Qseven-i.MX537
Hardware User Manual
Version 1.2
Contact
Bluetechnix GmbH
Waidhausenstraße 3/19
A-1140 Vienna
AUSTRIA
office@bluetechnix.com
http://www.bluetechnix.com
Document No.: 900-306 / A
Date: 2013-01-31
© Bluetechnix 2012
Table of Contents
1 Introduction ...................................................................................................................................... 5
1.1 Overview ................................................................................................................................... 5
1.2 Key Features ............................................................................................................................. 6
1.3 Applications............................................................................................................................... 6
2 General Description .......................................................................................................................... 7
2.1 Functional Description .............................................................................................................. 7
2.2 Boot Mode ................................................................................................................................ 7
2.3 Memory Map ............................................................................................................................. 7
2.4 PCB Placement ......................................................................................................................... 8
3 Specifications ................................................................................................................................... 9
3.1 Electrical Specifications ............................................................................................................ 9
3.1.1 Operating Conditions ......................................................................................................... 9
3.1.2 Maximum Ratings .............................................................................................................. 9
3.1.3 ESD Sensitivity ................................................................................................................. 10
4 Connector Description ................................................................................................................... 11
4.1 Qseven edge connector .......................................................................................................... 11
4.2 Image Sensor Connector X4 (Auxiliary-ISM-Connector) ........................................................ 16
4.3 Auxiliary I/O Connector X3 ...................................................................................................... 17
5 Application Information .................................................................................................................. 19
5.1 Qseven Specification .............................................................................................................. 19
5.2 Differential pairs ...................................................................................................................... 19
5.3 Signals ..................................................................................................................................... 19
6 Mechanical Outline ......................................................................................................................... 20
6.1 Top View ................................................................................................................................. 20
6.2 MXM Connector ...................................................................................................................... 20
7 Support ........................................................................................................................................... 21
7.1 General Support ...................................................................................................................... 21
7.2 Board Support Packages ........................................................................................................ 21
7.3 Blackfin® Software Support ................................................................................................... 21
7.3.1 BLACKSheep® OS .......................................................................................................... 21
7.3.2 LabVIEW .......................................................................................................................... 21
7.3.3 uClinux ............................................................................................................................. 21
7.4 Blackfin® Design Services ....................................................................................................... 21
7.4.1 Upcoming Products and Software Releases .................................................................. 21
8 Ordering Information ...................................................................................................................... 22
9 Dependability ................................................................................................................................. 23
© Bluetechnix 2012
9.1 MTBF ....................................................................................................................................... 23
10 Product History ........................................................................................................................... 24
10.1 Version Information ............................................................................................................. 24
10.1.1 Qseven-i.MX537 .............................................................................................................. 24
10.2 Anomalies ............................................................................................................................ 24
11 Document Revision History ........................................................................................................ 25
12 List of Abbreviations ................................................................................................................... 26
A List of Figures and Tables .............................................................................................................. 27
© Bluetechnix 2012
© Bluetechnix GmbH 2013
All Rights Reserved.
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights of technical change reserved.
We hereby disclaim any warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or in any
communication with you. Bluetechnix specifically disclaims any implied warranty of merchantability or fitness
for a particular purpose.
Bluetechnix takes no liability for any damages and errors causing of the usage of this board. The user of this
board is responsible by himself for the functionality of his application. He is allowed to use the board only if
he has the qualification. More information is found in the General Terms and Conditions (AGB).
Information
For further information on technology, delivery terms and conditions and prices please contact Bluetechnix
(http://www.bluetechnix.com).
Warning
Due to technical requirements components may contain dangerous substances.
© Bluetechnix 2012
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
1 Introduction
The Qseven-i.MX537 module is based on Freescale’s next generation, high-performance, power-efficient,
multimedia applications processor i.MX53. This processor features OpenGL® ES 2.0 and OpenVG™ 1.1
hardware accelerators, a multi-format HD1080p video decoder and a HD720p video encoder hardware
engine, dual display capability, a SATA controller, IEEE1588 time-stamping and numerous serial interfaces
(SDIO, SPI, I2C, UART). Further features are integrated security solutions, USB 2.0 controllers, Ethernet
controller, two LVDS Display outputs and a camera sensor input (CSI). The Qseven module is available for
industrial temperature range. It addresses 1GByte DDR2-SDRAM, has an on-board NAND flash of 2GByte
and an additional SPI-NOR flash of 4MByte.
The state of the art i.MX53 SoC in combination with the outstanding integration of several peripheral
controllers, memory and voltage control, turn the Qseven-i.MX537 module into a high-performance
embedded platform for your future applications.
