal to 1 for this example.
(3) OCH bit in MODE2 register is equal to 1 for this example.
Fig 16. LED All Call I2C-bus address programming and LED All Call sequence example
A5 A4 A3 A2 A1 A0 0 AS A6
slave address(1)
START condition R/W
acknowledge
from slave
002aad598
X X 1 1 0 1 1X
control register
Auto-Increment on
A
acknowledge
from slave
ALLCALLADR
register selection
0 1 0 1 0 1 X1
new LED All Call I2C address(2)
P
STOP
condition
A
acknowledge
from slave
0 1 0 1 0 1 0 AS 1
LED All Call I2C address
START condition R/W
acknowledge
from the
4 devices
X X 0 1 0 0 0X
control register
A
acknowledge
from the
4 devices
LEDOUT
register selection
1 0 1 0 1 0 10
LEDOUT register (LED fully ON)
P
STOP
condition
A
acknowledge
from the
4 devices
the 8 LEDs are on at the acknowledge(3)
sequence (A)
sequence (B)
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Product data sheet Rev. 3 — 6 September 2012 19 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
10. Application design-in information
(1) OE requires pull-up resistor if control signal from the master is open-drain.
I2C-bus address = 0010 101x.
Remark: During power-down, slow decay of voltage supplies may keep LEDs illuminated. Consider disabling LED outputs
using HIGH level applied to OE pin.
Fig 17. Typical application
PCA9624
LED0
LED1
SDA
SCL
OE
VDD = 2.5 V, 3.3 V or 5.0 V
I2C-BUS/SMBus
MASTERSDA
SCL
10 kΩ
OE
10 kΩ
LED2
LED3
A0
A1
A2
VDD
A3
A4
A5
A6
VSS
10 kΩ(1)
up to 40 V
LED4
LED5
LED6
LED7
002aad599
VSS
up to 40 V
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Product data sheet Rev. 3 — 6 September 2012 20 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
10.1 Junction temperature calculation
A device junction temperature can be calculated when the ambient temperature or the
case temperature is known.
When the ambient temperature is known, the junction temperature is calculated using
Equation 4 and the ambient tem p er at ur e , junc tio n to amb i en t ther ma l res i stance and
power dissipation.
(4)
where:
Tj = junction temperature
Tamb = ambient temperature
Rth(j-a) = junction to ambient thermal resistance
Ptot = (device) total power dissipation
When the case temperature is known, the junction temperature is calculated using
Equation 5 and the case temperature, junction to case thermal resistance and power
dissipation.
(5)
where:
Tj = junction temperature
Tcase = case temperature
Rth(j-c) = junction to case thermal resistance
Ptot = (device) total power dissipation
Here are two examples regarding how to calculate the junction temperatu re using junction
to case and junction to ambient thermal resistance. In the first example (Section 10.1.1),
given the operating condition and the junction to ambient thermal resistance, the junction
temperature of PCA9624PW, in the TSSOP24 package, is calculated for a system
operating cond itio n in 50 C1 ambient temperature. In the second example
(Section 10.1.2), based on a specific customer application requir ement where only the
case temperature is known, applying the junction to case thermal resistance equation, th e
junction temperature of the PCA9624PW, in the TSSOP24 package, is calculated.
1. 50 C is a typical temperature inside an enclosed system. The designers should feel free, as needed, to perform their own
calculation using the examples.
TjTamb Rth j-aPtot
+=
TjTcase Rth j-cPtot
+=
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Product data sheet Rev. 3 — 6 September 2012 21 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
10.1.1 Example 1: Tj calculation of PCA9624DR, in TSSOP24 package, when Tamb
is known
Rth(j-a) = 108 C/W
Tamb = 50 C
LED output low voltage (LED VOL) = 0.5 V
LED output current per channel = 80 mA
Number of outputs = 8
IDD(max) = 10 mA
VDD(max) = 5.5 V
I2C-bus clock (SCL) maximum sink current = 25 mA
I2C-bus data (SDA) maximum sink current = 25 mA
1. Find Ptot (device total power dissipation):
output total power = 80 m A 80.5 V = 320 mW
chip core power consumption = 10 mA 5.5 V = 55 mW
SCL power dissipation = 25 mA 0.4 V = 10 mW
SDA power dissipation = 25 mA 0.4 V = 10 mW
Ptot = (320 + 5 5 + 10 + 10) mW = 395 mW
2. Find Tj (junction temperature):
Tj = (Tamb +R
th(j-a) Ptot) = (50 C + 108 C/W 39 5 mW) = 92.7 C
10.1.2 Example 2: Tj calculation where only Tcase is known
This example uses a customer’s specific application of the PCA9624PW, 8-channel LED
controller in the TSSOP24 package, where only the case temperature (Tcase) is known.
