SP3003-04XTG - Littelfuse - Datasheet.Directory

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™ Family of Products)

Revision: June 20, 2012

SP3003 Series

SP3003

Low Capacitance ESD Protection - SP3003 Series

Description

Features

Applications

The SP3003 has ultra low capacitance rail-to-rail diodes with

an additional zener diode fabricated in a proprietary silicon

avalanche technology to protect each I/O pin providing a

high level of protection for electronic equipment that may

experience destructive electrostatic discharges (ESD). These

robust diodes can safely absorb repetitive ESD strikes at the

maximum level speciﬁed in the IEC 61000-4-2 international

standard (Level 4, ±8kV contact discharge) without

performance degradation. Their very low loading capacitance

also makes them ideal for protecting high speed signal pins

such as HDMI, DVI, USB2.0, and IEEE 1394.

• ESD protection of ±8kV

contact discharge,

±15kV air discharge,

(IEC61000-4-2)

• EFT protection,

IEC61000-4-4, 40A

(5/50ns)

• Lightning Protection,

IEC61000-4-5, 2.5A

(8/20µs)

• Low capacitance of

0.65pF (TYP) per I/O

• Low leakage current of

0.5μA (MAX) at 5V

• Complete line of small

packaging helps save

board space (SC70,

SOT553, SOT563,

MSOP10, µDFN-6L)

• LCD/ PDP TVs

• DVD Players

• Desktops

• MP3/ PMP

• Digital Cameras

• Set Top Boxes

• Mobile Phones

• Notebooks

• Computer Peripherals

Pinout

I/O 1

GND

I/O 2

I/O 4

I/O 3

I/O 1

GND

I/O 2

SP3003-04X/J

SP3003-02X/J

Functional Block Diagram

SP3003-04J/XTG SP3003-04ATG

SP3003-02J/XTG SP3003-08ATG

123

654

12345

10 9876

12312345

10 9876

I/O 1

I/O 2

GND

I/O 3

I/O 4

SP3003-04A

I/O 1

I/O 2

I/O 3

I/O 4

SP3003-08A

GND

I/O 8

I/O 7

I/O 6

I/O 5

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving

applications unless otherwise expressly indicated.

RoHS

GREEN

Application Example

*Package is shown as transparentDVI/ HDMI Port

Vcc/NC

Signal GND

GND

D2+

GND

D2-

D1+

D1-

D0+

D0-

CLK+

CLK-

A single, 4 channel SP3003-04 device can be used to

protect four (4) of the data lines in a HDMI/DVI interface

so two (2) SP3003-04 devices provide protection for all

eight (8) TMDS lines.

SP3003 Series 0.65pF Diode Array

SP3003-02UTG

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™ Family of Products)

Revision: June 20, 2012

SP3003 Series

Low Capacitance ESD Protection - SP3003 Series

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress only rating and operation of the device

at these or any other conditions above those indicated in the operational sections of this

speciﬁcation is not implied.

Absolute Maximum Ratings

Symbol Parameter Value Units

IPP Peak Current (tp=8/20μs) 2.5 A

TOP Operating Temperature -40 to 85 °C

TSTOR Storage Temperature -50 to 150 °C

Thermal Information

Parameter Rating Units

Storage Temperature Range -65 to 150 °C

Maximum Junction Temperature 150 °C

Maximum Lead Temperature

(Soldering 20-40s)

260 °C

Electrical Characteristics (TOP=25ºC)

Parameter Symbol Test Conditions Min Typ Max Units

Reverse Standoff Voltage VRWM IR ≤ 1µA 6 V

Reverse Leakage Current ILEAK VR=5V 0.5 µA

Clamp Voltage1VC

IPP=1A, tp=8/20µs, Fwd 10.0 12.0 V

IPP=2A, tp=8/20µs, Fwd 11. 8 15.0 V

ESD Withstand Voltage1VESD

IEC61000-4-2 (Contact) ±8 kV

IEC61000-4-2 (Air) ±15 kV

Diode Capacitance1CI/O-GND

Reverse Bias=0V 0.7 0.8 0.95 pF

Reverse Bias=1.65V 0.55 0.65 0.8 pF

Diode Capacitance1CI/O-I/O Reverse Bias=0V 0.35 pF

Note: 1. Parameter is guaranteed by design and/or device characterization.

Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND

-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

1.E+06 1.E+07 1.E+08 1.E+09 1.E+10

Frequency [Hz]

Insertion Loss [dB]

1.00

0.95

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

0.90

0.85

0.80

0.75

0.70

0.65

0.60

0.55

0.50

I/O Capacitance (pF)

I/O DC Bias (V)

VCC = 3.3V

VCC = Float

VCC = 5V

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™ Family of Products)

Revision: June 20, 2012

SP3003 Series

SP3003

Low Capacitance ESD Protection - SP3003 Series

Capacitance vs. Frequency

2E-13

4E-13

6E-13

8E-13

1E-12

1.2E-12

1.4E-12

1.E+06

1.E+07 1.E+08 1.E+09

Frequency [Hz]

Capacitance [F]

Product Characteristics

Lead Plating Matte Tin (SC70-x, MSOP-10) Pre-Plated

Frame (SOT5x3, µDFN-6)

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute

Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte ﬁnish VDI 11-13.

Time

Temperature

TS(max)

TS(min)

time to peak temperature

Preheat

rehea

Ramp-up

amp-up

Ramp-down

amp-d

Critical Zone

TL to TP

ritical Zon

Reﬂow Condition Pb – Free assembly

Pre Heat

- Temperature Min (Ts(min))150°C

- Temperature Max (Ts(max))200°C

- Time (min to max) (ts)60 – 180 secs

Average ramp up rate (Liquidus) Temp

(TL) to peak 3°C/second max

TS(max) to TL - Ramp-up Rate 3°C/second max

Reﬂow - Temperature (TL) (Liquidus) 217°C

- Temperature (tL)60 – 150 seconds

Peak Temperature (TP)260+0/-5 °C

Time within 5°C of actual peak

Temperature (tp)20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (TP)8 minutes Max.

Do not exceed 260°C

Soldering Parameters

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™ Family of Products)

Revision: June 20, 2012

SP3003 Series

Low Capacitance ESD Protection - SP3003 Series

Package Dimensions — SC70-6

A2 A

EHE

654

Package SC70-6

Pins 6

JEDEC MO-203

Millimeters Inches

Min Max Min Max

A0.80 1. 10 0.031 0.043

A1 0.00 0.10 0.000 0.004

A2 0.70 1. 0 0 0.028 0.039

B0.15 0.30 0.006 0.012

c0.08 0.25 0.003 0.010

D1.85 2.25 0.073 0.089

E1. 15 1.35 0.045 0.053

e0.65 BSC 0.026 BSC

HE 2.00 2.40 0.079 0.094

L0.26 0.46 0.010 0.018

Recommanded Solder Pad Layout

Package Dimensions — SC70-5

A2 A

EHE

not used 4

Package SC70-5

Pins 5

JEDEC MO-203

Millimeters Inches

Min Max Min Max

A0.80 1. 10 0.031 0.043

A1 0.00 0.10 0.000 0.004

A2 0.70 1. 0 0 0.028 0.039

B0.15 0.30 0.006 0.012

c0.08 0.25 0.003 0.010

D1.85 2.25 0.073 0.089

E1. 15 1.35 0.045 0.053

e0.65 BSC 0.026 BSC

HE 2.00 2.40 0.079 0.094

L0.26 0.46 0.010 0.018

Recommanded Solder Pad Layout

Package Dimensions — SOT553

Package SOT 553

Pins 5

Millimeters Inches

Min Max Min Max

A0.50 0.60 0.020 0.024

B0.17 0.27 0.007 0.011

c0.08 0.18 0.003 0.007

D1.50 1.70 0.059 0.067

E1. 10 1.30 0.043 0.051

e0.50 BSC 0.020 BSC

L0.10 0.30 0.004 0.012

HE 1.50 1.70 0.059 0.067

(not used)

Recommanded

Solder Pad Layout

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™ Family of Products)

Revision: June 20, 2012

SP3003 Series

SP3003

Low Capacitance ESD Protection - SP3003 Series

Package Dimensions — SOT563

Package SOT 563

Pins 6

Millimeters Inches

Min Max Min Max

A0.50 0.60 0.020 0.024

B0.17 0.27 0.007 0.011

c0.08 0.18 0.003 0.007

D1.50 1.70 0.059 0.067

E1. 10 1.30 0.043 0.051

e0.50 BSC 0.020 BSC

L0.10 0.30 0.004 0.012

HE 1.50 1.70 0.059 0.067

5Recommanded

Solder Pad Layout

Package Dimensions — MSOP10

Recommanded Solder Pad Layout

Package Dimensions —µDFN-6L

Package µDFN-6L

JEDEC MO-229

Pins 6

Millimeters Inches

Min Max Min Max

A0.45 0.55 0.018 0.022

A1 0.00 0.05 0.000 0.002

A3 0.125REF 0.005REF

b0.35 0.45 0.014 0.018

b1 0.15 0.25 0.006 0.010

D1.55 1.65 0.062 0.065

D2 ----

E0.95 1.05 0.038 0.042

E2 ----

e0.50REF 0.020REF

L0.33 0.43 0.013 0.017

Recommanded

Solder Pad Layout

Recommanded Solder Pad

Layout

Package MSOP10

JEDEC MO-187

Pins 10

Millimeters Inches

Min Max Min Max

A-1. 10 - 0.043

A1 0.00 0.15 0.000 0.006

B0.17 0.27 0.007 0.011

c0.08 0.23 0.003 0.009

D2.90 3.10 0.114 0.122

E4.67 5.10 0.184 0.200

E1 2.90 3.10 0.114 0.122

e0.50 BSC 0.020 BSC

HE 0.40 0.80 0.016 0.031

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™ Family of Products)

