INTEGRATED CIRCUITS DATA SHEET TEA1533T; TEA1533AT GreenChipTMII SMPS control IC Product specification Supersedes data of 2002 May 31 2002 Aug 23 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT FEATURES APPLICATIONS Distinctive features Besides typical application areas, i.e. adapters and chargers, the device can be used in TV and monitor supplies and all applications that demand an efficient and cost-effective solution up to 250 W. * Universal mains supply operation (70 to 276 V AC) * High level of integration, giving a very low external component count. Green features * Valley or zero voltage switching for minimum switching losses * Efficient quasi-resonant operation at high power levels * Frequency reduction at low power standby for improved system efficiency (<3 W) * Cycle skipping mode at very low loads; Pi <300 mW at no-load operation for a typical adapter application * On-chip start-up current source. Protection features 1 14 2 13 3 12 4 TEA1533T 11 * Safe restart mode for system fault conditions TEA1533AT * Continuous mode protection by means of demagnetization detection (zero switch-on current) * Accurate and adjustable overvoltage protection (latched in TEA1533T, safe restart in TEA1533AT) 5 10 6 9 7 8 * Short winding protection * Undervoltage protection (foldback during overload) * Overtemperature protection (latched in TEA1533T, safe restart in TEA1533AT) * Low and adjustable overcurrent protection trip level * Soft (re)start * Mains voltage-dependent operation enabling level. MGU499 Fig.1 Basic application diagram. 2002 Aug 23 2 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT The proprietary high voltage BCD800 process makes direct start-up possible from the rectified mains voltage in an effective and green way. A second low voltage BICMOS IC is used for accurate, high-speed protection functions and control. GENERAL DESCRIPTION GreenChip(1)II is the second generation of green The Switched Mode Power Supply (SMPS) control ICs operating directly from the rectified universal mains. A high level of integration leads to a cost effective power supply with a very low number of external components. Highly efficient and reliable supplies can easily be designed using the GreenChipII control IC. The special built-in green functions allow the efficiency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as fixed frequency operation with valley switching at medium power levels. At low power (standby) levels, the system operates at a reduced frequency and with valley detection. (1) GreenChip is a trademark of Koninklijke Philips Electronics N.V. ORDERING INFORMATION TYPE NUMBER TEA1533T PACKAGE NAME SO14 DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm TEA1533AT 2002 Aug 23 3 VERSION SOT108-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... GND 3 S1 OCP DEMAG SHORT PROTECTION UVLO start M-level Iprot(DEM) VALLEY clamp 12, 13 7 VOLTAGE CONTROLLED OSCILLATOR LOGIC DRAIN HVS n.c. DEM 50 mV 100 mV UP/DOWN COUNTER FREQUENCY CONTROL LOGIC Iprot(CTRL) 4 CTRL 6 OVERVOLTAGE PROTECTION 11 DRIVER DRIVER Iss -1 LEB POWER-ON RESET S Q R Q soft start S2 blank UVLO 2.5 V 0.5 V 9 OCP burst detect VCC < 4.5 V or UVLO (TEA1533AT) S Q R Q short winding 0.88 V OVERPOWER PROTECTION MGU500 Fig.2 Block diagram. Product specification MAXIMUM ON-TIME PROTECTION Isense TEA1533T; TEA1533AT OVERTEMPERATURE PROTECTION TEA1533T TEA1533AT Philips Semiconductors internal supply 14 START-UP CURRENT SOURCE GreenChipTMII SMPS control IC SUPPLY MANAGEMENT BLOCK DIAGRAM 2 book, full pagewidth 2002 Aug 23 VCC Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT PINNING FUNCTIONAL DESCRIPTION SYMBOL PIN The TEA1533 is the controller of a compact flyback converter, and is situated at the primary side. An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start-up. DESCRIPTION n.c. 1 not connected VCC 2 supply voltage GND 3 ground n.c. 4 not connected n.c. 5 not connected CTRL 6 control input DEM 7 input from auxiliary winding for demagnetization timing, overvoltage and overpower protection The TEA1533 can operate in multi modes (see Fig.4). n.c. 8 not connected Isense 9 programmable current sense input n.c. 10 not connected DRIVER 11 gate driver output HVS 12 high voltage safety spacer, not connected HVS 13 high voltage safety spacer, not connected DRAIN 14 drain of external MOS switch, input for start-up current and valley sensing f VCO P (W) Fig.4 Multi modes operation. The next converter stroke is started only after demagnetization of the transformer current (zero current switching), while the drain voltage has reached the lowest voltage to prevent switching losses (green function). The primary resonant circuit of the primary inductance and drain capacitor ensures this quasi-resonant operation. The design can be optimized in such a way that zero voltage switching can be reached over almost the universal mains range. 