Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
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In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
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Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
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reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
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1. Product profile
1.1 General description
The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel
RC low-p ass filter arrays. They are designed to provide filtering of undesired RF signals in
the 800 MHz-to-3 000 MHz frequen cy band. They incor porate diodes to pr ovide protection
to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV
contact and higher than 25 kVair discharge, far exceeding IEC 61000-4-2, level 4.
The devices support ESD protection of the USB data pins of a Universal Subscriber
Identity Module (USIM) interface, as well as the digital standard SIM interface
ESD protection and ElectroMagnetic Interface (EMI) filtering.
The devices are fabricated using monolithic silicon technology. They integrate three
resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack
No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all
three devices ideal for use in applications requiring component miniaturization, such as
mobile phone handsets, cordless telephones and personal digit al devices.
Similar products are available in Wafer Level Chip-Size Package (WLCSP).
IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces.
IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and
IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
3-channel SIM card interface integrated RC-filter array and SIM voltage
ESD protection
2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance
Integrated 100 /100 /47 series channel resistors
Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL)
or 40 pF (IP4264CZ8-40-TTL)
Downstream ESD protection up to 25 kV (contact) according to IEC 61000-4-2
Micropak (QFN compatible) plastic package with 0.4 mm pitch
1.3 Applications
SIM interfaces in for example, cellular phone and Personal Communication
System (PCS) mobile handsets
IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card p assive filter array with ESD protection
Rev. 2 — 12 October 2011 Product data sheet
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 2 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
2. Pinning information
3. Ordering information
4. Marking
Table 1. Pinning
Pin Description Simplified outline Graphic symbol
1 and 8 filter channel 1
2 and 7 filter channel 2
3 and 6 filter channel 3
4 and 5 ESD protection
GND ground
Transparent
top view
8
1
5
4
018aaa015
100 Ω
R1
47 Ω
R2
100 Ω
R3
1
2
3
4
8
7
6
5
Table 2. Ordering informa tion
Type number Package
Name Description Version
IP4264CZ8-10-TTL HUSON8 plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 1.35 1.7 0.55 mm SOT1166-1
IP4264CZ8-20-TTL
IP4264CZ8-40-TTL
Table 3. Marking codes
Type number Marking code
IP4264CZ8-10-TTL N1
IP4264CZ8-20-TTL N2
IP4264CZ8-40-TTL N4
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 3 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
5. Limiting values
[1] All devices are qualified using 1000 contact discharges of 8 kV (IP4264CZ8-10-TTL and
IP4264CZ8-20-TTL) or 25 kV (IP4264CZ8-40-TTL) using the IEC 61000-4-2 model, far exceeding the
specified IEC 61000-4-2, level 4 (8 kV contact discharge).
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IP4264CZ8-10-TTL
VESD electrostatic discharge
voltage pins 1, 2 and 3 to ground [1]
contact discharge 10 +10 kV
air discharge 15 +15 kV
pins 6, 7 and 8 to ground [1]
contact discharge 8+8kV
air discharge 15 +15 kV
pins 5 and 6 to ground [1]
contact discharge 15 +15 kV
air discharge 15 +15 kV
IP4264CZ8-20-TTL
VESD electrostatic discharge
voltage all pins to ground [1]
contact discharge 15 +15 kV
air discharge 15 +15 kV
IP4264CZ8-40-TTL
VESD electrostatic discharge
voltage all pins to ground [1]
contact discharge 25 +25 kV
air discharge 25 +25 kV
IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL
VESD electrostatic discharge
voltage IEC 61000-4-2, level 4;
all pins to ground
contact discharge 8+8kV
air discharge 15 +15 kV
VIinput voltage at I/O pins 0.5 +5.5 V
Pch channel power
dissipation Tamb =70C-60mW
Ptot total power dissipation Tamb =70C-180mW
Tstg storage temperature 55 +150 C
Treflow(peak) peak reflow
temperature tp10 s - 260 C
Tamb ambient temperature 30 +85 C
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 4 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
6. Characteristics
[1] Guaranteed by design.
