November 2006 i
© 2006 Actel Corporation See the Actel website for the latest version of the datasheet.
HiRel SX-A Family FPGAs
Features and Benefits
Leading Edge Performance
• 215 MHz System Performance (Military Temperature)
• 5.3 ns Clock-to-Out (Pin-to-Pin) (Military Temperature)
• 240 MHz Internal Performance (Military Temperature)
Specifications
• 48,000 to 108,000 Available System Gates
• Up to 228 User-Programmable I/O Pins
• Up to 2,012 Dedicated Flip-Flops
• 0.25/0.22 µ CMOS Process Technology
Features
• Hot-Swap Compliant I/Os
• Power-Up/Down Friendly (no sequencing required
for supply voltages)
• Class B Level Devices
• Three Standard Hermetic Package Options
Product Profile
• Actel Secure Programming Technology with
FuseLock™ Prevents Reverse Engineering and Design
Theft
• Cold-Sparing Capability
• Individual Output Slew Rate Control
• QML Certified Devices
• 100% Military Temperature Tested (–55°C to +125°C)
• 33 MHz PCI Compliant
• CPLD and FPGA Integration
• Single-Chip Solution
• Configurable I/O Support for 3.3 V/5 V PCI, LVTTL,
and TTL
• Configurable Weak Resistor Pull-Up or Pull-Down for
Tristated Outputs during Power-Up
• Up to 100% Resource Utilization and 100% Pin
Locking
• 2.5 V, 3.3 V, and 5 V Mixed Voltage Operation with
5 V Input Tolerance and 5 V Drive Strength
• Very Low Power Consumption
• Deterministic, User-Controllable Timing
• Unique In-System Diagnostic and Verification
Capability with Silicon Explorer II
• Boundary-Scan Testing in Compliance with IEEE
1149.1 (JTAG)
Device A54SX32A A54SX72A
Capacity
Typ ica l Gates
System Gates
32,000
48,000
72,000
108,000
Logic Modules
Combinatorial Cells
2,880
1,800
6,036
4,024
Register Cells
Dedicated Flip-Flops
Maximum Flip-Flops
1,080
1,980
2,012
4,024
Maximum User I/Os 228 213
Global Clocks 33
Quadrant Clocks 04
Boundary-Scan Testing Yes Yes
3.3 V / 5 V PCI Yes Yes
Clock-to-Out 5.3 ns 6.7 ns
Input Set-Up (External) 0 ns 0 ns
Speed Grades Std, –1 Std, –1
Package (by Pin Count)
CQFP 84, 208, 256 208, 256
v2.0
HiRel SX-A Family FPGAs
ii v2.0
Ordering Information
Ceramic Device Resources
Figure 1 • HiRel SX-A Family Ordering Information
Part Number
A54SX32A = 48,000 System Gates
A54SX72A = 108,000 System Gates
Speed Grade
Blank = Standard Speed
1 = Approximately 15% Faster than Standard
Package Type
CQ = Ceramic Quad Flat Pack
Package Lead Count
Application (Ambient Temperature Range)
M = Military (–55 to +125°C)
B = MIL-STD-883 Class B
A54SX32A 1CQ M
–208
Device
User I/Os (including clock buffers)
CQFP 84-Pin CQFP 208-Pin CQFP 256-Pin
A54SX32A 62 174 228
A54SX72A – 171 213
Note: Package Definitions: CQFP = Ceramic Quad Flat Pack
HiRel SX-A Family FPGAs
v2.0 iii
Actel MIL-STD-883 Product Flow
Step Screen 883 Method
883 – Class B
Requirement
1. Internal Visual 2010, Test Condition B 100%
2. Temperature Cycling 1010, Test Condition C 100%
3. Constant Acceleration 2001, Test Condition D, Y1, Orientation Only 100%
4. Seal
a. Fine
b. Gross
1014
100%
100%
5. Visual Inspection 2009 100%
6. Pre-Burn-In Electrical Parameters In accordance with applicable Actel device specification 100%
7. Burn-In Test 1015, Condition D, 160 hours @ 125°C or 80 hours @ 150°C 100%
8. Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Actel device specification 100%
9. Percent Defective Allowable 5% All Lots
10. Final Electrical Test
a. Static Tests
(1) 25°C (Subgroup 1, Table I)
(2) –55°C and +125°C
(Subgroups 2 and 3, Table I)
b. Functional Tests
(1) 25°C (Subgroup 7, Table I)
(2) –55°C and +125°C
(Subgroups 8A and 8B, Table I)
c. Switching Tests at 25°C
(Subgroup 9, Table I)
In accordance with applicable Actel device specification,
which includes a, b, and c:
5005
5005
5005
5005
5005
100%
100%
100%
11. External Visual 2009 100%
iv v2.0
Table of Contents
HiRel SX-A Family FPGAs
General Description
QML Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
HiRel SX-A Family Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Detailed Specifications
2.5 V/3.3 V/5 V Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
5 V PCI Compliance for the HiRel SX-A Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
3.3 V PCI Compliance for the HiRel SX-A Family . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
HiRel SX-A Timing Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-31
Package Pin Assignments
84-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
256-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
International Traffic in Arms Regulations (ITAR) and Export Administration
Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
HiRel SX-A Family FPGAs
v2.0 1-1
General Description
The HiRel versions of Actel SX-A family FPGAs offer
advantages for commercial applications and all types of
military and high reliability equipment.
The HiRel versions are fully pin compatible, allowing
designs to migrate across different applications that do
not have radiation requirements. Additionally, the HiRel
devices can be used as a lower cost prototyping tool for
RadTolerant (RT) designs. This datasheet discusses HiRel
SX-A products. Refer to the Actel website for more
information concerning RadTolerant products.
The programmable architecture of these devices offers
high performance, design flexibility, and fast and
inexpensive prototyping, all without the expense of test
vectors, NRE charges, long lead times, and schedule and
cost penalties for design modifications that are often
required by ASIC devices.
