NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 1
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Based on DDR2-667/800 64Mx16 (1GB)/128Mx8 (2GB) SDRAM G-Die
Features
• Performance:
Speed Sort
PC2-5300
PC2-6400
Unit
-3C
-AD
DIMM CAS Latency
5
6
fck – Clock Freqency
333
400
MHz
tck – Clock Cycle
3
2.5
ns
Data Transfer Speed
667
800
Mbps
• 200-Pin Small Outline Dual In-Line Memory Module (SO-DIMM)
• 1GB: 128Mx64 Unbuffered DDR2 SO-DIMM based on 64M x16
DDR2 SDRAM G-Die devices.
• 2GB: 256Mx64 Unbuffered DDR2 SO-DIMM based on 128M x8
DDR2 SDRAM G-Die devices.
• Intended for 333MHz and 400MHz applications
• Inputs and outputs are SSTL-18 compatible
• VDD = VDDQ = 1.8V ±0.1V
• SDRAMs have 8 internal banks for concurrent operation
• Differential clock inputs
• Data is read or written on both clock edges
• DRAM DLL aligns DQ and DQS transitions with clock transitions.
• Address and control signals are fully synchronous to positive
clock edge
• Auto Refresh (CBR) and Self Refresh Modes
• Automatic and controlled precharge commands
• Programmable Operation:
- DIMM Latency: 3, 4, 5, 6
- Burst Type: Sequential or Interleave
- Burst Length: 4, 8
- Operation: Burst Read and Write
• 13/10/2 Addressing (1GB)
• 14/10/2 Addressing (2GB)
• 7.8 s Max. Average Periodic Refresh Interval
• Serial Presence Detect
• Gold contacts
• 1GB module’s SDRAMs are 84-ball BGA Package
• 2GB module’s SDRAMs are 60-ball BGA Package
• RoHS compliance
Description
NT1GT64UH8G0FS / NT2GT64U8HG0BS are unbuffered 200-Pin Double Data Rate 2 (DDR2) Synchronous DRAM Small Outline Dual
In-Line Memory Module (SO-DIMM), organized as two ranks of 128Mx64 (1GB)/256Mx64 (2GB) high-speed memory array.
NT1GT64UH8G0FS uses eight 64Mx16 84-ball BGA packaged devices and NT2GT64U8HG0BS uses sixteen 128Mx8 60-ball BGA
packaged devices. These DIMMs are manufactured using raw cards developed for broad industry use as reference designs. The use of
these common design files minimizes electrical variation between suppliers. All Nanya DDR2 SODIMMs provide a high-performance,
flexible 8-byte interface in a space-saving footprint.
The DIMM is intended for use in applications operating of 333MHz/400MHz clock speeds and achieves high-speed data transfer speed of
667Mbps/800Mbps. Prior to any access operation, the device latency and burst/length/operation type must be programmed into the
DIMM by address inputs A0-A12 (1GB) / A0-A13 (2GB) and I/O inputs BA0, BA1 and BA2 using the mode register set cycle.
The DIMM uses serial presence-detect implemented via a serial EEPROM using a standard IIC protocol. The first 128 bytes of SPD data are
programmed and locked during module assembly. The remaining 128 bytes are available for use by the customer.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 2
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Ordering Information
Part Number
Speed
Organization
Power
Leads
Note
NT2GT64U8HG0BS - AD
DDR2-800
PC2-6400
400MHz (2.5ns @ CL = 6)
256Mx64
1.8V
Gold
NT2GT64U8HG0BS - 3C
DDR2-667
PC2-5300
333MHz (3.0ns @ CL = 5)
NT1GT64UH8G0FS - AD
DDR2-800
PC2-6400
400MHz (2.5ns @ CL = 6)
128Mx64
NT1GT64UH8G0FS - 3C
DDR2-667
PC2-5300
333MHz (3.0ns @ CL = 5)
Pin Description
CK0, CK1, ,
Differential Clock Inputs
DQ0-DQ63
Data input/output
CKE0, CKE1
Clock Enable
DQS0-DQS7
Bidirectional data strobes
Row Address Strobe
-
Differential data strobes
Column Address Strobe
DM0-DM7
Input Data Masks
Write Enable
VDD
Power (1.8V)
,
Chip Selects
VREF
Ref. Voltage for SSTL_18 inputs
A0-A9 A11-A13
Row Address Inputs
VDDSPD
Serial EEPROM positive power supply
A0-A9
Column Address Inputs
VSS
Ground
A10/AP
Column Address Input/Auto-precharge
SCL
Serial Presence Detect Clock Input
BA0, BA1, BA2
SDRAM Bank Address Inputs
SDA
Serial Presence Detect Data input/output
ODT0, ODT1
Active termination control lines
SA0, SA1
Serial Presence Detect Address Inputs
NC
No Connect
Note: A13 is for 2GB modules only.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 3