1.1 Overview
Figure 1-1 shows the main components of Qseven-i.MX537 module.
i.MX537
4MB
SPI-Flash
Qseven-i.MX53
2GByte
NAND-Flash
1GByte
DDR2-SDRAM
PMIC
ETH-PHY
SATA
LVDS
HDMI
230-pin card-edge connector
7x USB-HUB
HDMI
Transmitter
IO Switch
AC’97
10/100 Mbit ETH
8Bit SDIO
USB OTG
8Bit SDIO
I2C, CAN, SPI
Ctrl
Auxiliary
I/O Connetor
Auxiliary ISM
Connector
Micro SD-Card
Slot
7x USB Host
2x UART
SPI
BLT Image
Sensor
Figure 1-1: Main components of the Qseven-i.MX537 module
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Version 1.2
1.2 Key Features
• Freescale Application Processor
o MCIMX537CVV8C Rev2.1
• 1 GB DDR2-SDRAM
o MEM2G16D2DABG-25I
o DDR2-SDRAM Clock up to 400MHz
o 4x (128Mx16, 1Gbit at 1.8V)
• 2 GB NAND-Flash
o MT29F16G08ABACAWP-IT:C
o (16Gbit at 3.3V)
• 4 MB SPI-Flash
o M25PX32-VMW6E
o 32Mbit at 3.3V
• PMIC
o LTC3589 & ADP2119
o Energy Management
o Power-up sequencer
• Ethernet-PHY
o KSZ8041NLI
• HDMI-Trasmitter
o AD9889B
• USB-Hub
o USB2517-JZX
• µSD Card slot
• Connectors
o Qseven 230-pin card-edge connector
o Auxiliary ISM connector
o Auxiliary I/O connector
1.3 Applications
• Tablets
• Smart Mobile Devices
• Human-Machine-Interface
• Medical Devices
• Video Conference Systems
• Imaging and Consumer Multimedia
• Set Top Boxes
• Video Conference Applications
• Portable Media Players
• Industrial Applications
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Version 1.2
2 General Description
2.1 Functional Description
JTAG
SATA
HDMI
AC’97
7x USB
LVDS’s
USB-HUB
VIN
µSD-Card
i.MX53
ISM-Connector
USB-OTG
HDMI
Transmitter
Active
Components
Qseven
Connector
PMIC
CSI0
I2C, CAN,
SPI
JTAG
SD3
SATA USB IPU USBH1
UART’s
DISP1
Bootmode
Switch
i.MX53
Interfaces
Onboard
Connector
NAND
Flash
Controller
2GByte
NAND Flash
SDRAM
Controller
1GByte
DDR2-SDRAM
GPIO ETH-Phy 10/100 Mbit ETH
4MByte
SPI Flash CTRL
Figure 2-1: Functional overview
2.2 Boot Mode
The boot mode of the i.MX53 processor is determined by BOOT_ALT pin (pin 41of edge connector).
Pin
SPI-Flash
USB/UART
BOOT_ALT
0
1
Table 2-1: Boot Mode Selection Table
2.3 Memory Map
Component
Memory area
Chip select
512 MB DDR2-800 SDRAM
0x7000_0000 – 0x8FFF_FFFF
CSD0
512 MB DDR2-800 SDRAM
0xB000_0000 – 0xCFFF_FFFF
CSD1
Table 2-2: Memory Map
SPI-NOR and NAND flashes are not directly memory-mapped, but accessed via i.MX53 internal controllers.
Please consult the i.MX53 Reference Manual for the i.MX53 memory map.