QML Certification
Actel has achieved full QML certification, demonstrating
that quality management, procedures, processes, and
controls are in place and comply with MIL-PRF-38535, the
performance specification used by the Department of
Defense for monolithic integrated circuits.
QML
certification
is an example of the Actel commitment to supplying the
highest quality products for all types of high reliability,
military, and space applications.
Many suppliers of microelectronics components have
implemented QML as their primary worldwide business
system. Appropriate use of this system not only helps in
the implementation of advanced technologies, but also
allows for quality, reliable, and cost-effective logistics
support throughout the life cycles of QML products.
HiRel SX-A Family Architecture
The HiRel SX-A family architecture was designed to
satisfy next-generation performance and integration
requirements for production volume designs in a broad
range of applications.
Programmable Interconnect Element
The HiRel SX-A family incorporates either three (in HiRel
A54SX32A) or four (in HiRel A54SX72A) layers of metal
interconnect and provides efficient use of silicon by
locating the routing interconnect resources between the
top two metal layers (Figure 1-1). This completely
eliminates the channels of routing and interconnect
resources between logic modules (as implemented on
SRAM FPGAs and previous generations of antifuse
FPGAs) and enables the entire floor of the device to be
spanned with an uninterrupted grid of logic modules.
Note: HiRel A54SX72A has four layers of metal with the antifuse between Metal 3 and Metal 4. HiRel A54SX32A has three layers of metal
with antifuse between Metal 2 and Metal 3.
Figure 1-1 • HiRel SX-A Family Interconnect Elements
Silicon Substrate
Metal 4
Metal 3
Metal 2
Metal 1
Amorphous Silicon/
Dielectric Antifuse
Tungsten Plug Via
Tungsten Plug Via
Tungsten Plug Contact
Routing Tracks
HiRel SX-A Family FPGAs
1-2 v2.0
Interconnection between these logic modules is achieved
using Actel patented metal-to-metal programmable
antifuse interconnect elements, which are embedded in
the top two layers. The antifuses are normally open
circuit and, when programmed, form a permanent low-
impedance connection.
The extremely small size of these interconnect elements
gives the HiRel SX-A family abundant routing resources
and provides excellent protection against design theft.
Reverse engineering is virtually impossible because it is
extremely difficult to distinguish between programmed
and unprogrammed antifuses. Additionally, since HiRel
SX-A is a nonvolatile single-chip solution, there is no
configuration bitstream to intercept.
The HiRel SX-A interconnect elements (the antifuses and
metal tracks) also have lower capacitance and lower
resistance than those of any other device of similar
capacity, resulting in the fastest signal propagation in
the industry for the radiation tolerance offered.
Logic Module Design
The HiRel SX-A family architecture is described as a "sea-
of-modules" architecture because the entire floor of the
device is covered with a grid of logic modules with
virtually no chip area lost to interconnect elements or
routing. Actel HiRel SX-A devices provide two types of
logic modules: the register cell (R-cell) and the
combinatorial cell (C-cell).
The R-cell (Figure 1-2) contains a flip-flop featuring
asynchronous clear, asynchronous preset, and clock
enable (using the S0 and S1 lines) control signals. The
R-cell registers feature programmable clock polarity
selectable on a register-by-register basis.
This provides additional flexibility while allowing the
mapping of synthesized functions into the HiRel SX-A
FPGA. The clock source for the R-cell can be chosen from
the hardwired clock, the routed clocks, or internal logic.
The C-cell implements a range of combinatorial functions
up to five inputs (Figure 1-3). Inclusion of the DB input
and its associated inverter function increases the number
of combinatorial functions that can be implemented in a
single module from 800 options (as in previous
architectures) to more than 4,000 in the HiRel SX-A
architecture. An example of the improved flexibility
enabled by the inversion capability is the ability to
implement a three-input exclusive-OR function into a
single C-cell. This facilitates construction of 9-bit parity-
tree functions with 1.9 ns of propagation delay. At the
same time, the C-cell structure is extremely synthesis
friendly, simplifying the overall design and reducing
synthesis time.
Chip Architecture
The HiRel SX-A family chip architecture provides a
unique approach to module organization and chip
routing that delivers the best register/logic mix for a
wide variety of new and emerging applications.
Module Organization
Actel has arranged all C-cell and R-cell logic modules into
horizontal banks called clusters. There are two type of
clusters: Type 1 clusters contain two C-cells and one
R-cell, and Type 2 clusters contain one C-cell and two
R-cells.
To increase design efficiency and device performance,
Actel has further organized these modules into
SuperClusters (Figure 1-4 on page 1-3). A Type 1
SuperCluster is a two-wide grouping of Type 1 clusters. A
Figure 1-2 • R-Cell
Direct
Connect
Input
CLKA,
CLKB,
Internal Logic
HCLK
CKS CKP
CLRB
PSETB
YDQ
Routed
Data Input
S0
S1
Figure 1-3 • C-Cell
D0
D1
D2
D3
DB
A0 B0 A1 B1
Sa Sb
Y
HiRel SX-A Family FPGAs
v2.0 1-3
Type 2 SuperCluster is a two-wide group containing one
Type 1 cluster and one Type 2 cluster. HiRel SX-A devices
feature more Type 1 SuperCluster modules than Type 2
SuperCluster modules because designers typically require
significantly more combinatorial logic than flip-flops.
Routing Resources
Clusters and SuperClusters can be connected through the
use of two innovative local routing resources called
FastConnect and DirectConnect, which enable extremely
fast and predictable interconnection of modules within
clusters and SuperClusters (Figure 1-5 on page 1-4 and
Figure 1-6 on page 1-4). This routing architecture also
dramatically reduces the number of antifuses required to
complete a circuit, ensuring the highest possible
performance.
