ECCM7 Series
• RoHS Compliant (Pb-Free)
• Miniature four pad ceramic
surface mount package
• Standard frequencies up to 54.000MHz
• AT Cut
• Tape and reel available
CRYSTAL
ECCM7
MANUFACTURER CATEGORY SERIES PACKAGE CLASS REV.DATE
ECLIPTEK CORP. CRYSTAL ECCM7 CERAMIC CR38 03/09
NOTES
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ELECTRICAL SPECIFICATIONS
800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice.
H 0.8
L 3.2
W 2.5
Nominal Frequency (MHz)
12.000, 13.000, 13.560, 13.824, 14.318, 14.31818, 14.7456, 16.000, 16.384, 16.9344,
17.734475, 18.432, 19.000, 19.200, 20.000, 20.480, 22.1184, 22.5792, 24.000, 24.576,
25.000, 26.000, 27.000, 28.6363, 29.4912, 30.000, 32.000, 32.768, 33.000, 33.333,
33.8688, 34.368, 35.000, 35.328, 36.000, 36.864, 38.400, 38.880, 39.000, 40.000, 44.736,
48.000, 50.000, and 54.000MHz
Frequency Tolerance / Stability ±10ppm / ±10ppm, ±10ppm / ±15ppm, ±15ppm / ±20ppm, ±15ppm / ±30ppm,
Over Operating Temperature Range ±30ppm / ±50ppm or ±50ppm / ±50ppm
Operating Temperature Range -10°C to +60°C, -20°C to +70°C, or -30°C to +85°C
Load Capacitance (CL) 10pF Parallel Resonant
12pF Parallel Resonant
16pF Parallel Resonant
Series Resonant
Shunt Capacitance 5pF Maximum
Mode of Operation Fundamental
Crystal Cut AT-Cut
Aging (at 25°C) ±3ppm / year Maximum
Drive Level 100 µWatts Maximum
Storage Temperature Range -40°C to 85°C
Insulation Resistance 500 Megaohms Minimum at 100VDC
Spurious Response -3dB Minimum; F0 to F0 +5000ppm
Equivalent Series Resistance 100 Ohms Maximum from 12.000MHz to 18.999999MHz
80 Ohms Maximum from 19.000MHz to 29.999999MHz
60 Ohms Maximum from 30.000MHz to 54.000MHz
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
MANUFACTURER CATEGORY SERIES PACKAGE CLASS REV.DATE
ECLIPTEK CORP. CRYSTAL ECCM7 CERAMIC CR38 03/09
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
Tolerance = +0.2
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
M N O P Q
1.5 MIN 50 MIN 20.2 MIN 13±.2 40 MIN
R S T U V
QTY/REEL
2.5 MIN 10 MIN 13.0 MAX 180 MAX 8.4+1.5-0 3,000
REEL
A B C D E
8±.2 3.5±.1 2.75±.1 4 ±.1 2±.05
F G H J K L
.1 2.9±.1 1.5±.2 3.6±.1 .2 ±.05 1.0±.1
TAPE
*Compliant to EIA-481A
PACKAGING OPTIONS
Blank=Bulk, TR=Tape and Reel
FREQUENCY
PART NUMBERING GUIDE
ECCM7 A A 16 - 32.000M TR
LOAD CAPACITANCE
10=10pF Parallel Resonant
12=12pF Parallel Resonant
16=16PF Parallel Resonant
S=Series Resonant
MODE OF OPERATION
A=Fundamental
FREQUENCY TOLERANCE/STABILITY
A=±50ppm at 25°C, ±50ppm over -10°C to +60°C
B=±50ppm at 25°C, ±50ppm over -20°C to +70°C
D=±30ppm at 25°C, ±50ppm over -10°C to +60°C
E=±30ppm at 25°C, ±50ppm over -20°C to +70°C
F=±30ppm at 25°C, ±50ppm over -30°C to +85°C
G=±15ppm at 25°C, ±30ppm over -10°C to +60°C
H=±15ppm at 25°C, ±30ppm over -20°C to +70°C
J=±15ppm at 25°C, ±30ppm over -30°C to +85°C
K=±15ppm at 25°C, ±20ppm over -10°C to +60°C
L=±15ppm at 25°C, ±20ppm over -20°C to +70°C
M=±15ppm at 25°C, ±20ppm over -30°C to +85°C
N=±10ppm at 25°C, ±15ppm over -10°C to +60°C
P=±10ppm at 25°C, ±15ppm over -20°C to +70°C
Q=±10ppm at 25°C, ±15ppm over -30°C to +85°C
R=±10ppm at 25°C, ±10ppm over -10°C to +60°C
Line 1: E XX.X
Frequency in MHz
(3 Digits Maximum + Decimal)
Line 2: XXXXX
Ecliptek Manufacturing Identifier
800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice.
3.20
±0.10
2.50
±0.10
0.80 MAX
0.70 ±0.10
1.20
±0.10
MARKING
ORIENTATION
1
2
3
4
0.90 ±0.10
(
X4
)
1.00
±0.10
(X4)
Pad 1: Input/Output
Pad 2: Cover/Ground
Pad 3: Input/Output
Pad 4: Cover/Ground
PARAMETER SPECIFICATION
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Flammability UL94-V0
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A