TSSP77P38
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Rev. 2.2, 09-Jan-2019 1Document Number: 82481
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IR Detector for Mid Range Proximity Sensor
DESIGN SUPPORT TOOLS
MECHANICAL DATA
Pinning:
1, 4 = GND, 2 = VS, 3 = OUT
ORDERING CODE
Taping:
TSSP77P38TT - top view taped
TSSP77P38TR - side view taped
FEATURES
• Up to 2 m for proximity sensing
• Very low supply current
• Photo detector and preamplifier in one package
• Shielding against EMI
• Supply voltage: 2.5 V to 5.5 V
• Visible light is suppressed by IR filter
• Capable of side or top view
• Insensitive to supply voltage ripple and noise
•Two lenses for high sensitivity and wide
receiving angle
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Object approach detection for activation of displays and
user consoles, signaling of alarms, etc.
• Simple gesture controls
• Differentiation of car arrival, static, car departure in
parking lots
• Reflective sensors for toilet flush
• Navigational sensor for robotics
DESCRIPTION
The TSSP77P38 is a compact infrared detector module for
proximity sensing application. It receives 38 kHz modulated
signals and has a peak sensitivity of 940 nm.
The length of the detector’s output pulse varies in proportion
to the amount of light reflected from the object being
detected.
BLOCK DIAGRAM PROXIMITY SENSING
1
2
3
4
20953
1
2
3
4
209
5
3
click logo to get started
PARTS TABLE
Carrier frequency 38 kHz TSSP77P38
Package Heimdall
Pinning 1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm) 6.8 W x 3.0 H x 3.2 D
Mounting SMD
Application Proximity sensors
33 kΩVS
OUT
Demo-
GND
pass
AGCInput
PIN
Band dulator
Control circuit
2
3
1, 4
20445-8
+3 V
IR emitter
+3 V
38 kHz
Out to
μC
TSSP77P38
Envelope
signal
TSSP77P38
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Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Output Active Low Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
ABSOLUTE MAXIMUM RATINGS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage VS-0.3 to +6 V
Supply current IS5mA
Output voltage VO-0.3 to (VS + 0.3) V
Output current IO5mA
Junction temperature Tj100 °C
Storage temperature range Tstg -25 to +85 °C
Operating temperature range Tamb -25 to +85 °C
Power consumption Tamb ≤ 85 °C Ptot 10 mW
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply voltage VS2.5 - 5.5 V
Supply current VS = 5 V, Ee = 0 ISD 0.55 0.7 0.9 mA
Ev = 40 klx, sunlight ISH -0.8-mA
Receiving distance
Direct line of sight,
IR diode TSAL6200,
IF = 50 mA, test signal see Fig. 1
d-18-m
Output voltage low IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see Fig. 1 VOSL - - 100 mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1
Ee min. -0.20.4mW/m
2
Maximum irradiance tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1 Ee max. 50 - - W/m2
Directivity Angle of half receiving distance ϕ1/2 -± 50- deg
E
e
T
t
* tpi 10/f0 is recommended for optimal function
VO
VOH
VOL t
16110_4
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms)
Output Signal
td
1)
t
po 2)
1)
7/f0<td<15/f0
2)
tpi - 5/f0<tpo < tpi + 6/f0
tpi *
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.1 1 10 102103104
Ee - Irradiance (mW/m2)
tpo - Output Pulse Width (ms)
Input Burst Length
Output Pulse Width
λ = 950 nm,
Optical Test Signal, Fig.1
0
0.1
TSSP77P38
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Fig. 3 - Frequency Dependence of Responsivity
Fig. 4 - Sensitivity in Bright Ambient
Fig. 5 - Sensitivity vs. Supply Voltage Disturbances
Fig. 6 - Output Pulse Width vs. Irradiance
Fig. 7 - Sensitivity vs. Ambient Temperature
Fig. 8 - Relative Spectral Sensitivity vs. Wavelength
0.0
0.2
0.4
0.6
0.8
0.9
1.0
25 30 45 50
f/f
0
- Relative Frequency
E /E - Rel. Responsivity
e min. e
4035
0.1
0.3
0.5
0.7
f = f0 ± 5 %
Δf (3 dB) = f0/10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.01 0.1 1 10 100
Ee - Ambient DC Irradiance (W/m2)
Ee min. - Threshold Irradiance (mW/m2)
Correlation with Ambient Light Sources:
10 W/m2 = 1.4 kLx (Std. illum. A, T = 2855 K)
10 W/m2 = 8.2 kLx (Daylight, T = 5900 K)
Wavelength of Ambient
Illumination:
λ
= 950 nm
4.5
5.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1 10 100 1000
ΔVsRMS - AC Voltage on DC Supply Voltage (mV)
Ee min. - Threshold Irradiance (mW/m2)
f = f
0
f = 20 kHz
f = 30 kHz
f = 100 Hz
f = 10 kHz
22088
0
20
40
60
80
100
120
140
160
180
200
0.1 1 10 100
t
po
- Output Pulse Width (ms)
E
e
- Irradiance (mW/m
2
)
Burst length = 300 ms, f = fO
Tamb - Ambient Temperature (°C)
Ee min. - Sensitivity (mW/m2)
0
0.05
0.10
0.15
0.20
0.40
-30 -10 10 30 50 70 90
0.30
0.25
0.35
10
100
1000
10000
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
750 850 950 1050 1150
Axis Title
1st line
2nd line
2nd line
S(λ)rel. - Relative Spectral Sensitivity
λ - Wavelength (nm)
21425
TSSP77P38
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Fig. 9 - Angle Characteristic
Fig. 10 - tpo vs. Distance Kodak Gray Card Plus 15 %
Fig. 11 - Dynamic Range of Sensor vs. tpi
Fig. 12 - Max. Rate of Bursts
The typical application of the TSSP77P38 is a reflective sensor with analog information contained in its output. Such a sensor
is evaluating the time required by the AGC to suppress a quasi continuous signal. The time required to suppress such a signal
is longer when the signal is strong than when the signal is weak, resulting in a pulse length corresponding to the distance of an
object from the sensor. This kind of analog information can be evaluated by a microcontroller. The absolute amount of reflected
light depends much on the environment and is not evaluated. Only sudden changes of the amount of reflected light, and
therefore changes in the pulse width, are evaluated using this application.