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
2.4 PCB Placement
Figure 2-2: Top connectors placement
µSD-Card slot
Auxiliary
I/O-Connector
Auxiliary
ISM-Connector
Qseven 230-pin card-edge connector
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
3 Specifications
3.1 Electrical Specifications
3.1.1 Operating Conditions
Symbol
Parameter
Min
Typical
Max
Unit
VIN
Input supply voltage
4.5
5.0
5.5
V
IIN
Input supply current @ VIN=5.0V, TAMB=25°C
300
1
500
2
1000
3
mA
VOH
High level output voltage
2.0
3.3
3.6
V
VOL
Low level output voltage
-0.3
1.0
V
IIO
4
IO input current
2
161
µA
IRTC
VRTC current
1
mA
IUSB_FS
VUSB current in low/full speed mode
7
mA
IUSB_HS
VUSB current in high speed mode
22
mA
fCCLKC
Core clock frequency for industrial grade modules
800
MHz
fCCLKI
Core clock frequency for commercial grade modules
1000
MHz
Table 3-1: Electrical characteristics
1 Linux running in idle mode; no USB devices plugged in
2 Linux writes file to SATA HDD; one USB devices plugged in; display output on one LVDS interface
3 TBD
4 Dependent on which internal Pull-up resistor is asserted
3.1.2 Maximum Ratings
Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent
damage to the device. These are stress ratings only. Operation of the device at these or any other conditions
greater than those indicated in the operating sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Symbol
Parameter
Min
Max
Unit
VIO
Input or output voltage
-0.5
OVDD+0.3
V
VIN
Input supply voltage
-0.3
6
V
IOH /IOL
Output current per pin
10
mA
TAMBI
Ambient temperature for industrial grade modules
-40
851
°C
TAMBC
Ambient temperature for commercial grade modules
0
701
°C
TSTO
Storage temperature
-55
150
°C
φAMB
Relative ambient humidity (non condensing)
90
%
Table 3-2: Absolute maximum ratings
1 If extreme high ambient temperatures are expected (75°C in industrial environments or 60°C for commercial
products), the user has to apply a heat dissipator on CPU and DDR-RAM (avoid heat accumulation!). The die
temperature should be monitored regular, so that the CPU and RAM clock can be throttled if necessary.
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
3.1.3 ESD Sensitivity
ESD (electrostatic discharge) sensitive device. Charged devices and circuit
boards can discharge without detection. Although this product features patented
or proprietary protection circuitry, damage may occur on devices subjected to
high energy ESD. Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
4 Connector Description
For a detail signal description please consult the i.MX53 reference manual, available on the Freescale web
site.
4.1 Qseven edge connector
Pin No.
Signal Name
Direction
I/O Type
Function
1
GND
PWR
GND
2
GND
PWR
GND
3
NC
4
NC
5
NC
6
NC
7
ETH.LED_SPD
O
CMOS 3.3V
PP
ETH Speed LED Driver
8
NC
9
ETH.Rx_P
I_DP
LAN
ETH Receive Data+
10
ETH.Tx_N
O_DP
LAN
ETH Transmit Data-
11
ETH.Rx_N
I_DP
LAN
ETH Receive Data-
12
ETH.Tx_P
O_DP
LAN
ETH Transmit Data+
13
NC
14
ETH.LED_ACT
O
CMOS 3.3V
PP
ETH Activity LED Driver
15
VA_ETH
PWR_O
3.3V
ETH Analog Voltage
16
NC
17
NC
18
NC
19
NC
20
PWRON
I – 10k pull-up
CMOS 1.2V
OD
Start-Up Module if PIN is low for 400ms
21
UART2.CTS
O
CMOS 3.3V
PP
UART Request To Send / GPIO7_2
22
UART2.RTS
I
CMOS 3.3V
PP
UART Clear To Send / GPIO7_3
23
GND
PWR
GND
24
GND
PWR
GND
25
GND
PWR
GND
26
PWGIN
I
CMOS 5.0V
High active input for the Qseven® module
indicates that all power rails located on the
carrier board are ready for use.
27
OWIRE
I/O
CMOS 3.3V
PP
One Wire Interface / GPIO7_6
28
CTRL.nRESET_IN
I – 100k pull up
CMOS 1.8V
OD
Soft Reset
29
SATA.TX_P
O_DP
SATA
SATA Transmit Data+
30
NC
31
SATA.TX_N
O_DP
SATA
SATA Transmit Data-
32
NC
33
NC
34
GND
PWR
GND
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
Pin No.