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Pinout
Pin
Front
Pin
Back
Pin
Front
Pin
Back
Pin
Front
Pin
Back
Pin
Front
Pin
Back
1
VREF
2
VSS
51
DQS2
52
DM2
101
A1
102
A0
151
DQ42
152
DQ46
3
VSS
4
DQ4
53
VSS
54
VSS
103
VDD
104
VDD
153
DQ43
154
DQ47
5
DQ0
6
DQ5
55
DQ18
56
DQ22
105
A10/AP
106
BA1
155
VSS
156
VSS
7
DQ1
8
VSS
57
DQ19
58
DQ23
107
BA0
108
157
DQ48
158
DQ52
9
VSS
10
DM0
59
VSS
60
VSS
109
110
159
DQ49
160
DQ53
11
12
VSS
61
DQ24
62
DQ28
111
VDD
112
VDD
161
VSS
162
VSS
13
DQS0
14
DQ6
63
DQ25
64
DQ29
113
114
ODT0
163
NC
164
CK1
15
VSS
16
DQ7
65
VSS
66
VSS
115
116
A13/NC
165
VSS
166
17
DQ2
18
VSS
67
DM3
68
117
VDD
118
VDD
167
168
VSS
19
DQ3
20
DQ12
69
NC
70
DQS3
119
ODT1
120
NC
169
DQS6
170
DM6
21
VSS
22
DQ13
71
VSS
72
VSS
121
VSS
122
VSS
171
VSS
172
VSS
23
DQ8
24
VSS
73
DQ26
74
DQ30
123
DQ32
124
DQ36
173
DQ50
174
DQ54
25
DQ9
26
DM1
75
DQ27
76
DQ31
125
DQ33
126
DQ37
175
DQ51
176
DQ55
27
VSS
28
VSS
77
VSS
78
VSS
127
VSS
128
VSS
177
VSS
178
VSS
29
30
CK0
79
CKE0
80
CKE1
129
130
DM4
179
DQ56
180
DQ60
31
DQS1
32
81
VDD
82
VDD
131
DQS4
132
VSS
181
DQ57
182
DQ61
33
VSS
34
VSS
83
NC
84
NC
133
VSS
134
DQ38
183
VSS
184
VSS
35
DQ10
36
DQ14
85
BA2
86
NC
135
DQ34
136
DQ39
185
DM7
186
37
DQ11
38
DQ15
87
VDD
88
VDD
137
DQ35
138
VSS
187
VSS
188
DQS7
39
VSS
40
VSS
89
A12
90
A11
139
VSS
140
DQ44
189
DQ58
190
VSS
41
VSS
42
VSS
91
A9
92
A7
141
DQ40
142
DQ45
191
DQ59
192
DQ62
43
DQ16
44
DQ20
93
A8
94
A6
143
DQ41
144
VSS
193
VSS
194
DQ63
45
DQ17
46
DQ21
95
VDD
96
VDD
145
VSS
146
195
SDA
196
VSS
47
VSS
48
VSS
97
A5
98
A4
147
DM5
148
DQS5
197
SCL
198
SA0
49
50
NC
99
A3
100
A2
149
VSS
150
VSS
199
VDDSPD
200
SA1
Note: All pin assignments are consistent for all 8-byte unbuffered versions.
A13 is for 2GB modules only.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 4
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Input/Output Functional Description
Symbol
Type
Polarity
Function
CK0, CK1
(SSTL)
Positive
Edge
The positive line of the differential pair of system clock inputs which drives the input to the
on-DIMM PLL. All the DDR2 SDRAM address and control inputs are sampled on the rising edge
of their associated clocks.
,
(SSTL)
Negative
Edge
The negative line of the differential pair of system clock inputs which drives the input to the
on-DIMM PLL.
CKE0, CKE1
(SSTL)
Active
High
Activates the SDRAM CK signal when high and deactivates the CK signal when low. By
deactivating the clocks, CKE low initiates the Power Down mode, or the Self Refresh mode.
,
(SSTL)
Active
Low
Enables the associated SDRAM command decoder when low and disables the command
decoder when high. When the command decoder is disabled, new commands are ignored but
previous operations continue.
, ,
(SSTL)
Active
Low
When sampled at the positive rising edge of the clock, , , define the operation to be
executed by the SDRAM.
VREF
Supply
Reference voltage for SSTL-18 inputs
ODT0, ODT1
Input
Active
High
On-Die Termination control signals
BA0, BA1, BA2
(SSTL)
-
Selects which SDRAM bank is to be active.
A0 – A9
A10/AP
A11, A12/A13
(SSTL)
-
During a Bank Activate command cycle, A0-A12/A13 define the row address (RA0-RA12/RA13)
when sampled at the rising clock edge. A13 applies on 2GB SODIMM only.
During a Read or Write command cycle, A0-A9 defines the column address (CA0-CA9) when
sampled at the rising clock edge. In addition to the column address, AP is used to invoke
Autoprecharge operation at the end of the Burst Read or Write cycle. If AP is high, autoprecharge
is selected and BA0/BA1/BA2 define the bank to be precharged. If AP is low, autoprecharge is
disabled.
During a Precharge command cycle, AP is used in conjunction with BA0/BA1/BA2 to control
which bank(s) to precharge. If AP is high all 8 banks will be precharged regardless of the state of
BA0/BA1/BA2. If AP is low, then BA0/BA1/BA2 are used to define which bank to pre-charge.
DQ0 – DQ63
(SSTL)
Active
High
Data and Check Bit Input/Output pins.
