TSSP77P38 www.vishay.com Vishay Semiconductors IR Detector for Mid Range Proximity Sensor FEATURES * Up to 2 m for proximity sensing * Very low supply current * Photo detector and preamplifier in one package * * * * * * Shielding against EMI Supply voltage: 2.5 V to 5.5 V Visible light is suppressed by IR filter Capable of side or top view Insensitive to supply voltage ripple and noise Two lenses for high sensitivity and wide receiving angle * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 4 3 2 1 20953 DESIGN SUPPORT TOOLS click logo to get started APPLICATIONS Models Available * Object approach detection for activation of displays and user consoles, signaling of alarms, etc. * Simple gesture controls * Differentiation of car arrival, static, car departure in parking lots * Reflective sensors for toilet flush * Navigational sensor for robotics MECHANICAL DATA Pinning: 1, 4 = GND, 2 = VS, 3 = OUT ORDERING CODE Taping: TSSP77P38TT - top view taped TSSP77P38TR - side view taped DESCRIPTION The TSSP77P38 is a compact infrared detector module for proximity sensing application. It receives 38 kHz modulated signals and has a peak sensitivity of 940 nm. The length of the detector's output pulse varies in proportion to the amount of light reflected from the object being detected. PARTS TABLE Carrier frequency 38 kHz TSSP77P38 Package Heimdall Pinning 1, 4 = GND, 2 = VS, 3 = OUT Dimensions (mm) 6.8 W x 3.0 H x 3.2 D Mounting SMD Application Proximity sensors BLOCK DIAGRAM PROXIMITY SENSING +3 V 2 33 k IR emitter VS 3 Input AGC Band pass Demodulator Envelope signal OUT 38 kHz +3 V 1, 4 PIN Control circuit Out to C GND 20445-8 Rev. 2.2, 09-Jan-2019 TSSP77P38 1 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT VS -0.3 to +6 V mA Supply voltage Supply current IS 5 Output voltage VO -0.3 to (VS + 0.3) V Output current IO 5 mA Tj 100 C Tstg -25 to +85 C Tamb -25 to +85 C Ptot 10 mW Junction temperature Storage temperature range Operating temperature range Tamb 85 C Power consumption Note * Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. VS 2.5 - 5.5 V VS = 5 V, Ee = 0 ISD 0.55 0.7 0.9 mA Ev = 40 klx, sunlight ISH - 0.8 - mA Receiving distance Direct line of sight, IR diode TSAL6200, IF = 50 mA, test signal see Fig. 1 d - 18 - m Output voltage low IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see Fig. 1 VOSL - - 100 mV Minimum irradiance Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1 Ee min. - 0.2 0.4 mW/m2 Maximum irradiance tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1 Ee max. 50 - - W/m2 Angle of half receiving distance 1/2 - 50 - deg Supply voltage Supply current Directivity UNIT TYPICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) Optical Test Signal 1.0 (IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms) tpo - Output Pulse Width (ms) Ee t t pi * T 10/f0 is recommended for optimal function * tpi VO Output Signal 1) 2) VOH 16110_4 7/f0 < td < 15/f0 tpi - 5/f0 < tpo < tpi + 6/f 0 VOL tpo 2) td 1) Input Burst Length 0.7 0.6 0.5 0.4 0.3 0.2 = 950 nm, Optical Test Signal, Fig.1 0.1 1 10 102 Ee - Irradiance Fig. 1 - Output Active Low Rev. 2.2, 09-Jan-2019 0.8 0 0.1 t Output Pulse Width 0.9 103 104 (mW/m2) Fig. 2 - Pulse Length and Sensitivity in Dark Ambient 2 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 Vishay Semiconductors 1.0 200 0.9 180 tpo - Output Pulse Width (ms) E e min./Ee - Rel. Responsivity www.vishay.com 0.8 0.7 0.6 0.5 0.4 0.3 0.2 f = f0 5 % f (3 dB) = f0/10 0.1 160 140 120 100 80 60 40 0 25 35 30 40 45 0.1 50 0.40 Correlation with Ambient Light Sources: 4.5 10 W/m2 = 1.4 kLx (Std. illum. A, T = 2855 K) 2 4.0 10 W/m = 8.2 kLx (Daylight, T = 5900 K) 0.35 Ee min. - Sensitivity (mW/m2) 5.0 3.5 Wavelength of Ambient Illumination: = 950 nm 2.5 2.0 1.5 1.0 0.5 0 0.01 0.1 1 10 10 100 