PC3H711NIP1H - SHARP - Datasheet.Directory

Applications

1. Programmablecontrollers

2. Facsimiles

3. Telephones

Mini-flat Half Pitch Package

High CMR, Low Input Current

Photocoupler

Description

PC3H71xNIP1H Series contains a IRED optically

coupled to a phototransistor.

It is packaged in a 4-pin mini-flat, half pitch type.

Input-output isolation voltage(rms) is 2.5kV.

Collector-emitter voltage is 80V, CTR is 100% to

700%(at IF=0.5mA,VCE=5V,Ta=25℃) and CMR is

MIN.10kV/s.

Features

1. 4-pin Mini-flat Half pitch package

(Lead pitch : 1.27mm)

2. Double transf er mold package

(Ideal for F l ow Soldering)

3. Low input current type (IF=0.5mA)

4. High collector-emitter voltage (VCEO : 80V)

5. High noise immunity due to high common mode

rejection voltage (CMR : MIN. 10kV/s)

6. Isolation voltage between input and output

(Viso(rms) : 2.5kV)

7. RoHS directive compliant

1Sheet No.: OP18011EN

Date Jan. 15. 2018

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

PC3H71xNIP1H

Series

PC3H71xNIP1H Series

Agency approvals/Compliance

1. Recognized by UL1577 (Double protection isolation),

file No. E64380 (as model No. PC3H71)

2.Package resin : UL flammability grade (94V-0)

11Anode

2Cathode

3Emitter

4Collector

■Outline Dimensions (Unit : mm)

■Internal Connection Diagram

Sheet No.: OP18011EN

*( ): Reference dimensions

Product mass : approx. 0.05g

PC3H71xNIP1H Series

Sheet No.: OP18011EN

PC3H71xNIP1H Series

Date code MON TUE WED THU FRI SAT SUN

652 12/26 12/27 12/28 12/29 12/30 12/31 1/1

701 1/2 1/3 1/4 1/5 1/6 1/7 1/8

702 1/9 1/10 1/11 1/12 1/13 1/14 1/15

703 1/16 1/17 1/18 1/19 1/20 1/21 1/22

・・・・・・・・

752 12/11 12/12 12/13 12/14 12/15 12/16 12/17

751 12/18 12/19 12/20 12/21 12/22 12/23 12/24

752 12/25 12/26 12/27 12/28 12/29 12/30 12/31

801 1/1 1/2 1/3 1/4 1/5 1/6 1/7

Year Week

Date code indication (Ex.)

3-digit number shall be marked the age indication of 1-digit number, and week code of 2-digit number.

Week code “01” indicate the week including the first Thursday of January. And later, Monday is the starting

point.

Rank mark

Refer to the Model Line-uptable.

Country of origin and Plating material

Country of origin Plating material

Japan SnBi (Bi : 1～4%)

■Electro-optical Characteristics (Ta25˚C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input

Forward voltage VFIF5mA 1.2 1.4 V

Reverse current IRVR4V   10 A

Terminal capacitance CtV0, f1kHz 30 250 pF

Output

Dark current ICEO VCE50V, IF0  100 nA

Collector-emitter breakdown voltage BVCEO IC0.1mA, IF0 80   V

Emitter-collector breakdown voltage BVECO IE10A, IF0 6   V

Transfer

charac-

teristics

Collector current ICIF0.5mA, VCE5V 0.5 3.5 mA

Collector-emitter saturation voltage VCE (sat) IF10mA, IC1mA 0.2 V

Isolation resistance RISO DC500V, 40 to 60%RH 51010 11011  

Floating capacitance CfV0, f1MHz 0.6 1.0 pF

Response time Risetime trVCE2V, IC2mA, RL1004 18 s

Falltime tf3 18 s

Common mode rejection ratio CMR Ta25˚C, RL470,

VCM1.5kV(peak) IF0,

VCC9V, Vnp100mV

10   kV/s

■Absolute Maximum Ratings (Ta25˚C)

