12-Bit 10µs Serial CMOS Sampling
ANALOG-to-DIGITAL CONVERTER
FEATURES
●100kHz SAMPLING RATE
●72dB SINAD WITH 45kHz INPUT
●±1/2 LSB INL AND DNL
●SIX SPECIFIED INPUT RANGES
●SERIAL OUTPUT
●SINGLE +5V SUPPLY OPERATION
●PIN-COMPATIBLE WITH 16-BIT ADS7809
●USES INTERNAL OR EXTERNAL
REFERENCE
●100mW MAX POWER DISSIPATION
●0.3" SO-20
●SIMPLE DSP INTERFACE
DESCRIPTION
The ADS7808 is a complete 12-bit sampling analog-to-digital
using state-of-the-art CMOS structures. It contains a 12-bit
capacitor-based SAR A/D with S/H, reference, clock, and a
serial data interface. Data can be output using the internal
clock, or can be synchronized to an external data clock. The
ADS7808 also provides an output synchronization pulse for
ease of use with standard DSP processors.
The ADS7808 is specified at a 100kHz sampling rate, and
specified over the full temperature range. Laser-trimmed
scaling resistors provide various input ranges including ±10V
and 0V to 5V, while an innovative design operates from a
single +5V supply, with power dissipation under 100mW.
The ADS7808 is available in a 0.3" SO-20, fully specified for
operation over the industrial –40°C to +85°C range.
10kΩ
CDAC
4kΩ
20kΩ
5kΩ
Internal
+2.5V Ref
Clock
BUSY
Data Clock
Serial Data
Successive Approximation Register and Control Logic
Serial
Data
Out
Comparator
Buffer
20kΩ
R/C CS
R1
IN
R2
IN
R3
IN
REF
Power Down
CAP
ADS7808
SBAS018A – JANUARY 1992 – REVISED SEPTEMBER 2003
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1992-2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
ADS7808
ADS7808
2SBAS018A
www.ti.com
Analog Inputs: R1IN .......................................................................... ±25V
R2IN .......................................................................... ±25V
R3IN .......................................................................... ±25V
CAP .....................................VANA+0.3V to AGND2 –0.3V
REF ....................................... Indefinite Short to AGND2,
Momentary Short to VANA
Ground Voltage Differences: DGND, AGND2................................. ±0.3V
VANA ...................................................................................................... 7V
VDIG to VANA ....................................................................................... +0.3
VDIG ....................................................................................................... 7V
Digital Inputs ............................................................. –0.3V to V DIG +0.3V
Maximum Junction Temperature .................................................. +165°C
Internal Power Dissipation............................................................ 700mW
Lead Temperature (soldering, 10s) .............................................. +300°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, fS = 100kHz, VDIG = VANA = +5V, using internal reference and fixed resistors as shown in Figure 4, unless otherwise specified.
ADS7808U ADS7808UB
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
MAXIMUM MINIMUM
INTEGRAL SIGNAL-TO- SPECIFIED
LINEARITY (NOISE + DISTORTION) PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT ERROR (LSB) RATIO (DB) PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY
ADS7808U ±0.9 70 SO-20 DW –40°C to +85°C ADS7808U ADS7808U Tube, 38
" " " " " " " ADS7808U/1K Tape and Reel, 1000
ADS7808UB ±0.45 72 " " " ADS7808UB ADS7808UB Tube, 38
" " " " " " " ADS7808UB/1K Tape and Reel, 1000
PACKAGE/ORDERING INFORMATION
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
RESOLUTION 12 ✻Bits
ANALOG INPUT
Voltage Ranges ±10V, 0V to 5V, etc. (See Table I)
Impedance See Table I
Capacitance 35 ✻pF
THROUGHPUT SPEED
Conversion Time 5.7 8 ✻✻µs
Complete Cycle Acquire and Convert 10 ✻µs
Throughput Rate 100 ✻kHz
DC ACCURACY
Integral Linearity Error ±0.9 ±0.45 LSB(1)
Differential Linearity Error ±0.9 ±0.45 LSB
No Missing Codes Specified ✻
Transition Noise(2) 0.1 ✻LSB
Full Scale Error(3,4) ±0.5 ±0.25 %
Full Scale Error Drift ±7±5 ppm/°C
Full Scale Error(3,4) Ext. 2.5000V Ref ±0.5 ±0.25 %
Full Scale Error Drift Ext. 2.5000V Ref ±2✻ppm/°C
Bipolar Zero Error(3) Bipolar Ranges ±10 ✻mV
Bipolar Zero Error Drift Bipolar Ranges ±2±2 ppm/°C
Unipolar Zero Error(3) 0V to 10V Range ±5✻mV
0V to 4V Range ±3✻mV
0V to 5V Range ±3✻mV
Unipolar Zero Error Drift Unipolar Ranges ±2✻ppm/°C
Recovery to Rated Accuracy 1µF Capacitor to CAP 1 ✻ms
after Power Down
Power Supply Sensitivity +4.75V < VD < +5.25V ±0.5 ✻LSB
(VDIG = VANA = VD)
AC ACCURACY
Spurious-Free Dynamic Range fIN = 45kHz 80 90 ✻✻ dB(5)
Total Harmonic Distortion fIN = 45kHz –90 –80 ✻✻dB
Signal-to-(Noise+Distortion) fIN = 45kHz 70 73 72 ✻dB
Signal-to-Noise fIN = 45kHz 70 73 72 ✻dB
Full-Power Bandwidth(6) 250 ✻kHz
ADS7808 3
SBAS018A www.ti.com
ELECTRICAL CHARACTERISTICS (Cont.)