VDD, VSS
Supply
Power and ground for the DDR2 SDRAM input buffers and core logic
DQS0 – DQS7
–
(SSTL)
Negative
and
Positive
Edge
Data strobe for input and output data
DM0 – DM7
Input
Active
High
The data write masks, associated with one data byte. In Write mode, DM operates as a byte
mask by allowing input data to be written if it is low but blocks the write operation if it is high. In
Read mode, DM lines have no effect. DM8 is associated with check bits CB0-CB7, and is not
used on x64 modules.
SA0 – SA1
-
Address inputs. Connected to either VDD or VSS on the system board to configure the Serial
Presence Detect EEPROM address.
SDA
-
This bi-directional pin is used to transfer data into or out of the SPD EEPROM. A resistor must be
connected from the SDA bus line to V DD to act as a pull-up.
SCL
-
This signal is used to clock data into and out of the SPD EEPROM. A resistor may be connected
from the SCL bus time to V DD to act as a pull-up.
VDDSPD
Supply
Serial EEPROM positive power supply.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 5
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Functional Block Diagram
[1GB – 2 Ranks, 64Mx16 DDR2 SDRAMs]
VDDSPD
VSS
SPD
VDD
VREF
VDDID
Notes :
1. DQ wiring may differ from that described in this drawing.
2. DQ/DQS/DM/CKE/S S relationships are maintained as shown.
3. DQ/DQS/DM/DQS resistors are 22 +/- 5% Ohms
4. VDDID strap connections (for memory device VDD, VDDQ):
STRAP OUT (OPEN): VDD
= VDDQ
STRAP IN (VSS ): VDD
is not equal to VDDQ
4 loads
CK0
CK1
4 loads
Serial PD
A0 A2A1
SCL
WP SDA
SA0 SA1
DQ48
DQ49
DQ50
DQ55
DQ52
DQ54
DQ53
DQ51
DQ56
DQ57
DQ58
DQ63
DQ60
DQ62
DQ61
DQ59
DQS6
DM6
DQS7
DM7
DM4
DQS4
DQ32
DQ33
DQ34
DQ39
DQ36
DQ38
DQ37
DQ35
DQ40
DQ41
DQ42
DQ47
DQ44
DQ46
DQ45
DQ43
DQS5
DM5
DM0
DQ0
DQ1
DQ2
DQ7
DQ4
DQ6
DQ5
DQ3
DQ8
DQ9
DQ10
DQ15
DQ12
DQ14
DQ13
DQ11
DQS0
DM1
DQS1
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D0
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
DM3
DM2
DQS2
DQ16
DQ17
DQ18
DQ23
DQ20
DQ22
DQ21
DQ19
DQ24
DQ25
DQ26
DQ31
DQ28
DQ30
DQ29
DQ27
DQS3
ODT1
ODT0
CKE1
CKE0
C
K
E
O
D
T
3 Ohms +/- 5%
BA0-BA2
A0-A12
SDRAMS D0-D7
SDRAMS D0-D7
SDRAMS D0-D7
SDRAMS D0-D7
SDRAMS D0-D7
SA0
SA1
D0-D7, VDD and VDDQ
D0-D7
D0-D7, SPD
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D4
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
C
K
E
O
D
T
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D1
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
C
K
E
O
D
T
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D5
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
C
K
E
O
D
T
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D2
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
C
K
E
O
D
T
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D3
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
C
K
E
O
D
T
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D6
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
C
K
E
O
D
T
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
LDM
D7
I/O 8
I/O 9
I/O 14
I/O 13
I/O 12
I/O 11
I/O 10
I/O 15
UDM
UDQS
LDQS
C
K
E
O
D
T
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 6
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Functional Block Diagram
[2GB – 2 Ranks, 128M x8 DDR2 SDRAMs]
Notes :
Unless otherwise noted, resistor values are
22
ohms +/- 5 %
DQ wiring way differ from that described in this drawing
;
described in this drawing; however, DQ/DM/DQS/ DQS
relationships are maintained as shown
Serial PD
A0
A2
A1
SCL
WP SDA
CS0
CS1
ODT1
ODT0
CKE1
CKE0
3 Ohms +/- 5%
SA0
SA1
SCL
VDDSPD
VSS
Serial PD
SDRAMS D0-D15, VDD, and VDDQVDD
VREF SDRAMS D0-D15
SDRAMS D0-D15, SPD
BA0-BA2
A0-A13
RAS
SDRAMS D0-D15
SDRAMS D0-D15
SDRAMS D0-D15
WE
CAS SDRAMS D0-D15
SDRAMS D0-D15
10 Ohms +/- 5%
DM0
DQ0
DQ1
DQ2
DQ7
DQ4
DQ6
DQ5
DQ3
DQS0
DQS0
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
CS0
D0, D8
DQS
DQS CKE0 CKE1 ODT1
ODT0 CS1
DM1
DQ8
DQ9
DQ10
DQ15
DQ12
DQ14
DQ13
DQ11
DQS1
DQS1