Signal Name
Direction
I/O Type
Function
35
SATA.RX_P
I_DP
SATA
SATA Receive Data+
36
NC
37
SATA.RX_N
I_DP
SATA
SATA Receive Data-
38
NC
39
GND
PWR
GND
40
GND
PWR
GND
41
BOOT_ALT
I - 10k pull-up
CMOS 3.3V
OD
Pull low to disable module's on-board
BIOS
42
SD2.CLK
O
CMOS 3.3V
PP
SD Clock / GPIO1_15
43
SD2.CD
I
CMOS 3.3V
PP
SD Card Detect / GPIO1_4
44
UART3.RXD
CMOS 3.3V
PP
UART Receive Data / GPIO7_10
45
SD2.CMD
O
CMOS 3.3V
PP
SD Command / GPIO1_11
46
SD2.WP
I
CMOS 3.3V
PP
SD Write Protect / GPIO1_2
47
UART3.TXD
CMOS 3.3V
PP
UART Transmit Data / GPIO7_9
48
SD2.D1
I/O
CMOS 3.3V
PP
SD Data 1 / GPIO1_14
49
SD2.D0
I/O
CMOS 3.3V
PP
SD Data 0 / GPIO1_15
50
SD2.D3
I/O
CMOS 3.3V
PP
SD Data 3 / GPIO1_12
51
SD2.D2
I/O
CMOS 3.3V
PP
SD Data 2 / GPIO1_13
52
SD2.D5
I/O
CMOS 3.3V
PP
SD Data 5 / GPIO2_13
53
SD2.D4
I/O
CMOS 3.3V
PP
SD Data 4 / GPIO2_12
54
SD2.D7
I/O
CMOS 3.3V
PP
SD Data 7 / GPIO2_15
55
SD2.D6
I/O
CMOS 3.3V
PP
SD Data 6 / GPIO2_14
56
NC
57
GND
PWR
GND
58
GND
PWR
GND
59
AUD5.RFS
I – 47R serial
CMOS 3.3V
PP
AUD Receive Frame Sync / GPIO3_24
60
NC
61
GPIO.(3V3)_3
I/O
CMOS 3.3V
PP
GPIO4_5 / CLKO
62
NC
63
AUD5.RSCK
I – 47R serial
CMOS 3.3V
PP
AUD Receive Clock / GPIO3_25
64
NC
65
AUD5.RX
I
CMOS 3.3V
PP
AUD Receive Data / GPIO4_9
66
I2C1.SCL
O – 4k7 pull-up
CMOS 3.3V
PP
I2C Clock / GPIO5_27
67
AUD5.TX
O
CMOS 3.3V
PP
AUD Transmit Data / GPIO4_7
68
I2C1.SDA
I/O – 4k7 pull-up
CMOS 3.3V
I2C Data / GPIO5_26
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
Pin No.
Signal Name
Direction
I/O Type
Function
PP
69
FIRI.TXD
O
CMOS 3.3V
PP
FIRI Transmit Data / GPIO1_8
70
NC
71
FIRI.RXD
I
CMOS 3.3V
PP
FIRI Receive Data / GPIO1_7
72
NC
73
GND
PWR
GND
74
GND
PWR
GND
75
USBH2.D_N
I/O_DP
USB
USB Data-
76
USBH3.D_N
I/O_DP
USB
USB Data-
77
USBH2.D_P
I/O_DP
USB
USB Data+
78
USBH3.D_P
I/O_DP
USB
USB Data+
79
USBH3.OC
USBH2.OC
I
CMOS 3.3V
PP
Over-Current Sense
80
USBH4.OC
USBH5.OC
I
CMOS 3.3V
PP
Over-Current Sense
81
USBH5.D_N
I/O_DP
USB
USB Data-
82
USBH4.D_N
I/O_DP
USB
USB Data-
83
USBH5.D_P
I/O_DP
USB
USB Data+
84
USBH4.D_P
I/O_DP
USB
USB Data+
85
USBH7.OC
USBH6.OC
I
CMOS 3.3V
PP
Over-Current Sense
86
USBOTG.OC
USBH0.OC
I
CMOS 3.3V
PP
Over-Current Sense
87
USBH7.D_N
I/O_DP
USB
USB Data-
88
USBH6.D_N
I/O_DP
USB
USB Data-
89
USBH7.D_P
I/O_DP
USB
USB Data+
90
USBH6.D_P
I/O_DP
USB
USB Data+
91
USBOTG.VBUS
PWR
CMOS 3.3V
PP
USB VBUS
92
USBOTG.ID
I
CMOS 3.3V
PP
USB ID
93
USBOTG.D_N
I/O_DP
USB
USB Data-
94
USBH0.D_N
I/O_DP
USB
USB Data-
95
USBOTG.D_P
I/O_DP
USB
USB Data+
96
USBH0.D_P
I/O_DP
USB
USB Data+
97
GND
PWR
GND
98
GND
PWR
GND
99
LVDS0.TX0_P
O_DP
LVDS
LVDS0 Transmit Data0+ / GPIO7_30
100
LVDS1.TX0_P
O_DP
LVDS
LVDS1 Transmit Data 0+ / GPIO6_30
101
LVDS0.TX0_N
O_DP
LVDS
LVDS0 Transmit Data0- / GPIO7_31
102
LVDS1.TX0_N
O_DP
LVDS
LVDS1 Transmit Data 0- / GPIO6_31
103
LVDS0.TX1_P
O_DP
LVDS
LVDS0 Transmit Data1+ / GPIO7_28
104
LVDS1.TX1_P
O_DP
LVDS
LVDS1 Transmit Data 1+ / GPIO6_28
105
LVDS0.TX1_N
O_DP
LVDS
LVDS0 Transmit Data1- / GPIO7_29
106
LVDS1.TX1_N
O_DP
LVDS
LVDS1 Transmit Data 1- / GPIO6_29
107
LVDS0.TX2_P
O_DP
LVDS
LVDS0 Transmit Data2+ / GPIO7_26
108
LVDS1.TX2_P
O_DP
LVDS
LVDS1 Transmit Data 2+ / GPIO6_24
109
LVDS0.TX2_N
O_DP
LVDS
LVDS0 Transmit Data2- / GPIO7_27
110
LVDS1.TX2_N
O_DP
LVDS
LVDS1 Transmit Data 2- / GPIO6_25
111
UART3.CTS
I
CMOS 3.3V
UART Clear To Send / GPIO7_7
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
Pin No.