At TA = –40°C to +85°C, fS = 100kHz, VDIG = VANA = +5V, using internal reference and fixed resistors shown in Figure 4, unless otherwise specified.
ADS7808U ADS7808UB
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
Serial 12 bits
Binary Two's Complement or Straight Binary
Conversion results only available after completed conversion.
Selectable for internal or external data clock
SAMPLING DYNAMICS
Aperture Delay 40 ✻ns
Aperture Jitter Sufficient to meet AC specs ✻ns
Transient Response FS Step 2 ✻µs
Overvoltage Recovery(7) 150 ✻ns
REFERENCE
Internal Reference Voltage No Load 2.48 2.5 2.52 ✻✻✻ V
Internal Reference Source Current 1 ✻µA
(Must use external buffer)
External Reference Voltage Range 2.3 2.5 2.7 ✻✻✻ V
for Specified Linearity
External Reference Current Drain Ext. 2.5000V Ref 100 ✻µA
DIGITAL INPUTS
Logic Levels
VIL –0.3 +0.8 ✻✻V
VIH(8) +2.0 VD +0.3V ✻✻V
IIL VIL = 0V ±10 ✻µA
IIH VIH = 5V ±10 ✻µA
DIGITAL OUTPUTS
Data Format
Data Coding
Pipeline Delay
Data Clock
Internal EXT/INT LOW 2.3 ✻MHz
(Output Only When
Transmitting Data)
External EXT/INT HIGH 0.1 10 ✻✻MHz
(Can Run Continually)
VOL ISINK = 1.6mA +0.4 ✻V
VOH ISOURCE = 500µA+4 ✻V
Leakage Current High-Z State, ±5✻µA
VOUT = 0V to VDIG
Output Capacitance High-Z State 15 15 pF
POWER SUPPLIES
Specified Performance
VDIG Must be ≤ VANA +4.75 +5 +5.25 ✻✻✻ V
VANA +4.75 +5 +5.25 ✻✻✻V
IDIG 0.3 ✻mA
IANA 16 ✻mA
Power Dissipation: PWRD LOW VDIG = VANA = 5V, fS = 100kHz 100 ✻mW
PWRD HIGH 50 ✻µW
TEMPERATURE RANGE
Specified Performance –40 +85 ✻✻ °C
Derated Performance –55 +125 ✻✻ °C
Storage –65 +150 ✻✻°C
Thermal Resistance (
θ
JA)
SO 75 ✻°CW
✻ Specifications same as ADS7808U.
NOTES: (1) LSB means Least Significant Bit. For the ±10V input range, one LSB is 4.88mV. (2) Typical rms noise at worst case transitions and temperatures.
(3) As measured with fixed resistors in Figure 4. Adjustable to zero with external potentiometer. (4) For bipolar input ranges, full scale error is the worst case of
–Full Scale or +Full Scale untrimmed deviation from ideal first and last code transitions, divided by the transition voltage (not divided by the full-scale range) and
includes the effect of offset error. For unipolar input ranges, full scale error is the deviation of the last code transition divided by the transition voltage. It also includes
the effect of offset error. (5) All specifications in dB are referred to a full-scale ±10V input. (6) Full-Power Bandwidth defined as Full-Scale input frequency at which
Signal-to (Noise + Distortion) degrades to 60dB. (7) Recovers to specified performance after 2 x FS input overvoltage. (8) The minimum VIH level for the DATACLK
signal is 3V.