Fig. 6 - Output Pulse Width vs. Irradiance Fig. 3 - Frequency Dependence of Responsivity 3.0 1 Ee - Irradiance (mW/m2) 22088 f/f0 - Relative Frequency Ee min. - Threshold Irradiance (mW/m2) Burst length = 300 ms, f = fO 20 0.0 0.30 0.25 0.20 0.15 0.10 0.05 0 -30 100 Ee - Ambient DC Irradiance (W/m2) -10 10 30 50 70 90 Tamb - Ambient Temperature (C) Fig. 7 - Sensitivity vs. Ambient Temperature Fig. 4 - Sensitivity in Bright Ambient 1.0 0.8 0.7 f = 30 kHz 0.6 0.5 f = 20 kHz 0.4 f = 10 kHz 0.3 0.2 0.1 f = 100 Hz 0 1 10 100 1000 0.8 0.7 1000 0.6 0.5 0.4 100 0.3 0.2 0.1 0 VsRMS - AC Voltage on DC Supply Voltage (mV) 750 21425 850 950 1050 10 1150 - Wavelength (nm) Fig. 8 - Relative Spectral Sensitivity vs. Wavelength Fig. 5 - Sensitivity vs. Supply Voltage Disturbances Rev. 2.2, 09-Jan-2019 10000 0.9 1st line 2nd line f = f0 0.9 2nd line S()rel. - Relative Spectral Sensitivity Ee min. - Threshold Irradiance (mW/m2) Axis Title 1.0 3 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors 7 6 1.0 5 0.8 dmax./dmin. Relative Response Distance 1.2 0.6 0.4 4 3 2 Directivity Characteristic of a Reflective Sensor using VSMB3940X01 and TSSP77P38 0.2 0 -90 -70 -50 -30 -10 1 0 10 30 50 70 10 20 30 40 50 60 70 80 90 100 110 120 90 tpi (ms) Angle () Fig. 9 - Angle Characteristic Fig. 11 - Dynamic Range of Sensor vs. tpi 800 120 Emitter: VSMB1940X01 700 100 trepeat min. (ms) 600 tpo (ms) 80 60 IF = 100 mA 40 500 400 300 200 20 IF = 10 mA 0 0.0 0.2 100 IF = 30 mA IF = 50 mA 0.4 0.6 0.8 1.0 0 1.2 0 20 40 60 80 100 120 140 160 180 tpi (ms) Response Distance (m) Fig. 10 - tpo vs. Distance Kodak Gray Card Plus 15 % Fig. 12 - Max. Rate of Bursts The typical application of the TSSP77P38 is a reflective sensor with analog information contained in its output. Such a sensor is evaluating the time required by the AGC to suppress a quasi continuous signal. The time required to suppress such a signal is longer when the signal is strong than when the signal is weak, resulting in a pulse length corresponding to the distance of an object from the sensor. This kind of analog information can be evaluated by a microcontroller. The absolute amount of reflected light depends much on the environment and is not evaluated. Only sudden changes of the amount of reflected light, and therefore changes in the pulse width, are evaluated using this application. Rev. 2.2, 09-Jan-2019 4 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors Example of a signal pattern: trepeat = 500 ms tpi = 120 ms, 38 kHz Optical signal Response of the TSSP77P38 (strong reflection) Response of the TSSP77P38 (weak reflection) Example for a sensor hardware: IR Receiver TSSP77P38 Emitter TSAL6200 Separation to avoid crosstalk by stray light inside the housing There should be no common window in front of the emitter and receiver in order to avoid crosstalk by guided light through the window. The logarithmic characteristic of the AGC in the TSSP77P38 results in an almost linear relationship between distance and pulse width. Ambient light has also some impact to the pulse width of this kind of sensor, making the pulse shorter. Rev. 2.2, 09-Jan-2019 5 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 6.8 6.6 0.1 3.2 (3.4) Mold residue Mold residue 2.5 (1.8) 1.2 0.2 3 0.8 2.2 (0.635) (1) 1.27 (3 x) 0.5 0.1 (4 x) technical drawings according to DIN specifications 3 x 1.27 = 3.81 Marking area 2.2 Not indicated tolerances 0.15 (1.65) Tool separation line (2.2) Proposed pad layout from component side (for reference only) 3 x 1.27 = 3.81 1.27 Pick and place area 1.8 (R1.3) Drawing-No.: 6.550-5297.01-4 Issue: 4; 13.09.11 0.8 22608 Rev. 2.2, 09-Jan-2019 6 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering * Reflow soldering must be done within 72 h while stored under a max. temperature of 30 C, 60 % RH after