  
  
SLOS058C – OCTOBER 1979 – REVISED DECEMBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DµA741 Operating Characteristics
DLow Supply-Current Drain . . . 0.6 mA Typ
(per amplifier)
DLow Input Offset Voltage
DLow Input Offset Current
DClass AB Output Stage
DInput/Output Overload Protection
DDesigned to Be Interchangeable With
Industry Standard LM148, LM248, and
LM348
description/ordering information
The LM148, LM248, and LM348 are quadruple,
independent, high-gain, internally compensated
operational amplifiers designed to have operating
characteristics similar to the µA741. These
amplifiers exhibit low supply-current drain and
input bias and offset currents that are much less
than those of the µA741.
ORDERING INFORMATION
T
V
IO
max
PACKAGE
ORDERABLE TOP-SIDE
TA
VIOmax
AT 25°CPACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (N) Tube of 25 LM348N LM348N
0°Cto70°C
6mV
SOIC (D)
Tube of 50 LM348D
LM348
0°C to 70°C6 mV SOIC (D) Reel of 2500 LM348DR LM348
SOP (NS) Reel of 2000 LM348NSR LM348
PDIP (N) Tube of 25 LM248N LM248N
–25°C to 85°C6 mV
SOIC (D)
Tube of 50 LM248D
LM248
SOIC (D) Reel of 2500 LM248DR LM248
55°C to 125°C
5mV
CDIP (J) Tube of 25 LM148J LM148J
–55°C to 125°C5 mV
LCCC (FK)
Tube of 50
LM148FK
LM148FK
LCCC (FK) Tube of 50 LM148FK LM148FK
Package drawings, standard packing quantities, thermal data, symboliztion, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
        
         
       
   
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN–
1 IN+
VCC+
2IN+
2IN–
2OUT
4OUT
4IN–
4IN+
VCC–
3IN+
3IN–
3OUT
LM148 ...J PACKAGE
LM248 ...D OR N PACKAGE
LM348 . . . D, N, OR NS PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
4IN+
NC
VCC–
NC
3IN+
1IN+
NC
VCC+
NC
2IN+
LM148 . . . FK PACKAGE
(TOP VIEW)
1IN–
1OUT
NC
3IN– 4IN–
2IN–
2OUT
NC
NC – No internal connection
3OUT 4OUT
        
       
        
  
  
SLOS058C OCTOBER 1979 REVISED DECEMBER 2002
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
symbol (each amplifier)
+
OUT
IN
IN+
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC+ (see Note 1): LM148 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC (see Note 1): LM148 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2): LM148 44 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (either input, see Notes 1 and 3): LM148 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature,TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 5 and 6):D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJC (see Notes 7 and 8):FK package 5.61°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
J package 15.05°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: J package 300°C. . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, N, or NS package 260°C. . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC.
2. Differential voltages are at IN+ with respect to IN.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or the value specified in the table,
whichever is less.
4. The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure that
the dissipation rating is not exceeded.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
MIN MAX UNIT
Supply voltage, VCC+ 4 18 V
Supply voltage, VCC418 V