ADS7808
4SBAS018A
www.ti.com
PIN # NAME DESCRIPTION
PIN ASSIGNMENTS
PIN CONFIGURATION
V
DIG
V
ANA
PWRD
BUSY
CS
R/C
TAG
DATA
DATACLK
SYNC
R1
IN
AGND1
R2
IN
R3
IN
CAP
REF
AGND2
SB/BTC
EXT/INT
DGND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
ADS7808
ANALOG CONNECT R1IN CONNECT R2IN
INPUT VIA 200ΩVIA 100ΩCONNECT R3IN
RANGE TO TO TO IMPEDANCE
±10V VIN AGND CAP 22.9kΩ
±5V AGND VIN CAP 13.3kΩ
±3.33 VIN VIN CAP 10.7kΩ
0V to 10V AGND VIN AGND 13.3kΩ
0V to 5V AGND AGND VIN 10.0kΩ
0V to 4V VIN AGND VIN 10.7kΩ
TABLE I. Input Range Connections. See Figure 4 for
complete information.
1R1
IN Analog Input. See Table I and Figure 4 for input range connections.
2 AGND1 Analog Ground. Used internally as ground reference point. Minimal current flow.
3R2
IN Analog Input. See Table I and Figure 4 for input range connections.
4R3
IN Analog Input. See Table I and Figure 4 for input range connections.
5 CAP Reference Buffer Capacitor. 2.2µF Tantalum to ground.
6 REF Reference Input/Output. Outputs internal 2.5V reference. Can also be driven by external system reference. In both cases,
bypass to ground with a 2.2µF Tantalum capacitor.
7 AGND2 Analog Ground.
8 SB/BTC Select Straight Binary or Binary Two’s Complement data output format. If HIGH, data will be output in a Straight Binary format. If
LOW, data will be output in a Binary Two’s complement format.
9 EXT/INT Select External or Internal Clock for transmitting data. If HIGH, data will be output synchronized to the clock input on DATACLK. If
LOW, a convert command will initiate the transmission of the data from the previous conversion, along with 12 clock pulses output
on DATACLK.
10 DGND Digital Ground.
11 SYNC Synch Output. If EXT/INT is HIGH, either a rising edge on R/C with CS LOW or a falling edge on CS with R/C HIGH will output a
pulse on SYNC synchronized to the external DATACLK.
12 DATACLK Either an input or an output depending on the EXT/INT level. Output data will be synchronized to this clock. If EXT/INT is LOW,
DATACLK will transmit 12 pulses after each conversion, and then remain LOW between conversions.
13 DATA Serial Data Output. Data will be synchronized to DATACLK, with the format determined by the level of SB/BTC. In the external clock
mode, after 12-bits of data, the ADS7808 will output the level input on TAG as long as CS is LOW and R/C is HIGH (see Figure 3.) If
EXT/INT is LOW, data will be valid on both the rising and falling edges of DATACLK, and between conversions DATA will stay at the
level of the TAG input when the conversion was started.
14 TAG Tag Input for use in external clock mode. If EXT/INT is HIGH, digital data input on TAG will be output on DATA with a delay of 12
DATACLK pulses as long as CS is LOW and R/C is HIGH. See Figure 3.
15 R/C Read/Convert Input. With CS LOW, a falling edge on R/C puts the internal sample/hold into the hold state and starts a conversion.
When EXT/INT is LOW, this also initiates the transmission of the data results from the previous conversion. If EXT/INT is HIGH, a
rising edge on R/C with CS LOW, or a falling edge on CS with R/C HIGH, transmits a pulse on SYNC and initiates the transmission of
data from the previous conversion.
16 CS Chip Select. Internally OR’ed with R/C.
17 BUSY Busy Output. Falls when a conversion is started, and remains LOW until the conversion is completed and the data is latched into the
output shift register. CS or R/C must be HIGH when BUSY rises, or another conversion will start without time for signal acquisition.
18 PWRD Power Down Input. If HIGH, conversions are inhibited and power consumption is significantly reduced. Results from the previous
conversion are maintained in the output shift register.
19 VANA Analog Supply Input. Nominally +5V. Connect directly to pin 20, and decouple to ground with 0.1µF ceramic and 10µF Tantalum
capacitors.
20 VDIG Digital Supply Input. Nominally +5V. Connect directly to pin 19. Must be ≤ VANA.
ADS7808 5
SBAS018A www.ti.com
FIGURE 1. Basic Conversion Timing.
MODE Acquire
t
4
t
5
t
1
t
3
t
7
t
6
Convert Acquire
t
2
BUSY
CS, R/C
TABLE II. Conversion and Data Timing TA = –40°C to +85°C.
FIGURE 2. Serial Data Timing Using Internal Clock. (CS, EXT/INT and TAG Tied LOW.)