Signal Name
Direction
I/O Type
Function
PP
112
UART3.RTS
I
CMOS 3.3V
PP
UART Clear To Send / GPIO7_3
113
LVDS0.TX3_P
O_DP
LVDS
LVDS0 Transmit Data3+ / GPIO7_22
114
LVDS1.TX3_P
O_DP
LVDS
LVDS1 Transmit Data 3+ / GPIO6_22
115
LVDS0.TX3_N
O_DP
LVDS
LVDS0 Transmit Data3- / GPIO7_23
116
LVDS1.TX3_N
O_DP
LVDS
LVDS1 Transmit Data 3- / GPIO6_23
117
GND
PWR
GND
118
GND
PWR
GND
119
LVDS0.CLK_P
O_DP
LVDS
LVDS0 Clock+ / GPIO7_24
120
LVDS1.CLK_P
O_DP
LVDS
LVDS1 Clock + / GPIO6_26
121
LVDS0.CLK_N
O_DP
LVDS
LVDS0 Clock- / GPIO7_25
122
LVDS1.CLK_N
O_DP
LVDS
LVDS1 Clock - / GPIO6_27
123
CTRL.PWM1
O
CMOS 3.3V
PP
Pulse Width Modulation Output / GPIO1_9
124
NC
125
I2C3.SDA
I/O – 4k7 pull-up
CMOS 3.3V
OD
I2C3 Data / GPIO1_6
126
NC
127
I2C3.SCL
O – 4k7 pull-up
CMOS 3.3V
OD
I2C3 Clock / GPIO1_5
128
NC
129
CAN1.TX
O
CMOS 3.3V
PP
CAN Transmit Data / GPIO4_10
130
CAN1.RX
I
CMOS 3.3V
PP
CAN Receive Data / GPIO4_11
131
HDMI.TC_P
O_DP
HDMI
HDMI Clock+
132
NC
133
HDMI.TC_N
O_DP
HDMI
HDMI Clock-
134
NC
135
GND
PWR
GND
136
GND
PWR
GND
137
HDMI.Tx1.P
O_DP
HDMI
HDMI Transmit Data 1+
138
NC
139
HDMI.Tx1_N
O_DP
HDMI
HDMI Transmit Data 1-
140
NC
141
GND
PWR
GND
142
GND
PWR
GND
143
HDMI.Tx0_P
O_DP
HDMI
HDMI Transmit Data 0+
144
NC
145
HDMI.Tx0_N
O_DP
HDMI
HDMI Transmit Data 0-
146
NC
147
GND
PWR
GND
148
GND
PWR
GND
149
HDMI.Tx2_P
O_DP
HDMI
HDMI Transmit Data 2+
150
HDMI.SDA
I/O – 2k2 pull-up
CMOS 5.0V
OD
HDMI I2C Data
151
HDMI.Tx2_N
O_DP
HDMI
HDMI Transmit Data 2-
152
HDMI.SCL
I/O – 2k2 pull-up
CMOS 5.0V
OD
HDMI I2C Clock
153
HDMI.HPD
I
CMOS 5.0V
PP
HDMI Hot Plug Detect
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Version 1.2
Pin No.