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
D1, D9
DQS CKE0 CKE1 ODT1
ODT0
DM2
DQ16
DQ17
DQ18
DQ23
DQ20
DQ22
DQ21
DQ19
DQS2
DQS2
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
D2, D10
DQS CKE0 CKE1 ODT1
ODT0
DM3
DQ24
DQ25
DQ26
DQ31
DQ28
DQ30
DQ29
DQ27
DQS3
DQS3
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
D3, D11
DQS CKE0 CKE1 ODT1
ODT0
DM4
DQ32
DQ33
DQ34
DQ39
DQ36
DQ38
DQ37
DQ35
DQS4
DQS4
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
D4, D12
DQS CKE0 CKE1 ODT1
ODT0
DM5
DQ40
DQ41
DQ42
DQ47
DQ44
DQ46
DQ45
DQ43
DQS5
DQS5
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
D5, D13
DQS CKE0 CKE1 ODT1
ODT0
DM6
DQ48
DQ49
DQ50
DQ55
DQ52
DQ54
DQ53
DQ51
DQS6
DQS6
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
D6, D 14
DQS CKE0 CKE1 ODT1
ODT0
DM7
DQ56
DQ57
DQ58
DQ63
DQ60
DQ62
DQ61
DQ59
DQS7
DQS7
I/O 0
I/O 1
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 7
DM
D7, D15
DQS CKE0 CKE1 ODT1
ODT0
8 loads
CK0
CK0 5.6pF
8 loads
CK1 5.6pF
CK1
CS0
DQS CS1
CS0
DQS CS1
CS0
DQS CS1
CS0
DQS CS1
CS0
DQS CS1
CS0
DQS CS1
CS0
DQS CS1
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 7
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Serial Presence Detect (1GB – 2 Ranks, 64Mx16 DDR2 SDRAMs) (Part 1 of 2)
Byte
Description
Serial PD Data Entry (Hex.)
Note
-3C
-AD
0
Number of Serial PD Bytes Written during Production
80
80
1
Total Number of Bytes in Serial PD device
08
08
2
Fundamental Memory Type
08
08
3
Number of Row Addresses on Assembly
0D
0D
4
Number of Column Addresses on Assembly
0A
0A
5
Number of DIMM Ranks, Package, and Height
61
61
6
Data Width of Assembly
40
40
7
Reserved
00
00
8
Voltage Interface Level of this Assembly
05
05
9
DDR2 SDRAM Device Cycle Time at CL=5
30
25
10
DDR2 SDRAM Device Access Time (tac) from Clock at CL=5
45
40
11
DIMM Configuration Type
00
00
12
Refresh Rate/Type
82
82
13
Primary DDR2 SDRAM Width
10
10
14
Error Checking DDR2 SDRAM Device Width
00
00
15
Reserved
00
00
16
DDR2 SDRAM Device Attributes: Burst Length Supported
0C
0C
17
DDR2 SDRAM Device Attributes: Number of Device Banks
08
08
18
DDR2 SDRAM Device Attributes: Latencies Supported
38
70
19
DIMM Mechanical Characteristics
01
01
20
DDR2 SDRAM DIMM Type Information
04
04
21
DDR2 SDRAM Module Attributes
00
00
22
DDR2 SDRAM Device Attributes: General
03
03
23
Minimum Clock Cycle at CL=4
3D
30
24
Maximum Data Access Time from Clock at CL=4
50
45
25
Minimum Clock Cycle Time at CL=3
50
3D
26
Maximum Data Access Time from Clock at CL=3
60
50
27
Minimum Row Precharge Time (tRP)
3C
3C
28
Minimum Row Active to Row Active delay (tRRD)
28
28
29
Minimum to delay (tRCD)
3C
3C
30
Minimum Active to Precharge Time (tRAS)
2D
2D
31
Module Rank Density
80
80
32
Address and Command Setup Time Before Clock (tIS)
20
17
33
Address and Command Hold Time After Clock (tIH)
27
25
34
Data Input Setup Time Before Clock (tDS)
10
05
35
Data Input Hold Time After Clock (tDH)
17
12
36
Write Recovery Time (tWR)
3C
3C
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 8
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Serial Presence Detect (1GB – 2 Ranks, 64Mx16 DDR2 SDRAMs) (Part 2 of 2)
Byte
Description
Serial PD Data Entry (Hex.)
Note
-3C
-AD
37
Internal Write to Read Command delay (tWTR)
1E
1E
38
Internal Read to Precharge delay (tRTP)
1E
1E
39
Reserved
00
00
40
Extension of Byte 41 tRC and Byte 42 tRFC
06
06
41
Minimum Core Cycle Time (tRC)
3C
3C
42
Min. Auto Refresh Command Cycle Time (tRFC)
7F
7F
43
Maximum Clock Cycle Time (tCK)
80
80
44
Max. DQS-DQ Skew Factor (tQHS)
18
14
45
Read Data Hold Skew Factor (tQHS)
22
1E
46-61
Reserved
--
--
62
SPD Reversion
13
13
63
Checksum for Byte 0-62
A6
70
64-71
Manufacturer’s JEDEC ID Code
--
--
72
Module Manufacturing Location
00
00
73-91
Module Part number
--
--
92-255
Reserved
--
--
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 9
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Serial Presence Detect (2GB – 2 Ranks, 128Mx8 DDR2 SDRAMs) (Part 1 of 2)
Byte
Description
Serial PD Data Entry (Hex.)