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t1Convert Pulse Width 40 4500 ns
t2BUSY Delay 65 ns
t3BUSY LOW 8 µs
t4BUSY Delay after 220 ns
End of Conversion
t5Aperture Delay 40 ns
t6Conversion Time 5.7 8 µs
t7Acquisition Time 2 µs
t6 + t7Throughput Time 9 10 µs
t8R/C LOW to DATACLK Delay 450 ns
t9DATACLK Period 440 ns
t10 Data Valid to DATACLK 2 0 75 ns
HIGH Delay
t11 Data Valid after 100 125 ns
DATACLK LOW Delay
t12 External DATACLK Period 100 ns
t13 External DATACLK HIGH 20 ns
t14 External DATACLK LOW 30 ns
t15 DATACLK HIGH 20 t12 + 5 ns
Setup Time
t16 R/C to CS 10 ns
Setup Time
t17 SYNC Delay After 15 35 ns
DATACLK HIGH
t18 Data Valid Delay 25 55 ns
t19 CS to Rising Edge Delay 25 ns
t20 Data Available after CS LOW 4.5 µs
1
MSB Valid
R/C
DATACLK
SDATA
t
8
t
11
t
10
t
9
2 3 11 12
Bit 10 Valid Bit 1 ValidBit 9 Valid LSB Valid
t
2
t
3
BUSY
ADS7808
6SBAS018A
www.ti.com
HEX HEX
DESCRIPTION BINARY CODE CODE BINARY CODE CODE
Full-Scale Range ±10 ±5±3.33V 0V to 5V 0V to 10V 0V to 4V
Least Significant Bit (LSB) 4.88mV 2.44mV 1.63mV 1.22mV 2.44mV 0.98mV
+Full Scale (FS – 1LSB) 9.99512V 4.99756V 3.33171V 4.99878V 9.99756V 3.99902V 0111 1111 1111 7FF 1111 1111 1111 FFF
Midscale 0V 0V 0V 2.5V 5V 2V 0000 0000 0000 000 1000 0000 0000 800
One LSB Below Midscale –4.88mV –2.44mV –1.63mV 2.49878V 4.99756V 1.99902V 1111 1111 1111 FFF 0111 1111 1111 7FF
–Full Scale –10V –5V –3.333333V 0V 0V 0V 1000 0000 0000 800 0000 0000 0000 000
BINARY TWO’S
COMPLEMENT STRAIGHT BINARY
(SB/BTC LOW) (SB/BTC HIGH)
Initiate Conversion and
Output Data Using External
Clock
Power Down
Selecting Output Format
Incorrect Conversions
SPECIFIC FUNCTION CS R/C BUSY EXT/INT DATACLK PWRD SB/BTC OPERATION
Initiate Conversion and 1>0 0 1 0 Output 0 x Initiates conversion “n”. Data from conversion “n–1”
Output Data Using clocked out on DATA synchronized to 12 clock
Internal Clock pulses output on DATACLK.
0 1>0 1 0 Output 0 x Initiates conversion “n”. Data from conversion “n–1”
clocked out on DATA synchronized to 12 clock
pulses output on DATACLK.
1>0 0 1 1 Input 0 x Initiates conversion “n”.
0 1>0 1 1 Input 0 x Initiates conversion “n”.
1>0 1 1 1 Input x x Outputs a pulse on SYNC followed by data from
conversion “n” clocked out synchronized to external
DATACLK.
1>0 1 0 1 Input 0 x Outputs a pulse on SYNC followed by data from
conversion “n–1” clocked out synchronized to
external DATACLK.(1) Conversion “n” in process.
0 0>1 0 1 Input 0 x Outputs a pulse on SYNC followed by data from
conversion “n–1” clocked out synchronized to
external DATACLK .(1) Conversion “n” in process.
0 0 0>1 x x 0 x CS or R/C must be HIGH or a new conversion will
be initiated without time for acquisition.
x x x x x 0 x Analog circuitry powered. Conversion can proceed.
x x x x x 1 x Analog circuitry disabled. Data from previous
conversion maintained in output registers.
x x x x x x 0 Serial data is output in Binary Two’s Complement
format.
x x x x x x 1 Serial data is output in Straight Binary format.
NOTE: (1) See Figure 3b for constraints on previous data valid during conversion.
Table III. Control Truth Table.
ANALOG INPUT
DIGITAL OUTPUT
Table IV. Output Codes and Ideal Input Voltages.
ADS7808 7
SBAS018A www.ti.com
FIGURE 3a. Conversion and Read Timing with External Clock. (EXT/INT Tied HIGH). Read After Conversion.