Tj = Tcase + Rth(j-c) Ptot, where:
Rth(j-c) = 30 C/W
Tcase (measured) = 94.6 C
VOL of LED ~ 0.5 V
IDD(max) = 10 mA
VDD(max) = 5.5 V
LED output voltage LOW = 0.5 V
LED output current:
60 mA on 1 port = (60 mA 1)
50 mA on 6 ports = (50 mA 6)
40 mA on 1 port = (40 mA 1)
I2C-bus maximum sink current on clock line = 25 mA
I2C-bus maximum sink current on da ta line = 25 mA
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Product data sheet Rev. 3 — 6 September 2012 22 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
1. Find Ptot (device total power dissipation)
output current (60 mA 1 port); output power (60 mA 10.5 V) = 30 mW
output current (50 mA 6 ports); output power (50 mA 60.5 V) = 150 mW
output current (40 mA 1 port); output power (40 mA 10.5 V) = 20 mW
Output total power = 200 mW
chip core power consumption = 10 mA 5.5 V = 55 mW
SCL power dissipation = 25 mA 0.4 V = 10 mW
SDA power dissipation = 25 mA 0.4 V = 10 mW
Ptot (device total power dissipation) = 275 mW
2. Find Tj (junction temperature):
Tj = Tcase + Rth(j-a) Ptot = 94.6 C + 30 C/W 275 mW = 102.85 C
11. Limiting values
[1] Each bit must be limited to a maximum of 100 mA and the total package limited to 800 mA due to internal
busing limits. The pull-up (current limiting) resistor must be of sufficient size (W) and value () to guarantee
that the 100 mA limit is not exceeded on any output.
[2] Refer to Section 10.1 for calculation.
Table 13. Limiting va lues
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +6.0 V
VI/O voltage on an input/output pin VSS 0.5 5.5 V
Vdrv(LED) LED driver voltage VSS 0.5 40 V
IO(LEDn) output current on pin LEDn - 100 mA
IOL(tot) total LOW-level output current LED driver outputs;
VOL =0.5V [1] 800 - mA
ISS ground supply current per VSS pin - 800 mA
Ptot total power dissipation Tamb =25C-1.8W
Tamb =85C - 0.72 W
P/ch power dissipation per channel Tamb =25C-100mW
Tamb =85C-45mW
Tjjunction temperature [2] - +125 C
Tstg storage temperature 65 +150 C
Tamb ambient temperature operating 40 +85 C
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Product data sheet Rev. 3 — 6 September 2012 23 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
[1] This value signifies package’s ability to handle more than 100 mA per output driver . The device’s maximum
current rating per output is 100 mA.
12. Thermal characteristics
[1] Calculated in accordance with JESD 51-7.
Table 14. TSSOP24 ver sus HVQFN24 power dissipation and output curren t capability
Measurement TSSOP24 HVQFN24
Tamb = 25 C
maximum power
dissipation
(chip + output drivers)
926 mW 2220 mW
maximum power
dissipation
(output drivers only)
851 mW 2150 mW
maximum drive current
per channel [1] [1]
Tamb = 60 C
maximum power
dissipation
(chip + output drivers)
602 mW 1440 mW
maximum power
dissipation
(output drivers only)
527 mW 1365 mW
maximum drive current
per channel [1] [1]
Tamb = 80 C
maximum power
dissipation
(chip + output drivers)
417 mW 1000 mW
maximum power
dissipation
(output drivers only)
342 mW 925 mW
maximum drive current
per channel [1]
851 mW
8-bit 0.5 V
--------------------------------
212.75 mA=
2150 mW
8-bit 0.5 V
--------------------------------
537.5 mA=
527 mW
8-bit 0.5 V
--------------------------------
131.8 mA=
1365 mW
8-bit 0.5 V
--------------------------------
341.25 mA=
342 mW
8-bit 0.5 V
--------------------------------
85.5 mA=
925 mW
8-bit 0.5 V
--------------------------------
231.3 mA=
Table 15. Th ermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to ambient TSSOP24 [1] 108 C/W
HVQFN24 [1] 45 C/W
Rth(j-c) thermal resistance from junction to case TSSOP24 [1] 30 C/W
HVQFN24 [1] 19.6 C/W
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Product data sheet Rev. 3 — 6 September 2012 24 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
13. Static characteristics
[1] VDD must be lowered to 0.2 V in order to reset part.