Note
-3C
-AD
0
Number of Serial PD Bytes Written during Production
80
80
1
Total Number of Bytes in Serial PD device
08
08
2
Fundamental Memory Type
08
08
3
Number of Row Addresses on Assembly
0E
0E
4
Number of Column Addresses on Assembly
0A
0A
5
Number of DIMM Ranks, Package, and Height
61
61
6
Data Width of Assembly
40
40
7
Reserved
00
00
8
Voltage Interface Level of this Assembly
05
05
9
DDR2 SDRAM Device Cycle Time at CL=5
30
25
10
DDR2 SDRAM Device Access Time (tac) from Clock at CL=5
45
40
11
DIMM Configuration Type
00
00
12
Refresh Rate/Type
82
82
13
Primary DDR2 SDRAM Width
08
08
14
Error Checking DDR2 SDRAM Device Width
00
00
15
Reserved
00
00
16
DDR2 SDRAM Device Attributes: Burst Length Supported
0C
0C
17
DDR2 SDRAM Device Attributes: Number of Device Banks
08
08
18
DDR2 SDRAM Device Attributes: Latencies Supported
38
70
19
DIMM Mechanical Characteristics
01
01
20
DDR2 SDRAM DIMM Type Information
04
04
21
DDR2 SDRAM Module Attributes
00
00
22
DDR2 SDRAM Device Attributes: General
03
03
23
Minimum Clock Cycle at CL=4
3D
30
24
Maximum Data Access Time from Clock at CL=4
50
45
25
Minimum Clock Cycle Time at CL=3
50
3D
26
Maximum Data Access Time from Clock at CL=3
60
50
27
Minimum Row Precharge Time (tRP)
3C
3C
28
Minimum Row Active to Row Active delay (tRRD)
1E
1E
29
Minimum to delay (tRCD)
3C
3C
30
Minimum Active to Precharge Time (tRAS)
2D
2D
31
Module Rank Density
01
01
32
Address and Command Setup Time Before Clock (tIS)
20
17
33
Address and Command Hold Time After Clock (tIH)
27
25
34
Data Input Setup Time Before Clock (tDS)
10
05
35
Data Input Hold Time After Clock (tDH)
17
12
36
Write Recovery Time (tWR)
3C
3C
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 10
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Serial Presence Detect (2GB – 2 Ranks, 128 M x 8 DDR2 SDRAMs) (Part 2 of 2)
Byte
Description
Serial PD Data Entry (Hex.)
Note
-3C
-AD
37
Internal Write to Read Command delay (tWTR)
1E
1E
38
Internal Read to Precharge delay (tRTP)
1E
1E
39
Reserved
00
00
40
Extension of Byte 41 tRC and Byte 42 tRFC
06
06
41
Minimum Core Cycle Time (tRC)
3C
3C
42
Min. Auto Refresh Command Cycle Time (tRFC)
7F
7F
43
Maximum Clock Cycle Time (tCK)
80
80
44
Max. DQS-DQ Skew Factor (tQHS)
18
14
45
Read Data Hold Skew Factor (tQHS)
22
1E
46-61
Reserved
--
--
62
SPD Reversion
13
13
63
Checksum for Byte 0-62
16
E0
64-71
Manufacturer’s JEDEC ID Code
--
--
72
Module Manufacturing Location
00
00
73-91
Module Part number
--
--
92-255
Reserved
--
--
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 11
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Environmental Requirements
Symbol
Parameter
Rating
Units
TOPR
Operating Temperature (ambient)
0 to 65
°C
HOPR
Operating Humidity (relative)
10 to 90
%
TSTG
Storage Temperature
-50 to 100
°C
HSTG
Storage Humidity (without condensation)
5 to 95
%
Barometric pressure (operating & storage) up to 9850ft.
105 to 69
kPa
Note: Stress greater than those listed may cause permanent damage to the device. This is a stress rating only and device functional
operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect reliability
Absolute Maximum DC Ratings
Symbol
Parameter
Rating
Units
VDD
Voltage on VDD pins relative to Vss
-1.0 to +2.3
V
VDDQ
Voltage on VDDQ pins relative to Vss
-0.5 to +2.3
V
VDDL
Voltage on VDDL pins relative to Vss
-0.5 to +2.3
V
VIN, VOUT
Voltage on I/O pins relative to Vss
-0.5 to +2.3
V
TSTG
Storage Temperature (Plastic)
-55 to +100
°C
Note: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is stress
rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Storage temperature is the case surface temperature on the center/top side of the DRAM.
Operating temperature Conditions
Symbol
Parameter
Rating
Units
Note
TCASE
Operating Temperature (Ambient)
0 to 95
°C
1
Note:
1. Case temperature is measured at top and center side of any DRAMs.
2. tCASE > 85°C tREFI = 3.9 μs
DC Electrical Characteristics and Operating Conditions
Symbol
Parameter
Min
Max
Units
Notes
VDD
Supply Voltage
1.7
1.9
V
1
VDDL
DLL Supply Voltage
1.7
1.9
V
1
VDDQ
Output Supply Voltage
1.7
1.9
V
1
VSS, VSSQ
Supply Voltage, I/O Supply Voltage
0
0
V
VREF
Input Reference Voltage
0.49VDDQ
0.51VDDQ
V
1, 2
VTT
Termination Voltage
VREF – 0.04
VREF + 0.04
V
3
Note:
1. There is no specific device VDD supply voltage requirement for SSTL_18 compliance. However, VDDQ must be less than or equal to
VDD under all conditions.
