INTEGRATED CIRCUITS ADDENDUM SL2 FCS20 I-CONNECT SLI Flip Chip Package Specification Product Specification Revision 3.0 Public Philips Semiconductors January 2003 Philips Semiconductors Product Specification Rev 3.0 I-CONNECT Specification January 2003 SL2 FCS 20 CONTENTS 1 SCOPE...................................................................................................................................... 3 2 SPECIFICATIONS ...................................................................................................................... 4 2.1 Chip........................................................................................................................................... 4 2.2 ABSOLUTE MAXIMUM RATINGS 2.3 OPERATING CONDITIONS ........................................................................................................ 4 2.4 Electrical Characteristics............................................................................................................. 5 3 ORDERING INFORMATION ....................................................................................................... 5 4 DEFINITIONS ............................................................................................................................ 6 5 DISCLAIMERS ........................................................................................................................... 6 5.1 Life support applications.............................................................................................................. 6 5.2 Licence Policy ............................................................................................................................ 6 6 REVISION HISTORY .................................................................................................................. 7 1, 2 ........................................................................................... 4 I*CODE is a registered trademark of Philips Electronics N.V. 2 Philips Semiconductors Product Specification Rev 3.0 I-CONNECT Specification January 2003 SL2 FCS 20 1 SCOPE This document gives specifications for the product SL2FCS20; the I-CONNECT SLI. * The SL2FCS2001DV/DH is the integrated circuit SL2ICS2001 in the package SOT732AA1. * The SL2FCS2001DV/DC is the integrated circuit SL2ICS2001 in the package SOT732BB1. Therefore this document encompasses all information not covered by the specification of the package and/or the functional specification of the integrated circuit. * Detailed information on the package is given in the specification FCP 2.1 Flip Chip Package. * Functionality of the integrated circuit is described in the Functional Specification I*CODE SLI Smart Label IC SL2ICS2001. 3 Philips Semiconductors Product Specification Rev 3.0 January 2003 I-CONNECT Specification SL2 FCS 20 2 SPECIFICATIONS 2.1 Chip Functionality of the integrated circuit is described in the I*CODE SLI Smart Label IC SL2ICS2001 Functional Specification. 2.2 ABSOLUTE MAXIMUM RATINGS 1, 2 ABSOLUTE MAXIMUM RATINGS TEST CONDITIONS MIN TYP 1 MIL-STD-883D, Method 3015.7, Human Body Model ESD Voltage Immunity Input Peak Current -60 MAX UNIT 2 kV peak +60 mApeak Processing temperature: refer to specification "FCP 2.1 Flip Chip Package" NOTES: 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. 2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. 2.3 OPERATING CONDITIONS SYMBOL Tj op ILA-LB PARAMETER TEST CONDITIONS Operating Junction Temperature Input Current MIN TYP 1 - 25 2 MAX UNIT + 85 C 30 mArms Minimum Supply Voltage VLA-LB fop for READ/WRITE/EAS Operating Frequency 3 2.5 2.6 2.9 Vrms 13.553 13.560 13.567 MHz NOTES: 1. Typical ratings are not guaranteed. These values listed are at room temperature. 2. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter ILA-LB). 3. Bandwidth limitation (7 kHz) according to ISM band regulations. 4 Philips Semiconductors Product Specification Rev 3.0 January 2003 I-CONNECT Specification SL2 FCS 20 2.4 Electrical Characteristics Tjop = - 25 to +85 C SYMBOL PARAMETER Cres Input Capacitance between LA - LB Pmin Minimum Operating Supply Power m tP sm tD R mod tret nwrite 2 TEST CONDITIONS VLA-LB = 2 Vrms MIN TYP 1 MAX UNIT 22,7 23,5 25,1 pF 3 Modulation of RF Voltage for Demodulator Response 280 Vmax - Vmin m = Vmax + Vmin Modulation Pulse Length of RF Voltage Demodulator Response Time m 10 %, 100% Load Modulation EEPROM Data Retention Tamb 55 C EEPROM Write Endurance W ** ** ** % ** ** ** s ** ** ** s ** ** ** 10 Years 100 000 Cycles NOTES: 1. Typical ratings are not guaranteed. These values listed are at room temperature. 2. Measured with an HP4285A LCR meter at 13.56 MHz. 3. Including losses in resonant capacitor and rectifier. ** : refer to ISO/IEC 15693-2 and 15693-3 including pulse shapes and tolerances; proper coil design assumed 3 ORDERING INFORMATION Ordering Name SL2FCS2001DV/DH Description I-CONNECT SLI, Ordering Code 12NC: 9352 725 07118 Hot laminated backside tape SL2FCS2001DV/DC I-CONNECT SLI, Cold laminated backside tape 5 12NC: 9352 725 06118 Philips Semiconductors Product Specification Rev 3.0 I-CONNECT Specification January 2003 SL2 FCS 20 4 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics section of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 5 DISCLAIMERS 5.1 Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 5.2 Licence Policy Purchase of this Philips IC with a functionally according to ISO/IEC 15693 Standard does not convey an implied license under any patent right on this standard. A license for the Philips portfolio of patents on the ISO/IEC 15693 Standard can be obtained via the Philips Intellectual Property and Standards department. For more information please contact the nearest Philips Semiconductors sales office. 6 Philips Semiconductors Product Specification Rev 3.0 January 2003 I-CONNECT Specification SL2 FCS 20 6 REVISION HISTORY Table 1 Addendum Flip Chip Package Specification Revision History REVISION DATE 3.0 2.1 2.0 1.0 Jan. 2003 Oct. 2002 Sept. 2002 May 2002 CPCN PAGE - 5 DESCRIPTION Product version typo of 12NC ordering code Preliminary version Initital version. 7 Philips Semiconductors Product Specification Rev 3.0 I-CONNECT Specification January 2003 SL2 FCS 20 NOTES 8 Philips Semiconductors - a worldwide company Contact Information For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Philips Semiconductors