[2] Each bit must be limited to a maximum of 100 mA and the total package limited to 800 mA due to internal busing limits.
Table 16. Static characteristics
VDD = 2.3 V to 5.5 V; VSS =0V; T
amb =
40
Cto+85
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supply
VDD supply voltage 2.3 - 5.5 V
IDD supply current on pin VDD; operating mode;
no load; fSCL =1MHz
VDD = 2.7 V - 0.15 4 mA
VDD =3.6V - 0.4 6 mA
VDD =5.5V - 2.0 10 mA
Istb standby current on pin VDD;
no load; fSCL =0Hz;
I/O = inputs; VI=V
DD
VDD =2.7V - 0.3 5 A
VDD =3.6V - 0.6 6 A
VDD =5.5V - 2.1 7 A
VPOR power-on reset voltage no load; VI=V
DD or VSS [1] -1.702.0V
Input SCL; input/outpu t S DA
VIL LOW-level input voltage 0.5 - +0.3VDD V
VIH HIGH-level input voltage 0.7VDD -5.5V
IOL LOW-level output current VOL =0.4V; V
DD =2.3V 20 - - mA
VOL =0.4V; V
DD =5.0V 30 - - mA
ILleakage current VI=V
DD or VSS 1- +1 A
Ciinput capacitance VI=V
SS -6 10pF
LED driver outputs
IOL LOW-level output current VOL =0.5V [2] 100 - - mA
ILOH HIGH-level output leakage
current Vdrv(LED) =5V - - 1A
Vdrv(LED) =40V - 115 A
Ron ON-state resistance Vdrv(LED) =40V; V
DD =2.3V - 2 5
Cooutput capacitance [3] -1540pF
OE input
VIL LOW-level input voltage 0.5 - +0.8 V
VIH HIGH-level input voltage 2 - 5.5 V
ILI input leakage current 1- +1 A
Ciinput capacitance - 3.7 5 pF
Address inputs
VIL LOW-level input voltage 0.5 - +0.3VDD V
VIH HIGH-level input voltage 0.7VDD -5.5V
ILI input leakage current 1- +1 A
Ciinput capacitance - 3.7 5 pF
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Product data sheet Rev. 3 — 6 September 2012 25 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
[3] Tested with outputs off.
a. Tamb =40 Cb.T
amb =25C
c. Tamb =85C
Fig 18. VOL versus IOL
VOL (V)
0.05 0.550.350.15
002aae510
0.05
0.25
0.35
IOL
(A)
0.05
0.15
VDD = 5.5 V
4.5 V
3.0 V
2.3 V
VOL (V)
0.05 0.550.350.15
002aae511
0.05
0.15
0.25
IOL
(A)
0.05
VDD = 5.5 V
4.5 V
3.0 V
2.3 V
VOL (V)
0.05 0.550.350.15
002aae512
0.05
0.15
0.25
IOL
(A)
0.05
VDD = 5.5 V
4.5 V
3.0 V
2.3 V
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Product data sheet Rev. 3 — 6 September 2012 26 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
14. Dynamic characteristics
[1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
Table 17. Dy namic characteristics
Symbol Parameter Conditions St andard-mode
I2C-bus Fast-mode
I2C-bus Fast-mode
Plus I2C-bus Unit
Min Max Min Max Min Max
fSCL SCL clock frequency 0 100 0 400 0 1000 k Hz
tBUF bus free time between a
STOP and START
condition
4.7 - 1.3 - 0.5 - s
tHD;STA hold time (repeated)
START condition 4.0 - 0.6 - 0.26 - s
tSU;STA set-up time for a
repeated START
condition
4.7 - 0.6 - 0.26 - s
tSU;STO set-up time for STOP
condition 4.0 - 0.6 - 0.26 - s
tHD;DAT data hold time 0 - 0 - 0 - ns
tVD;ACK data valid acknowledge
time [1] 0.3 3.45 0.1 0.9 0.05 0.45 s
tVD;DAT data valid time [2] 0.3 3.45 0.1 0.9 0.05 0.45 s
tSU;DAT data set-up time 250 - 100 - 50 - ns
tLOW LOW period of the SCL
clock 4.7 - 1.3 - 0.5 - s
tHIGH HIGH period of the SCL
clock 4.0 - 0.6 - 0.26 - s
tffall time of both SDA and
SCL signals [3][4] -30020+0.1C
b[5] 300 - 120 ns
trrise time of both SDA
and SCL signals - 1000 20 + 0.1Cb[5] 300 - 120 ns
tSP pulse width of spikes
that must be suppressed
by the input filter
[6] -50 - 50-50ns
Output pr opagation delay
tPLH LOW to HIGH
propagation delay OE to LEDn;
MODE2[1:0] = 01 -- - --150ns
tPHL HIGH to LOW
propagation delay OE to LEDn;