Signal Name
Direction
I/O Type
Function
154
NC
155
NC
156
NC
157
NC
158
NC
159
GND
PWR
GND
160
GND
PWR
GND
161
NC
162
NC
163
NC
164
NC
165
GND
PWR
GND
166
GND
PWR
GND
167
NC
168
NC
169
NC
170
NC
171
NC
172
NC
173
NC
174
NC
175
NC
176
NC
177
NC
178
NC
179
NC
180
NC
181
NC
182
NC
183
GND
PWR
GND
184
GND
PWR
GND
185
NC
186
NC
187
NC
188
NC
189
NC
190
NC
191
NC
192
NC
193
NC
194
GPIO.(2V5)_2
I/O
CMOS 2.5V
PP
GPIO1_18
195
GPIO.(2V5)_1
I/O
CMOS 2.5V
PP
GPIO1_17
196
CTRL.PWM2
O
CMOS 2.5V
PP
Pulse Width Modulation Output /
GPIO1_19
197
GND
PWR
GND
198
GND
PWR
GND
199
ECSPI1.MOSI
O
CMOS 3.3V
PP
SPI MOSI / GPIO5_23
200
ECSPI1.SS0
O
CMOS 3.3V
PP
SPI Select 0 / GPIO5_25
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
Pin No.
Signal Name
Direction
I/O Type
Function
201
ECSPI1.MISO
I
CMOS 3.3V
PP
SPI MISO / GPIO5_24
202
ECSPI1.SS1
O
CMOS 3.3V
PP
SPI Select 1 / GPIO3_19
203
ECSPI1.SCLK
O
CMOS 3.3V
PP
SPI CLK / GPIO5_22
204
JTAG.nTRST
I
CMOS 2.8V
PP
JTAG Test Reset
205
NC
206
NC
207
JTAG.TCK
I
CMOS 2.8V
PP
JTAG Test Clock
208
JTAG.TDI
I
CMOS 2.8V
PP
JTAG Test Data Input
209
JTAG.TDO
O
CMOS 2.8V
PP
JTAG Test Data Output
210
JTAG.TMS
I
CMOS 2.8V
PP
JTAG Test Mode Select
211
VIN
PWR
5V0
212
VIN
PWR
5V0
213
VIN
PWR
5V0
214
VIN
PWR
5V0
215
VIN
PWR
5V0
216
VIN
PWR
5V0
217
VIN
PWR
5V0
218
VIN
PWR
5V0
219
VIN
PWR
5V0
220
VIN
PWR
5V0
221
VIN
PWR
5V0
222
VIN
PWR
5V0
223
VIN
PWR
5V0
224
VIN
PWR
5V0
225
VIN
PWR
5V0
226
VIN
PWR
5V0
227
VIN
PWR
5V0
228
VIN
PWR
5V0
229
VIN
PWR
5V0
230
VIN
PWR
5V0
Table 4-1: Qseven edge connector description
4.2 Image Sensor Connector X4 (Auxiliary-ISM-Connector)
Pin
Name
Direction
I/O Type
Description
1
VCAMA
PWR
-
Camera Analog Voltage Supply
2
GND
PWR
-
Power Ground
3
SADDR
NC
-
Not Connected
4
NC
NC
-
Not Connected
5
GPIO4_0
O
CMOS 2.8V
PP
Global Camera Reset
6
I2C1.SCL
O – 4k7 pull-up
CMOS 3.3V
OD
Configuration Bus Clock Line
7
I2C1.SDA
I/O – 4k7 pull-up
CMOS 3.3V
Configuration Bus Data Line
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Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
Pin
Name
Direction
I/O Type
Description
OD
8
NC
NC
-
Not Connected
9
GND
PWR
-
Power Ground
10
CSI0.PCLK
I
CMOS 3.3V
PP
Pixel Clock
11
CSI0.VSYNC
I
CMOS 3.3V
PP
VSYNC
12
CSI0.HSYNC
I
CMOS 3.3V
PP
HSYNC
13
GPIO4_1
O
CMOS 2.8V
PP
Camera Trigger
14
GPIO4_2
I
CMOS 2.8V
PP
Strobe Signal from Camera
15
NC
NC
-
Not Connected
16
NC
NC
-
Not Connected
17
CSI0.D0
I
CMOS 3.3V
PP
Pixel Data
18
CSI0.D1
I
CMOS 3.3V
PP
Pixel Data
19
VCAMIO
PWR
-
Camera IO Power Supply
20
GND
PWR
-
Power Ground
21
CSI0.D2
I
CMOS 3.3V
PP
Pixel Data
22
CSI0.D3
I
CMOS 3.3V
PP
Pixel Data
23
CSI0.D4
I
CMOS 3.3V
PP
Pixel Data
24
CSI0.D5
I
CMOS 3.3V
PP
Pixel Data
25
GND
PWR
-
Power Ground
26
CSI0.D6
I
CMOS 3.3V
PP
Pixel Data
27
CSI0.D7
I
CMOS 3.3V
PP
Pixel Data
28
CSI0.D8
I
CMOS 3.3V
PP
Pixel Data
29
CSI0.D9
I
CMOS 3.3V
PP
Pixel Data
30
CSI0.DE
O
CMOS 3.3V
PP
Output Enable (Active Low)
Table 4-2: BLT-ISM-Connector interface description (X4)
4.3 Auxiliary I/O Connector X3
All I/O Types are CMOS 3.3V PP.
