NUMBER
BUS-12-087
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
13 of 21 M
AUTHORIZED BY DATE
Ribcage™ II Printed Wiring Board Connector System
C. Martinez 27 Feb 07
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
3.7.7 Salt Spray - After exposure of the mated connector to a
salt fog atmosphere, the low level circuit resistance shall not exceed the value
specified in Table 1 (see paragraph 3.5.2). The test shall be in accordance with MIL-
STD-202, Method 101; the following test details shall apply:
(a) Salt solution: 5 percent by weight
(b) Test condition: B (48 hours)
3.7.8 Solderability - The minimum tail length solderable on both
the receptacle assemblies and headers shall be up to the standoffs on the respective
housings. The test shall be similar to MIL-STD-202, Method 208; the following details
shall apply:
(a) Aging: suspended 2 inches above boiling distilled water for 60 minutes.
(b) Acceptable Coverage: 95% minimum
(c) Solder: 60/40 Tin-Lead in accordance with QQ-S-571, Type S
(d) Flux: Type A, in accordance with MIL-F-14256
(e) Flux immersion time: terminal dipped and allowed to sit 60 seconds
(f) Solder dwell time: terminal held immediately above solder for 10 seconds then
immersed for 3 seconds
(g) Solder temperature: 232 +_ 5o C
(h) Number of samples: 20
3.7.9 Resistance to Soldering Heat
3.7.9.1 Wave Soldering - There shall be no evidence of
physical damage to the insulator when the unterminated connector or
header is subjected to the high temperature extreme imposed during
wave soldering. The test shall be in accordance with MIL-STD-202,
Method 210; the following details shall apply:
(a) Test condition: B (10 seconds @ 260 +_ 5o C)
(b) Immersion depth: To within 0.040 +_ 0.015 of insulator
3.7.9.2 IR Reflow - There shall be no evidence of
physical damage to the insulator when the unterminated header or
connector is subjected to a maximum of 445o F (230o C) during the
solder reflow process.
PDM: Rev:M Released .STATUS: Printed: Nov 28, 2010