MODE2[1:0] = 01 -- - --150ns
Output port timing
td(SCL-Q) delay time from SCL
to data output SCL to LEDn;
MODE2[3] = 1;
outputs change on
ACK
-- - --450ns
td(SDA-Q) delay time from SDA
to data output SDA to LEDn;
MODE2[3] = 0;
outputs change on
STOP condition
-- - --450ns
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Product data sheet Rev. 3 — 6 September 2012 27 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
[2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.
[3] A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to
bridge the undefined region of SCL’s falling edge.
[4] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time (tf) for the SDA output stage is specified at
250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without
exceeding the maximum specified tf.
[5] Cb= total capacitance of one bus line in pF.
[6] Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.
Fig 19. Definition of timing
t
SP
t
BUF
t
HD;STA
PP S
t
LOW
t
r
t
HD;DAT
t
f
t
HIGH
t
SU;DAT
t
SU;STA
Sr
t
HD;STA
t
SU;STO
SDA
SCL
002aaa986
0.7 × V
DD
0.3 × V
DD
0.7 × V
DD
0.3 × V
DD
Rise and fall times refer to VIL and VIH.
Fig 20. I2C-bus timing diagram
SCL
SDA
t
HD;STA
t
SU;DAT
t
HD;DAT
t
f
t
BUF
t
SU;STA
t
LOW
t
HIGH
t
VD;ACK
002aab285
t
SU;STO
protocol START
condition
(S)
bit 7
MSB
(A7)
bit 6
(A6) bit 1
(D1) bit 0
(D0)
1
/ f
SCL
t
r
t
VD;DAT
acknowledge
(A)
STOP
condition
(P)
0.3 × V
DD
0.7 × V
DD
0.3 × V
DD
0.7 × V
DD
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Product data sheet Rev. 3 — 6 September 2012 28 of 37
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8-bit Fm+ I2C-bus 100 mA 40 V LED driver
15. Test information
RL = Load resistor for LEDn. RL for SDA and SCL > 1 k (3 mA or less current).
CL = Load capacitance includes jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generators.
Fig 21. Test circuitr y for switching times
PULSE
GENERATOR
V
O
CL
50 pF
RL
500 Ω
002aab284
RT
V
I
V
DD
DUT
V
DD
open
GND
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Product data sheet Rev. 3 — 6 September 2012 29 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
16. Package outline
Fig 22. Package outline SOT355-1 (TSSOP24)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 7.9
7.7 4.5
4.3 0.65 6.6
6.2 0.4
0.3 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153 99-12-27
03-02-19
0.25 0.5
0.2
wM
bp
Z
e
112
24 13
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1
A
max.
1.1
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Product data sheet Rev. 3 — 6 September 2012 30 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
Fig 23. Package outline SOT616-3 (HVQFN24)
0.51 0.2
A1Eh
b
UNIT ye
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 4.1
3.9
Dh
2.75
2.45
y1
4.1
3.9 2.75
2.45
e1
2.5
e2
2.5
0.30
0.18
c
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT616-3 MO-220 04-11-19
05-03-10
- - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT616-3
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
712
24 19
18
13
6
1
X
D
E
C
BA
e2
terminal 1
index area
terminal 1
index area
AC
CB
vM
wM
1/2 e
1/2 e
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
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Product data sheet Rev. 3 — 6 September 2012 31 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
17. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate prec a ut io ns ar e taken as
described in JESD625-A or equivalent standards.