Pin
Name
Direction
Description
1
3.3V
PWR
Power Supply
2
GND
PWR
Power Supply
3
EN_PERI
O –1k pull-up
Enable Periphery
4
GPIO5_0
IO
General Purpose GPIO
5
UART1.RXD
IO
UART1 RxD or GPIO6_18
6
UART1.TXD
IO
UART1 TxD or GPIO6_17
7
UART2.RXD
IO
UART2 RxD or GPIO7_1
© Bluetechnix 2012 Page | 17
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
Pin
Name
Direction
Description
8
UART2.TXD
IO
UART2 TxD or GPIO7_0
9
ECSPI2.MISO
IO
ECSPI2 MISO or GPIO2_25
10
ECSPI2.MOSI
IO
ECSPI2 MOSI or GPIO2_24
11
ECSPI2.SCLK
IO
ECSPI2 SCLK or GPIO2_24
12
ECSPI2.SS0
IO
ECSPI2 SS0 or GPIO2_26
Table 4-3: Extension Connector interface description (X3)
© Bluetechnix 2012 Page | 18
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
5 Application Information
5.1 Qseven Specification
Have a look at the Qseven Specification to get more information about the Qseven standard:
http://www.qseven-standard.org/fileadmin/spec/Qseven-Spec_1.20.pdf
5.2 Differential pairs
All signals/pins named *_N/*_P (for example: LVDS1.CLK_N and LVDS1.CLK_P) are differential pairs which
should be routed with a differential impedance of 100Ω for LVDS and SATA or 90Ω for USB for a good signal
integrity and to prevent EMI problems.
5.3 Signals
All signals which are not differential pairs should be routed with a single ended impedance of 50Ohm to
minimize EMI.
© Bluetechnix 2012 Page | 19
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
6 Mechanical Outline
6.1 Top View
Figure 6-1 shows the top view of the mechanical outline of the Qseven-i.MX537 module. All dimensions are
given in millimeters! Outline dimensions +/- 0,5mm.
Figure 6-1: Mechanical outline (top view)
6.2 MXM Connector
The Qseven module features a 230-pin card-edge connector. The base board has to use the opposite
connector (AS0B326-S78N-7F).
Manufacturer
Part Number
Foxconn
AS0B326-S78N-7F
Yamaichi
BEC-0.5-230-S9-xF-R-EDC
Table 6-1: Compatible Qseven connector types
© Bluetechnix 2012 Page | 20
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
7 Support
7.1 General Support
General support for products can be found at Bluetechnix’ support site https://support.bluetechnix.at/wiki
7.2 Board Support Packages
Board support packages and software downloads are for registered customers only
https://support.bluetechnix.at/software/
7.3 Blackfin® Software Support
7.3.1 BLACKSheep® OS
BLACKSheep® OS stands for a powerfully and multithreaded real-time operating system (RTOS) originally
designed for digital signal processing application development on Analog Devices Blackfin® embedded
processors. This high-performance OS is based on the reliable and stable real-time VDK kernel from Analog
Devices that comes with VDSP++ IDE. Of course BLACKSheep® OS is fully supported by all Bluetechnix
Core-Modules and development hardware.
7.3.2 LabVIEW
You can get LabVIEW embedded support for Bluetechnix Core Modules by Schmid-Engineering AG
http://www.schmid-engineering.ch.
7.3.3 uClinux
You can get uClinux support (boot loader and uClinux) for Bluetechnix Core Modules at
http://blackfin.uClinux.org.
7.4 Blackfin® Design Services
Based on more than seven years of experience with Blackfin, Bluetechnix offers development assistance as
well as custom design services and software development.
7.4.1 Upcoming Products and Software Releases
Keep up to date with all product changes, releases and software updates of Bluetechnix at
http://www.bluetechnix.com.
© Bluetechnix 2012 Page | 21
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
8 Ordering Information
Article Number
Name
Temperature Range
100-1500-1
Qseven-i.MX537
Industrial
100-1520-1
DEV-Qseven-i.MX
Commercial
Table 8-1: Ordering information
NOTE: Custom Core Modules are available on request! Please contact Bluetechnix
(office@bluetechnix.com) if you are interested in custom Core Modules.