DirectConnect is a horizontal routing resource that
provides connections from a C-cell to its neighboring
R-cell in a given SuperCluster. DirectConnect uses a
hardwired signal path requiring no programmable
interconnection to achieve its fast signal propagation
time of less than 0.1 ns.
FastConnect enables horizontal routing between any
two logic modules within a single SuperCluster and
vertical routing to the SuperCluster immediately below
it. Only one programmable connection is used in a
FastConnect path, delivering a maximum pin-to-pin
propagation time of 0.3 ns.
In addition to DirectConnect and FastConnect, the
architecture makes use of two globally oriented routing
resources known as segmented routing and high-drive
routing. The Actel segmented routing structure provides
a variety of track lengths for extremely fast routing
between SuperClusters. The exact combination of track
lengths and antifuses within each path is chosen by the
100 percent automatic place-and-route software to
minimize signal propagation delays.
Figure 1-4 • Cluster Organization
Type 1 SuperCluster Type 2 SuperCluster
Cluster 1 Cluster 2 Cluster 2 Cluster 1
R-Cell C-Cell
D0
D1
D2
D3
DB
A0 B0 A1 B1
Sa Sb
Y
Direct
Connect
Input
CLKA,
CLKB,
Internal Logic
HCLK
CKS CKP
CLRB
PSETB
YDQ
Routed
Data Input
S0
S1
HiRel SX-A Family FPGAs
1-4 v2.0
Figure 1-5 • DirectConnect and FastConnect for Type 1 SuperClusters
Figure 1-6 • DirectConnect and FastConnect for Type 2 SuperClusters
Type 1 SuperClusters
Routing Segments
• Typically Two Antifuses
• Max. Five Antifuses
Fast Connect
• One Antifuse
• 0.4 ns Routing Delay
Direct Connect
• No Antifuses
• 0.1 ns Routing Delay
Type 2 SuperClusters
Routing Segments
• Typically Two Antifuses
• Max. Five Antifuses
Fast Connect
• One Antifuse
• 0.3 ns Routing Delay
Direct Connect
• No Antifuses
• 0.1 ns Routing Delay
HiRel SX-A Family FPGAs
v2.0 1-5
Clock Resources
The Actel high-drive routing structure provides up to
three clock networks (Table 1-1). The first clock, called
HCLK, is hardwired from the HCLK buffer to the clock
select MUX in each R-cell. HCLK cannot be connected to
combinatorial logic. This results in a fast propagation
path for the clock signal, enabling the 5.3 ns clock-to-out
(pad-to-pad) performance of the HiRel SX-A devices. The
hardwired clock is tuned to provide clock skew of less
than 0.3 ns worst case. If not used, this pin must be set as
LOW or HIGH on the board. It must not be left floating.
Figure 1-7 shows the clock circuit used for the HCLK.
The two routed clocks (CLKA and CLKB) are global clocks
that can be sourced from external pins or from internal
logic signals within the HiRel SX-A device. CLKA and
CLKB may be connected to sequential cells or to
combinatorial logic. If the CLKA or CLKB pins are not
used or sourced from signals, then these pins must be set
as LOW or HIGH on the board. They must not be left
floating, except in HiRel A54SX72A, where they can be
configured as regular I/Os. Figure 1-8 shows the CLKA
and CLKB circuit used in HiRel A54SX32A.
In addition, the HiRel A54SX72A device provides four
quadrant clocks (QCLKA, QCLKB, QCLKC, and QCLKD),
which can be sourced from external pins or from internal
logic signals within the device. Each of these clocks can
individually drive up to a quarter of the chip, or they can
be grouped together to drive multiple quadrants. If
QCLKs are not used as quadrant clocks, they will behave
as regular I/Os. The CLKA, CLKB, and QCLK circuits for
HiRel A54SX72A are shown in Figure 1-9. For more
information, refer to the "Pin Description" section on
page 1-31.
For more information on how to use quadrant clocks in
HiRel A54SX72A, refer to the Actel Global Clock
Networks in Actel Antifuse Devices application note.
Other Architectural Features
Technology
The Actel HiRel SX-A family is implemented in a high-
voltage twin-well CMOS using 0.25 µm design rules. The
metal-to-metal antifuse is made up of a combination of
amorphous silicon and dielectric material with barrier
metals. It also has a programmed ("on" state) resistance
of 25 Ω with a capacitance of 1.0 fF for low signal
impedance.
Performance
The combination of architectural features described
above allows HiRel SX-A devices to operate with internal
clock frequencies of 240 MHz, enabling very fast
execution of complex logic functions. Thus, the HiRel SX-A
family is an optimal platform upon which to integrate
the functionality previously contained in multiple CPLDs.
Table 1-1 • HiRel SX-A Clock Resources
HiRel
A54SX32A
HiRel
A54SX72A
Hardwired Clocks (HCLK) 11
Routed Clocks (CLKA, CLKB) 22
Quadrant Clocks (QCLKA,
QCLKB, QCLKC, QCLKD)
04
Figure 1-7 • HiRel SX-A Hardwired Load Clock Pad
Note: This does not include the clock pad for HiRel A54SX72A.
Figure 1-8 • HiRel SX-A Routed Clock Pads
HCLKBUF
Constant Load
Clock Network
CLKBUF
CLKBUFI
CLKINT
CLKINTI
Clock Network
From Internal Logic
Figure 1-9 • HiRel A54SX72A CLKA/CLKB/QCLK Pads
CLKBUF
CLKBUFI
CLKINT
CLKINTI
CLKBIBUF
CLKBIBUFI
QCLKBUF
QCLKBUFI
QCLKINT
QCLKINTI
QCLKBIBUF
QCLKBIBUFI
OE
From Internal Logic
To Internal Logic
Clock Network
From Internal Logic
HiRel SX-A Family FPGAs
1-6 v2.0
In addition, designs that previously would have required
a gate array to meet performance goals can now be
integrated into a HiRel SX-A device with dramatic
improvements in cost and time-to-market. Using timing-
driven place-and-route tools, designers can achieve
highly deterministic device performance. With HiRel SX-
A
devices, designers do not need to use complicated
performance-enhancing design techniques, such as
redundant logic to reduce fanout on critical nets or the
instantiation of macros in HDL code to achieve high
performance.