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitch es and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
W ave soldering is a joinin g technology in which the joint s are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
18.3 Wave soldering
Key characteristics in wave soldering are:
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Product data sheet Rev. 3 — 6 September 2012 32 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to
higher minimum peak temperatures (see Figure 24) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enoug h for the solder to make reliable solder joint s (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged . The peak temperature of the package
depends on package thickness and volume and is classified in acco rdance with
Table 18 and 19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24.
Table 18. SnPb eutec t ic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350
< 2.5 235 220
2.5 220 220
Table 19. Le ad-free process (from J-STD-020 C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
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Product data sheet Rev. 3 — 6 September 2012 33 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
For further information on temperature profile s, refer to Application Note AN10365
“Surface mount reflow soldering description”.
19. Abbreviations
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 20. Ab breviations
Acronym Description
CDM Charged-Device Model
DUT Device Under Test
ESD ElectroStatic Discharge
FET Field-Effect Transistor
HBM Human Body Model
I2C-bus Inter-Integrated Circuit bus
I/O Input/Output
LCD Liqui d Crystal Display
LED Light Emitting Diode
LSB Least Significant Bit
MSB Most Significant Bit
NMOS Negative-channel Metal-Oxide Semiconductor
NPN bipolar transistor with N-type emitter and collector and a P-type base
PCB Printed-Circuit Board
PMOS Positive-channel Metal-Oxide Semiconductor
PNP bipolar transistor with P-type emitter and collector and an N-type base
PWM Pulse Width Modulation
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Product data sheet Rev. 3 — 6 September 2012 34 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
20. Revision history
RGB Red/Green/Blue
RGBA Red/Green/Blue/Amber
SMBus System Management Bus
Table 20. Ab breviations …continued
Acronym Description
Table 21. Revision history
Document ID Release date Data sheet stat us Change notice Supersedes
PCA9624 v.3 20120906 Product data sheet - PCA9624 v.2
Modifications: Section 2 “Features and benefits, 21st bullet: deleted phrase “150 V MM per JESD22-A115”
Table 5 “MODE1 - Mode register 1 (address 00h) bit description, Table note [1], first sentence:
changed from “has been set to logic 1” to “has been set to logic 0”
Table 6 “MODE2 - Mode register 2 (address 01h) bit description:
Added Table note [2] and references to it at bit 2, bi t 1, and bit 0.
Section 10.1 “Junction temperature calculation, fourth paragraph, last sentence changed from
“PCA9626B, in the LQFP48 package” to “PCA9624PW, in the TSSOP24 package”
Section 10.1.2 “Example 2: Tj calculation where only Tcase is known:
first paragraph changed from “PCA9626B, 24-channel LED controller in the LQFP48 package”
to “PcA9624PW, 8-channel LED controller in the TSSOP24 package”
Rth(j-c) changed from “18 C/W” to “30 C/W”
IDD(max) changed from “18 mA” to “10 mA”
LED output current: third line changed from “40 mA on 2 ports = (40 mA 2)”
to “40 mA on 1 port = (40 mA 1)”
LED output current: deleted fourth line
LED output current: deleted fifth line
List item 1., third line changed from “output current (40 mA 2 ports); output power
(40 mA 20.5 V) = 40 mW”
to “output current (40 mA 1 port); output power (40 mA 10.5 V) = 20 mW”
List item 1., deleted (old ) fourth line
List item 1., deleted (old) fifth line
Output total power changed from “341.5 mW” to “200 mW”
List item 1., chip core power consu mp ti on changed from “18 mA 5.5V=99mW
to “10 mA 5.5 V = 55 mW”
Ptot changed from “460.5 mW” to “275 mW”
List item 2.: equation changed
from “Tj = Tcase + Rth(j-a) Ptot = 94.6 C + 18 C/W 460.5 mW = 102.9 C
to “Tj = Tcase + Rth(j-a) Ptot = 94.6 C + 30 C/W 275 mW = 102.85 C
PCA9624 v.2 20090826 Product data sheet - PCA9624 v.1
PCA9624 v.1 20090603 Product data sheet - -
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Product data sheet Rev. 3 — 6 September 2012 35 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
21. Legal information
21.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The prod uct sta tus of device (s) descri bed in this d ocument m ay have cha nged since thi s docume nt was publish ed and ma y diffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
21.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre vail.
