ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 ADC12130/ADC12132/ADC12138 Self-Calibrating 12-Bit Plus Sign Serial I/O A/D Converters with MUX and Sample/Hold Check for Samples: ADC12130, ADC12132, ADC12138 FEATURES DESCRIPTION * NOTE: Some device/package combinations are obsolete and are described and shown here for reference only. See our web site for product availability. 1 2 * * * * * Serial I/O (MICROWIRE, SPI and QSPI Compatible) Power Down Mode Programmable Acquisition Time Variable Digital Output Word Length and Format No Zero or Full Scale Adjustment Required 0V to 5V Analog Input Range with Single 5V Power Supply APPLICATIONS * * * Pen-Based Computers Digitizers Global Positioning Systems KEY SPECIFICATIONS * * * * * * Resolution 12-bit plus sign 12-Bit plus sign conversion time 8.8 s (max) 12-Bit plus sign throughput time 14 s (max) Integral Linearity Error 2 LSB (max) Single Supply 3.3V or 5V 10% Power Consumption - +3.3V 15 mW (max) - +3.3V power down 40 W (typ) - +5V 33 mW (max) - +5V power down 100 W (typ) The ADC12130, ADC12132 and ADC12138 are 12bit plus sign successive approximation Analog-toDigital converters with serial I/O and configurable input multiplexer. The ADC12132 and ADC12138 have a 2 and an 8 channel multiplexer, respectively. The differential multiplexer outputs and ADC inputs are available on the MUXOUT1, MUXOUT2, A/DIN1 and A/DIN2 pins. The ADC12130 has a two channel multiplexer with the multiplexer outputs and ADC inputs internally connected. The ADC12130 family is tested and specified with a 5 MHz clock. On request, these ADCs go through a self calibration process that adjusts linearity, zero and full-scale errors to typically less than 1 LSB each. The analog inputs can be configured to operate in various combinations of single-ended, differential, or pseudo-differential modes. A fully differential unipolar analog input range (0V to +5V) can be accommodated with a single +5V supply. In the differential modes, valid outputs are obtained even when the negative inputs are greater than the positive because of the 12-bit plus sign output data format. The serial I/O is configured to comply with NSC MICROWIRE. For voltage references, see the LM4040, LM4050 or LM4041. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2013, Texas Instruments Incorporated ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com ADC12138 Simplified Block Diagram Connection Diagrams Top View Figure 1. 16-Pin MDIP and Wide Body SOIC Packages See Package Number NFG0016E and DW0016B 2 Submit Documentation Feedback Top View Figure 2. 20-Pin SSOP Package See Package Number DB0020A Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Top View Figure 3. 28-Pin MDIP, SSOP and Wide Body SOIC Packages See Package Numbers N28B, DB0028A, and DW0028B Some of these product/package combinations are obsolete and are shown here for reference only. Check the TI web site for availability. PIN DESCRIPTIONS Pin Name CH0 thru CH7 COM MUXOUT1 MUXOUT2 Pin Description Analog Inputs to the MUX (multiplexer). A channel input is selected by the address information at the DI pin, which is loaded at the rising edge of SCLK into the address register (see Table 2 and Table 3). The voltage applied to these inputs should not exceed VA+ or go below VA- or below GND. Exceeding this range on an unselected channel may corrupt the reading of a selected channel. Analog input pin that is used as a pseudo ground when the analog multiplexer is single-ended. Multiplexer Output pins. If the multiplexer is used, these pins should be connected to the A/DIN pins, directly or through an amplifier and/of filter. A/DIN1 A/DIN2 Converter Input pins. MUXOUT1 is usually tied to A/DIN1. MUXOUT2 is usually tied to A/DIN2. If external circuitry is placed between MUXOUT1 and A/DIN1, or MUXOUT2 and A/DIN2, it may be necessary to protect these pins against voltage overload. The voltage at these pins should not exceed VA+ or go below AGND (see Figure 64). DO Data Output pin. This pin is an active push/pull output when CS is low. When CS is high, this output is TRI-STATE. The conversion result (DB0-DB12) and converter status data are clocked out at the falling edge of SCLK on this pin. The word length and format of this result can vary (see Table 1). The word length and format are controlled by the data shifted into the multiplexer address and mode select register (see Table 4). DI Serial Data Input pin. The data applied to this pin is shifted at the rising edge of SCLK into the multiplexer address and mode select register. Table 2 through Table 4 show the assignment of the multiplexer address and the mode select data. EOC This pin is an active push/pull output which indicates the status of the ADC12130/2/8.A logic low on this pin indicates that the ADC is busy with a conversion, Auto Calibration, Auto Zero or power down cycle. The rising edge of EOC signals the end of one of these cycles CONV A logic low is required at this pin to program any mode or to change the ADC's configuration as listed in Mode Programming (Table 4). When this pin is high, the ADC is placed in the read data only mode. While in the read data only mode, bringing CS low and pulsing SCLK will only clock out the data stored in the ADCs output shift register. The data at DI will be ignored. A new conversion will not be started and the ADC will remain in the mode and/or configuration previously programmed. Read data only cannot be performed while a conversion, Auto Cal or Auto Zero are in progress. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 3 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com PIN DESCRIPTIONS (continued) Pin Name Pin Description CS Chip Select input pin. When a logic low is applied to this pin, the rising edge of SCLK shifts the data at the DI input into the address register and brings DO out of TRI-STATE. With CS low, the falling edge of SCLK shifts the data resulting from the previous ADC conversion out at the DO output, with the exception of the first bit of data. When CS is low continuously, the first bit of the data is clocked out on the rising edge of EOC (end of conversion). When CS is toggled, the falling edge of CS always clocks out the first bit of data. CS should be brought low while SCLK is low. The falling edge of CS interrupts a conversion in progress and starts the sequence for a new conversion. When CS is brought low during a conversion, that conversion is prematurely terminated and the data in the output latches may be corrupted. Therefore, when CS is brought low during a conversion in progress, the data output at that time should be ignored. CS may also be left continuously low. In this case, it is imperative that the correct number of SCLK pulses be applied to the ADC in order to remain synchronous. After the ADC supply power is applied, the device expects to see 13 clock pulses for each I/O sequence. The number of clock pulses the ADC expects is the same as the digital output word length. This word length can be modified by the data shifted in at the DO pin. Table 4 details the data required. DOR Data Output Ready pin. This pin is an active push/pull output which is low when the conversion result is being shifted out and goes high to signal that all the data has been shifted out. SCLK Serial Data Clock input. The clock applied to this input controls the rate at which the serial data exchange occurs. The rising edge loads the information at the DI pin into the multiplexer address and mode select shift register. This address controls which channel of the analog input multiplexer (MUX) is selected and the mode of operation for the ADC. With CS low, the falling edge of SCLK shifts the data resulting from the previous ADC conversion out on DO, with the exception of the first bit of data. When CS is low continuously, the first bit of the data is clocked out on the rising edge of EOC (end of conversion). When CS is toggled, the falling edge of CS always clocks out the first bit of data. CS should be brought low when SCLK is low. The rise and fall times of the clock edges should not exceed 1 s. CCLK Conversion Clock input. The clock applied to this input controls the successive approximation conversion time interval and the acquisition time. The rise and fall times of the clock edges should not exceed 1 s. VREF+ Positive analog voltage reference input. In order to maintain accuracy, the voltage range of VREF (VREF = VREF+ - VREF-) is 1.0 VDC to 5.0 VDC and the voltage at VREF+ cannot exceed VA+. See Figure 63 for recommended bypassing. VREF- The negative analog voltage reference input. In order to maintain accuracy, the voltage at this pin must not go below GND or exceed VREF+. (See Figure 63). PD Power Down pin. When PD is high the ADC is powered down; when PD is low the ADC is powered up, or active. The ADC takes a maximum of 700 s to power up after the command is given. VA+ VD+ These are the analog and digital power supply pins. VA+ and VD+ are not connected together on the chip. These pins should be tied to the same supply voltage and bypassed separately (see Figure 63). The operating voltage range of VA+ and VD+ is 3.0 VDC to 5.5 VDC. DGND The digital ground pin (see Figure 63). AGND The analog ground pin (see Figure 63). These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) Positive Supply Voltage (V+ = VA+ = VD+) 6.5V Voltage at Inputs and Outputs except CH0-CH7 and COM -0.3V to V+ +0.3V Voltage at Analog Inputs CH0-CH7 and COM GND -5V to V+ +5V |VA+ - VD+| 300 mV Input Current at Any Pin Package Input Current (3) 30 mA (3) 120 mA Package Dissipation at TA = 25C ESD Susceptibility (4) 500 mW (5) Human Body Model 1500V Soldering Information PDIP Packages (10 seconds) SOIC Package 260C (6) Vapor Phase (60 seconds) 215C Infrared (15 seconds) 220C -65C to +150C Storage Temperature (1) (2) (3) (4) (5) (6) All voltages are measured with respect to GND, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA+ or VD+), the current at that pin should be limited to 30 mA. The 120 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 30 mA to four. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, JA and the ambient temperature, TA. The maximum allowable power dissipation at any temperature is PD = (TJmax - TA)/JA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 150C. The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. See AN450 "Surface Mounting Methods and Their Effect on Product Reliability" or the section titled "Surface Mount" found in any post 1986 Texas Instruments Linear Data Book for other methods of soldering surface mount devices. Operating Ratings (1) (2) TMIN TA TMAX -40C TA +85C Operating Temperature Range Supply Voltage (V+ = VA+ = VD+) +3.0V to +5.5V |VA+ - VD+| 100 mV VREF+ 0V to VA+ VREF- 0V to (VREF+ -1V) VREF (VREF+ - VREF-) 1V to VA+ VREF Common Mode Voltage Range [(VREF+) - (VREF-)] / 2 0.1 VA+ to 0.6 VA+ A/DIN1, A/DIN2, MUXOUT1 and MUXOUT2 Voltage Range ADC IN Common Mode Voltage [(VIN+) - (VIN-)] / 2 (1) (2) 0V to VA+ Range 0V to VA+ Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND, unless otherwise specified. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 5 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Package Thermal Resistance Part Number Thermal Resistance (JA) ADC12130CIN 53C/W ADC12130CIWM 70C/W ADC12132CIMSA 134C/W ADC12132CIWM 64C/W ADC121038CIN 40C/W ADC121038CIMSA 97C/W ADC12138CIWM 50C/W Some of these product/package combinations are obsolete and are shown here for reference only. Check the TI web site for availability. Converter Electrical Characteristics The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = 3.3V, VREF+ = 2.5V and fully-differential input with fixed 1.250V common-mode voltage), VREF- = 0V, 12-bit + sign conversion mode (1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2) (3) (4) Parameter Test Conditions Typical (5) Limits (6) Units (Limits) STATIC CONVERTER CHARACTERISTICS Resolution with No Missing Codes 12 + sign Bits (min) 2 LSB (max) 1.5 LSB (max) 3.0 LSB (max) 1/2 3.0 LSB (max) 1/2 2 LSB (max) (7) (8) 1/2 After Auto Cal (7) (8) 1/2 After Auto Cal (7) (8) ILE Integral Linearity Error After Auto Cal DNL Differential Non-Linearity After Auto Cal Positive Full-Scale Error Negative Full-Scale Error (9) (8) Offset Error (1) (2) (3) (4) (5) (6) (7) (8) (9) 6 After Auto Cal VIN(+) = VIN(-) = 2.048V The "12-Bit Conversion of Offset" and "12-Bit Conversion of Full-Scale" modes are intended to test the functionality of the device. Therefore, the output data from these modes are not an indication of the accuracy of a conversion result. Two on-chip diodes are tied to each analog input through a series resistor as shown below. Input voltage magnitude up to 5V above VA+ or 5V below GND will not damage this device. However, errors in conversion can occur (if these diodes are forward biased by more than 50 mV) if the input voltage magnitude of selected or unselected analog input go above VA+ or below GND by more than 50 mV. As an example, if VA+ is 4.5 VDC, full-scale input voltage must be 4.55 VDC to ensure accurate conversions. To ensure accuracy, it is required that the VA+ and VD+ be connected together to the same power supply with separate bypass capacitors at each V+ pin. With the test condition for VREF (VREF+ - VREF-) given as +4.096V, the 12-bit LSB is 1.0 mV. For VREF = 2.5V, the 12-bit LSB is 610 V. Typical figures are at TJ = TA = 25C and represent most likely parametric norm. Tested limits are specified to TI's AOQL (Average Outgoing Quality Level). Positive integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive full-scale and zero. For negative integral linearity error, the straight line passes through negative full-scale and zero (see Figure 5 and Figure 6). The ADC12130 family's self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the selfcalibration process will result in a maximum repeatability uncertainty of 0.2 LSB. The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Converter Electrical Characteristics (continued) The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = 3.3V, VREF+ = 2.5V and fully-differential input with fixed 1.250V common-mode voltage), VREF- = 0V, 12-bit + sign conversion mode(1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2)(3)(4) Parameter Test Conditions (5) Limits (6) Units (Limits) After Auto Cal (10) 2 LSB (max) Total Unadjusted Error After Auto Cal (7) (11) (12) 1 LSB Multiplexer Chan-to-Chan Matching V+ = +5V 10%, VREF = +4.096V 0.05 LSB 0.5 0.5 0.5 0.5 LSB LSB LSB LSB 69.4 dB fIN = 20 kHz, VIN = 5 VPP, VREF = 5.0V 68.3 dB fIN = 40 kHz, VIN = 5 VPP, VREF+ = 5.0V 65.7 dB VIN = 5 VPP, where S/(N+D) drops 3 dB 31 kHz fIN = 1 kHz, VIN = 5V, VREF+ = 5.0V 77.0 dB fIN = 20 kHz, VIN = 5V, VREF+ = 5.0V 73.9 dB fIN = 40 kHz, VIN = 5V, VREF+ = 5.0V 67.0 dB VIN = 5V, where S/(N+D) drops 3 dB 40 kHz DC Common Mode Error TUE Typical Power Supply Sensitivity Offset Error + Full-Scale Error - Full-Scale Error Integral Linearity Error UNIPOLAR DYNAMIC CONVERTER CHARACTERISTICS fIN = 1 kHz, VIN = 5 VPP, VREF+ = 5.0V S/(N+D) Signal-to-Noise Plus Distortion Ratio -3 dB Full Power Bandwidth + DIFFERENTIAL DYNAMIC CONVERTER CHARACTERISTICS S/(N+D) Signal-to-Noise Plus Distortion Ratio -3 dB Full Power Bandwidth REFERENCE INPUT, ANALOG INPUTS AND MULTIPLEXER CHARACTERISTICS CREF Reference Input Capacitance 85 pF CA/D A/DIN1 and A/DIN2 Analog Input Capacitance 75 pF 0.1 A GND - 0.05 (VA+) + 0.05 V (min) V (max) 10 pF A/DIN1 and A/DIN2 Analog Input Leakage Current VIN = +5.0V or VIN = 0V CH0-CH7 and COM Input Voltage CCH CH0-CH7 and COM Input Capacitance CMUXOUT MUX Output Capacitance 20 pF On Channel = 5V and Off Channel = 0V -0.01 A On Channel = 0V and Off Channel = 5V 0.01 A On Channel = 5V and Off Channel = 0V 0.01 A On Channel = 0V and Off Channel = 5V -0.01 A MUXOUT1 and MUXOUT2 Leakage Current VMUXOUT = 5.0V or VMUXOUT = 0V 0.01 A MUX On Resistance VIN = 2.5V and VMUXOUT = 2.4V 850 RON Matching Channel to Channel VIN = 2.5V and VMUXOUT = 2.4V 5 Off Channel Leakage (13) CH0-CH7 and COM Pins On Channel Leakage (13) CH0-CH7 and COM Pins RON 1900 (max) % (10) The DC common-mode error is measured in the differential multiplexer mode with the assigned positive and negative input channels shorted together. (11) Offset or Zero error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the average value of the code transitions between -1 to 0 and 0 to +1 (see Figure 7). (12) Total unadjusted error includes offset, full-scale, linearity and multiplexer errors. (13) Channel leakage current is measured after the channel selection. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 7 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Converter Electrical Characteristics (continued) The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = 3.3V, VREF+ = 2.5V and fully-differential input with fixed 1.250V common-mode voltage), VREF- = 0V, 12-bit + sign conversion mode(1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2)(3)(4) Parameter Test Conditions Channel-to-Channel Crosstalk Typical VIN = 5 VPP, fIN = 40 kHz MUX Bandwidth (5) Limits (6) Units (Limits) -72 dB 90 kHz DC and Logic Electrical Characteristics The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully-differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = +3.3V, VREF+ = +2.5V and fully-differential input with fixed 1.250V commonmode voltage), VREF- = 0V, 12-bit + sign conversion mode (1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2) (3) (4) Parameter Test Conditions Typical (5) V+ = VA+ = VD+ = 3.3V Limits (6) V+ = VA+ = VD+ = 5V Limits (6) Units (Limits) CCLK, CS, CONV, DI, PD AND SCLK INPUT CHARACTERISTICS VIN(1) Logical "1" Input Voltage VA+ = VD+ = V+ +10% 2.0 2.0 V (min) VIN(0) Logical "0" Input Voltage VA+ = VD+ = V+ -10% 0.8 0.8 V (max) IIN(1) Logical "1" Input Current VIN = V+ 0.005 1.0 1.0 A (max) IIN(0) Logical "0" Input Current VIN = 0V -0.005 -1.0 -1.0 A (min) VA+ = VD+ = V+ - 10%, IOUT = -360 A 2.4 2.4 V (min) VA+ = VD+ = V+ - 10%, IOUT = -10 A 2.9 4.25 V (min) 0.4 0.4 V (max) -3.0 3.0 -3.0 3.0 A (max) A (max) DO, EOC AND DOR DIGITAL OUTPUT CHARACTERISTICS VOUT(1) Logical "1" Output Voltage VOUT(0) Logical "0" Output Voltage VA+ = VD+ = V+ - 10% IOUT = 1.6 mA IOUT TRI-STATE Output Current VOUT = 0V VOUT = V+ -0.1 -0.1 +ISC Output Short Circuit Source Current VOUT = 0V -14 mA -ISC Output Short Circuit Sink Current VOUT = VD+ 16 mA (1) (2) (3) (4) (5) (6) 8 The "12-Bit Conversion of Offset" and "12-Bit Conversion of Full-Scale" modes are intended to test the functionality of the device. Therefore, the output data from these modes are not an indication of the accuracy of a conversion result. Two on-chip diodes are tied to each analog input through a series resistor as shown below. Input voltage magnitude up to 5V above VA+ or 5V below GND will not damage this device. However, errors in conversion can occur (if these diodes are forward biased by more than 50 mV) if the input voltage magnitude of selected or unselected analog input go above VA+ or below GND by more than 50 mV. As an example, if VA+ is 4.5 VDC, full-scale input voltage must be 4.55 VDC to ensure accurate conversions. To ensure accuracy, it is required that the VA+ and VD+ be connected together to the same power supply with separate bypass capacitors at each V+ pin. With the test condition for VREF (VREF+ - VREF-) given as +4.096V, the 12-bit LSB is 1.0 mV. For VREF = 2.5V, the 12-bit LSB is 610 V. Typical figures are at TJ = TA = 25C and represent most likely parametric norm. Tested limits are specified to TI's AOQL (Average Outgoing Quality Level). Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 DC and Logic Electrical Characteristics (continued) The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully-differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = +3.3V, VREF+ = +2.5V and fully-differential input with fixed 1.250V commonmode voltage), VREF- = 0V, 12-bit + sign conversion mode(1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2)(3)(4) Parameter Test Conditions Typical (5) V+ = VA+ = VD+ = 3.3V Limits (6) V+ = VA+ = VD+ = 5V Limits (6) Units (Limits) 1.5 2.5 mA (max) POWER SUPPLY CHARACTERISTICS Awake (Active) ID+ Digital Supply Current CS = HIGH, Powered Down, CCLK on 600 A CS = HIGH, Powered Down, CCLK off 20 A Awake (Active) IA+ IREF Positive Analog Supply Current Reference Input Current 3.0 CS = HIGH, Powered Down, CCLK on 10 CS = HIGH, Powered Down, CCLK off 0.1 4.0 mA (max) A A CS = HIGH, Powered Down, CCLK on 70 A CS = HIGH, Powered Down, CCLK off 0.1 A AC Electrical Characteristics The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully-differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = +3.3V, VREF+ = +2.5V and fully-differential input with fixed 1.250V commonmode voltage), VREF- = 0V, 12-bit + sign conversion mode (1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2) Parameter Test Conditions Typical fCK Conversion Clock (CCLK) Frequency 10 1 fSK Serial Data Clock SCLK Frequency 10 0 tC (1) (2) (3) (4) (3) Limits (4) Units (Limits) 5 MHz (max) MHz (min) 5 MHz (max) Hz (min) Conversion Clock Duty Cycle 40 60 % (min) % (max) Serial Data Clock Duty Cycle 40 60 % (min) % (max) Conversion Time 12-Bit + Sign or 12-Bit 44(tCK) 44(tCK) (max) 8.8 s (max) The "12-Bit Conversion of Offset" and "12-Bit Conversion of Full-Scale" modes are intended to test the functionality of the device. Therefore, the output data from these modes are not an indication of the accuracy of a conversion result. Timing specifications are tested at the TTL logic levels, VOL = 0.4V for a falling edge and VOL = 2.4V for a rising edge. TRI-STATE output voltage is forced to 1.4V. Typical figures are at TJ = TA = 25C and represent most likely parametric norm. Tested limits are specified to TI's AOQL (Average Outgoing Quality Level). Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 9 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com AC Electrical Characteristics (continued) The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully-differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = +3.3V, VREF+ = +2.5V and fully-differential input with fixed 1.250V commonmode voltage), VREF- = 0V, 12-bit + sign conversion mode(1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2) Parameter Test Conditions Typical (3) 6(tCK) 6 Cycles Programmed 10(tCK) 10 Cycles Programmed tA Acquisition Time (5) 18(tCK) 18 Cycles Programmed 34(tCK) 34 Cycles Programmed tCAL Self-Calibration Time tAZ Auto Zero Time tSYNC Self-Calibration or Auto Zero Synchronization Time from DOR DOR High Time when CS is Low Continuously for Read Data and Software Power Up/Down tCONV CONV Valid Data Time (5) (4) Units (Limits) 6(tCK) (min) 7(tCK) (max) 1.2 s (min) 1.4 s (max) 10(tCK) (min) 11(tCK) (max) 2.0 s (min) 2.2 s (max) 18(tCK) (min) 19(tCK) (max) 3.6 s (min) 3.8 s (max) 34(tCK) (min) 35(tCK) (max) 6.8 s (min) 7.0 s (max) 4944(tCK) 4944(tCK) (max) 988.8 s (max) 76(tCK) 76(tCK) (max) 15.2 s (max) 2(tCK) tDOR Limits 9(tSK) 8(tSK) 2(tCK) (min) 3(tCK) (max) 0.40 s (min) 0.60 s (max) 9(tSK) (max) 1.8 s (max) 8(tSK) (max) 1.6 s (max) If SCLK and CCLK are driven from the same clock source, then tA is 6, 10, 18 or 34 clock periods minimum and maximum. AC Electrical Characteristics The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully-differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = +3.3V, VREF+ = +2.5V and fully-differential input with fixed 1.250V commonmode voltage), VREF- = 0V, 12-bit + sign conversion mode (1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2) (Continued) (1) (2) 10 The "12-Bit Conversion of Offset" and "12-Bit Conversion of Full-Scale" modes are intended to test the functionality of the device. Therefore, the output data from these modes are not an indication of the accuracy of a conversion result. Timing specifications are tested at the TTL logic levels, VOL = 0.4V for a falling edge and VOL = 2.4V for a rising edge. TRI-STATE output voltage is forced to 1.4V. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 AC Electrical Characteristics (continued) The following specifications apply for (V+ = VA+ = VD+ = +5V, VREF+ = +4.096V, and fully-differential input with fixed 2.048V common-mode voltage) or (V+ = VA+ = VD+ = +3.3V, VREF+ = +2.5V and fully-differential input with fixed 1.250V commonmode voltage), VREF- = 0V, 12-bit + sign conversion mode(1), source impedance for analog inputs, VREF- and VREF+ 25, fCK = fSK = 5 MHz, and 10 (tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C. (2) (Continued) Parameter Test Conditions Typical (3) Limits (4) Units (Limits) tHPU Hardware Power-Up Time, Time from PD Falling Edge to EOC Rising Edge 500 700 s (max) tSPU Software Power-Up Time, Time from Serial Data Clock Falling Edge to EOC Rising Edge 500 700 s (max) tACC Access Time Delay from CS Falling Edge to DO Data Valid 25 60 ns (max) tSET-UP Set-Up Time of CS Falling Edge to Serial Data Clock Rising Edge 50 ns (min) tDELAY Delay from SCLK Falling Edge to CS Falling Edge 0 5 ns (min) t1H, t0H Delay from CS Rising Edge to DO TRI-STATE 70 100 ns (max) tHDI DI Hold Time from Serial Data Clock Rising Edge 5 15 ns (max) tSDI DI Set-Up Time from Serial Data Clock Rising Edge 5 10 ns (min) tHDO DO Hold Time from Serial Data Clock Falling Edge 35 65 5 ns (max) ns (min) tDDO Delay from Serial Data Clock Falling Edge to DO Data Valid 50 90 ns (max) tRDO DO Rise Time, TRI-STATE to High DO Rise Time, Low to High RL = 3k, CL = 100 pF 10 10 40 40 ns (max) ns (max) tFDO DO Fall Time, TRI-STATE to Low DO Fall Time, High to Low RL = 3k, CL = 100 pF 15 15 40 40 ns (max) ns (max) tCD Delay from CS Falling Edge to DOR Falling Edge 45 80 ns (max) tSD Delay from Serial Data Clock Falling Edge to DOR Rising Edge 45 80 ns (max) CIN Capacitance of Logic Inputs 20 pF COUT Capacitance of Logic Outputs 20 pF (3) (4) RL = 3k, CL = 100 pF RL = 3k, CL = 100 pF Typical figures are at TJ = TA = 25C and represent most likely parametric norm. Tested limits are specified to TI's AOQL (Average Outgoing Quality Level). Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 11 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Figure 4. Transfer Characteristic Figure 5. Simplified Error Curve vs. Output Code without Auto Calibration or Auto Zero Cycles 12 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Figure 6. Simplified Error Curve vs. Output Code after Auto Calibration Cycle Figure 7. Offset or Zero Error Voltage Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 13 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics The following curves apply for 12-bit + sign mode after Auto Calibration unless otherwise specified. 14 Linearity Error Change vs. Clock Frequency Linearity Error Change vs. Temperature Figure 8. Figure 9. Linearity Error Change vs. Reference Voltage Linearity Error Change vs. Supply Voltage Figure 10. Figure 11. Full-Scale Error Change vs. Clock Frequency Full-Scale Error Change vs. Temperature Figure 12. Figure 13. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Typical Performance Characteristics (continued) The following curves apply for 12-bit + sign mode after Auto Calibration unless otherwise specified. Full-Scale Error Change vs. Reference Voltage Full-Scale Error Change vs. Supply Voltage Figure 14. Figure 15. Offset or Zero Error Change vs. Clock Frequency Offset or Zero Error Change vs. Temperature Figure 16. Figure 17. Offset or Zero Error Change vs. Reference Voltage Offset or Zero Error Change vs. Supply Voltage Figure 18. Figure 19. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 15 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) The following curves apply for 12-bit + sign mode after Auto Calibration unless otherwise specified. 16 Analog Supply Current vs. Temperature Digital Supply Current vs. Clock Frequency Figure 20. Figure 21. Digital Supply Current vs. Temperature Linearity Error Change vs. Temperature Figure 22. Figure 23. Full-Scale Error Change vs. Temperature Full-Scale Error Change vs. Supply Voltage Figure 24. Figure 25. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Typical Performance Characteristics (continued) The following curves apply for 12-bit + sign mode after Auto Calibration unless otherwise specified. Offset or Zero Error Change vs. Temperature Offset or Zero Error Change vs. Supply Voltage Figure 26. Figure 27. Analog Supply Current vs. Temperature Digital Supply Current vs. Temperature Figure 28. Figure 29. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 17 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Typical Dynamic Performance Characteristics The following curves apply for 12-bit + sign mode after Auto Calibration unless otherwise specified. 18 Bipolar Spectral Response with 1 kHz Sine Wave Input Bipolar Spectral Response with 10 kHz Sine Wave Input Figure 30. Figure 31. Bipolar Spectral Response with 20 kHz Sine Wave Input Bipolar Spectral Response with 30 kHz Sine Wave Input Figure 32. Figure 33. Bipolar Spectral Response with 40 kHz Sine Wave Input Bipolar Spectral Response with 50 kHz Sine Wave Input Figure 34. Figure 35. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Typical Dynamic Performance Characteristics (continued) The following curves apply for 12-bit + sign mode after Auto Calibration unless otherwise specified. Bipolar Spurious Free Dynamic Range Unipolar Signal-to-Noise Ratio vs. Input Frequency Figure 36. Figure 37. Unipolar Signal-to-Noise + Distortion Ratio vs. Input Frequency Unipolar Signal-to-Noise + Distortion Ratio vs. Input Signal Level Figure 38. Figure 39. Unipolar Spectral Response with 1 kHz Sine Wave Input Unipolar Spectral Response with 10 kHz Sine Wave Input Figure 40. Figure 41. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 19 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Typical Dynamic Performance Characteristics (continued) The following curves apply for 12-bit + sign mode after Auto Calibration unless otherwise specified. 20 Unipolar Spectral Response with 20 kHz Sine Wave Input Unipolar Spectral Response with 30 kHz Sine Wave Input Figure 42. Figure 43. Unipolar Spectral Response with 40 kHz Sine Wave Input Unipolar Spectral Response with 50 kHz Sine Wave Input Figure 44. Figure 45. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Test Circuits Figure 46. DO "TRI-STATE" (t1H, t0H) Figure 47. DO except "TRI-STATE" Figure 48. Leakage Current Timing Diagrams Figure 49. DO Falling and Rising Edge Figure 50. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 21 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Figure 51. DI Data Input Timing Figure 52. DO Data Output Timing Using CS 0 1 2 3 4 n SCLK tSET-UP CS tDDO tHDO tHDO tACC DO 2.4V 2.4V 0.4V tDDO 0.4V 2.4V tSD tCD DOR EOC Figure 53. DO Data Output Timing with CS Continuously Low 22 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Note: DO output data is not valid during this cycle. Figure 54. ADC12138 Auto Cal or Auto Zero Figure 55. ADC12138 Read Data without Starting a Conversion Using CS Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 23 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Figure 56. ADC12138 Read Data without Starting a Conversion with CS Continuously Low Figure 57. ADC12138 Conversion Using CS with 16-Bit Digital Output Format 24 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Figure 58. ADC12138 Conversion with CS Continuously Low and 16-Bit Digital Output Format Figure 59. ADC12138 Software Power Up/Down Using CS with 16-Bit Digital Output Format Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 25 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Figure 60. ADC12138 Software Power Up/Down with CS Continuously Low and 16-Bit Digital Output Format Note: Hardware power up/down may occur at any time. If PD is high while a conversion is in progress that conversion will be corrupted and erroneous data will be stored in the output shift register. Figure 61. ADC12138 Hardware Power Up/Down 26 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Figure 62. ADC12138 Configuration Modification--Example of a Status Read VA+ ANALOG INPUT VOLTAGE ASSIGNED (+) INPUT VD+ ** 0.01 uF ** 0.1 uF 10 uF * ** 0.01 uF ** 0.1 uF 10 uF * ** 0.01 uF ** 0.1 uF 10 uF * +5.0V ADC ANALOG INPUT VOLTAGE ASSIGNED (-) INPUT VREF+ +4.096V VREFAGND DGND ANALOG INPUT VOLTAGE GROUND REFERENCE *Tantalum **Monolithic Ceramic or better Figure 63. Recommended Power Supply Bypassing and Grounding Figure 64. Protecting the MUXOUT1, MUXOUT2, A/DIN1 and A/DIN2 Analog Pins Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 27 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Format and Set-Up Tables Table 1. Data Out Formats (1) DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB 10 DB 11 DB 12 DB 13 DB 14 DB 15 DB 16 17 Bits X X X X Sign MSB 10 9 8 7 6 5 4 3 2 1 LSB 13 Bits Sing MSB 10 9 8 7 6 5 4 3 2 1 LSB 17 Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB Sign X X X X 13 Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB Sign 16 Bits 0 0 0 0 MSB 10 9 8 7 6 5 4 3 2 1 LSB 12 Bits MSB 10 9 8 7 6 5 4 3 2 1 LSB 16 Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB 0 0 0 0 12 Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB DO Formats MSB First with Sign LSB First MSB First without Sign LSB First (1) X = High or Low state. Table 2. ADC12138 Multiplexer Addressing Analog Channel Addressed and Assignment with A/DIN1 tied to MUXOUT1 and A/DIN2 tied to MUXOUT2 MUX Address DI0 DI1 DI2 DI3 L L L L L L L L H L H L L L H H L H L L L H L H L H H L L H H H H L L L H L L H H L H L H L H H H H L L H H L H H H H L H H H H 28 CH 0 CH 1 + - CH 2 CH 3 + CH 4 CH 5 CH 6 A/DIN2 MUXOUT1 MUXOUT2 + - CH0 CH1 + - CH2 CH3 + - CH4 CH5 + - CH6 CH7 - + CH0 CH1 - + CH2 CH3 - + CH4 CH5 - + CH6 CH7 - + - CH0 COM - + - CH2 COM - + - CH4 COM - + - CH6 COM - + - CH1 COM - + - CH3 COM - + - CH5 COM - + - CH7 COM - + - + - + - + - + + + + + + Submit Documentation Feedback + + + Multiplexer Output Channel Assignment A/DIN1 - + - CH COM 7 ADC Input Polarity Assignment Mode Differential Single-Ended Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Table 3. ADC12130 and ADC12132 Multiplexer Addressing (1) Analog Channel Addressed and Assignment MUX Address with A/DIN1 tied to MUXOUT1 and A/DIN2 tied to MUXOUT2 Multiplexer Output Channel Assignment DI0 DI1 CH0 CH1 A/DIN1 A/DIN2 MUXOUT1 MUXOUT2 L L + - + - CH0 CH1 L H - + - + CH0 CH1 H L + - + - CH0 COM H H - + - CH1 COM (1) COM ADC Input Polarity Assignment + Mode Differential Single-Ended ADC12130 do not have A/DIN1, A/DIN2, MUXOUT1 and MUXOUT2 pins. Table 4. Mode Programming (1) ADC12138 ADC12130 and ADC12132 DI0 DI0 DI1 DI2 DI3 DI1 DI5 DI6 DI7 DI5 Mode Selected (Current) DO Format (next Conversion Cycle) DI2 DI3 DI4 See Table 2 or Table 3 L L L L 12 Bit Conversion 12 or 13 Bit MSB First See Table 2 or Table 3 L L L H 12 Bit Conversion 16 or 17 Bit MSB First See Table 2 or Table 3 L H L L 12 Bit Conversion 12 or 13 Bit LSB First See Table 2 or Table 3 (1) DI4 L H L H 12 Bit Conversion 16 or 17 Bit LSB First L L L L H L L L Auto Cal No Change L L L L H L L H Auto Zero No Change L L L L H L H L Power Up No Change L L L L H L H H Power Down No Change L L L L H H L L Read Status Register No Change L L L L H H L H Data Out without Sign No Change H L L L H H L H Data Out with Sign No Change L L L L H H H L Acquisition Time--6 CCLK Cycles No Change L H L L H H H L Acquisition Time--10 CCLK Cycles No Change H L L L H H H L Acquisition Time--18 CCLK Cycles No Change H H L L H H H L Acquisition Time--34 CCLK Cycles No Change L L L L H H H H User Mode No Change H X X X H H H H Test Mode (CH1-CH7 become Active Outputs) No Change The ADC powers up with no Auto Cal, no Auto Zero, 10 CCLK acquisition time, 12-bit + sign conversion, power up, 12- or 13-bit MSB First, and user mode. X = Don't Care Table 5. Conversion/Read Data Only Mode Programming (1) (1) CS CONV PD Mode L L L See Table 4 for Mode Read Only (Previous DO Format). No Conversion. L H L H X L Idle X X H Power Down X = Don't Care Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 29 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Table 6. Status Register Status Bit Location Status Bit DB0 PU DB1 DB2 PD Cal DB3 DB4 12 or 13 Device Status Function 30 "High" indicates a Power Up Sequence is in progress "High" indicates a Power Down Sequence is in progress Submit Documentation Feedback DB5 DB6 DB7 DB8 16 or 17 Sign Justification Test Mode When "High" the conversion result will be output MSB first. When "Low" the result will be output LSB first. When "High" the device is in test mode. When "Low" the device is in user mode. DO Output Format Status "High" Not used indicates an Auto Cal Sequence is in progress "High" indicates a 12 or 13 bit format "High" indicates a 16 or 17 bit format "High" indicates that the sign bit is included. When "Low" the sign bit is not included. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 APPLICATION INFORMATION NOTE: Some of the device/package combinations are obsolete and are shown and described here for reference only. Please see the TI web site for availability. 1.0 DIGITAL INTERFACE 1.1 Interface Concepts The example in Figure 65 shows a typical sequence of events after the power is applied to the ADC12130/2/8: Figure 65. Typical Power Supply Power Up Sequence The first instruction input to the ADC via DI initiates Auto Cal. The data output on DO at that time is meaningless and is completely random. To determine whether the Auto Cal has been completed, a read status instruction should be issued to the ADC. Again the data output at that time has no significance since the Auto Cal procedure modifies the data in the output shift register. To retrieve the status information, an additional read status instruction should be issued to the ADC. At this time the status data is available on DO. If the Cal signal in the status word is low, Auto Cal has been completed. Therefore, the next instruction issued can start a conversion. The data output at this time is again status information. To keep noise from corrupting the conversion, status can not be read during a conversion. If CS is strobed and is brought low during a conversion, that conversion is prematurely ended. EOC can be used to determine the end of a conversion or the ADC controller can keep track in software of when it would be appropriate to communicate to the ADC again. Once it has been determined that the ADC has completed a conversion, another instruction can be transmitted to the ADC. The data from this conversion can be accessed when the next instruction is issued to the ADC. Note, when CS is low continuously it is important to transmit the exact number of SCLK cycles, as shown in the timing diagrams. Not doing so will desynchronize the serial communication to the ADC. (See 1.3 CS Low Continuously Considerations.) 1.2 Changing Configuration The configuration of the ADC12130/2/8 on power up defaults to 12-bit plus sign resolution, 12- or 13-bit MSB First, 10 CCLK acquisition time, user mode, no Auto Cal, no Auto Zero, and power up mode. Changing the acquisition time and turning the sign bit on and off requires an 8-bit instruction to be issued to the ADC. This instruction will not start a conversion. The instructions that select a multiplexer address and format the output data do start a conversion. Figure 66 describes an example of changing the configuration of the ADC12130/2/8. During I/O sequence 1, the instruction at DI configures the ADC to do a conversion with 12-bit +sign resolution. Notice that, when the 6 CCLK Acquisition and Data Out without Sign instructions are issued to the ADC, I/O sequences 2 and 3, a new conversion is not started. The data output during these instructions is from conversion N, which was started during I/O sequence 1. The Figure 62 describes in detail the sequence of events necessary for a Data Out without Sign, Data Out with Sign, or 6/10/18/34 CCLK Acquisition time mode selection. Table 4 describes the actual data necessary to be loaded into the ADC to accomplish this configuration modification. The next instruction, shown in Figure 66, issued to the ADC starts conversion N+1 with 16-bit format and 12 bits of resolution formatted MSB first. Again the data output during this I/O cycle is the data from conversion N. The number of SCLKs applied to the ADC during any conversion I/O sequence should vary in accord with the data out word format chosen during the previous conversion I/O sequence. The various formats and resolutions available are shown in Table 1. In Figure 66, since 16-bit without sign MSB first format was chosen during I/O sequence 4, the number of SCLKs required during I/O sequence 5 is sixteen. In the following I/O sequence the format changes to 12-bit without sign MSB first; therefore the number of SCLKs required during I/O sequence 6 changes accordingly to 12. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 31 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com 1.3 CS Low Continuously Considerations When CS is continuously low, it is important to transmit the exact number of SCLK pulses that the ADC expects. Not doing so will desynchronize the serial communications to the ADC. When the supply power is first applied to the ADC, it will expect to see 13 SCLK pulses for each I/O transmission. The number of SCLK pulses that the ADC expects to see is the same as the digital output word length. The digital output word length is controlled by the Data Out (DO) format. The DO format maybe changed any time a conversion is started or when the sign bit is turned on or off. The table below details out the number of clock periods required for different DO formats: DO Format Number of SCLKs Expected 12-Bit MSB or LSB First 16-Bit MSB or LSB first SIGN OFF 12 SIGN ON 13 SIGN OFF 16 SIGN ON 17 If erroneous SCLK pulses desynchronize the communications, the simplest way to recover is by cycling the power supply to the device. Not being able to easily resynchronize the device is a shortcoming of leaving CS low continuously. The number of clock pulses required for an I/O exchange may be different for the case when CS is left low continuously vs. the case when CS is cycled. Take the I/O sequence detailed in Figure 65 as an example. The table below lists the number of SCLK pulses required for each instruction: Instruction CS Low Continuously CS Strobed Auto Cal 13 SCLKs 8 SCLKs Read Status 13 SCLKs 8 SCLKs Read Status 13 SCLKs 8 SCLKs 12-Bit + Sign Conv 1 13 SCLKs 8 SCLKs 12-Bit + Sign Conv 2 13 SCLKs 13 SCLKs 1.4 Analog Input Channel Selection The data input at DI also selects the channel configuration (see Table 2, Table 3, and Table 4). In Figure 66 the only times when the channel configuration could be modified would be during I/O sequences 1, 4, 5 and 6. Input channels are reselected before the start of each new conversion. Shown below is the data bit stream required at DI during I/O sequence number 4 in Figure 66 to set CH1 as the positive input and CH0 as the negative input for the different ADC versions. Part Number (1) DI Data (1) DI0 DI1 DI2 DI3 DI4 DI5 DI6 DI7 ADC12130andADC12132 L H L L H ADC12138 L H L L L L X X L H L X can be a logic high (H) or low (L). 1.5 Power Up/Down The ADC may be powered down by taking the PD pin HIGH or by the instruction input at DI (see Table 4, Table 5, Figure 59, Figure 60, and Figure 61). When the ADC is powered down in this way, the ADC conversion circuitry is deactivated but the digital I/O circuitry is kept active. Hardware power up/down is controlled by the state of the PD pin. Software power-up/down is controlled by the instruction issued to the ADC. If a software power up instruction is issued to the ADC while a hardware power down is in effect (PD pin high) the device will remain in the power-down state. If a software power down instruction is issued to the ADC while a hardware power up is in effect (PD pin low), the device will power down. When the device is powered down by software, it may be powered up by either issuing a software power up instruction or by taking PD pin high and then low. If the power down command is issued during a conversion, that conversion is interrupted, so the data output after power up cannot be relied upon. 32 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Figure 66. Changing the ADC's Conversion Configuration 1.6 User Mode and Test Mode An instruction may be issued to the ADC to put it into test mode, which is used by the manufacturer to verify complete functionality of the device. During test mode CH0-CH7 become active outputs. If the device is inadvertently put into the test mode with CS continuously low, the serial communications may be desynchronized. Synchronization may be regained by cycling