UC1710 UC2710 UC3710 High Current FET Driver FEATURES DESCRIPTION * Totem Pole Output with 6A Source/Sink Drive The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET's. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A. * 3ns Delay * 20ns Rise and Fall Time into 2.2nF * 8ns Rise and Fall Time into 30nF * 4.7V to 18V Operation * Inverting and Non-Inverting Outputs * Under-Voltage Lockout with Hysteresis * Thermal Shutdown Protection Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis. The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for -55C to +125C operation. The UC2710 and UC3710 are specified for a temperature range of -40C to +85C and 0C to +70C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available. * MINIDIP and Power Packages ORDERING INFORMATION TRUTH TABLE INV N.I. Out H H L OUT= INV and N.I. L H H OUT= INV or N.I. H L L L L L UC1710J UC2710DW UC2710J UC2710N UC2710T UC3710DW UC3710N UC3710T TEMPERATURE RANGE -55C to +125C -40C to +85C 0C to +70C PACKAGE 8 pin CDIP 16 pin SOIC-wide 8 pin CDIP 8 pin PDIP 5 pin TO220 16 pin SOIC-wide 8 pin PDIP 5 pin TO220 BLOCK DIAGRAM INTERNALLY CONNECTED IN T PACKAGE VIN 5 OUTPUT BIAS 4 VC 3 Out 2 Pwr Gnd LOGIC BIAS N.I. IN 8 INV IN 1 Logic Gnd 7 TSD UVLO INTERNALLY CONNECTED IN T PACKAGE UDG-99079 05/99 UC1710 UC2710 UC3710 ABSOLUTE MAXIMUM RATINGS N-Package J-Package T-Package Supply Voltage, Vin . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V Output Current (Source or Sink) Steady-State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500mA. . . . . . . . . . . . 500mA . . . . . . . . . . . . . 1A Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V-VIN . . . . . . . . -0.3V - VIN . . . . . . . . -0.3V - VIN Power Dissipation at Ta=25C . . . . . . . . . . . . . . . . . . . 1W . . . . . . . . . . . . . . . 1W . . . . . . . . . . . . . . . 3W Power Dissipation at T (Case) = 25C. . . . . . . . . . . . . . 2W . . . . . . . . . . . . . . . 2W . . . . . . . . . . . . . . 25W Operating Junction Temperature . . . . . . . -55C to +150C . . . . -55C to +150C . . . . -55C to +150C Storage Temperature . . . . . . . . . . . . . . . -65C to +150C . . . . -65C to +150C . . . . -65C to +150C Lead Temperature (Soldering, 10 seconds) . . . . . . . 300C . . . . . . . . . . . . 300C . . . . . . . . . . . . 300C Note 1: All currents are positive into, negative out of the specified terminal. Note 2: Consult Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages. CONNECTION DIAGRAMS DIL-8 MINIDIP (Top View) J or N Package SOIC-16 (Top View) DW Package 5-Pin TO-220 (Top View) T Package ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC = 15V, No load, TA = TJ. PARAMETERS VIN Supply Current VC Supply Current UVLO Threshold TEST CONDITIONS MIN TYP MAX UNITS VIN =18V, VC =18V, Output Low 26 35 mA VIN =18V, VC =18V, Output High 21 30 mA VIN =18V, VC =18V, Output Low 1.5 5.0 mA VIN =18V, VC =18V,Output High 5.0 8 mA VIN High to Low 3.8 4.1 4.4 V VIN Low to High 4.1 4.4 4.8 V 2 UC1710 UC2710 UC3710 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC = 15V, No load, TA = TJ. PARAMETERS TEST CONDITIONS UVLO Threshold Hysteresis MIN TYP 0.1 0.3 Digital Input Low Level Digital Input High Level MAX UNITS 0.5 V 0.8 V 2.0 V Digital Input = 0.0V Output High Sat., VC - VO IO= -100mA 1.35 2.2 V IO= -6A 3.2 4.5 V IO= 100mA 0.25 0.6 V IO= 6A 3.4 4.5 V Output Low Sat., VO Thermal Shutdown -70 A Digital Input Current -4.0 165 C From Inv., Input to Output (Note 3, 4): Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 70 ns CL = 0 20 40 ns CL = 2.2nF 25 40 ns CL = 30nF 85 150 ns CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 80 ns CL = 0 15 40 ns CL = 2.2nF 20 40 ns CL = 30nF 85 150 ns CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 70 ns From N.I. Input to Output (Note 3,4): Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall Total Supply Current at 200kHz Input Switching Frequency CL = 0 20 40 ns CL = 2.2nF 25 40 ns CL = 30nF 85 150 ns CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 80 ns CL = 0 15 40 ns CL = 2.2nF 20 50 ns CL = 30nF 85 150 ns TA = 25C (Note 5) CL = 0 30 40 mA Note: 3. Delay measured from 50% input change to 10% output change. Note: 4. Those parameters with CL = 30nF are not tested in production. Note: 5. Inv. Input pulsed at 50% duty cycle with N.I. Input = 3V. or N.I. Input pulsed at 50% duty cycle with Inv. Input = 0V. UNITRODE CORPORATION 7 CONTINENTAL BLVD. * MERRIMACK, NH 03054 TEL. (603) 424-2410 FAX (603) 424-3460 3 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 5962-0152001QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0152001QPA UC1710 5962-0152001VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0152001VPA UC1710 5962-0152001VXA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0152001VXA UC1710J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 UC1710J UC1710J883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0152001QPA UC1710 UC1710L883B OBSOLETE TO/SOT L 20 TBD Call TI Call TI -55 to 125 UC1710SP OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC2710N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2710N UC2710NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2710N UC2710T ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 85 UC2710T UC2710TG3 ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 85 UC2710T UC3710DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3710DW UC3710DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3710DW UC3710N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3710N UC3710NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3710N UC3710T ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 70 UC3710T UC3710TG3 ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 70 UC3710T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF UC1710, UC1710-SP, UC3710 : * Catalog: UC3710, UC1710 * Military: UC1710 * Space: UC1710-SP NOTE: Qualified Version Definitions: Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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