0
0.2
0.4
0.6
0.8
1.0
1.2
-90 90
Angle (°)
Relative Response Distance
70503010-10-30-50-70
Directivity Characteristic of a
Reective Sensor using
VSMB3940X01 and TSSP77P38
Response Distance (m)
tpo (ms)
0
20
40
60
80
100
120
0.0 0.2 0.4 0.6 0.8 1.0 1.2
IF = 100 mA
IF = 50 mAIF = 30 mA
IF = 10 mA
Emitter: VSMB1940X01
t
pi
(ms)
dmax./dmin.
0
1
2
3
4
5
6
7
10 20 30 40 110 1201009080706050
tpi (ms)
trepeat min. (ms)
0
100
200
300
400
500
600
700
800
0 20 40 60 80 100 120 140 160 180
TSSP77P38
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Example of a signal pattern:
Example for a sensor hardware:
There should be no common window in front of the emitter
and receiver in order to avoid crosstalk by guided light
through the window.
The logarithmic characteristic of the AGC in the TSSP77P38
results in an almost linear relationship between distance and
pulse width. Ambient light has also some impact to the pulse
width of this kind of sensor, making the pulse shorter.
Optical signal
Response of the
TSSP77P38
(strong reflection)
trepeat = 500 ms
tpi = 120 ms, 38 kHz
Response of the
TSSP77P38
(weak reflection)
Emitter
TSAL6200
IR Receiver
TSSP77P38
Separation to avoid
crosstalk by stray light inside
the housing
TSSP77P38
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Rev. 2.2, 09-Jan-2019 6Document Number: 82481
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PACKAGE DIMENSIONS in millimeters
6.6 ± 0.1
3.2
1.27
3 x 1.27 = 3.81
(4 x)
2.2
(1)
1.2 ± 0.2
(2.2)
2.2
(3.4)
(R1.3)
2.5
0.5 ± 0.1
0.8
(1.8)
3
Pick and place area
Proposed pad layout
from component side
(for reference only)
technical drawings
according to DIN
specications
Not indicated tolerances ± 0.15
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
Marking area
Tool separation line
(0.635)
(1.65)
0.8
1.8
1.27
3 x 1.27 = 3.81
(3 x)
Mold residue
Mold residue
6.8
22608
TSSP77P38
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Rev. 2.2, 09-Jan-2019 7Document Number: 82481
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ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
max. 120 s max. 100 s
max. 20 s
Max. ramp up 3 °C/s
max. 260 °C
10
100
1000
10000
0
50
100
250
300
0 300
Axis Title
2nd line
Temperature (°C)
Time (s)
25020015010050
200
150
245 °C
217 °C
240 °C
255 °C
Max. ramp down 6 °C/s
Max. 2 cycles allowed
19800
TSSP77P38
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Rev. 2.2, 09-Jan-2019 8Document Number: 82481
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TAPING VERSION TSSP77P38TR DIMENSIONS in millimeters
Drawing-No.: 9.700-5337.01-4
Issue: 2; 06.10.15
2
1.75
7.5
16
8
4
3.6
0.3
Ø 1.5 min.
Ø 1.5
Direction of feed
1.34 ref.
technical drawings
according to DIN
specications
TSSP77P38
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TAPING VERSION TSSP77P38TT DIMENSIONS in millimeters
0.3
3.65
16
7.51.75
Ø 1.5
Ø 1.5
2
8
4
Drawing-No.: 9.700-5338.01-4
Issue: 4; 12.06.13
technical drawings
according to DIN
specications
Direction of feed
TSSP77P38
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REEL DIMENSIONS in millimeters
LEADER AND TRAILER DIMENSIONS in millimeters
COVER TAPE PEEL STRENGTH
According to DIN EN 60286-3
0.1 N to 1.3 N
300 ± 10 mm/min.
165° to 180° peel angle
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
16734
Trailer Leader
no devices
min.
200
min. 400
StartEnd
devices
96 11818
no devices
TSSP77P38
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DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
FINAL PACKING
The sealed reel is packed into a cardboard box.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING ABBREVIATION LENGTH
Item-description -18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted byACC -
Packed byPCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
Long bar code top Type Length
Item-number N8
Plant-code N2
Sequence-number X3
Quantity N8
Total length -21
Short bar code bottom Type Length
Selection-code X3
Data-code N3
Batch-number X10
Filter -1
Total length -17
Aluminum bag
Label
Reel
15973
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
4
LEVEL
22522
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ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS (example)
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
22178
Legal Disclaimer Notice
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Revision: 01-Jan-2021 1Document Number: 91000
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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