*1 Pulse width100s, Duty ratio : 0.001

*2 40 to 60%RH, AC for 1 minute, f=60Hz

*3 For 10s

Parameter Symbol Rating Unit

Input

Forward current IF10 mA

Peak forward current IFM 200 mA

Reverse voltage VR6 V

Power dissipation P 15 mW

Output

Collector-emittervoltage VCEO 80 V

Emitter-collectorvoltage VECO 6 V

Collector current IC50 mA

Collector power dissipation PC150 mW

Total power dissipation Ptot 170 mW

Operating temperature Topr 30 to 100 ˚C

Storage temperature Tstg 40 to 125 ˚C

*2 Isolation voltage Viso (rms) 2.5 kV

*3 Soldering temperature Tsol 260 ˚C

Sheet No.: OP18011EN

PC3H71xNIP1H Series

Package Taping Rank mark IC [mA]

(IF0.5mA, VCE5V,Ta25˚C)

3,500pcs/reel

Model No.

PC3H710NIP1H with or “_” 0.5 to 3.5

PC3H711NIP1H A 0.7 to 1.75

PC3H712NIP1H B 1.0 to 2.5

Please contact a local SHARP sales representative to inquire about production status.

Sheet No.: OP18011EN

Model Line-up

PC3H71xNIP1H Series

Fig.4 Total Power Dissipation vs. Ambient

Temperature

Fig.1 Forward Current vs. Ambient

Temperature

Fig.2 Diode Power Dissipation vs. Ambient

Temperature

Fig.3 Collector Power Dissipation vs.

Ambient Temperature

Sheet No.: OP18011EN

Fig.6 Forward Current vs. Forward Voltage

Fig.5 Peak Forward Current vs. Duty Ratio

PC3H71xNIP1H Series

Fig.9 Relative Current Transfer Ratio vs.

Ambient Temperature

Fig.10 Collector - emitter Saturation Voltage

vs. Ambient Temperature

Fig.8 Collector Current vs. Collector-emitter

Voltage

Fig.7 Current Transfer Ratio vs. Forward

Current

Sheet No.: OP18011EN

Fig.11 Collector Dark Current vs.

Ambient Temperature

Fig.12 Collector-emitter Saturation Voltage vs.

Forward Current

PC3H71xNIP1H Series

Fig.14 Test Circuit for Response Time

Fig.13 Response Time vs. Load Resistance

(Saturation region)

Sheet No.: OP18011EN

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

Fig.15 Frequency Response Fig.16 Test Circuit for Frequency Response

Fig.17 Test Circuit for Common Mode Rejection Voltage

PC3H71xNIP1H Series

✩For additional design assistance, please review our corresponding Optoelectronic Application Notes.

Sheet No.: OP18011EN

1.27

0.8

1.5

(Unit : mm)

●Recommended Foot Print (reference)

6.3

PC3H71xNIP1H Series

Design Considerations

●Design guide

This product is not designed against irradiation and incorporates non-coherent IRED.

●Degradation

In general, the emission of the IRED used in photocouplers will degrade over time.

In the case of long term operation, please take the general IRED degradation (50% degradation over 5

years) into the design consideration.

While operating at IF<0.5mA, CTR variation may increase.

Please make design considering this fact.

In case that some sudden big noise caused by voltage variation is provided between primary and secondary

terminals of photocoupler some current caused by it is floating capacitance may be generated and result in

false operation since current may go through IRED or current may change.

If the photocoupler may be used under the circumstances where noise will be generated we recommend to

use the bypass capacitors at the both ends of IRED.

Sheet No.: OP18011EN

PC3H71xNIP1H Series

Manufacturing Guidelines

●Soldering Method

Reflow Soldering :

Reflow soldering should follow the temperature profile shown below.

Soldering should not exceed the curve of temperature profile and time.

Please don't solder more thantwice.

(˚C)

Flow Soldering :

Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-

low listed guidelines.

Flow soldering should be completed below 270℃ and within 10s.

Preheating is within the bounds of 100 to 150℃ and 30 to 80s.

Please don't solder more than twice.

Hand soldering

Hand soldering should be completed within 3s when the point of solder iron is below 400℃.

Please don't solder more than twice.

Other notice

Please test the soldering method in actual condition and make sure the soldering works fine, since the im-

pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.

