CM1203-02CP - California Micro Devices

06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-51 12 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 1

CM1203

1, 2 and 3-Channel ESD Arrays in CSP

Features

• Functionally and pin compatible with CMD’s

CSPESD301/302/303 family of devices

• OptiGuard™ coated for improved reliability at

assembly

• 1, 2 or 3 channels of ESD protection

• ±15kV ESD protection (IEC 61000-4-2, contact

discharge)

• ±30kV ESD protection (HBM)

• Supports both AC and DC signal applications

• Low leakage current (<100nA)

• Chip Scale Package features extremely low lead

inductance for optimum ESD and filter perfor-

mance

• 4 bump, 1.06 x 0.93mm footprint Chip Scale Pack-

age (CSP)

• Lead-free version available

Applications

• I/O port protection

• EMI filtering for data ports

• Cellphones, notebook computers, PDAs

• Wireless Handsets

• MP3 Players

• Digital Still Cameras

• Handheld PCs

Product Description

The CM1203 comprises a family of 1, 2, and 3-channel

ESD protection arrays, which integrate two, three and

four identical avalanche-style diodes. It is intended that

one of these diodes is connected to GND and the other

diodes provide ESD protection for up to 3 lines

depending upon the configuration utilized. The back-

to-back diode connections provide ESD protection for

nodes that have AC signals up to 5.9V peak. These

devices provide a very high level of protection for sen-

sitive electronic components that may be subjected to

electrostatic discharge (ESD). The diodes are

designed and characterized to safely dissipate ESD

strikes of ±15kV, well beyond the maximum require-

ments of the IEC 61000-4-2 international standard.

Using the MIL-STD-883 (Method 3015) specification

for Human Body Model (HBM) ESD, these devices pro-

tect against contact discharges of greater than ±30kV.

The diodes also provide some EMI filtering, when used

in combination with a PCB trace or series resistor.

These devices are particularly well-suited for portable

electronics (e.g. cellular telephones, PDAs, notebook

computers) because of their small package format and

easy-to-use pin assignments.

The CM1203 incorporates OptiGuard™ coating which

results in improved reliability at assembly. The CM1203

is available in a space-saving, low-profile, chip-scale

package with optional lead-free finishing.

Electrical Schematics

A2 B2B1A2 B2B1A2A1

CM1203-01 CM1203-02 CM1203-03

2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 06/28/04

CM1203

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.

B2 B1

A1A2 Orientation

Marking

An*

Orientation

Marking

(see note 2)

PACKAGE / PINOUT DIAGRAMS

Notes

CM1203

TOP VIEW BOTTOM VIEW

(Bumps Down View) (Bumps Up View)

* See ordering information for

appropriate part marking.

1) These drawings are not to scale.

Lead-free devices are specified by using a "+" character for the top side orientation mark.

4-Bump CSP Package

3) All 4 bumps are always present. Unused bumps are electrically unconnected.

PART NUMBERING INFORMATION

Bumps Package

Standard Finish Lead-free Finish2

Ordering Part

Number1Part Marking

Ordering Part

Number1Part Marking

4 CSP CM1203-01CS P CM1203-01CP P

4 CSP CM1203-02CS Q CM1203-02CP Q

4 CSP CM1203-03CS R CM1203-03CP R

06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 3

CM1203

Specifications

Note 1: TA=25°C unless otherwise specified.

Note 2: ESD applied to input and output pins with respect to

another diode, one at a time.

Note 3: Unused pins are left open.

Note 4: These parameters are guaranteed by design and char-

acterization.