I/O Modules
Each I/O on a HiRel SX-A device can be configured as an
input, an output, a tristate output, or a bidirectional pin.
Mixed I/O standards are allowed, and can be set on an
individual basis. Even without the inc
lusion of dedicated I/
O
registers, these I/Os, in combination with array registers,
can achieve clock-to-output-pad timing as fast as 4.1 ns.
In most FPGAs, I/O cells that have embedded latches and
flip-flops require instantiation in HDL code; this is a
design complication not encountered in HiRel SX-A
FPGAs. Fast pin-to-pin timing ensures the device will
have little trouble interfacing with any other device in
the system, which in turn enables parallel design of
system components and reduces overall design time. All
unused I/Os are configured as tristate outputs by the
Designer software. Each I/O module has an available
power-up resistor of approximately 50 kΩ that can
configure the I/O to a known state during power-up. Just
slightly before VCCA reaches 2.5 V, the resistors are
disabled so the I/Os will behave normally. For more
information about the power-up resistors, see the Actel
application
note
Actel SX-A and RT54SX-S Devices in Hot-
Swap and Cold-Sparing Applications
. See
Table 1-2
and
Table 1-3
for more information on I/O features.
HiRel SX-A inputs should be driven by high-speed push-
pull devices with a low resistance pull-up device. If the
input voltage is greater than VCCI and a fast push-pull
device is not used, the high-resistance pull-up of the
driver and the internal circuitry of the HiRel SX-A I/O,
may create a voltage divider. This voltage divider could
pull the input voltage below specification for some
devices connected to the driver. A logic '1' may not be
correctly presented in this case. For example, if an open
drain driver is used with a pull-up resistor to 5 V to
provide the logic '1' input, and VCCI is set to 3.3 V on the
HiRel SX-A device, the input signal may be pulled down
by the HiRel SX-A input.
Table 1-2 • I/O Features
Function Description
Two Input Buffer Threshold Selections • 5 V: PCI, TTL
• 3.3 V: PCI, LVTTL
Flexible Output Driver • 5 V: PCI, TTL
• 3.3 V: PCI, LVTTL
Output Buffer Hot-Swap Capability (3.3 V PCI is not hot-swappable)
• I/O on an unpowered device does not sink current
• Can be used for cold sparing
Selectable on an individual I/O basis
Individually selectable slew rate, high-slew or low-slew (the default is high slew rate). The slew
is only affected on the falling edge of an output. No slew is changed on the rising edge of the
output or any inputs.
Power-Up Individually selectable pull-ups and pull-downs during power-up (default is to power-up
tristate)
Enables deterministic power-up of device
VCCA and VCCI can be powered in any order
Table 1-3 • I/O Characteristics for All I/O Configurations
Hot-Swappable Slew Rate Control Power-Up Resistor Pull
TTL, LVTTL Yes Yes. Affects falling edge outputs only. Pull-up or pull-down
3.3 V PCI No No. High slew rate only. Pull-up or pull-down
5 V PCI Yes No. High slew rate only. Pull-up or pull-down
HiRel SX-A Family FPGAs
v2.0 1-7
Hot-Swapping
HiRel SX-A I/Os can be configured to be hot-swappable in
compliance with the Compact PCI Specification.
However, a 3.3 V PCI device is not hot-swappable. During
power-up/down, all I/Os are tristated. VCCA and VCCI do
not have to be stable during power-up/down. After the
HiRel SX-A device is plugged into an electrically active
system, it will not degrade the reliability of or cause
damage to the host system. The device’s output pins are
driven to a high impedance state until normal chip
operating conditions are reached. Table 1-4 summarizes
the VCCA voltage at which the I/Os behave according to
the user’s design for a HiRel SX-A device at room
temperature for various ramp-up rates. The data
reported assumes a linear ramp-up profile to 2.5 V. Refer
to the Actel application note Actel SX-A and RT54SX-S
Devices in Hot-Swap and Cold-Sparing Applications for
more information on hot-swapping.
Power Requirements
The HiRel SX-A family supports 2.5 V/3.3 V/5 V mixed-
voltage operation and is designed to tolerate 5 V inputs
for all standards except 3.3 V PCI. In PCI mode, I/Os
support 3.3 V or 5 V, and input tolerance depends on
VCCI. Refer to Table 1-8 on page 1-11 and Table 1-10 on
page 1-12 for more information. Power consumption is
extremely low due to the very short distances signals are
required to travel to complete a circuit. Power
requirements are further reduced due to the small
number of antifuses in the path and the low-resistance
properties of the antifuses. The antifuse architecture
does not require active circuitry to hold a charge (as do
SRAM or EPROM), making it the lowest-power
architecture on the market.
Boundary Scan Testing (BST)
All HiRel SX-A devices are IEEE 1149.1 compliant. HiRel
SX-A devices offer superior diagnostic and testing
capabilities by providing BST and probing capabilities.
The BST function is controlled through the special JTAG
pins (TMS, TDI, TCK, TDO, and TRST). The functionality of
the JTAG pins is defined by one of two available modes:
Dedicated and Flexible (Table 1-5). TMS cannot be
employed as a user I/O in either mode.
Configuring Diagnostic Pins
The JTAG and probe pins (TDI, TCK, TMS, TDO, PRA, and
PRB) are placed in the desired mode by selecting the
appropriate check boxes in the Variation dialog
window. This dialog window is accessible through the
Design Setup Wizard under the Tools menu in the Actel
Designer software.