[2] Total line capacitance including diode capacitance, per channel.
[3] Pins 4 and 5 to ground.
Table 5. Channel resistance
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Rs(ch) channel series
resistance R1, R3 85 100 115
R2 40 47 54
Table 6. Channel characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IRM reverse leakage
current VI=3V - - 50 nA
VBR breakdown voltage Itest =1mA 6 - 10 V
IP4264CZ8-10-TTL
Cch channel capacitance f = 1 MHz [1][2]
Vbias(DC) = 0 V 8 10 12 pF
Vbias(DC) =2.5V 4 6 8 pF
Cddiode capacitance f = 1 MHz [1][3]
Vbias(DC) = 0 V 8 10 12 pF
Vbias(DC) =2.5V 4 6 8 pF
IP4264CZ8-20-TTL
Cch channel capacitance f = 1 MHz [1][2]
Vbias(DC) = 0 V - 17 20 pF
Vbias(DC) =2.5V - 11 15 pF
IP4264CZ8-40-TTL
Cch channel capacitance f = 1 MHz [1][2]
Vbias(DC) = 0 V - 35 40 pF
Vbias(DC) = 2.5 V - 23 28 pF
IP4264CZ8-20-TTL and IP4264CZ8-40-TTL
Cddiode capacitance f = 1 MHz [3]
Vbias(DC) =0V 12 16 20 pF
Vbias(DC) =2.5V 8 11 14 pF
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 5 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
7. Application information
7.1 Insertion loss
The devices are designed as EMI/Radio Frequency Interference (RFI) filters for SIM card
interfaces. The setup for measuring return loss is shown in Figure 1.
The insertion loss in a 50 system for all three channels of
IP4264CZ8-10-TTL (Cch = 10 pF) is shown in Figure 2. The same measurements for
IP4264CZ8-20-TTL (C ch = 20 pF) are shown in Figure 3. The insertion loss for
IP4264CZ8-40-TTL (C ch = 10 pF) is shown in Figure 4.
Cch =10pF
(1) Pin 2 to 7
(2) Pin 1 to 8
(3) Pin 3 to 6
Fig 1. Frequency response setup Fig 2. IP4264CZ8-10-TTL: Frequency response
curves
018aaa016
50 Ω
Vgen
50 Ω
DUT OUTIN
TEST BOARD
018aaa145
–20
–30
–10
0
S21
(dB)
–40
f (MHz)
10–1 104
103
110
2
10
(1)
(2)
(3)
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 6 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
Cch =20pF
(1) Pin 2 to 7
(2) Pin 1 to 8
(3) Pin 3 to 6
Cch =40pF
(1) Pin 2 to 7
(2) Pin 1 to 8
(3) Pin 3 to 6
Fig 3. IP4264CZ8-20-TTL: Frequency response
curves Fig 4. IP4264CZ8-40-TTL: Fre qu ency response
curves
018aaa017
−20
−30
−10
0
S21
(dB)
−40
f (MHz)
10−1104
103
110
2
10
(1)
(2)
(3)
018aaa018
−20
−30
−10
0
S21
(dB)
−40
f (MHz)
10−1104
103
110
2
10
(1)
(2)
(3)
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 7 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
7.2 Crosstalk
The setup for mea su rin g cro ss talk betwee n ch an ne ls in a 50 system is shown in
Figure 5. The crosstalk for IP4264CZ8-10-TTL is shown in Figure 6, for
IP4264CZ8-20-TTL in Figure 7 and for IP4264CZ8-40-TTL in Figure 8. Unused channels
are terminated with a 50 resistor to ground.
The crosstalk between any pin and pin 4 and pin 5 is similar to the crosstalk between the
channels.