Figure 1. Parameter Legend

ABSOLUTE MAXIMUM RATINGS

PARAMETER RATING UNITS

Storage Temperature Range -65 to +150 °C

DC Package Power Rating 200 mW

STANDARD OPERATING CONDITIONS

PARAMETER RATING UNITS

Operating Temperature Range -40 to +85 °C

ELECTRICAL OPERATING CHARACTERISTICS1

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

VSO Diode Stand-off Voltage IDIODE = ±10µA±5.9 V

ILEAK Diode Leakage Current VIN=3.3V 100 nA

VSIG Small Signal Clamp Voltage

Positive Clamp

Negative Clamp

IDIODE = 10mA

IDIODE = -10mA

6.0

-9.2

7.6

-7.6

9.2

-6.0

VESD In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883,

Method 3015

b) Contact Discharge per IEC 61000-4-2

Notes 2, 3 and 4

±30

±15

VCL Clamping Voltage during ESD Discharge

MIL-STD-883 (Method 3015), 8kV

Between adjacent bumps

Between diagonal bumps

Notes 2, 3 and 4

19.5

19.9

RDDynamic Resistance

Between adjacent bumps

Between diagonal bumps

Notes 2, 3 and 4

0.85

1.10

Ω

C Capacitance At 0VDC, 1MHz, 30mVAC 27 pF

3.3V

10mA

10µA

SIG

ESD

LEAK

slope = 1

4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 06/28/04

CM1203

Performance Information

Figure 2. Typical EMI Filter Performance (0VDC, 50 Ohm Environment)

Figure 3. Typical Capacitance vs. Input Voltage (normalized to 0VDC)

06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 5

CM1203

Performance Information (cont’d)

Figure 4. Low Current I-V Curve

Figure 5. High Current I-V Curve

-6

-4

-2

468-8 -6 -4 -2

I(µA)

V (V)

-8

-2.0

-1.5

-1.0

-0.5

0.0

0.5

1.0

1.5

2.0

-12-11-10-9-8-7-6-5-4-3-2-10123456789101112

High Current I-V Characteristic - Pads A1 to A2

Current [A]

Voltage [V]

6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 06/28/04

CM1203

Application Information

Refer to Application Note AP-217, "The Chip Scale

Package", for a detailed description of Chip Scale

Packages offered by California Micro Devices.

Figure 6. Recommended Non-Solder Mask Defined Pad Illustration

Figure 7. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 8. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER VALUE

Pad Size on PCB 0.275mm

Pad Shape Round

Pad Definition Non-Solder Mask defined pads

Solder Mask Opening 0.325mm Round

Solder Stencil Thickness 0.125mm - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball +50µm

Solder Ball Side Coplanarity +20µm

Maximum Dwell Time Above Liquidous 60 seconds

Soldering Maximum Temperature 260°C

Solder Mask Opening

0.325mm DIA.

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Stencil Opening

0.330mm DIA.

200

250

150

100

0 1:00.0 2:00.0 3:00.0 4:00.0

Time (minutes)

Temperature (°C)

06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 7

CM1203

Mechanical Details

CSP Mechanical Specifications

CM1203 devices are packaged in a custom Chip Scale

Package (CSP). Dimensions are shown below. For

complete information on CSP packaging, see the Cali-

fornia Micro Devices CSP Package Information docu-

ment.

Package Dimensions for

CM1203 Chip Scale Package

CSP Tape and Reel Specifications

Figure 9. Tape and Reel Mechanical Data

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 4

Dim Millimeters Inches

Min Nom Max Min Nom Max

A1 0.881 0.925 0.971 0.0347 0.0365 0.0382

A2 1.015 1.060 1.105 0.0400 0.0417 0.0435

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.495 0.500 0.505 0.0195 0.0197 0.0199

C1 0.163 0.213 0.263 0.0064 0.0084 0.0104

C2 0.230 0.280 0.330 0.0091 0.0110 0.0130

D1 0.600 0.670 0.739 0.0236 0.0264 0.0291

D2 0.394 0.445 0.495 0.0155 0.0175 0.0195

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

DIMENSIONS IN MILLIMETERS

BOTTOM VIEW

SIDE

VIEW

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)

OptiGuard

Coating

PART NUMBER CHIP SIZE (mm)

POCKET SIZE (mm)

B0 X A0 X K0

TAPE WIDTH

REEL

DIAMETER

QTY PER

REEL P0P1

CM1203 1.06 X 0.93 X 0.670 1.14 X 1.00 X 0.70 8mm 178mm (7") 3500 4mm 4mm

Top

For tape feeder reference

Cover

Tape

only including draft.

Concentric around B.

Embossment

User Direction of Feed

0.2 mm

Center Lines

of Cavity

10 Pitches Cumulative

Tolerance On Tape