If JTAG I/Os (except TMS) are not programmed as
dedicated JTAG I/Os, they can be used as regular I/Os.
TRST Pin
When the Reserve JTAG Test Reset box is checked, the
TRST pin will become a Boundary Scan Reset pin. In this
mode, the TRST pin functions as a dedicated,
asynchronous, active low input to initialize or reset the
BST circuit. An internal pull-up resistor will be enabled
automatically on the TRST pin.
The TRST pin will function as a user I/O when the
Reserve JTAG Test Reset check box is cleared. The
internal pull-up resistor will be disabled in this mode.
Dedicated Test Mode
When the Reserve JTAG box is checked in the Designer
software, the HiRel SX-A device is placed in Dedicated
Test mode, which configures the TDI, TCK, and TDO pins
for BST or in-circuit verification with Silicon Explorer II.
An internal pull-up resistor is automatically enabled on
both the TMS and TDI pins. In Dedicated Test mode, TCK,
TDI, and TDO are dedicated test pins and become
unavailable for pin assignment in the Pin Editor. The TMS
pin will function as specified in the IEEE 1149.1 (JTAG)
specification.
Table 1-4 • Power-Up Time at which I/Os Become Active
Ramp Rate 0.25 V/µs 0.025 V/µs 5 V/ms 2.5 V/ms 0.5 V/ms 0.25 V/ms 0.1 V/ms 0.025 V/ms
Units µs µs ms ms ms ms ms ms
HiRel A54SX32A 10 100 0.46 0.74 2.8 5.2 12.1 47.2
HiRel A54SX72A 10 100 0.41 0.67 2.6 5.0 12.1 47.2
Table 1-5 • Boundary Scan Pin Functionality
Program Fuse Blown
(Dedicated Test Mode)
Program Fuse Not Blown
(Flexible Mode)
TCK, TDI, TDO are dedicated
BST pins.
TCK, TDI, TDO are flexible and
may be used as I/Os.
No need for pull-up resistor for
TMS.
Use a pull-up resistor of 10 kΩ
on TMS.
HiRel SX-A Family FPGAs
1-8 v2.0
Flexible Mode
When the Reserve JTAG box is not selected, the HiRel
SX-A device is placed in flexible mode, which allows the
TDI, TCK, and TDO pins to function as user I/Os or BST
pins. In this mode, the internal pull-up resistors on the
TMS and TDI pins are disabled. An external 10 kΩ pull-up
resistor to VCCI is required on the TMS pin.
The TDI, TCK, and TDO pins are transformed from user
I/Os to BST pins when a rising edge on TCK is detected
while TMS is at logical LOW. Once the BST pins are in test
mode, they will remain in BST mode until the internal
BST state machine reaches the "logic reset" state. At this
point the BST pins will be released and will function as
regular I/O pins. The "logic reset" state is reached five
TCK cycles after the TMS pin is set to logical HIGH.
Development Tool Support
HiRel SX-A devices are fully supported by the Actel line
of FPGA development tools, including the Actel Designer
software and Actel Libero® Integrated Design
Environment (IDE). Designer software, the Actel suite of
FPGA development tools for PCs and Workstations,
includes the ACTgen Macro Builder, timing-driven place-
and-route, timing analysis tools, and fuse file generation.
Libero IDE is a design management environment that
integrates the needed design tools, streamlines the
design flow, manages all design and log files, and passes
necessary design data between tools. Libero IDE includes
Synplify®, ViewDraw®, the Actel Designer software,
ModelSim® HDL Simulator, WaveFormer Lite™, and Actel
Silicon Explorer II.
HiRel SX-A Probe Circuit Control Pins
The Silicon Explorer II tool uses the boundary scan ports
(TDI, TCK, TMS, and TDO) to select the desired nets for
verification. The selected internal nets are assigned to
the PRA/PRB pins for observation.
Figure 1-10 illustrates
the interconnection between Silicon Explorer II and the
FPGA when performing in-circuit verification. The TRST
pin is equipped with an internal pull-up resistor from the
reset state during probing. It is recommended that TRST
be left floating.
Design Considerations
Avoid using the TDI, TCK, TDO, PRA, and PRB pins as
input or bidirectional ports. Since these pins are active
during probing, critical input signals through these pins
are not available. In addition, do not program the
Security Fuse, as this disables the Probe Circuit. Actel
recommends that you use a series 70 Ω termination
resistor on every probe connector (TDI, TCK, TMS, TDO,
PRA, and PRB). The 70 Ω termination is used to prevent
data transmission corruption during probing and
reading back the checksum.
Figure 1-10 • Probe Setup
16
70 Ω
70 Ω
70 Ω
70 Ω
70 Ω
70 Ω
Serial Connection Silicon Explorer II
Additional
Channels
HiRel SX-A FPGA
TDI
TCK
TMS
TDO
PRA
PRB
HiRel SX-A Family FPGAs
v2.0 1-9
Related Documents
Application Notes
Global Clock Networks in Actel Antifuse Devices
www.actel.com/documents/GlobalClk_AN.pdf
Actel SX-A and RT54SX-S Devices in Hot-Swap and Cold-Sparing Applications
www.actel.com/documents/HotSwapColdSparing_AN.pdf
Datasheets
SX-A Family FPGAs
www.actel.com/documents/SXA_DS.pdf
HiRel SX-A Family FPGAs
1-10 v2.0
Detailed Specifications
2.5 V/3.3 V/5 V Operating Conditions
Table 1-6 • Absolute Maximum Ratings1
Symbol Parameter Limits Units
VCCI DC Supply Voltage –0.3 to +6.0 V
VCCA 2AC Supply Voltage –0.3 to +3.5 V
VCCA DC Supply Voltage –0.3 to +3.0 V
VIInput Voltage –0.5 to +6.0 V
VO 3Output Voltage –0.5 to +VCCI +0.5 V
TSTG Storage Temperature –65 to +150 °C
Notes:
1. Stresses beyond those listed under "Absolute maximum Ratings" may cause permanent damage to the device. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the
Recommended Operating Conditions.