2. VREF is expected to be equal to 0.5 V DDQ of the transmitting device, and to track variations in the DC level of the same. Peak-to-peak
noise on VREF may not exceed 2% of the DC value.
3. VTT of transmitting device must track VREF of receiving device.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 12
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
ODT DC Electrical Characteristics
Parameter/Condition
Symbol
Min.
Nom.
Max.
Units
Note
Rtt effective impedance value for EMRS(A6,A2)=0,1; 75ohm
Rtt1(eff)
60
75
90
ohm
1
Rtt effective impedance value for EMRS(A6,A2)=1,0; 150ohm
Rtt2(eff)
120
150
180
ohm
1
Rtt effective impedance value for EMRS(A6,A2)=1,1; 50ohm
Rtt3(eff)
40
50
60
ohm
1
Deviation of VM with respect to VDDQ/2
Delta VM
-6
+6
%
1
Note1: Test condition for Rtt measurements.
Input AC/DC logic level
Symbol
Parameter
PC2-5300
PC2-6400
Units
Min.
Max.
Min.
Max.
VIH (AC)
Input High (Logic1) Voltage
VREF + 0.200
-
VREF + 0.200
-
V
VIL (AC)
Input Low (Logic0) Voltage
-
VREF – 0.200
-
VREF – 0.200
V
VIH (DC)
Input High (Logic1) Voltage
VREF + 0.125
VDDQ + 0.3
VREF + 0.125
VDDQ + 0.3
V
VIL (DC)
Input Low (Logic0) Voltage
-0.3
VREF – 0.125
-0.3
VREF – 0.125
V
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 13
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Operating, Standby, and Refresh Currents
TCASE = 0 °C ~ 85 °C; VDDQ = VDD = 1.8V ± 0.1V [1GB, 2 Ranks, 64Mx16 DDR2 SDRAMs]
Symbol
Parameter/Condition
PC2-5300
(-3C)
PC2-6400
(-AD)
Unit
IDD0
Operating Current: one bank; active/precharge; tRC = tRC (MIN); tCK = tCK
(MIN); DQ, DM, and DQS inputs changing twice per clock cycle; address
and control inputs changing once per clock cycle
660
792
mA
IDD1
Operating Current: one bank; active/read/precharge; Burst = 4; tRC = tRC
(MIN); CL= 4; tCK = tCK (MIN); IOUT = 0mA; address and control inputs
changing once per clock cycle
748
858
mA
IDD2P
Precharge Power-Down Standby Current: all banks idle; power-down
mode; CKE VIL (MAX); tCK = tCK (MIN)
79
79
mA
IDD2Q
Precharge quiet standby current
440
528
mA
IDD2N
Idle Standby Current: CS VIH (MIN); all banks idle; CKE VIH (MIN); tCK = tCK
(MIN); address and control inputs changing once per clock cycle
440
572
mA
IDD3N
Active Standby Current: one bank; active/precharge; CS VIH (MIN); CKE
VIH (MIN); tRC = tRAS (MAX); tCK = tCK (MIN); DQ, DM, and DQS inputs changing
twice per clock cycle; address and control inputs changing once per
clock cycle
506
616
mA
IDD4R
Operating Current: one bank; Burst = 4; reads; continuous burst;
address and control inputs changing once per clock cycle; DQ and DQS
outputs changing twice per clock cycle; CL = 4; tCK = tCK (MIN); IOUT = 0mA
880
1320
mA
IDD4W
Operating Current: one bank; Burst = 4; writes; continuous burst;
address and control inputs changing once per clock cycle; DQ and DQS
inputs changing twice per clock cycle; CL= 4; tCK = tCK (MIN)
880
1320
mA
IDD5B
Burst Refresh Current: tRC = tRFC (MIN)
1100
1210
mA
IDD6
Self-Refresh Current: CKE 0.2V
79
79
mA
IDD7
Operating Current: four bank; four bank interleaving with BL = 4,
address and control inputs randomly changing; 50% of data changing at
every transfer; tRC = tRC (min); IOUT = 0mA.