© Bluetechnix 2012 Page | 22
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
9 Dependability
9.1 MTBF
Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results,
because MTBF numbers just represent a statistical approximation of how long a set of devices should last
before failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take
all the components into account. The PCB and solder connections are excluded from this estimation. For
test conditions we assume an ambient temperature of 30°C of all Core Module components except the
Blackfin® processor (80°C) and the memories (70°C). We use the MTBF Calculator from ALD
(http://www.aldservice.com/) and use the reliability prediction MIL-217F2 Part Stress standard. Please get in
touch with Bluetechnix (office@bluetechnix.com) if you are interested in the MTBF result.
© Bluetechnix 2012 Page | 23
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
10 Product History
10.1 Version Information
10.1.1 Qseven-i.MX537
Version
Component
Type
1.1.0
Processor
RAM
SPI-Flash
NAND-Flash
ETH PHY
USB HUB
HDMI Trans.
Audio
MCIMX537CVV8C Rev2.1
MEM2G16D2DABG-25I
M25PX32-VMW6E
MT29F16G08ABACAWP-IT:C
KSZ8041NLI
KUSB2517I-JZX
AD9889BBCPZ-165
SGTL5000XNAA3R2
Table 10-1: Overview Qseven-i.MX537 product changes
10.2 Anomalies
Version
Date
Description
1.0.0
2011-12-09
No anomalies reported yet.
Table 10-2: Overview product anomalies
© Bluetechnix 2012 Page | 24
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
11 Document Revision History
Version
Date
Document Revision
1
2011-11-22
Preliminary Release of the Document
1
2012-01-10
Processor change to MCIMX537CVV8C
2
2012-11-28
Updated HUM with new CI-Design.
Table 11-1: Revision history
© Bluetechnix 2012 Page | 25
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
12 List of Abbreviations
Abbreviation
Description
ADI
Analog Devices Inc.
AI
Analog Input
AMS
Asynchronous Memory Select
AO
Analog Output
CM
Core Module
DC
Direct Current
DSP
Digital Signal Processor
eCM
Enhanced Core Module
EBI
External Bus Interface
ESD
Electrostatic Discharge
GPIO
General Purpose Input Output
I
Input
I²C
Inter-Integrated Circuit
I/O
Input/Output
ISM
Image Sensor Module
LDO
Low Drop-Out regulator
MTBF
Mean Time Between Failure
NC
Not Connected
NFC
NAND Flash Controller
O
Output
OS
Operating System
PPI
Parallel Peripheral Interface
PWR
Power
RTOS
Real-Time Operating System
SADA
Stand Alone Debug Agent
SD
Secure Digital
SoC
System on Chip
SPI
Serial Peripheral Interface
SPM
Speech Processing Module
SPORT
Serial Port
TFT
Thin-Film Transistor
TISM
Tiny Image Sensor Module
TSC
Touch Screen Controller
UART
Universal Asynchronous Receiver Transmitter
USB
Universal Serial Bus
USBOTG
USB On The Go
ZIF
Zero Insertion Force
Table 12.1: List of abbreviations
© Bluetechnix 2012 Page | 26
Hardware User Manual - Qseven-i.MX537 Last change: 31 January 2013
Version 1.2
A List of Figures and Tables
Figures
Figure 1-1: Main components of the Qseven-i.MX537 module .......................................................................... 5
Figure 2-1: Functional overview .......................................................................................................................... 7
Figure 2-2: Top connectors placement ............................................................................................................... 8
Figure 6-1: Mechanical outline (top view) ......................................................................................................... 20
Tables
Table 2-1: Boot Mode Selection Table ............................................................................................................... 7
Table 2-2: Memory Map ...................................................................................................................................... 7
Table 3-1: Electrical characteristics .................................................................................................................... 9
Table 3-2: Absolute maximum ratings ................................................................................................................ 9
Table 4-1: Qseven edge connector description ................................................................................................ 16
Table 4-2: BLT-ISM-Connector interface description (X4) ............................................................................... 17
Table 4-3: Extension Connector interface description (X3) .............................................................................. 18
Table 6-1: Compatible Qseven connector types .............................................................................................. 20
Table 8-1: Ordering information ........................................................................................................................ 22
Table 10-1: Overview Qseven-i.MX537 product changes ................................................................................ 24
Table 10-2: Overview product anomalies ......................................................................................................... 24
Table 11-1: Revision history .............................................................................................................................. 25
Table 12.1: List of abbreviations ....................................................................................................................... 26
© Bluetechnix 2012 Page | 27
