Models 303134 through to 303138 (Ultra High Precision Surface Mount Chip
Resistors, VSMP Z-Foil Technology Configuration), Screen/Test Flow in Compliance
with EEE-INST-002, (Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-55342
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
Document Number: 63169 For any questions, contact: foil@vishaypg.com www.foilresistors.com
Revision: 29-Mar-10 1
INTRODUCTION
The 303134 through to 303138 series is the first surface
mount device to provide high rated power, excellent load life
stability along with extremely low TCR all in one resistor.
One of the most important parameters influencing stability is
the temperature coefficient of resistance (TCR). Although the
TCR of foil resistors is considered extremely low, this
characteristic has been further refined over the years. The
303134 through to 303138 Series utilizes ultra high precision
Bulk Metal® Z-Foil. The Z-Foil technology provides a
significant reduction of the resistive element’s sensitivity to
ambient temperature variations (TCR) and to self heating
when power is applied (power coefficient). Along with the
inherently low PCR and TCR, Z-Foil technology also
provides remarkably improved load life stability, low noise
and availability of tight tolerance.
The 303134 through to 303138 series has a full wraparound
termination which ensures safe handling during the
manufacturing process, as well as providing stability during
multiple thermal cyclings.
Our application engineering department is available to
advise and make recommendations.
FEATURES
Temperature coefficient of resistance (TCR):
0.05 ppm/°C typical (0 °C to + 60 °C)
0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.)
Tolerance: to ± 0.02 %
Power coefficient “R due to self heating”:
5 ppm at rated power
Power rating: to 400 mW at + 70 °C
Load life stability: to ± 0.03 % at 70 °C, 2000 h at rated
power
Resistance range: 10 to 75 k
Vishay Foil resistors are not restricted to standard values,
we can supply specific “as required” values at no extra cost
or delivery (e.g. 1K2345 vs. 1K)
Fast thermal stabilization < 1 s
Electrostatic discharge (ESD) up to 25 000 V
Short time overload: 0.02 %
Non-inductive, non-capacitive design
Rise time: 1 ns effectively no ringing
Current noise: - 42 dB
Voltage coefficient < 0.1 ppm/V
Non-inductive: < 0.08 µH
Non hot spot design
Terminal finish: tin/lead alloy
Matched sets are available on request
For prototype units, append a “U” to the model number
(example: 303134U). These units have all of the table 2A
(page 3) 100 % tests performed, with no destructive
qualification testing required (table 3A, page 4). For more
information, please contact foil@vishaypg.com
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(- 55 °C to + 125 °C, + 25 °C ref.)
RESISTANCE
VALUE
()
TOLERANCE
(%)
MAXIMUM TCR
(ppm/°C)
250to 75K ± 0.02 ± 3
100to < 250 ± 0.05 ± 3
50to < 100 ± 0.1 ± 4
25to < 50 ± 0.25 ± 5
10to < 25 ± 0.5 ± 5
Top View
FIGURE 1 - POWER DERATING CURVE
100
75
50
25
0
- 75 - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Percent of Rated Power
+ 70 °C
- 55 °C
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
www.foilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63169
2Revision: 29-Mar-10
Note
(1) Land Pattern Dimensions are per IPC-7351A
Note
(1) As shown + 0.01 to allow for measurement errors at low values.
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
Note: Foil shown in black, etched spaces in white
Mutual
Inductance
Reduction due
to Opposing
Current in
Adjacent Lines
Current Path
Before Trimming
Interloop
Capacitance
Reduction
in Series
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing Resistance
Current Path
After Trimming
FIGURE 3 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
Note
• The TCR values for < 100 are influenced by the termination
composition and result in deviation from this curve.