1364
1738
mA
Note: Module IDD was calculated from component IDD. It may differ from the actual measurement.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 14
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Operating, Standby, and Refresh Currents
TCASE = 0 °C ~ 85 °C; VDDQ = VDD = 1.8V ± 0.1V [2GB, 2 Ranks, 128M x 8 DDR2 SDRAMs]
Symbol
Parameter/Condition
PC2-5300
(-3C)
PC2-6400
(-AD)
Unit
IDD0
Operating Current: one bank; active/precharge; tRC = tRC (MIN); tCK = tCK
(MIN); DQ, DM, and DQS inputs changing twice per clock cycle; address
and control inputs changing once per clock cycle
836
968
mA
IDD1
Operating Current: one bank; active/read/precharge; Burst = 4; tRC = tRC
(MIN); CL= 4; tCK = tCK (MIN); IOUT = 0mA; address and control inputs
changing once per clock cycle
924
1100
mA
IDD2P
Precharge Power-Down Standby Current: all banks idle; power-down
mode; CKE VIL (MAX); tCK = tCK (MIN)
158
158
mA
IDD2Q
Precharge quiet standby current
528
616
mA
IDD2N
Idle Standby Current: CS VIH (MIN); all banks idle; CKE VIH (MIN); tCK = tCK
(MIN); address and control inputs changing once per clock cycle
528
704
mA
IDD3N
Active Standby Current: one bank; active/precharge; CS VIH (MIN); CKE
VIH (MIN); tRC = tRAS (MAX); tCK = tCK (MIN); DQ, DM, and DQS inputs changing
twice per clock cycle; address and control inputs changing once per
clock cycle
660
792
mA
IDD4R
Operating Current: one bank; Burst = 4; reads; continuous burst;
address and control inputs changing once per clock cycle; DQ and DQS
outputs changing twice per clock cycle; CL = 4; tCK = tCK (MIN); IOUT = 0mA
1144
1408
mA
IDD4W
Operating Current: one bank; Burst = 4; writes; continuous burst;
address and control inputs changing once per clock cycle; DQ and DQS
inputs changing twice per clock cycle; CL= 4; tCK = tCK (MIN)
1144
1408
mA
IDD5B
Burst Refresh Current: tRC = tRFC (MIN)
1672
1892
mA
IDD6
Self-Refresh Current: CKE 0.2V
158
158
mA
IDD7
Operating Current: four bank; four bank interleaving with BL = 4,
address and control inputs randomly changing; 50% of data changing at
every transfer; tRC = tRC (min); IOUT = 0mA.
2112
2552
mA
Note: Module IDD was calculated from component IDD. It may differ from the actual measurement.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 15
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
AC Timing Specifications for DDR2 SDRAM Devices Used on Module
(TCASE = 0 °C ~ 85 °C; VDDQ = 1.8V ± 0.1V; VDD = 1.8V ± 0.1V, See AC Characteristics) (Part 1 of 2)
Symbol
Parameter
-3C
-AD
Unit
Notes
Min.
Max.
Min.
Max.
tAC
DQ output access time from CK/
-0.45
+0.45
-0.40
+0.40
ns
tDQSCK
DQS output access time from CK/
-0.4
+0.4
-0.35
+0.35
ns
tCH
CK high-level width
0.48
0.52
0.48
0.52
tCK
tCL
CK low-level width
0.48
0.52
0.48
0.52
tCK
tHP
Minimum half clk period for any given cycle; defined by clk high
(tCH) or clk low (tCL) time
Min(tCH(ab.
s),tCL(abs))
-
Min(tCH(ab.
s),tCL(abs))L
-
tCK
tCK
Clock Cycle Time
3
8
2.5
8
ns
tDH
DQ and DM input hold time
175
-
125
-
ps
tDS
DQ and DM input setup time
100
-
50
-
ps
tIPW
Input pulse width
0.6
-
0.6
-
tCK
tDIPW
DQ and DM input pulse width (each input)
0.35
-
0.35
-
tCK
tHZ
Data-out high-impedance time from CK/
-
tAC max
-
tAC max
ns
tLZ(DQ)
Data-out low-impedance time from CK/
2xtAC min
tAC max
2xtAC min
tAC max
ns
tLZ(DQS)
DQS low-impedance time from CK/
tAC min
tAC max
tAC min
tAC max
ns
tDQSQ
DQS-DQ skew (DQS & associated DQ signals)
-
0.24
-
0.20
ns
tQHS
Data hold Skew Factor
-
0.34
-
0.30
ns
tQH
Data output hold time from DQS
tHP –
tQHS
-
tHP –
tQHS
-
ns
tDQSS
Write command to 1st DQS latching transition
-0.25
0.25
-0.25
0.25
tCK
tDQSH
DQS input high pulse width
0.35
-
0.35
-
tCK
tDQSL
DQS input low pulse width
0.35
-
0.35
-
tCK
tDSS
DQS falling edge to CK setup time
(write cycle)
0.2
-
0.2
-
tCK
tDSH
DQS falling edge hold time from CK
(write cycle)
0.2
-
0.2
-
tCK
tMRD
Mode register set command cycle time
2
-
2
-
tCK
tWPST
Write postamble
0.40
0.60
0.40
0.60
tCK
tWPRE
Write preamble
0.35
-
0.35
-
tCK
tIH
Address and control input hold time
0.275
-
0.250
-
ns
tIS
Address and control input setup time
0.2
-
0.175
-
ns
tRPRE
Read preamble
0.9
1.1
0.9
1.1
tCK
tRPST
Read postamble
0.4
0.6
0.4
0.6
tCK
tDelay
Minimum time clocks remains ON after CKE asynchronously
drops Low
tIS + tCK(avg) +
tIH
-
tIS + tCK(avg) +
tIH
-
ns
tRFC
Refresh to active/Refresh command time
127.5
127.5
ns
tREFI
Average Periodic Refresh Interval
(85ºC < TCASE ≤ 95ºC)
3.9
3.9
μs
Average Periodic Refresh Interval
(0ºC ≤ TCASE ≤ 85ºC)
7.8
7.8
μs
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 16
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
AC Timing Specifications for DDR2 SDRAM Devices Used on Module
(TCASE = 0 °C ~ 85 °C; VDDQ = 1.8V ± 0.1V; VDD = 1.8V ± 0.1V, See AC Characteristics) (Part 2 of 2)
Symbol
Parameter
-3C
-AD
Unit
Notes
Min.