2. The AC transient VCCA limit is for transients of less than 10 µs duration and is not intended for repetitive use. Transients must not
exceed 10 hours total duration over the lifetime of the part. Core voltage spikes from a single transient will not negatively impact
the reliability of the device if, for this nonrepetitive event, the transient does not exceed 3.5 V at any time and the time that the
transient exceeds 2.75 V does not exceed 10 µs in duration.
3. VO max for 3.3 V PCI is VCCI + 0.5 V. For other I/O standards VO max is 6.0 V.
Table 1-7 • Recommended Operating Conditions
Parameter Military Units
Temperature Range* –55 to +125 °C
VCCA 2.5 V Power Supply Range 2.25 to 2.75 V
VCCI 3.3 V Power Supply Range 3.0 to 3.6 V
VCCI 5 V Power Supply Range 4.5 to 5.5 V
Note: *Ambient temperature (TA) is used for commercial and industrial; case temperature (TC) is used for military.
HiRel SX-A Family FPGAs
v2.0 1-11
Table 1-8 • 3.3 V LVTTL and 5 V TTL Electrical Specifications
Symbol Parameter
Military
UnitsMin. Max.
VOH VDD = MIN, VI = VIH or VIL (IOH = –1 mA) 0.9VCCI V
VDD = MIN, VI = VIH or VIL (IOH = –8 mA) 2.4 V
VOL VDD = MIN, VI = VIH or VIL (IOL = 1 mA) 0.1VCCI V
VDD = MIN, VI = VIH or VIL (IOL = 12 mA) 0.4 V
VIL1Input Low Voltage 0.8 V
VIH2Input High Voltage 2.0 V
IIL/ IIH Input Leakage Current, VIN = VCCI or GND –20 +20 µA
IOZ Tristate Output Leakage Current, VOUT = VCCI or GND –20 +20 µA
tR, tFInput Transition Time tR, tF10 ns
CIO I/O Capacitance 20 10 pF
ICC Standby Current 25 mA
IV Curve3Can be derived from the IBIS model on the web
Notes:
1. For AC signals, the input signal may undershoot during transitions to –1.2 V for no longer than 11 ns. Current during the transition
must not exceed 95 mA.
2. For AC signals, the input signal may overshoot during transitions to VCCI + 1.2 V for no longer than 11 ns. Current during the
transition must not exceed 95 mA.
3. The IBIS model can be found at www.actel.com/techdocs/models/ibis.html.
4. See the SX-A Family FPGAs datasheet for more information on commercial devices.
Table 1-9 • Maximum Source and Sink Currents for All I/O Standards
I/O Standard
Max. Source Current Max. Sink Current
Min. VOH I(typ) (mA) Max. VOL I(typ) (mA)
5 V TTL 2.4 V –139 0.4 V 46
0.9VCCI –35 0.1VCCI 56
3.3 V LVTTL 2.4 V –43 0.4 V 39
0.9VCCI –18 0.1VCCI 32
5 V PCI 2.4 V –139 0.55 V 61.5
3.3 V PCI 0.9VCCI –20 0.1VCCI 38
Note: This information is derived from the IBIS model and was taken under typical conditions. The numbers do not include derating for
package resistance.
HiRel SX-A Family FPGAs
1-12 v2.0
5 V PCI Compliance for the HiRel SX-A Family
The HiRel SX-A family supports 3.3 V and 5 V PCI and is compliant with the PCI Local Bus Specification Rev. 2.1.
Figure 1-11 shows the 5 V PCI V/I curve and the minimum and maximum PCI drive characteristics of the HiRel SX-A
family.
Table 1-10 • DC Specifications, 5 V PCI Operation
Symbol Parameter Condition Min. Max. Units
VCCA Supply Voltage for Array 2.25 2.75 V
VCCI Supply Voltage for I/Os 4.5 5.5 V
VIH Input High Voltage12.0 VCCI + 0.5 V
VIL Input Low Voltage1–0.5 0.8 V
IIH Input High Leakage Current VIN = 2.7 70 µA
IIL Input Low Leakage Current VIN = 0.5 –70 µA
VOH Output High Voltage IOUT = –2 mA 2.4 V
VOL Output Low Voltage2IOUT = 3 mA, 6 mA 0.55 V
CIN Input Pin Capacitance310 pF
CCLK CLK Pin Capacitance 5 12 pF
Notes:
1. Input leakage currents include hi-Z output leakage for all bidirectional buffers with tristate outputs.
2. Signals without pull-up resistors must have 3 mA low output current. Signals requiring pull-up must have 6 mA; the latter includes
FRAME#, IRDY#, TRDY#, DEVSEL#, STOP#, SERR#, PERR#, LOCK#, and when used, AD[63:32], C/BE[7:4]#, PAR64, REQ64#, and
ACK64#.
