Alle Rechte vorbehalten! Ald rights reserved 5 | 4, 3 2 4 Mating face according to MIL-C-24308 / DIN 41 652 / CECC 75301-802 6,1 No. 1 contact 4,5 3) : wi | 2| Y_ o | 2 2,94 7,3 in | o Grounding pins 0,2x0,6 9,4 Printed board layout(1,640,2 thick) View component side 7 (PCB plating = Tin] | | aja |e omnes A =| 5) Ut l i HU No. 1 contact 2,74 ~3 | _ _ =|| Ja | Ae | P4444 $oo 7 25 40,1 1 20,1 0.8 < 2,7 > 3x| 2,74 |=8,22 Mounting force on Printed board : 25 - 80N E 09 66 162 6815 M3 2 Dat. Nane D-Sub male low profile Mafstah/ 09 66 162 7815 M3 3 Detail. (23-NOV-01] JB 9 poles with solder pins, 09 66 162 5815 M3 0,76 um Au Insp. AIL Dim, in om nuts, board lock 15s 09 66 162 6816| 4-40 UNC 2 Stand, Orig, Size DIN A and grounding pins ya: 09 66 162 7816| 4-40 UNC 3 29749 |14-FEB-02] JB Blatt/ Page 09 66 162 5816| 4-40 UNC 0,76 ym Au 29733 pa-nov-o| JB | PAR, NG CURE firs IB 09 66 162 X81x y Part number |nut thread | Performance level Mod. Dat. Name aris Sub,