Cch =10pF
(1) Pin 1 to 7
(2) Pin 2 to 6
(3) Pin 3 to 8
Fig 5. Crosstalk measurement setup Fig 6. IP4264CZ8-10-TTL: Crosstalk behavior
018aaa019
50 Ω
Vgen
50 Ω
DUT OUT2IN1
TEST BOARD
50 Ω
OUT1
50 Ω
IN2
018aaa146
–60
–30
0
S21
(dB)
–90
f (MHz)
10–1 104
103
110
2
10
(1)
(2)(3)
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 8 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
Cch =20pF
(1) Pin 1 to 7
(2) Pin 2 to 6
(3) Pin 3 to 8
Cch =40pF
(1) Pin 1 to 7
(2) Pin 2 to 6
(3) Pin 3 to 8
Fig 7. IP4264CZ8-20-TTL: Cros stalk behavior Fig 8. IP4264CZ8-40-TTL: Crosstalk behavior
018aaa020
−60
−40
−80
−20
0
S21
(dB)
−100
f (MHz)
10−1104
103
110
2
10
(1)
(2)
(3)
018aaa021
−60
−40
−80
−20
0
S21
(dB)
−100
f (MHz)
10−1104
103
110
2
10
(1)
(2)
(3)
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 9 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
7.3 USIM and SIM interface application schematic
The application schematic diagram depicted in Figure 9 demonstrates how the three
NXP SIM card EMI filter and ESD protection devices are used in a typical USIM interface
application.
For example, in case a standard SIM interface without USB 1.1 is used, the two single
diodes (pins 4 and 5) can protect the VSIM line.
It is only one example depende nt on la yout con straint s. For example, cha nnels 1 to 8 can
be swapped with channels 3 to 6.
Also, the USB interface ESD pr otection pins 4 and 5 can be exchanged. Due to both sides
of the devices containing identical protection diodes, ba seband an d SIM card side can be
swapped, too (pin 1 with pin 8, pin 2 with pin 7 etc.).
A standard SIM interface application is depicted in Figure 10. In this case, both
ESD protection diodes (pins 1 and 8) are used to protect VSIM.
Fig 9. USIM application schematic
6
7
8
5
1
2
3
BASEBAND
VSIM
RST
CLK
CENTER GROUND PAD
SIM CARD
4
D+
D–
USB
VSIM
protection
diode
I/O
R3
100 Ω
R2
R1
100 Ω
47 Ω
018aaa147
VCC GND
RST SPU
AUX 1 AUX 2
CLK I/O
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 10 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
7.4 Compatible devices in WLCSP
The IP4264CZ8-10-TTL and IP4264CZ8-20-TTL are optimized for SIM and USIM
interfaces. Comparab le de vic es ar e also av aila ble in WLCSP:
•IP4064CX8, 0.5 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL
•IP4364CX8, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL
•IP4366CX8/P, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-10-TTL
•IP4365CX11/P, 0.4 mm pitch USIM interface device compatible with
IP4264CZ8-10-TTL
Fig 10. SIM application schematic
6
7
8
5
1
2
3
CENTER GROUND PAD
SIM CARD
4
BASEBAND
VSIM
RST
CLK
I/O
R3
100 Ω
R2
R1
100 Ω
47 Ω
018aaa148
VCC GND
RST SPU
AUX 1 AUX 2
CLK I/O
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 11 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
8. Package outline
Fig 11. Package outline SOT1166-1 (HUSON8)
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 12 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
9. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
IP4264CZ8-10_20_40-TTL v.2 20111012 Product data sheet - IP4264CZ8-10_20_40-TTL v.1
Modifications: •Figure 2: corrected title
•Section 10 “Legal information”: updated
IP4264CZ8-10_20_40-TTL v.1 20110708 Product data sheet - -
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 13 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
10.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development .
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 12 October 2011 14 of 15
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 October 2011
Document identifier : I P42 64CZ8-10_20_4 0-TTL
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 5
7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.2 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.3 USIM and SIM interface application
schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.4 Compatible devices in WLCSP. . . . . . . . . . . . 10
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11 Contact information. . . . . . . . . . . . . . . . . . . . . 14
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15