EXTERNAL
DATACLK
CS
0
Bit 11 (MSB)
R/C
BUSY
DATA
TAG
SYNC
12 34 1314
Bit 10 Bit 1 Bit 0 (LSB) Tag 0 Tag 1
Tag 1 Tag 2 Tag 11 Tag 12 Tag 13 Tag 14Tag 0 Tag 15
t
19
t
18
t
17
t
12
t
16
t
16
t
2
t
12
t
13
t
14
t
15
t
1
ADS7808
8SBAS018A
www.ti.com
FIGURE 3b. Conversion and Read Timing with External Clock. (EXT/INT Tied HIGH.) Read During Conversion (Previous
Conversion Results).
EXTERNAL
DATACLK
CS
Bit 11 (MSB)
R/C
BUSY
DATA
TAG
SYNC
Bit 0 (LSB) Tag 0 Tag 1
Tag 1 Tag 12 Tag 13 Tag 14 Tag 15
Tag 0
t19
t18
t17
t12
t16
t2
t12
t13 t14
t1t20
t15
ADS7808 9
SBAS018A www.ti.com
With Trim
Input Range Without Trim (Adjust offset first at 0V, then adjust gain)
FIGURE 4a. Offset/Gain Circuits for Unipolar Input Ranges.
0V – 10V
0V – 5V
0V – 4V
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
R3
IN
100Ω
2.2µF
2.2µF
V
IN
33.2kΩ
+
+
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
V
IN
R3
IN
100Ω
33.2kΩ
2.2µF
2.2µF
+
+
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
R3
IN
100Ω
2.2µF
V
IN
+5V
+5V
33.2kΩ
2.2µF
576kΩ
50kΩ
50kΩ
+
+
200Ω
AGND2
REF
CAP
R2IN
AGND1
R1IN
VIN
R3IN
100Ω
33.2kΩ
2.2µF
2.2µF
+5V
50kΩ50kΩ576kΩ
+5V +
+
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
R3
IN
100Ω
2.2µF
2.2µF
V
IN
33.2kΩ
+
+
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
R3
IN
100Ω
2.2µF
V
IN
+5V
+5V
33.2kΩ
576kΩ
50kΩ
50kΩ2.2µF +
+
ADS7808
10 SBAS018A
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200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
R3
IN
100Ω
2.2µF
V
IN
+5V
+5V
33.2kΩ
2.2µF
576kΩ
50kΩ
50kΩ
+
+
200Ω
AGND2
REF
CAP
R2IN
AGND1
R1IN
R3IN
100Ω
2.2µF
2.2µF
VIN
33.2kΩ
+
+
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
V
IN
R3
IN
100Ω
33.2kΩ
2.2µF
2.2µF
+5V
50kΩ
50kΩ576kΩ
+5V
+
+
With Trim
Input Range Without Trim (Adjust offset first at 0V, then adjust gain)
±10V
±5V
±3.33V
FIGURE 4b. Offset/Gain Circuits for Bipolar Input Ranges.
200Ω
AGND2
REF
CAP
R2IN
AGND1
R1IN
VIN
R3IN
100Ω
33.2kΩ
2.2µF
2.2µF
+
+
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
V
IN
R3
IN
33.2kΩ
2.2µF
2.2µF
100Ω
+
+
200Ω
AGND2
REF
CAP
R2
IN
AGND1
R1
IN
V
IN
R3
IN
33.2kΩ2.2µF
2.2µF
100Ω
+5V
50kΩ+5V
50kΩ576kΩ
+
+
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
ADS7808P OBSOLETE PDIP N 20 TBD Call TI Call TI
ADS7808PB OBSOLETE PDIP N 20 TBD Call TI Call TI
ADS7808U ACTIVE SOIC DW 20 38 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
ADS7808U/1K ACTIVE SOIC DW 20 1000 Pb-Free
(RoHS) CU NIPDAU Level-3-260C-168 HR
ADS7808U/1KE4 ACTIVE SOIC DW 20 1000 Pb-Free
(RoHS) CU NIPDAU Level-3-260C-168 HR
ADS7808UB ACTIVE SOIC DW 20 38 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
ADS7808UB/1KE4 ACTIVE SOIC DW 20 1000 Pb-Free
(RoHS) CU NIPDAU Level-3-260C-168 HR
ADS7808UBE4 ACTIVE SOIC DW 20 38 Pb-Free
(RoHS) CU NIPDAU Level-3-260C-168 HR
ADS7808UBG4 ACTIVE SOIC DW 20 38 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
ADS7808UE4 ACTIVE SOIC DW 20 38 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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