SLOS058C OCTOBER 1979 REVISED FEBRUAR Y 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
electrical characteristics at specified free-air temperature, VCC± = ±15 V (unless otherwise noted)
PARAMETER
LM148 LM248 LM348
UNIT
PARAMETER TEST CONDITIONS
MIN TYP MAX MIN TYP MAX MIN TYP MAX UNIT
V
Inp t offset oltage
V0
25°C 1 5 1 6 1 6
mV
VIO Input offset voltage VO = 0 Full range 6 7.5 7.5 mV
I
Input offset current
V0
25°C 4 25 4 50 4 50
nA
IIO Input offset current VO = 0 Full range 75 125 100 nA
I
Inp t bias c rrent
V0
25°C 30 100 30 200 30 200
nA
IIB Input bias current VO = 0 Full range 325 500 400 nA
VICR Common-mode input voltage range Full range ±12 ±12 ±12 V
RL = 10 k25°C±12 ±13 ±12 ±13 ±12 ±13
V
Maximum peak output volta
g
eRL 10 kFull range ±12 ±12 ±12
V
VOM
Maximum
eak
out ut
voltage
swing RL = 2 k25°C±10 ±12 ±10 ±12 ±10 ±12 V
g
RL 2 kFull range ±10 ±10 ±10
A
Lar
g
e-si
g
nal differential volta
g
e V
O
= ±10 V
,
25°C 50 160 25 160 25 160
V/mV
AVD
Large
-
signal
differential
voltage
amplification
VO
=
±10
V
,
RL= 2 kFull range 25 15 15 V/mV
riInput resistance25°C 0.8 2.5 0.8 2.5 0.8 2.5 M
B1Unity-gain bandwidth AVD = 1 25°C 1 1 1 MHz
φmPhase margin AVD = 1 25°C 60°60°60°
CMRR
Common mode rejection ratio
V
IC
= V
ICR
min
,
25°C 70 90 70 90 70 90
dB
CMRR Common-mode rejection ratio
VIC
=
VICRmin
,
VO = 0 Full range 70 70 70 dB
k
Suppl
y
-volta
g
e re
j
ection ratio V
CC±
= ±9 V to ±15 V
,
25°C 77 96 77 96 77 96
dB
kSVR
Su ly
-
voltage
rejection
ratio
(VCC±/VIO)
VCC±
=±9
V
to
±15
V
,
VO = 0 Full range 77 77 77 dB
IOS Short-circuit output current 25°C±25 ±25 ±25 mA
I
S ppl c rrent (fo r amplifiers)
No load
VO = 0
25°C
2.4 4.5 2.4 4.5
mA
ICC Supply current (four amplifiers) No load VO = VOM 25°C2.4 3.6 mA
VO1/VO2 Crosstalk attenuation f = 1 Hz to 20 kHz 25°C 120 120 120 dB
All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. Full range for TA is 55°C to 125°C for
LM148, 25°C to 85°C for LM248, and 0°C to 70°C for LM348.
This parameter is not production tested.
  
  
SLOS058C OCTOBER 1979 REVISED FEBRUARY 2002
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
operating characteristics, VCC± = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Slew rate at unity gain RL = 2 kΩ, CL = 100 pF, See Figure 1 0.5 V/µs
PARAMETER MEASUREMENT INFORMATION
+
VICL = 100 pF RL = 2 k
Figure 1. Unity-Gain Amplifier
+
10 k
100
VI
RL = 2 kCL = 100 pF
AVD = 100
Figure 2. Inverting Amplifier
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM148FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 LM148FKB
LM148J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 LM148J
LM148JB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 LM148JB
LM248D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM248
LM248DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM248
LM248N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -25 to 85 LM248N
LM348D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM348
LM348DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM348
LM348DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM348
LM348DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM348
LM348DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM348
LM348N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 LM348N
LM348NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM348
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM248DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM348DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM348DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM348NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM248DR SOIC D 14 2500 367.0 367.0 38.0
LM348DR SOIC D 14 2500 333.2 345.9 28.6
LM348DR SOIC D 14 2500 367.0 367.0 38.0
LM348NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308 -7.977.83[ ]
14X -.026.014 -0.660.36[ ]
14X -.065.045 -1.651.15[ ]
.2 MAX TYP
[5.08] .13 MIN TYP
[3.3]
TYP-.060.015 -1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754 -19.9419.15[ ]
B -.283.245 -7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
78
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
www.ti.com
EXAMPLE BOARD LAYOUT
ALL AROUND
[0.05] MAX.002
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
METAL
(.063)
[1.6]
(R.002 ) TYP
[0.05]
14X ( .039)
[1]
( .063)
[1.6]
12X (.100 )
[2.54]
(.300 ) TYP
[7.62]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
SEE DETAIL A SEE DETAIL B
SYMM
SYMM
1
78
14
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
DETAIL B
13X, SCALE: 15X
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TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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