+ 500
+ 200
+ 100
0
- 100
- 200
- 300
- 500
- 55 - 25 + 25 + 60 + 75 + 100 + 125
ΔR
R
(ppm)
0
0.05 ppm/°C
- 0.1 ppm/°C 0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
- 0.16 ppm/°C
- 400
+ 300
+ 400
Ambient Temperature (°C)
TCR Values for Different Temperature Ranges
TABLE 2 - DIMENSIONS AND LAND PATTERN in Inches (Millimeters)
MODEL
(CHIP SIZE)
L
± 0.005 (0.13)
W
± 0.005 (0.13)
THICKNESS
MAXIMUM
D
± 0.005 (0.13) Z (1) G (1) X (1)
303134 (0805) 0.080 (2.03) 0.050 (1.27) 0.025 (0.64) 0.015 (0.38) 0.122 (3.10) 0.028 (0.71) 0.050 (1.27)
303135 (1206) 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.175 (4.45) 0.059 (1.50) 0.071 (1.80)
303136 (1506) 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.083 (2.11) 0.071 (1.80)
303137 (2010) 0.198 (5.03) 0.097 (2.46) 0.025 (0.64) 0.025 (0.64) 0.247 (6.27) 0.115 (2.92) 0.103 (2.62)
303138 (2512) 0.249 (6.32) 0.127 (3.23) 0.025 (0.64) 0.032 (0.81) 0.291 (7.39) 0.150 (3.81) 0.127 (3.23)
Top View
D
TW
L
Recommended Land Pattern
Footprint
Z
G
X
TABLE 3 - SPECIFICATIONS
MODEL
(CHIP SIZE)
RATED POWER (mW)
at + 70 °C
MAX. WORKING
VOLTAGE ()
RESISTANCE RANGE
()
MAXIMUM WEIGHT
(mg)
303134 (0805) 100 22 V 10to 5K 6
303135 (1206) 150 46 V 10to 14K 11
303136 (1506) 200 57 V 10to 16K 12
303137 (2010) 300 102 V 10to 35K 27
303138 (2512) 400 173 V 10to 75K 40
TABLE 4 - PERFORMANCES
TEST OR CONDITIONS MIL-PRF-55342
CHARACTERISTIC E R LIMITS
TYPICAL
R LIMITS
MAXIMUM
R LIMITS (1)
Thermal Shock, 100 x (- 65 °C to + 150 °C) ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
Low Temperature Operation, - 65 °C, 45 min at Rated Power ± 0.1 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
Short Time Overload, 6.25 x Rated Power, 5 s ± 0.1 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
High Temperature Exposure, + 150 °C, 100 h ± 0.1 % ± 0.01 % (100 ppm) ± 0.03 % (300 ppm)
Resistance to Soldering Heat ± 0.2 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
Moisture Resistance ± 0.2 % ± 0.005 % (50 ppm) ± 0.04 % (400 ppm)
Load Life Stability + 70 °C for 2000 h at Rated Power ± 0.5 % ± 0.005 % (50 ppm) ± 0.03 % (300 ppm)
PR
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
Document Number: 63169 For any questions, contact: foil@vishaypg.com www.foilresistors.com
Revision: 29-Mar-10 3
Notes
(1) Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
(2) Vacuum pick up is recommended for handling
(3) Soldering iron may damage the resistor
Notes
(1) Measurement error allowed for R limits: 0.01 .
(2) An additional 54 sample units per lot which successfully pass 100 % screening are to be used for destructive testing and are to be kept on
file at the plant of manufacture.
(3) Lot definition (1 lot = 1 primary flowcard): Each value per chip size should be qualified individually. Contact Vishay application engineering for
alternative lot definitions.
(4) For prototype units, append a “U” to the model number (example: 303134U). These units have all of the table 2A 100 % tests performed, with
no destructive qualification testing required.
