EAISR3216A0 - EVERLIGHT ELECTRONICS

1

www.everlightamericas.com

Reverse Package Infrared LED

EAISR3216A0

Features

․Small double-end package

․Low forward voltage

․Good spectral matching to Si photo detector

․Package in 8mm tape on 7” diameter reel

․Pb free

․The product itself will remain within RoHS compliant version.

Descriptions

․EAISR3216A0 is an infrared emitting diode in

miniature SMD package which is molded in a

water clear plastic with flat top view lens.

․The device is spectrally matched with silicon

photodiode and phototransistor.

Applications

․PCB mounted infrared sensor

․Infrared emitting for miniature light barrier

․Floppy disk drive

․Optoelectronic switch

․Smoke detector

Device Selection Guide

LED Part No.

Chip

Material

Lens Color

EAISR3216A0

GaAlAs

Water Clear

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

2

www.everlightamericas.com

Package Dimensions

Notes: 1.All dimensions are in millimeters

2.Tolerances unless dimensions ±0.1mm

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

3

www.everlightamericas.com

Absolute Maximum Ratings (Ta=25℃)

Parameter

Symbol

Rating

Units

Continuous Forward Current

IF

65

mA

Reverse Voltage

VR

5

V

Operating Temperature

Topr

-25 ~ +85

℃

Storage Temperature

Tstg

-40 ~ +85

℃

Power Dissipation at(or below)

25℃Free Air Temperature

Pd

130

mW

Soldering Temperature

Tsol

Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

Notes: Soldering time≦5 seconds.

.

Electro-Optical Characteristics (Ta=25℃)

Parameter

Symbol

Condition

Min.

Typ.

Max.

Units

Radiant Intensity

Ee

IF=20mA

0.5

1.5

--

mW /sr

IF=100mA

Pulse Width≦100μs ,Duty≦1%

--

7.5

--

Peak Wavelength

λp

IF=20mA

--

940

--

nm

Spectral Bandwidth

Δλ

IF=20mA

--

45

--

nm

Forward Voltage

VF

IF=20mA

--

1.2

1.5

V

IF=100mA

Pulse Width≦100μs ,Duty≦1%

--

1.4

1.8

IF=1A

--

2.6

4.0

Reverse Current

IR

VR=5V

--

10

μA

View Angle

2θ1/2

IF=20mA

--

160

--

deg

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

4

www.everlightamericas.com

0

-25 0 4020 60 10080

20

40

60

100

80

120

140

0

20

40

60

80

100 IF=20mA

Ta=25° C

75

-25

900 0

920

940

25 50

960

980

100

0

10

101

102

3

104

1 2 3 4

Typical Electro-Optical Characteristics Curves

Fig.1 Forward Current vs. Fig.2 Spectral Distribution

Ambient Temperature

Fig.3 Peak Emission Wavelength Fig.4 Forward Current

Ambient Temperature vs. Forward Voltage

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

5

www.everlightamericas.com

25

1

1.1

1.2

1.3

50 75 100 120

IF=20mA

010

10010

110

23104

1

10

100

IF-Forward Current (mA)

Ie-Radiant Intensity(mW/sr)

-20

0.6

0.9

0.7

0.8

1.0

0.20.4 0 0.2 0.4 0.6

50

70

80

60

40

30

-10 02010

Typical Electro-Optical Characteristics Curves

Fig.5 Relative Intensity vs. Fig.6 Relative Radiant Intensity vs.

Forward Current Angular Displacement

Fig.7 Relative Intensity vs. Fig.8 Forward Voltage vs.

Ambient Temperature(°C) Ambient Temperature(°C)

25

0.5

1.0

50 75 100 120

IF=20mA

2.0

1.5

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

6

www.everlightamericas.com

Precautions For Use

1. Over-current-proof

Customer must apply resistors for protection,otherwise slight voltage shift will cause big

current change (Burn out will happen).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 48 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

7

www.everlightamericas.com

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3

seconds within once in less than the soldering iron capacity 25W. Leave two seconds and

more intervals, and do soldering of each terminal. Be careful because the damage of the

product is often started at the time of the hand solder.

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is

unavoidable, a double-head soldering iron should be used (as below figure). It should be

confirmed beforehand whether the characteristics of the LEDs will or will not be damaged

by repairing.

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

8

www.everlightamericas.com

Package Dimensions

Taping Dimensions

Unit:mm

Data Sheet

Reverse Package Infrared LED

EAISR3216A0

9

www.everlightamericas.com

Label Form Specification

CPN: Customer’s Production Number

P/N : Production Number

QTY: Packing Quantity

CAT: Ranks

HUE: Peak Wavelength

REF: Reference

LOT No: Lot Number

Notes

1. Above specification may be changed without notice. Everlight Americas will reserve authority

on material change for above specification.

2. When using this product, please observe the absolute maximum ratings and the instructions for

using outlined in these specification sheets. Everlight Americas assumes no responsibility for

any damage resulting from use of the product which does not comply with the absolute

maximum ratings and the instructions included in these specification sheets.

3. These specification sheets include materials protected under copyright of Everlight Americas

corporation. Please don’t reproduce or cause anyone to reproduce them without Everlight

Americas’s consent.