opening the dry pack envelope * Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 C * Finish soldering within 3 s * Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured * Handle products only after the temperature has cooled off * Handling after reflow should be done only after the work surface has been cooled off VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE Axis Title 300 10000 max. 260 C 255 C 240 C 2nd line Temperature (C) 250 245 C 217 C 1000 200 max. 20 s 150 max. 120 s max. 100 s 100 100 Max. ramp up 3 C/s 50 Max. ramp down 6 C/s Max. 2 cycles allowed 10 0 0 19800 Rev. 2.2, 09-Jan-2019 50 100 150 200 250 300 Time (s) 7 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors 0.3 3.6 TAPING VERSION TSSP77P38TR DIMENSIONS in millimeters 16 7.5 1.75 1.34 ref. O 1.5 4 Direction of feed 8 2 O 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5337.01-4 Issue: 2; 06.10.15 Rev. 2.2, 09-Jan-2019 8 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors 3.65 0.3 TAPING VERSION TSSP77P38TT DIMENSIONS in millimeters 16 1.75 7.5 O 1.5 4 8 Direction of feed 2 O 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5338.01-4 Issue: 4; 12.06.13 Rev. 2.2, 09-Jan-2019 9 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters 16734 LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 COVER TAPE PEEL STRENGTH LABEL According to DIN EN 60286-3 Standard bar code labels for finished goods 0.1 N to 1.3 N The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. 300 10 mm/min. 165 to 180 peel angle Rev. 2.2, 09-Jan-2019 10 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 Item-number INO 8 Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - LOT-/serial-number Mixed code indicator Origin Long bar code top MIXED CODE - xxxxxxx+ Company logo Type Length Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 Short bar code bottom Type Length Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 DRY PACKING After more than 72 h under these conditions moisture content will be too high for reflow soldering. The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 C + 5 C / - 0 C and < 5 % RH (dry air / nitrogen) or 96 h at 60 C + 5 C and < 5 % RH for all device containers or 24 h at 125 C + 5 C not suitable for reel or tubes. Aluminum bag Label An EIA JEDEC(R) standard J-STD-020 level 4 label is included on all dry bags. Reel LEVEL CAUTION This bag contains MOISTURE-SENSITIVE DEVICES 15973 4 1. Shelf life in sealed bag: 12 months at < 40 C and < 90 % relative humidity (RH) FINAL PACKING 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 C) must be 2a. Mounted within 72 hours at factory condition of < 30 C/60 % RH or 2b. Stored at < 5 % RH The sealed reel is packed into a cardboard box. RECOMMENDED METHOD OF STORAGE 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 C 5 C or 2a. or 2b. are not met. Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: 4. If baking is required, devices may be baked for: 192 hours at 40 C + 5 C/- 0 C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 C 5 C and < 5 % RH for all device containers or 24 hours at 125 C 5 C not suitable for reels or tubes Bag Seal Date: (If blank, see barcode label) Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 * Storage temperature 10 C to 30 C 22522 * Storage humidity 60 % RH max. Rev. 2.2, 09-Jan-2019 EIA JEDEC standard J-STD-020 level 4 label is included on all dry bags 11 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77P38 www.vishay.com Vishay Semiconductors ESD PRECAUTION VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS (example) Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. 22178 Rev. 2.2, 09-Jan-2019 12 Document Number: 82481 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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