Max.
Min.
Max.
tRRD
Active bank A to Active bank B command
7.5
-
7.5
-
ns
tCCD
to
2
-
2
-
tCK
tWR
Write recovery time
15
-
15
-
ns
WR
Write recovery time with Auto-Precharge
tWR/tCK
tWR/tCK
ns
tDAL
Auto precharge write recovery + precharge time
WR
+tnRP
-
WR
+tnRP
-
tCK
tWTR
Internal write to read command delay
7.5
-
7.5
-
ns
tRTP
Internal read to precharge command delay
7.5
-
7.5
-
ns
tXSNR
Exit self refresh to a Non-read command
tRFC
+10
-
tRFC
+10
-
ns
tXSRD
Exit self refresh to a Read command
200
-
200
-
tCK
tXP
Exit precharge power down to any Non- read command
2
-
2
-
tCK
tXARD
Exit active power down to read command
2
-
2
-
tCK
tXARDS
Exit active power down to read command
7-AL
-
8-AL
-
tCK
tCKE
CKE minimum pulse width
3
-
3
-
tCK
tOIT
OCD drive mode output delay
0
12
0
12
ns
ODT
tAOND
ODT turn-on delay
2
2
2
2
tCK
tAON
ODT turn-on
tAC(min)
tAC(max) +0.7
tAC(min)
tAC(max) +0.7
ns
tAONPD
ODT turn-on (Power down mode)
tAC(min)
+2
2 tCK(avg) +
tAC(max)+1
tAC(min)
+2
2 tCK(avg) +
tAC(max)+1
ns
tAOFD
ODT turn-off delay
2.5
2.5
2.5
2.5
tCK
tAOF
ODT turn-off
tAC(min)
tAC(max)+0.6
tAC(min)
tAC(max)+0.6
ns
tAOFPD
ODT turn-off (Power down mode)
tAC(min)
+2
2.5tCK(avg) +
tAC(max)+1
tAC(min)
+2
2.5tCK(avg) +
tAC(max)+1
ns
tANPD
ODT to power down entry latency
3
-
3
-
tCK
tAXPD
ODT power down exit latency
8
-
8
-
tCK
Speed Grade Definition
Symbol
Parameter
-3C
-AD
Unit
Min.
Max.
Min.
Max.
tRAS
Row Active Time
45
70000
45
70000
ns
tRCD
RAS to CAS delay
15
-
15
-
ns
tRC
Row Cycle Time
60
-
60
-
ns
tRP
Row Precharge Time
15
-
15
-
ns
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 17
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Package Dimensions
[1GB – 2 Ranks, 64Mx16 DDR2 SDRAMs]
67.60
FRONT
SIDE
199
139 41
Detail A Detail B
11.40
(2X)
BACK
63.60
Detail A
2.55
0.60
Detail B
0.45
Note: All dimensions are typical with tolerances of +/- 0.15 unless otherwise stated.
Units: Millimeters (Inches)
4.00 +/- 0.10
1.00 +/- 0.1
0.25 MAX
3.80 MAX
1.00 +/- 0.10
2.45
47.40
2.70
4.20
2.15
1.80
4.00
20.00
30.00
6.00
Note: Device position and scale are only for reference.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 18
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Package Dimensions
[2GB – 2 Ranks, 128M x8 DDR2 SDRAMs]
67.60
FRONT
SIDE
1991 41
Detail A Detail B
4.00
20.00
30.00
6.00
(2X)
BACK
63.60
39
Detail A
2.55
0.60
Detail B
0.45
Note: All dimensions are typical with tolerances of +/- 0.15 unless otherwise stated.
Units: Millimeters (Inches)
4.00 +/- 0.10
1.00 +/- 0.1
0.25 MAX
3.80 MAX
1.00 +/- 0.10
2.45
47.40
2.70
4.20
11.402.15
1.80
Note: Device position and scale are only for reference.
NT1GT64UH8G0FS / NT2GT64U8HG0BS
1GB: 128M x 64 / 2GB: 256M x 64
PC2-5300 / PC2-6400
Unbuffered DDR2 SO-DIMM
REV 1.0 19
08/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Revision Log
Rev
Date
Modification
0.1
01/2010
Preliminary Edition
1.0
08/2010
Official Release
Nanya Technology Corporation
Hwa Ya Technology Park 669
Fu Hsing 3rd Rd., Kueishan,
Taoyuan, 333, Taiwan, R.O.C.
Tel: +886-3-328-1688
Please visit our home page for more information: www.nanya.com
Printed in Taiwan
© 2010