3. Absolute maximum pin capacitance for a PCI input is 10 pF (except for CLK).
Figure 1-11 • 5 V PCI Curve for HiRel SX-A Family
–200.0
–150.0
–100.0
–50.0
0.0
50.0
100.0
150.0
200.0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Voltage Out (V)
Current (mA)
IOH
IOL
IOH MIN Spec
IOH MAX Spec
IOL MIN Spec
IOL MAX Spec
HiRel SX-A Family FPGAs
v2.0 1-13
IOH = 11.9 * (VOUT – 5.25) * (VOUT + 2.45)
for VCCI > VOUT > 3.1 V
EQ 1-1
IOL = 78.5 * VOUT * (4.4 – VOUT)
for 0 V < VOUT < 0.71 V
EQ 1-2
Table 1-11 • AC Specifications, 5 V PCI Operation
Symbol Parameter Condition Min. Max. Units
IOH(AC) Switching
Current High
0 < VOUT ≤ 1.4 1–44 mA
1.4 ≤ VOUT < 2.4 1, 2 (–44 + (VOUT – 1.4)/0.024 mA
3.1 < VOUT < VCCI 1, 3 EQ 1-1 on page 1-13
(Test Point) VOUT = 3.1 3–142 mA
IOL(AC) Switching
Current Low
VOUT ≥ 2.2 195 mA
2.2 > VOUT > 0.55 1VOUT/0.023 mA
0.71 > VOUT > 0 1, 3 EQ 1-2 on page 1-13
(Test Point) VOUT = 0.71 3206 mA
ICL Low Clamp Current –5 < VIN ≤ –1 –25 + (VIN + 1)/0.015 mA
slewROutput Rise Slew Rate 0.4 V – 2.4 V load 415V/ns
slewFOutput Fall Slew Rate 2.4 V – 0.4 V load 415V/ns
Notes:
1. Refer to the V/I curves in Figure 1-11 on page 1-12. Switching current characteristics for REQ# and GNT# are permitted to be one-
half of that specified here; i.e., half-size output drivers may be used on these signals. This specification does not apply to CLK and
RST#, which are system outputs. "Switching Current High" specifications are not relevant to SERR#, INTA#, INTB#, INTC#, or INTD#,
which are open drain outputs.
2. Note that this segment of the minimum current curve is drawn from the AC drive point directly to the DC drive point, rather than
toward the voltage rail (as is done in the pull-down curve). This difference is intended to allow for an optional N-channel pull-up.
3. Maximum current requirements must be met as drivers pull beyond the last step voltage. EQ 1-1 and EQ 1-2 define these maxima.
The equation defined maximum should be met by the design. In order to facilitate component testing, a maximum current test
point is defined for each side of the output driver.
4. This parameter is to be interpreted as the cumulative edge rate across the specified range, rather than the instantaneous rate at any
point within the transition range. The specified load (Figure 1-12) is optional; i.e., the designer may elect to meet this parameter
with an unloaded output per revision 2.0 of the PCI Local Bus Specification. However, adherence to both maximum and minimum
parameters is now required (the maximum is no longer simply a guideline). Since adherence to the maximum slew rate was not
required prior to revision 2.1 of the specification, there may be components on the market for some time yet that have faster edge
rates. Therefore, motherboard designers must bear in mind that rise and fall times faster than this specification could occur, and
they should ensure that signal integrity modeling accounts for this. Rise in slew rate does not apply to open drain outputs.
Figure 1-12 • 5 V PCI Slew Load
½" Maximum
Pin
Output
Buffer VCC
10 pF
1 kΩ1 kΩ
HiRel SX-A Family FPGAs
1-14 v2.0
3.3 V PCI Compliance for the HiRel SX-A Family
The HiRel SX-A family supports 3.3 V and 5 V PCI and is compliant with the PCI Local Bus Specification Rev. 2.1.
Figure 1-13
shows the 3.3 V PCI V-I curve and the minimum and maximum PCI drive characteristics of the HiRel SX-A
family
.
Table 1-12 • DC Specifications, 3.3 V PCI Operation
Symbol Parameter Condition Min. Max. Units
VCCA Supply Voltage for Array 2.25 2.75 V
VCCI Supply Voltage for I/Os 3.0 3.6 V
VIH Input High Voltage 0.5VCCI VCCI + 0.5 V
VIL Input Low Voltage –0.5 0.3VCCI V
IIPU Input Pull-Up Voltage10.7VCCI V
IIL Input Leakage Current20 < VIN < VCCI ±20 µA
VOH Output High Voltage IOUT = –500 µA 0.9VCCI V
VOL Output Low Voltage IOUT = 1500 µA 0.1VCCI V
CIN Input Pin Capacitance310 pF
CCLK CLK Pin Capacitance 5 12 pF
Notes:
1. This specification should be guaranteed by design. It is the minimum voltage to which pull-up resistors are calculated to pull a
floating network. Applications sensitive to static power utilization should ensure that the input buffer conducts minimal current at
this input voltage.
2. Input leakage currents include hi-Z output leakage for all bidirectional buffers with tristate outputs.
3. Absolute maximum pin capacitance for a PCI input is 10 pF (except for CLK).
Figure 1-13 • 3.3 V PCI V-I Curve for HiRel SX-A Family
–150.0
–100.0
–50.0
0.0
50.0
100.0
150.0
0 0.5 1 1.5 2 2.5 3 3.5 4
Voltage Out (V)
Current (mA)
IOH
IOL
IOH MIN Spec
IOH MAX Spec
IOL MIN Spec
IOL MAX Spec
HiRel SX-A Family FPGAs
v2.0 1-15
IOH = (98.0/VCCI) * (VOUT – VCCI) * (VOUT + 0.4VCCI)
for VCCI > VOUT > 0.7VCCI
EQ 1-3
IOL = (256/VCCI) * VOUT * (VCCI – VOUT)
for 0 V < VOUT < 0.18VCC
EQ 1-4
Table 1-13 • AC Specifications, 3.3 V PCI Operation
Symbol Parameter Condition Min. Max. Units
IOH(AC) Switching Current High 0 < VOUT ≤ 0.3VCCI 1–12VCCI mA
0.3VCCI ≤ VOUT < 0.9VCCI 1–17.1 + (VCCI – VOUT)mA
0.7VCCI < VOUT < VCCI 1, 2 EQ 1-3
(Test Point) VOUT = 0.7VCC 2–32VCCI mA
IOL(AC) Switching Current Low VCCI > VOUT ≥ 0.6VCCI 116VCCI mA
0.6VCCI > VOUT > 0.1VCCI 126.7VOUT mA
0.18VCCI > VOUT > 0 1, 2 EQ 1-4
(Test Point) VOUT = 0.18VCC 2 38VCCI mA
ICL Low Clamp Current –3 < VIN ≤ –1 –25 + (VIN + 1)/0.015 mA
ICH High Clamp Current VCCI + 4 > VIN ≥ VCCI + 1 25 + (VIN – VCCI – 1)/0.015 mA
slewROutput Rise Slew Rate 0.2VCCI to 0.6VCCI load314V/ns
slewFOutput Fall Slew Rate 0.6VCCI to 0.2VCCI load314V/ns
Notes:
1. Refer to the V-I curves in Figure 1-13 on page 1-14. Switching current characteristics for REQ# and GNT# are permitted to be one-
half of that specified here; i.e., half-size output drivers may be used on these signals. This specification does not apply to CLK and
RST#, which are system outputs. "Switching Current High" specifications are not relevant to SERR#, INTA#, INTB#, INTC#, or INTD#,
which are open drain outputs.