Revision: June 20, 2012

SP3003 Series

Low Capacitance ESD Protection - SP3003 Series

Embossed Carrier Tape & Reel Speciﬁcation — MSOP-10

Millimetres Inches

Min Max Min Max

E1.65 1.85 0.065 0.073

F5.40 5.60 0.213 0.220

D1.50 1.60 0.059 0.063

D1 1.50 Min 0.059 Min

P0 3.90 4.10 0.154 0.161

10P0 40.0+/- 0.20 1.574+/-0.008

W11.90 12.10 0.469 0.476

P7.90 8.10 0.311 0.319

A0 5.20 5.40 0.205 0.213

B0 3.20 3.40 0.126 0.134

K0 1.20 1.40 0.047 0.055

t0.30 +/- 0.05 0.012+/- 0.002

User Feeding Direction

Pin 1 Location

Embossed Carrier Tape & Reel Speciﬁcations — SOT553 and SOT563

Millimetres Inches

Min Max Min Max

E1.65 1.85 0.064 0.073

F3.45 3.55 0.135 0.139

P2 1.95 2.05 0.076 0.081

D1.40 1.60 0.055 0.063

D1 0.45 0.55 0.017 0.021

P0 3.90 4.10 0.154 0.161

10P0 40.0+/- 0.20 1.574+/-0.008

W7.70 8.10 0.303 0.318

P3.90 4.10 0.153 0.161

A0 1.73 1.83 0.068 0.072

B0 1.73 1.83 0.068 0.072

K0 0.64 0.74 0.025 0.029

t0.22 max 0.009 max

Embossed Carrier Tape & Reel Speciﬁcations — SC70-5 and SC70-6

Millimetres Inches

Min Max Min Max

E1.65 1.85 0.064 0.073

F3.45 3.55 0.135 0.139

P2 1.95 2.05 0.077 0.081

D1.40 1.60 0.055 0.063

D1 1. 0 0 1.25 0.039 0.049

P0 3.90 4.10 0.154 0.161

10P0 40.0+/- 0.20 1.574+/-0.008

W7.70 8.10 0.303 0.318

P3.90 4.10 0.153 0.161

A0 2.14 2.34 0.084 0.092

B0 2.24 2.44 0.088 0.960

K0 1. 12 1.32 0.044 0.052

t0.27 max 0.010 max

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™ Family of Products)

Revision: June 20, 2012

SP3003 Series

SP3003

Low Capacitance ESD Protection - SP3003 Series

Part Numbering System

SP3003 TG

Series

Number of Channels

-02 = 2 channel

(SC70-5, SOT553 packages)

-04 = 4 channel

(SC70-6, SOT563, MSOP-10 packages)

-08 = 8 channel

(MSOP-10 packages)

Package

A = MSOP-10

J = SC70-5 or SC70-6

X = SOT553 or SOT563

U= µDFN-6L

T= Tape & Reel

G= Green

Silicon Protection

Array (SPATM)

Family of

TVS Diode Arrays

Part Marking System

F * *

F**

Product Series

F=SP3003 series

Assembly Site

(varies)

Number of Channels

(varies)

Ordering Information

Part Number Package Marking Min. Order Qty.

SP3003-02JTG SC70-5 F*23000

SP3003-02UTG µDFN-6L FH2 3000

SP3003-02XTG SOT553 F*23000

SP3003-04ATG MSOP-10 F*44000

SP3003-04JTG SC70-6 F*43000

SP3003-04XTG SOT563 F*43000

SP3003-08ATG MSOP-10 F*84000

Embossed Carrier Tape & Reel Speciﬁcation — µDFN-6L

Millimetres Inches

Min Max Min Max

E1.65 1.85 0.064 0.073

F3.45 3.55 0.135 0.139

P2 1.95 2.05 0.076 0.081

D1.40 1.60 0.055 0.063

D1 0.45 0.55 0.017 0.021

P0 3.90 4.10 0.154 0.161

10P0 40.0+/-0.20 1.574+/-0.008

W7.90 8.30 0.311 0.319

P0 3.90 4.10 0.154 0.161

A0 1. 15 1.25 0.045 0.049

B0 1.75 1.85 0.069 0.073

K0 0.65 0.75 0.026 0.03

t0.22 max 0.009 max