the power supply voltage to the device. Cycling the power supply voltage will also set the device into user mode. If CS is used in the serial interface, the ADC may be queried to see what mode it is in. This is done by issuing a "read STATUS register" instruction to the ADC. When bit 9 of the status register is high, the ADC is in test mode; when bit 9 is low the ADC, is in user mode. As an alternative to cycling the power supply, an instruction sequence may be used to return the device to user mode. This instruction sequence must be issued to the ADC using CS. The following table lists the instructions required to return the device to user mode. Note that this entire sequence, including both Test Mode and User Mode values, should be sent to recover from the test mode. Instruction DI0 DI1 DI2 DI3 DI4 DI5 DI6 DI7 TEST MODE H X X X H H H H Reset Test Mode Instructions L L L L H H H L L L L L H L H L L L L L H L H H L L L L H H H H USER MODE (1) DI Data (1) Power Up L L L L H L H L Set DO with or without Sign H or L L L L H H L H Set Acquisition Time H or L H or L L L H H H L Start a Conversion H or L H or L H or L H or L L H or L H or L H or L X = Don't Care The power up, data with or without sign, and acquisition time instructions should be resent after returning to the user mode. This is to ensure that the ADC is in the required state before a conversion is started. 1.7 Reading the Data Without Starting a Conversion The data from a particular conversion may be accessed without starting a new conversion by ensuring that the CONV line is taken high during the I/O sequence. See Figure 55 and Figure 56.Table 5 describes the operation of the CONV pin. It is not necessary to read the data as soon as DOR goes low. The data will remain in the output register ifCS is brought high right after DOR goes high. A single conversion may be read as many times as desired before CS is brought low. 1.8 Brown Out Conditions When the supply voltage dips below about 2.7V, the internal registers, including the calibration coefficients and all of the other registers, may lose their contents. When this happens the ADC will not perform as expected or not at all after power is fully restored. While writing the desired information to all registers and performing a calibration might sometimes cause recovery to full operation, the only sure recovery method is to reduce the supply voltage to below 0.5V, then reprogram the ADC and perform a calibration after power is fully restored. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 33 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com 2.0 THE ANALOG MULTIPLEXER For the ADC12138, the analog input multiplexer can be configured with 4 differential channels or 8 single ended channels with the COM input as the zero reference or any combination thereof (see Figure 67). The difference between the voltages at the VREF+ and VREF- pins determines the input voltage span (VREF). The analog input voltage range is 0 to VA+. Negative digital output codes result when VIN- > VIN+. The actual voltage at VIN- or VIN+ cannot go below AGND. 8 Single-Ended Channels with COM as Zero Reference 4 Differential Channels Figure 67. Input Multiplexer Options Differential Configuration Single-Ended Configuration A/DIN1 and A/DIN2 can be assigned as the + or - input A/DIN1 is + input A/DIN2 is - input Figure 68. MUXOUT connections for multiplexer option CH0, CH2, CH4, and CH6 can be assigned to the MUXOUT1 pin in the differential configuration, while CH1, CH3, CH5, and CH7 can be assigned to the MUXOUT2 pin. In the differential configuration, the analog inputs are paired as follows: CH0 with CH1, CH2 with CH3, CH4 with CH5 and CH6 with CH7. The A/DIN1 and A/DIN2 pins can be assigned positive or negative polarity. With the single-ended multiplexer configuration, CH0 through CH7 can be assigned to the MUXOUT1 pin. The COM pin is always assigned to the MUXOUT2 pin. A/DIN1 is assigned as the positive input; A/DIN2 is assigned as the negative input. (See Figure 68). The Multiplexer assignment tables for these ADCs (Table 2 and Table 3) summarize the aforementioned functions for the different versions of ADCs. 2.1 Biasing for Various Multiplexer Configurations Figure 69 is an example of device connections for single-ended operation. The sign bit is always low. The digital output range is 0 0000 0000 0000 to 0 1111 1111 1111. One LSB is equal to 1 mV (4.1V/4096 LSBs). 34 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 ANALOG INPUT VOLTAGE RANGE 0 TO 4.096V (0V TO 2.5V) 12-BITS UNSIGNED VA+ CH0 CH1 CH2 to CH7 ASSIGNED (+) INPUT VD+ 0.01 uF 0.1 uF 10 uF 0.01 uF 0.1 uF 10 uF +5.0V (+3.3V) 1k ADC1213X ASSIGNED VREF+ (-) INPUT 0.01 uF COM 0.1 uF +2.048V (+2.5) 10 uF LM4040-4.1 (LM4040-2.5) VREFAGND DGND ANALOG INPUT VOLTAGE GROUND REFERENCE Figure 69. Single-Ended Biasing For pseudo-differential signed operation, the circuit of Figure 70 shows a signal AC coupled to the ADC. This gives a digital output range of -4096 to +4095. With a 2.5V reference, 1 LSB is equal to 610 V. Although the ADC is not production tested with a 2.5V reference, when VA+ and VD+ are +5.0V, linearity error typically will not change more than 0.1 LSB (see the curves in Typical Performance Characteristics). With the ADC set to an acquisition time of 10 clock periods, the input biasing resistor needs to be 600 or less. Notice though that the input coupling capacitor needs to be made fairly large to bring down the high pass corner. Increasing the acquisition time to 34 clock periods (with a 5 MHz CCLK frequency) would allow the 600 to increase to 6k, which would set the high pass corner at 26 Hz. Increasing R, to 6k would allow R2 to be 2k with a 1 F coupling capacitor. ANALOG INPUT VOLTAGE RANGE 0V to 5V (0V to 2.5V) 12-BITS SIGNED ASSIGNED (+) INPUT 600: (DEPENDS UPON ACQUISITION TIME) R1 VA+ CH0 CH1 CH2 to CH7 VD+ 0.1 uF 10 uF 0.01 uF 0.1 uF 10 uF COM VREF+ 0.01 uF 0.1 uF VREFAGND +5.0V (+3.3V) R2 ADC1213X ASSIGNED (-) INPUT 0.01 uF 10 uF 430: +2.5V (+1.25V) LM4040-2.5 (LM4041-1.2) DGND ANALOG INPUT VOLTAGE GROUND REFERENCE Figure 70. Pseudo-Differential Biasing with the Signal Source AC Coupled Directly into the ADC An alternative method for biasing pseudo-differential operation is to use the +2.5V from the LM4040 to bias any amplifier circuits driving the ADC as shown in Figure 71. The value of the resistor pull-up biasing the LM4040-2.5 will depend upon the current required by the op amp biasing circuitry. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 35 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com In the circuit of Figure 71, some voltage range is lost since the amplifier will not be able to swing to +5V and GND with a single +5V supply. Using an adjustable version of the LM4041 to set the full scale voltage at exactly 2.048V and a lower grade LM4040D-2.5 to bias up everything to 2.5V as shown in Figure 72 will allow the use of all the ADC's digital output range of -4096 to +4095 while leaving plenty of head room for the amplifier. Fully differential operation is shown in Figure 73. One LSB for this case is equal to (4.1V/4096) = 1 mV. ANALOG INPUT VOLTAGE RANGE 0V to 5V (0V to 2.5V) 12-BITS SIGNED + ANALOG INPUT VOLTAGE - ASSIGNED (+) INPUT CH0 CH1 CH2 to CH7 1M VA+ 0.01 uF 0.1 uF 10 uF VD+ 0.01 uF 0.1 uF 10 uF 1k ADC1213X ASSIGNED (-) INPUT VREF+ COM 0.01 uF +2.5V (+1.25V) 0.1 uF 10 uF LM4040-2.5 (LM4041-1.2) VREFAGND +5.0V (+3.3V) DGND ANALOG INPUT VOLTAGE GROUND REFERENCE Figure 71. Alternative Pseudo-Differential Biasing ANALOG INPUT VOLTAGE RANGE 2.5V +/- 2.048V 12-BITS SIGNED + ANALOG INPUT VOLTAGE ASSIGNED (+) INPUT +5.0V 1M 1k VA+ CH0 CH1 CH2 to CH7 VD+ 0.01 uF 0.1 uF 10 uF 0.01 uF 0.1 uF 10 uF 2k ADC1213X ASSIGNED (-) INPUT VREF+ COM +5.0V 0.01 uF 0.1 uF 10 uF +2.048V LM4040-2.5 VREFAGND DGND LM4041-ADJ ANALOG INPUT VOLTAGE GROUND REFERENCE Figure 72. Pseudo-Differential Biasing without the Loss of Digital Output Range 36 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 ANALOG INPUT VOLTAGE RANGE 0.45V to 4.55V (0.4V to 2.9V) ASSIGNED (+) INPUT CH0 CH2 CH4 or CH6 FULLY DIFFERENTIAL 12-BIT PLUS SIGN ANALOG INPUT VOLTAGE RANGE 0.45V to 4.55V (0.4V to 2.9V) VA+ 0.01 uF 0.1 uF 10 uF VD+ 0.01 uF 0.1 uF 10 uF 1k ADC1213X ASSIGNED (-) INPUT CH1 CH3 CH4 or CH7 VREF+ +5.0V (+3.3V) 0.01 uF 0.1 uF 10 uF +4.1V (+2.5V) LM4040-4.1 (LM4040-2.5) VREFAGND DGND ANALOG INPUT VOLTAGE GROUND REFERENCE Figure 73. Fully Differential Biasing 3.0 REFERENCE VOLTAGE The difference in the voltages applied to the VREF+ and VREF- defines the analog input span (the difference between the voltage applied between two multiplexer inputs or the voltage applied to one of the multiplexer inputs and analog ground) over which 4095 positive and 4096 negative codes exist. The voltage sources driving VREF+ and VREF- must have very low output impedance and noise. The circuit in Figure 74 is an example of a very stable reference appropriate for use with the device. *Tantalum Figure 74. Low Drift Extremely Stable Reference Circuit The ADC12130/2/8 can be used in either ratiometric or absolute reference applications. In ratiometric systems, the analog input voltage is proportional to the voltage used for the ADC's reference voltage. When this voltage is the system power supply, the VREF+ pin is connected to VA+ and VREF- is connected to ground. This technique relaxes the system reference stability requirements because the analog input voltage and the ADC reference voltage move together. This maintains the same output code for given input conditions. For absolute accuracy, where the analog input voltage varies between very specific voltage limits, a time and temperature stable voltage source can be connected to the reference inputs. Typically, the reference voltage magnitude will require an initial adjustment to null reference voltage induced full-scale errors. Below are recommended references along with some key specifications. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 37 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com Output Voltage Tolerance Temperature Coefficient LM4041CI-Adj Part Number 0.5% 100ppm/C LM4040AI-4.1 0.1% 100ppm/C LM4120AI-4.1 0.2% 50ppm/C LM4121AI-4.1 0.2% 50ppm/C LM4050AI-4.1 0.1% 50ppm/C LM4030AI-4.1 0.05% 10ppm/C 0.1% 3.0ppm/C Adjustable 2ppm/C LM4040AI-4.1 Circuit of Figure 74 The reference voltage inputs are not fully differential. The ADC12130/2/8 will not generate correct conversions or comparisons if VREF+ is taken below VREF-. Correct conversions result when VREF+ and VREF- differ by 1V or more and remain at all times between ground and VA+. The VREF common mode range, (VREF+ + VREF-)/2, is restricted to (0.1 x VA+) to (0.6 x VA+). Therefore, with VA+ = 5V, the center of the reference ladder should not go below 0.5V or above 3.0V. Figure 75 is a graphic representation of the voltage restrictions on VREF+ and VREF-. Figure 75. VREF Operating Range 4.0 ANALOG INPUT VOLTAGE RANGE The ADC12130/2/8's fully differential ADC generate a two's complement output that is found by using the equation shown below: for (12-bit) resolution the Output Code = (1) 38 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 Round off to the nearest integer value between -4096 to 4095 if the result of the above equation is not a whole number. Examples are shown in the table below: VREF+ VREF- VIN+ VIN- Code Output Digital +2.5V +1V +1.5V 0V 0,1111,1111,1111 +4.096V 0V +3V 0V 0,1011,1011,1000 +4.096V 0V +2.499V +2.500V 1,1111,1111,1111 +4.096V 0V 0V +4.096V 1,0000,0000,0000 5.0 INPUT CURRENT At the start of the acquisition window (tA) a charging current flows into or out of the analog input pins (A/DIN1 and A/DIN2) depending upon the input voltage polarity. The analog input pins are CH0-CH7 and COM when A/DIN1 is tied to MUXOUT1 and A/DIN2 is tied to MUXOUT2. The peak value of this input current will depend upon the actual input voltage applied, the source impedance and the internal multiplexer switch on resistance. With MUXOUT1 tied to A/DIN1 and MUXOUT2 tied to A/DIN2 the internal multiplexer switch on resistance is typically 1.6 k. The A/DIN1 and A/DIN2 mux on resistance is typically 750. 6.0 INPUT SOURCE RESISTANCE For low impedance voltage sources (<600), the input charging current will decay, before the end of the S/H's acquisition time of 2 s (10 CCLK periods with fCK = 5 MHz), to a value that will not introduce any conversion errors. For high source impedances, the S/H's acquisition time can be increased to 18 or 34 CCLK periods. For less ADC accuracy and/or slower CCLK frequencies the S/H's acquisition time may be decreased to 6 CCLK periods. To determine the number of clock periods (Nc) required for the acquisition time with a specific source impedance for the various resolutions the following equations can be used: 12 Bit + Sign NC = [RS + 2.3] x fCK x 0.824 Where fCK is the conversion clock (CCLK) frequency in MHz and RS is the external source resistance in k. As an example, operating with a resolution of 12 Bits + sign, a 5 MHz clock frequency and maximum acquisition time of 34 conversion clock periods the ADC's analog inputs can handle a source impedance as high as 6 k. The acquisition time may also be extended to compensate for the settling or response time of external circuitry connected between the MUXOUT and A/DIN pins. An acquisition starts at a falling edge of SCLK and ends at a rising edge of CCLK (see timing diagrams). If SCLK and CCLK are asynchronous, one extra CCLK clock period may be inserted into the programmed acquisition time for synchronization. Therefore, with asynchronous SCLK and CCLK, the acquisition time will change from conversion to conversion. 7.0 INPUT BYPASS CAPACITANCE External capacitors (0.01 F-0.1 F) can be connected between the analog input pins, CH0-CH7, and analog ground to filter any noise caused by inductive pickup associated with long input leads. These capacitors will not degrade the conversion accuracy. 8.0 NOISE The leads to each of the analog multiplexer input pins should be kept as short as possible. This will minimize input noise and clock frequency coupling that can cause conversion errors. Input filtering can be used to reduce the effects of the noise sources. 9.0 POWER SUPPLIES Noise spikes on the VA+ and VD+ supply lines can cause conversion errors; the comparator will respond to the noise. The ADC is especially sensitive to any power supply spikes that occur during the Auto Zero or linearity correction. The minimum power supply bypassing capacitors recommended are low inductance tantalum capacitors of 10 F or greater paralleled with 0.1 F monolithic ceramic capacitors. More or different bypassing may be necessary depending upon the overall system requirements. Separate bypass capacitors should be used for the VA+ and VD+ supplies and placed as close as possible to these pins. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 39 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com 10.0 GROUNDING The ADC12130/2/8's performance can be maximized through proper grounding techniques. These include the use of separate analog and digital areas of the board with analog and digital components and traces located only in their respective areas. Bypass capacitors of 0.01 F and 0.1 F surface mount capacitors and a 10 F are recommended at each of the power supply pins for best performance. These capacitors should be located as close to the bypassed pin as practical, especially the smaller value capacitors. 11.0 CLOCK SIGNAL LINE ISOLATION The ADC12130/2/8's performance is optimized by routing the analog input/output and reference signal conductors as far as possible from the conductors that carry the clock signals to the CCLK and SCLK pins. Maintaining a separation of at least 7 to 10 times the height of the clock trace above its reference plane is recommended. 12.0 THE CALIBRATION CYCLE A calibration cycle needs to be started after the power supplies, reference, and clock have been given enough time to stabilize after initial turn-on. During the calibration cycle, correction values are determined for the offset voltage of the sampled data comparator and any linearity and gain errors. These values are stored in internal RAM and used during an analog-to-digital conversion to bring the overall full-scale, offset, and linearity errors down to the specified limits. Full-scale error typically changes 0.4 LSB over temperature and linearity error changes even less; therefore, it should be necessary to go through the calibration cycle only once after power up if the Power Supply Voltage and the ambient temperature do not change significantly (see the curves in the Typical Performance Characteristics). 13.0 THE Auto Zero CYCLE To correct for any change in the zero (offset) error of the ADC, the Auto Zero cycle can be used. It may be desirable to do an Auto Zero cycle whenever the ambient temperature or the power supply voltage change significantly. (See the curves, Figure 17 and Figure 19, in the Typical Performance Characteristics.) 