Ver. 201207
※Rated Current: DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
21 2.0±0.1 1.25±0.1 0.5max 0.5+0.2
-0.3
DESCRIPTION
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
Max.
CIG21FR47MNC 0805/2012 0.47 ±20 % 0.12 ±25 % 1.10
CIG21F1R0MNC 0805/2012 1.0 ±20 % 0.19 ±25 % 0.80
CIG21F1R5MNC 0805/2012 1.5 ±20 % 0.25 ±25 % 0.70
CIG21F2R2MNC 0805/2012 2.2 ±20 % 0.34 ±25 % 0.60
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG21F Series (2012/ EIA 0805)
Much lower Profile than any other series (0.5mm max)
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201207
CI G 21 F 1R0 M N C
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (F:Low Profile)
(5) Inductance (R47:0.47uH, 1R0:1.0uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4,000
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING FLOW SOLDERING
PRODUCT IDENTIFICATION