Product specificationThe information and data provided in a Product
data sheet shall define the specification of the product as agr eed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyon d those described in the
Product data sheet.
21.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descripti ons, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environment al
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associate d with t heir
applications and products.
NXP Semiconductors does not accept any liabil ity related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the appl ication or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress rating s only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] dat a sheet Production This document contains t he product specification.
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Product data sheet Rev. 3 — 6 September 2012 36 of 37
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors prod uct is automotive qualified,
the product is not suitable for automo tive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specif ications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
21.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
I2C-bus — logo is a trademark of NXP B.V.
22. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PCA9624
8-bit Fm+ I2C-bus 100 mA 40 V LED driver
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 September 2012
Document identifier: PCA9624
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
23. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 5
7.1 Device addresses. . . . . . . . . . . . . . . . . . . . . . . 5
7.1.1 Regular I2C-bus slave address. . . . . . . . . . . . . 5
7.1.2 LED All Call I2C-bus address . . . . . . . . . . . . . . 6
7.1.3 LED Sub Call I2C-bus addresses . . . . . . . . . . . 6
7.1.4 Software Reset I2C-bus address . . . . . . . . . . . 6
7.2 Control register. . . . . . . . . . . . . . . . . . . . . . . . . 7
7.3 Register definitions. . . . . . . . . . . . . . . . . . . . . . 8
7.3.1 Mode register 1, MODE1 . . . . . . . . . . . . . . . . . 9
7.3.2 Mode register 2, MODE2 . . . . . . . . . . . . . . . . . 9
7.3.3 PWM0 to PWM7, individual brightness control 10
7.3.4 GRPPWM, group duty cycle control. . . . . . . . 10
7.3.5 GRPFREQ, group frequency . . . . . . . . . . . . . 11
7.3.6 LEDOUT0 and LEDOUT1, LED driver output
state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.3.7 SUBADR1 to SUBADR3, I2C-bus subaddress
1 to 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.3.8 ALLCALLADR, LED All Call I2C-bus address. 12
7.4 Active LOW output enable input. . . . . . . . . . . 13
7.5 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 13
7.6 Software reset. . . . . . . . . . . . . . . . . . . . . . . . . 13
7.7 Individual brightness control with group
dimming/blinking. . . . . . . . . . . . . . . . . . . . . . . 14
8 Characteristics of the I2C-bus . . . . . . . . . . . . 15
8.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1.1 START and STOP conditions . . . . . . . . . . . . . 15
8.2 System configuration . . . . . . . . . . . . . . . . . . . 15
8.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 16
9 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 17
10 Application design-in information . . . . . . . . . 19
10.1 Junction temperature calculation . . . . . . . . . . 20
10.1.1 Example 1: Tj calculation of PCA9624DR, in
TSSOP24 package, when Tamb is known. . . . 21
10.1.2 Example 2: Tj calculation where only Tcase is
known. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 22
12 Thermal characteristics . . . . . . . . . . . . . . . . . 23
13 Static characteristics . . . . . . . . . . . . . . . . . . . 24
14 Dynamic characteristics. . . . . . . . . . . . . . . . . 26
15 Test information . . . . . . . . . . . . . . . . . . . . . . . 28
16 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 29
17 Handling information . . . . . . . . . . . . . . . . . . . 31
18 Soldering of SMD packages. . . . . . . . . . . . . . 31
18.1 Introduction to soldering. . . . . . . . . . . . . . . . . 31
18.2 Wave and reflow soldering. . . . . . . . . . . . . . . 31
18.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 31
18.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 32
19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 33
20 Revision history . . . . . . . . . . . . . . . . . . . . . . . 34
21 Legal information . . . . . . . . . . . . . . . . . . . . . . 35
21.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 35
21.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
21.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 35
21.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 36
22 Contact information . . . . . . . . . . . . . . . . . . . . 36
23 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37