1 2 3 4

300

200

100

Terminal : 260˚C peak

(package surface : 250˚C peak)

Preheat

150 to 180˚C, 120s or less

Reflow

220˚C or more, 60s or less

(min)

Sheet No.: OP18011EN

PC3H71xNIP1H Series

●Cleaninginstructions

Solvent cleaning :

Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.

Ultrasonic cleaning :

The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,

size of PCB and mounting method of the device.

Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of

mass production.

Recommended solvent materials :

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.

In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-

tual using conditions since some materials may erode the packagingresin.

●Presence of ODC

This product shall not contain the following materials.

And they are not used in the production process for this product.

Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.

(1) The RoHS directive(2011/65/EU)

This product complies with the RoHS directive(2011/65/EU)

Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls

（PBB）and polybrominated diphenyl ethers（PBDE）

(2) Content of six substances specified in Management Methods for Control of Pollution Caused

by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).

This table is prepared in accordance with the provisions of SJ/T 11364.

○：Indicates that said hazardous substance contained in all of the homogeneous materials

for this part is below the limit requirement of GB/T 26572.

Category

Hazardous Substances

Lead

(Pb)

Mercury

(Hg)

Cadmium

(Cd)

Hexavalent

chromium

(Cr6+)

Polybrominated

biphenyls

(PBB)

Polybrominated

diphenyl ethers

(PBDE)

Photocoupler ○○○ ○ ○ ○

Marking Styles for the Names and Contents of the Hazardous Substances

[Packing : 3,500pcs/reel]

Sheet No.: OP18011EN

PC3H71xNIP1H Series

Package specification

●Tape and Reel package

Package materials

Carrier tape : PS

Cover tape : PET (three layer system)

Reel : PS

Carrier tape structure and Dimensions

A B C D E F G

16.00.3 7.50.1 1.750.1 4.00.1 2.00.1 4.00.1 1.50.1

0.0

H I J K L

7.550.1 0.3 2.30.1 2.850.1 1.550.1

Dimensions List (Unit : mm)

Pull-out direction

Direction of product insertion

Reel structure and Dimensions

a b c d

3302.0 17.51.0 100.01.0 13.00.2

e f g

21.0 2.00.5 2.00.5

Dimensions List (Unit : mm)

[E190] Sheet No.: OP18011EN

PC3H71xNIP1H Series

■Important Notices

·The circuit application examples in this publication

are provided to explain representative applications of

SHARP devices and are not intended to guarantee any

circuit design or license any intellectual property rights.

SHARP takes no responsibility for any problems related

to any intellectual property right of a third party resulting

from the use of SHARP's devices.

·Contact SHARP in order to obtain the latest device

specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the

specifications, characteristics, data, materials, structure,

and other contents described herein at any time

without notice in order to improve design or reliability.

Manufacturing locations are also subject to change

without notice.

·Observe the following points when using any devices

in this publication. SHARP takes no responsibility for

damage caused by improper use of the devices which

does not meet the conditions and absolute maximum

ratings to be used specified in the relevant specification

sheet nor meet the following conditions:

(i)The devices in this publication are designed for use in

general electronic equipment designs such as:

--- Personal computers

--- Office automationequipment

--- Telecommunication equipment [terminal]

--- Test and measurement equipment

--- Industrial control

--- Audio visualequipment

--- Consumer electronics

(ii)Measures such as fail-safe function and redundant

design should be taken to ensure reliability and safety

when SHARP devices are used for or in connection

with equipment that requires higher reliability such as:

--- Transportation control and safety equipment (i.e.,

aircraft, trains, automobiles,etc.)

--- Trafficsignals

--- Gas leakage sensor breakers

--- Alarmequipment

--- Various safety devices,etc.

(iii) SHARP devices shall not be used for or in

connection with equipment that requires an extremely

high level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment [trunk lines]

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.,

scuba).

·If the SHARP devices listed in this publication fall

within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Law of Japan, it

is necessary to obtain approval to export such SHARP

devices.

·This publication is the proprietary product of SHARP

the copyright laws, no part of this publication may be

reproduced or transmitted in any form or by any means,

electronic or mechanical, for any purpose, in whole or in

part, without the express written permission of SHARP.

Express written permission is also required before any

use of this publication may be made by a third party.

·Contact and consult with a SHARP representative if

there are any questions about the contents of this

publication.