2. Maximum current requirements must be met as drivers pull beyond the last step voltage. EQ 1-3 and EQ 1-4 define these maxima.
The equation-defined maximum should be met by the design. To facilitate component testing, a maximum current test point is
defined for each side of the output driver.
3. This parameter is to be interpreted as the cumulative edge rate across the specified range, rather than the instantaneous rate at any
point within the transition range. The specified load (Figure 1-14) is optional; i.e., the designer may elect to meet this parameter
with an unloaded output per the latest revision of the PCI Local Bus Specification. However, adherence to both maximum and
minimum parameters is required (the maximum is no longer simply a guideline). Rise slew rate does not apply to open drain
outputs.
Figure 1-14 • 3.3 V PCI Slew Load
½" Maximum
Pin
Output
Buffer VCC
10 pF
1 kΩ1 kΩ
HiRel SX-A Family FPGAs
1-16 v2.0
Junction Temperature (TJ)
The temperature variable selected in the Designer
software refers to the junction temperature, not the
ambient temperature. This is an important distinction
because the heat generated by dynamic power
consumption usually produces a temperature hotter
than the ambient temperature. EQ 1-5 can be used to
calculate junction temperature.
Junction Temperature = ΔT + Ta
EQ 1-5
where
ΔT = θja * P
EQ 1-6
where
Package Thermal Characteristics
The device junction-to-case thermal characteristic is θjc,
and the junction-to-ambient characteristic is θja. In
Table 1-14, the values of θja are given for two different
air flow rates.
The maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power dissipation allowed for a 256-pin CQFP package at commercial
temperatures and in still air is given in EQ .
EQ 1-7
For Device Power Calculator information, see the Software Tools section on the Actel website.
Ta= Ambient temperature
ΔT= Temperature gradient between junction (silicon) and
ambient
P=Power
θja = Junction-to-ambient thermal resistance of package. θja
values are given in Tab l e 1 - 1 4 .
Table 1-14 • Sample Thermal Characteristics
Package Type Pin Count θjc θja Still Air θja 300 ft/min Units
Ceramic Quad Flat Pack (CQFP) 84 – – – °C/W
Ceramic Quad Flat Pack (CQFP) 208 6.3 22 14 °C/W
Ceramic Quad Flat Pack (CQFP) 256 6.2 20 10 °C/W
Maximum Power Allowed Max. junction temp. (°C) Max. ambient temp. (°C)–
θja(°C/W)
--------------------------------------------------------------------------------------------------------------------------------------150°C70°C–
20°C/W
------------------------------------ 4 . 0 W===
HiRel SX-A Family FPGAs
v2.0 1-17
HiRel SX-A Timing Model
Hardwired Clock
External Setup
= tINYH + tRD1 + tSUD – tHCKL
= 1.0 + 0.5 + 1.0 - 2.2 = 0.3ns
EQ 1-8
Clock-to-Out (Pin-to-Pin)
= tHCKL + tRCO + tRD1 + tDHL
= 2.2 + 1.0 + 0.5 + 4.5 = 8.2 ns
EQ 1-9
Routed Clock
External Setup
= tINYH + tRD1 + tSUD – tRCKH
= 1.0 + 0.5 + 1.0 - 3.9 = -1.4 ns
EQ 1-10
Clock-to-Out (Pin-to-Pin)
= tRCKH + tRCO + tRD1 + tDHL
= 3.9 + 1.0 + 0.5 + 4.5 = 9.9 ns
EQ 1-11
Note: *Values shown for are HiRel A54SX72A–1, worst-case military conditions for VCCI = 3.0 V.
Figure 1-15 • HiRel SX-A Timing Model
I/O Module
Input DelaysInternal DelaysPredicted
Routing
Delays
Output Delays
I/O Module
tINYH = 1.0 ns tIRD1 = 0.5 ns
tIRD2 = 0.7 ns Combinatorial
Cell
I/O Module
tDHL = 4.5 ns
tRD1 = 0.5 ns
tRD4 = 1.2 ns
tRD8 = 2.0 ns
tPD = 1.2 ns
I/O Module
tRCO = 1.0 ns
I/O Module
tINYH = 1.0 ns
tENZL = 2.9 ns
tSUD = 1.0 ns
tHD = 0.0 ns
tRCKH = 3.9 ns
(100% Load)
DQ
Register
Cell
Routed
Clock
tHCKL = 2.2 ns
DQ
Register
Cell
Hardwired
Clock
tDHL = 4.5 ns
tDHL = 4.5 ns
tENZL = 2.9 ns
tRD1 = 0.5 ns
tRD1 = 0.5 ns
tRCO = 1.0 ns
tSUD = 1.0 ns
tHD = 0.0 ns