- Solder hot dip Tin(Sn) lead finish
- Pb free version and RoHS compliant
- All external surfaces are corrosion resistant and
leads are readily solderable
DO-35
MECHANICAL DATA
- Case : DO-35 package (SOD-27)
- High temperature soldering guaranteed: 260°C/10s
- Polarity : Indicated by cathode band
- Weight : 109 ± 4 mg
PDmW
VRRM V
IFM mA
IOmA
RθJA oC/W
TJ , TSTG oC
SYMBOL MIN TYP MAX UNIT
100
75
0.62 0.72
1.0
1.0
25 nA
5.0 μA
Junction Capacitance CJ4.0 pF
Trr 4.0 ns
Note : 1. Test Conditions : IF=10mA, VR=6V, RL=100Ω, IRR=1mA
Document Number:DS_S1402014
FEATURES
- Through-hole device type mounting
- Moisture sensitivity level 1
Taiwan Semiconductor
Small Signal Product
500mW High Speed Switching Diode
- Fast switching device(Trr<4.0nS)
Version : G14
VALUE
Repetitive Peak Reverse Voltage
Reverse Recovery Time (Note 1)
HERMETICALLY SEALED GLASS
PARAMETER
500
100
Power Dissipation
SYMBOL
A
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(TA=25℃ unless otherwise noted)
UNIT
450
150
240
-65 to + 150
VR=0 , f=1.0MHz
Peak Forward Surge Current
Pluse Width = 1μS, Square Wave
Non-Repetitive Peak Forward Current
Average Forward Current
Thermal Resistance (Junction to Ambient)
Junction and Storage Temperature Range
IFSM 2.0
Reverse Leakage Current
1N4448, 1N914B IF
VR=20V
VR=75V
VF
IR
V
IR=100μA
IR=5μA
1N4148 IF=10.0mA
1N4448 , 1N914B IF=5.0mA
Forward Voltage
V(BR)
Reverse Breakdown Voltage V