PC3H71xNIP1H Series PC3H71xNIP1H Series Description PC3H71xNIP1H Series contains a IRED optically coupled to a phototransistor. It is packaged in a 4-pin mini-flat, half pitch type. Input-output isolation voltage(rms) is 2.5kV. Collector-emitter voltage is 80V, CTR is 100% to 700%(at IF=0.5mA,VCE=5V,Ta=25) and CMR is MIN.10kV/s. Features 1. 4-pin Mini-flat Half pitch package (Lead pitch : 1.27mm) 2. Double transf er m old package (Ideal for F l ow Soldering) 3. Low input current type (IF=0.5mA) 4. High collector-emitter voltage (VCEO : 80V) 5. High noise immunity due to high common mode rejection voltage (CMR : MIN. 10kV/s) 6. Isolation voltage between input and output (Viso(rms) : 2.5kV) Mini-flat Half Pitch Package High CMR, Low Input Current Photocoupler Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC3H71) 2.Package resin : UL flammability grade (94V-0) Applications 1. Programmable controllers 2. Facsimiles 3. Telephones 7. RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: OP18011EN 1 Date Jan. 15. 2018 (c) SHARP Corporation PC3H71xNIP1H Series Internal Connection Diagram 1 4 2 3 1 2 3 4 Anode Cathode Emitter Collector Outline Dimensions (Unit : mm) *( ): Reference dimensions Product mass : approx. 0.05g Sheet No.: OP18011EN 2 PC3H71xNIP1H Series Date code indication (Ex.) 3-digit number shall be marked the age indication of 1-digit number, and week code of 2-digit number. Week code "01" indicate the week including the first Thursday of January. And later, Monday is the starting point. Year Week Date code 652 701 702 703 752 751 752 801 MON 12/26 1/2 1/9 1/16 12/11 12/18 12/25 1/1 TUE 12/27 1/3 1/10 1/17 12/12 12/19 12/26 1/2 WED 12/28 1/4 1/11 1/18 12/13 12/20 12/27 1/3 THU 12/29 1/5 1/12 1/19 12/14 12/21 12/28 1/4 FRI 12/30 1/6 1/13 1/20 12/15 12/22 12/29 1/5 SAT 12/31 1/7 1/14 1/21 12/16 12/23 12/30 1/6 SUN 1/1 1/8 1/15 1/22 12/17 12/24 12/31 1/7 Country of origin and Plating material Country of origin Japan Plating material SnBi (Bi : 14%) Rank mark Refer to the Model Line-up table. Sheet No.: OP18011EN 3 PC3H71xNIP1H Series Absolute Maximum Ratings Output Input Parameter Forward current *1 Peak forward current Reverse voltage Power dissipation Collector-emittervoltage Emitter-collectorvoltage Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature *2 Isolation voltage *3 Soldering temperature Symbol IF IFM VR P VCEO VECO IC PC Ptot Topr Tstg Viso (rms) Tsol (Ta25C) Rating 10 200 6 15 80 6 50 150 170 30 to 100 40 to 125 2.5 260 Unit mA mA V mW V V mA mW mW C C kV C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Parameter Forward voltage Reverse current Terminal capacitance Dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance Risetime Response time Falltime Common mode rejection ratio Symbol VF IR Ct ICEO BVCEO BVECO IC VCE (sat) RISO Cf tr tf Conditions IF5mA VR4V V0, f1kHz VCE50V, IF0 IC0.1mA, IF0 IE10A, IF0 IF0.5mA, VCE5V IF10mA, IC1mA DC500V, 40 to 60%RH V0, f1MHz VCE2V, IC2mA, RL100 Ta25C, RL470, VCM1.5kV(peak) IF0, VCC9V, Vnp100mV CMR (Ta25C) MAX. Unit V 1.4 A 10 250 pF 100 nA V V 3.5 mA V 0.2 1.0 pF s 18 MIN. 80 6 0.5 51010 TYP. 1.2 30 11011 0.6 4 3 18 s 10 kV/s Sheet No.: OP18011EN 4 PC3H71xNIP1H Series Model Line-up Taping 3,500pcs/reel PC3H710NIP1H PC3H711NIP1H Model No. PC3H712NIP1H Package Rank mark IC [mA] (IF0.5mA, VCE5V,Ta25C) with or "_" A B 0.5 to 3.5 0.7 to 1.75 1.0 to 2.5 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: OP18011EN 5 PC3H71xNIP1H Series Fig.1 Forward Current vs. Ambient Temperature Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.3 Collector Power Dissipation vs. Ambient Temperature Fig.4 Total Power Dissipation vs. Ambient Temperature Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Forward Current vs. Forward Voltage Sheet No.: OP18011EN 6 PC3H71xNIP1H Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature Fig.11 Collector Dark Current vs. Ambient Temperature Fig.12 Collector-emitter Saturation Voltage vs. Forward Current Sheet No.: OP18011EN 7 PC3H71xNIP1H Series Fig.13 Response Time vs. Load Resistance (Saturation region) Fig.15 Frequency Response Fig.14 Test Circuit for Response Time Fig.16 Test Circuit for Frequency Response Fig.17 Test Circuit for Common Mode Rejection Voltage Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: OP18011EN 8 PC3H71xNIP1H Series Design Considerations Design guide While operating at IF<0.5mA, CTR variation may increase. Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through IRED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of IRED. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) 0.8 1.27 6.3 1.5 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: OP18011EN 9 PC3H71xNIP1H Series Manufacturing Guidelines Soldering Method Reflow Soldering : Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak (package surface : 250C peak) 200 Reflow 220C or m ore, 60s or less Preheat 100 0 150 to 180C, 120s or less 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270 and within 10s. Preheating is within the bounds of 100 to 150 and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400. Please don't solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: OP18011EN 10 PC3H71xNIP1H Series Cleaning instructions Solvent cleaning : Solvent temperature should be 45C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. (1) The RoHS directive(2011/65/EU) This product complies with the RoHS directive(2011/65/EU) Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls PBBand polybrominated diphenyl ethersPBDE (2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : ). Marking Styles for the Names and Contents of the Hazardous Substances Hazardous Substances Category Photocoupler Lead Mercury Cadmium (Pb) (Hg) (Cd) Hexavalent chromium Polybrominated biphenyls Polybrominated diphenyl ethers (Cr6+) (PBB) (PBDE) This table is prepared in accordance with the provisions of SJ/T 11364. Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572. Sheet No.: OP18011EN 11 PC3H71xNIP1H Series Package specification Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List (Unit : mm) A 16.00.3 H 7.550.1 B 7.50.1 I 0.3 C 1.750.1 J 2.30.1 D 4.00.1 K 2.850.1 E 2.00.1 L 1.550.1 F 4.00.1 G 1.50.1 0.0 Reel structure and Dimensions Dimensions List a 3302.0 e 21.0 b 17.51.0 f 2.00.5 (Unit : mm) c d 1.0 100.0 13.00.2 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 3,500pcs/reel] Sheet No.: OP18011EN 12 PC3H71xNIP1H Series Important Notices *The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: *Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). *If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. *Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i)The devices in this publication are designed for use in general electronic equipment designs such as: *This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visualequipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection *Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: OP18011EN [E190] 13