14.0 DYNAMIC PERFORMANCE Many applications require the converter to digitize AC signals, but the standard DC integral and differential nonlinearity specifications will not accurately predict the converter's performance with AC input signals. The important specifications for AC applications reflect the converter's ability to digitize AC signals without significant spectral errors and without adding noise to the digitized signal. Dynamic characteristics such as signal-to-noise (S/N), signal-to-noise + distortion ratio or S/(N + D), effective bits, full power bandwidth, aperture time and aperture jitter are quantitative measures of the converter's capability. An ADC's AC performance can be measured using Fast Fourier Transform (FFT) methods. A sinusoidal waveform is applied to the ADC's input, and the transform is then performed on the digitized waveform. S/(N + D) and S/N are calculated from the resulting FFT data, and a spectral plot may also be obtained. Typical values for S/N are shown in Converter Electrical Characteristics, and spectral plots of S/(N + D) are included in Typical Performance Characteristics. The ADC's noise and distortion levels will change with the frequency of the input signal, with more distortion and noise occurring at higher signal frequencies. This can be seen in the S/(N + D) versus frequency curves. These curves will also give an indication of the full power bandwidth (the frequency at which the S/(N + D) or S/N drops 3 dB). Effective number of bits can also be useful in describing the ADC's noise and distortion performance. An ideal ADC will have some amount of quantization noise, determined by its resolution, and no distortion, which will yield an optimum S/(N + D) ratio given by the following equation: S/(N + D) = (6.02 x n + 1.76) dB where * "n" is the ADC's resolution in bits (2) The effective bits of an actual ADC can be found by: n(effective) = ENOB = (S/(N + D) - 1.76) / 6.02 40 Submit Documentation Feedback (3) Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 As an example, this device with a differential signed 5V, 1 kHz sine wave input signal will typically have a S/(N + D) of 77 dB, which is equivalent to 12.5 effective bits. 15.0 AN RS232 SERIAL INTERFACE Shown on the following page is a schematic for an RS232 interface to any IBM and compatible PCs. The DTR, RTS, and CTS RS232 signal lines are buffered via level translators and connected to the ADC12138's DI, SCLK, and DO pins, respectively. The D flip-flop is used to generate the CS signal. CH0 VD+ CH1 DOR CH2 CCLK CH3 SCLK CH4 DI CH5 DO CH6 CS +5V 1/4 DS14C89 1/6 74HC04 RTS 5 MHz 1/4 DS14C89 DTR ABC CH7 CONV COM EOC MUXOUT1 CTS 1/4 DS14C88 RS-232 Interface D Q PD CLK A/DIN1 AGND MUXOUT2 VREF+ A/DIN2 VREF- DGND VA+ +4.096V 7474 +5V Note: VA+, VD+, and VREF+ on the ADC12138 each have 0.01 F and 0.1 F chip caps, and 10 F tantalum caps. All logic devices are bypassed with 0.1 F caps. Figure 76. RS232 Serial Interface Schematic The assignment of the RS232 port is shown below COM1 B7 B6 B5 B4 B3 B2 B1 B0 Input Address 3FE X X X CTS X X X X Output Address 3FC X X X 0 X X RTS DTR A sample program, written in Microsoft QuickBasic, is shown on the next page. The program prompts for data mode select instruction to be sent to the ADC. This can be found from the Mode Programming table shown earlier. The data should be entered in "1"s and "0"s as shown in the table with DI0 first. Next, the program prompts for the number of SCLK cycles required for the programmed mode select instruction. For instance, to send all "0"s to the ADC, selects CH0 as the +input, CH1 as the -input, 12-bit conversion, and 13-bit MSB first data output format (if the sign bit was not turned off by a previous instruction). This would require 13 SCLK periods since the output data format is 13 bits. The ADC powers up with No Auto Cal, No Auto Zero, 10 CCLK Acquisition Time, 12-bit conversion, data out with sign, power up, 12- or 13-bit MSB First, and user mode. Auto Cal, Auto Zero, Power Up and Power Down instructions do not change these default settings. The following power up sequence should be followed: 1. Run the program 2. Prior to responding to the prompt apply the power to the ADC12138 3. Respond to the program prompts Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 41 ADC12130, ADC12132, ADC12138 SNAS098G - MARCH 2000 - REVISED MARCH 2013 www.ti.com It is recommended that the first instruction issued to the ADC12138 be Auto Cal (See 1.1 Interface Concepts). Code Listing: 'variables DOL=Data Out word length, DI=Data string for the DI input, ' DO=ADC result string 'SET CS# HIGH OUT &H3FC, (&H2 OR INP (&H3FC) 'set RTS HIGH OUT &H3FC, (&HFE AND INP(&H3FC) 'SET DTR LOW OUT &H3FC, (&HFD AND INP (&H3FC) 'SET RTS LOW OUT &H3FC, (&HEF AND INP(&H3FC)) 'set B4 low 10 LINE INPUT "DI data for ADC12138 (see Mode Table on data sheet)"; DI$ INPUT "ADC12138 output word length (12,13,16 or 17)"; DOL 20 'SET CS# HIGH OUT &H3FC, (&H2 OR INP (&H3FC) 'set RTS HIGH OUT &H3FC, (&HFE AND INP(&H3FC) 'SET DTR LOW OUT &H3FC, (&HFD AND INP (&H3FC) 'SET RTS LOW 'SET CS# LOW OUT &H3FC, (&H2 OR INP (&H3FC) 'set RTS HIGH OUT &H3FC, (&H1 OR INP(&H3FC) 'SET DTR HIGH OUT &H3FC, (&HFD AND INP (&H3FC) 'SET RTS LOW DO$=" " 'reset DO variable OUT &H3FC, (&H1 OR INP(&H3FC) 'SET DTR HIGH OUT &H3FC, (&HFD AND INP(&H3FC)) 'SCLK low FOR N = 1 TO 8 Temp$ = MID$(DI$, N, 1) IF Temp$="0" THEN OUT &H3FC, (&H1 OR INP(&H3FC)) ELSE OUT &H3FC, (&HFE AND INP(&H3FC)) END IF 'out DI OUT &H3FC, (&H2 OR INP(&H3FC)) 'SCLK high IF (INP(&H3FE) AND 16) = 16 THEN DO$ = DO$ + "0" ELSE DO$ = DO$ + "1" END IF 'Input DO OUT &H3FC, (&H1 OR INP(&H3FC) 'SET DTR HIGH OUT &H3FC, (&HFD AND INP(&H3FC)) 'SCLK low NEXT N IF DOL > 8 THEN FOR N=9 TO DOL OUT &H3FC, (&H1 OR INP(&H3FC) 'SET DTR HIGH OUT &H3FC, (&HFD AND INP(&H3FC)) 'SCLK low OUT &H3FC, (&H2 OR INP(&H3FC)) 'SCLK high IF (INP(&H3FE) AND &H1O) = &H1O THEN DO$ = DO$ + "0" ELSE DO$ = DO$ + "1" END IF NEXT N END IF OUT &H3FC, (&HFA AND INP(&H3FC)) 'SCLK low and DI high FOR N = 1 TO 500 NEXT N PRINT DO$ INPUT "Enter "C" to convert else "RETURN" to alter DI data"; s$ IF s$ = "C" OR s$ = "c" THEN GOTO 20 ELSE GOTO 10 END IF END 42 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 ADC12130, ADC12132, ADC12138 www.ti.com SNAS098G - MARCH 2000 - REVISED MARCH 2013 REVISION HISTORY Changes from Revision F (March 2013) to Revision G * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 42 Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: ADC12130 ADC12132 ADC12138 Submit Documentation Feedback 43 PACKAGE OPTION ADDENDUM www.ti.com 17-Nov-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) ADC12130CIWM/NOPB ACTIVE SOIC DW 16 45 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC12130 CIWM ADC12130CIWMX/NOPB ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC12130 CIWM ADC12138CIMSA/NOPB LIFEBUY SSOP DB 28 47 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC12138 CIMSA ADC12138CIMSAX/NOPB LIFEBUY SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC12138 CIMSA ADC12138CIWM/NOPB LIFEBUY SOIC DW 28 26 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC12138 CIWM ADC12138CIWMX/NOPB LIFEBUY SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 ADC12138 CIWM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Nov-2018 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing ADC12130CIWMX/NOPB SOIC ADC12138CIMSAX/NOPB ADC12138CIWMX/NOPB SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.9 10.7 3.2 12.0 16.0 Q1 DW 16 1000 330.0 16.4 SSOP DB 28 2000 330.0 16.4 8.4 10.7 2.4 12.0 16.0 Q1 SOIC DW 28 1000 330.0 24.4 10.8 18.4 3.2 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADC12130CIWMX/NOPB SOIC DW 16 1000 367.0 367.0 38.0 ADC12138CIMSAX/NOPB SSOP DB 28 2000 367.0 367.0 38.0 ADC12138CIWMX/NOPB SOIC DW 28 1000 367.0 367.0 45.0 Pack Materials-Page 2 GENERIC PACKAGE VIEW DW 16 SOIC - 2.65 mm max height SMALL OUTLINE INTEGRATED CIRCUIT Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4040000-2/H PACKAGE OUTLINE DW0016A SOIC - 2.65 mm max height SCALE 1.500 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 14X 1.27 16 1 2X 8.89 10.5 10.1 NOTE 3 8 9 0.51 0.31 0.25 C A B 16X B 7.6 7.4 NOTE 4 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0.3 0.1 0 -8 1.27 0.40 DETAIL A (1.4) TYPICAL 4220721/A 07/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SEE DETAILS SYMM 16 1 16X (0.6) SYMM 14X (1.27) 9 8 R0.05 TYP (9.3) LAND PATTERN EXAMPLE SCALE:7X METAL SOLDER MASK OPENING SOLDER MASK OPENING 0.07 MAX ALL AROUND METAL 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220721/A 07/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SYMM 1 16 16X (0.6) SYMM 14X (1.27) 9 8 R0.05 TYP (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:7X 4220721/A 07/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DB0028A SSOP - 2 mm max height SCALE 1.500 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 26X 0.65 28 1 2X 10.5 9.9 NOTE 3 8.45 14 15 28X B 5.6 5.0 NOTE 4 SEE DETAIL A (0.15) TYP 0.38 0.22 0.15 C A B 2 MAX 0.25 GAGE PLANE 0 -8 0.95 0.55 0.05 MIN DETAIL A A 15 TYPICAL 4214853/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com EXAMPLE BOARD LAYOUT DB0028A SSOP - 2 mm max height SMALL OUTLINE PACKAGE SYMM 28X (1.85) (R0.05) TYP 1 28X (0.45) 28 26X (0.65) SYMM 15 14 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL EXPOSED METAL EXPOSED METAL 0.07 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.07 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4214853/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DB0028A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 28X (1.85) SYMM (R0.05) TYP 1 28X (0.45) 28 26X (0.65) SYMM 14 15 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214853/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. 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