FIGURE 4 - RECOMMENDED MOUNTING (1)(2)(3)
MODEL NUMBER 303134 303135 303136 303137 303138
CHIP SIZE 0805 1206 1506 2010 2512
VALUE RANGE (SPACE APPLICATIONS) 10 to 5 k10 to 14 k10 to 16 k10 to 35 k10 to 75 k
RATED POWER AT 70 °C 100 mW 150 mW 200 mW 300 mW 400 mW
TABLE 5 - EEE-INST-002 (TABLE 2A FILM/FOIL, LEVEL 1) 100 % TESTS/INSPECTIONS
Pre-cap Visual Inspection Performed in production flow prior overcoating
RC Record In tolerance
Thermal Shock 25 x (- 65 °C to + 150 °C)
Power Conditioning 70 °C, 100 h, 1.5 rated power - not to exceed max. voltage
RC Record In tolerance R = 0.05 % for thermal shock and conditioning combined
Final Inspection 5 % PDA on R only, 10 % PDA on “Out of Final Tolerance”
Visual Inspection Materials, design, etc.
Mechanical Inspection Physical dimensions, sample size: 3 units, zero failure
25 % to 85 % of T
A low profile solder fillet is
recommended to avoid unnecessary
stresses along top edge of
metallization. IR and vapor phase
reflow are best.
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
www.foilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63169
4Revision: 29-Mar-10
TABLE 6 - EEE-INST-002 (TABLE 3A FILM/FOIL, LEVEL 1) DESTRUCTIVE TESTS
Group 2
Sample size: 3, zero failure
Solderability
Group 3
Sample size: 10, zero failure - mounted on FR4
TCR
(- 55 °C/+ 25 °C/+ 125 °C)
Values TCR limits
100 ± 3 ppm/°C
50 to < 100 ± 4 ppm/°C
10 to < 50 ± 5 ppm/°C
Low temperature storage
R = 0.02 %
- 65 °C no load dwell for 24 h ± 4 h
+ 25 °C ambient no load dwell for 2 h to 8 h
Low temperature operation
R = 0.02 %
- 65 °C no load dwell for 1 h
rated power for 45 min
+ 25 °C ambient no load dwell for 24 h ± 4 h
Short time overload R = 0.02 %
6.25 x rated power, 5 s - no “I” limitation: not to exceed twice the maximum voltage
Group 4
Sample size: 9, zero failure - mounted on FR4
Resistance to soldering heat R = 0.02 %
Performed per MIL-PRF-55342 para. 4.8.8.1
Group 6
Sample size: 12, zero failure - mounted on FR4
Life R = 0.03 %
2000 h, + 70 °C, rated power
Group 7B
Sample size: 10, zero failure - mounted on FR4
Solder mounting integrity
Performed per MIL-PRF-55342
For 0805, 1206, 1506: force applied: 2 kg, 30 s
For 2010, 2512: force applied: 3 kg, 30 s
Group 8
Sample Size: 5, zero failure - chips not mounted
Voltage coefficient
R = 0.1 ppm/V
Applicable resistors 10K
Performed per MIL-STD-202 method 309
Group 9
Sample size: 5, zero failure - mounted on FR4
High temperature exposure
R = 0.03 %
Performed per MIL-PRF-55342
100 h at + 150 °C ± 5 °C
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
Document Number: 63169 For any questions, contact: foil@vishaypg.com www.foilresistors.com
Revision: 29-Mar-10 5
TABLE 7 - PART NUMBER IDENTIFICATION
Model # 303134 303135 303136 303137 303138
Chip Size 0805 1206 1506 2010 2512
Value Range
(Space Application) 10 to 5 k10 to 14 k10 to 16 k10 to 35 k10 to 75 k
Part Number:
{Model} - {Value} - {Tolerance} - {Termination} - {Packaging}
Resistance Value Tolerance (Tightest) Code Termination Code Packaging Code
250R to 75K 0.02 % Q Tin/lead B Waffle W
100R to < 250R 0.05 % A Tape and reel T
50R to < 100R 0.1 % B
25R to < 50R 0.25 % C
10R to < 25R 0.5 % D
Example: 303135 - 10K025 - DBW
1206 chip size, 10.025 k, 0.5 %, tin/lead termination, waffle packaging
Vishay Precision Group
Document No.: 63999
Revision: 27-Apr-11
www.vishaypg.com
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