14 DRAIN 13 HVS GND 3 12 HVS n.c. 5 To prevent very high frequency operation at lower loads, the quasi-resonant operation changes smoothly in fixed frequency PWM control. TEA1533T 11 DRIVER TEA1533AT At very low power (standby) levels, the frequency is controlled down, via the VCO, to a minimum frequency of approximately 25 kHz. 10 n.c. CTRL 6 9 Isense DEM 7 8 n.c. Start-up, mains enabling operation level and undervoltage lock-out MGU501 Initially, the IC is self supplying from the rectified mains voltage via pin DRAIN (see Figs 11 and 12). Supply capacitor CVCC is charged by the internal start-up current source to approximately 4 V or higher, depending on the voltage on pin DRAIN. Fig.3 Pin configuration. 2002 Aug 23 quasi resonant 25 VCC 2 n.c. 4 fixed 175 handbook, halfpage n.c. 1 MGU508 handbook, halfpage (kHz) 5 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT Once the drain voltage exceeds the M-level (mains-dependent operation-enabling level), the start-up current source will continue charging capacitor CVCC (switch S1 will be opened); see Fig.2. The IC will activate the converter as soon as the voltage on pin VCC passes the VCC(start) level. The IC supply is taken over by the auxiliary winding as soon as the output voltage reaches its intended level and the IC supply from the mains voltage is subsequently stopped for high efficiency operation (green function). MGU233 V sense(max) handbook, halfpage 0.52 V 1V (typ) The moment the voltage on pin VCC drops below the undervoltage lock-out level, the IC stops switching and enters a safe restart from the rectified mains voltage. Inhibiting the auxiliary supply by external means causes the converter to operate in a stable, well defined burst mode. 1.5 V (typ) VCTRL Fig.5 Vsense(max) voltage as function of VCTRL. Supply management MGU509 f (kHz) All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit. handbook, halfpage 175 kHz 175 Current mode control Current mode control is used for its good line regulation behaviour. 25 The `on-time' is controlled by the internally inverted control voltage, which is compared with the primary current information. The primary current is sensed across an external resistor. The driver output is latched in the logic, preventing multiple switch-on. VCO2 VCO1 level level Vsense(max) (V) Fig.6 VCO frequency as function of Vsense(max) Cycle skipping The internal control voltage is inversely proportional to the external control pin voltage, with an offset of 1.5 V. This means that a voltage range from 1 to 1.5 V on pin CTRL will result in an internal control voltage range from 0.5 to 0 V (a high external control voltage results in a low duty cycle). At very low power levels, a cycle skipping mode will be activated. A high control voltage will reduce the switching frequency to a minimum of 25 kHz. If the voltage on the control pin is raised even more, switch-on of the external power MOSFET will be inhibited until the voltage on the control pin has dropped to a lower value again (see Fig.7). Oscillator For system accuracy it is not the absolute voltage on the control pin that will trigger the cycle skipping mode, but a signal derived from the internal VCO will be used. The maximum fixed frequency of the oscillator is set by an internal current source and capacitor. The maximum frequency is reduced once the control voltage enters the VCO control window. Then, the maximum frequency changes linearly with the control voltage until the minimum frequency is reached (see Figs 5 and 6). Remark 1: If the no-load requirement of the system is such that the output voltage can be regulated to its intended level at a switching frequency of 25 kHz or above, the cycle skipping mode will not be activated. Remark 2: As switching will stop when the voltage on the control pin is raised above a certain level, the burst mode has to be activated by a microcontroller or any other circuit sending a 30 s, 16 mA pulse to the control input (pin CTRL) of the IC. 2002 Aug 23 6 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT fosc handbook, full pagewidth 1.5 V - VCTRL current comparator CTRL fmax DRIVER DRIVER fmin Isense X2 dV2 Vx dV1 cycle skipping V I 150 Vx (mV) OSCILLATOR 150 mV 1 0 Vx (mV) MGU510 The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively. Fig.7 The cycle skipping circuitry. Demagnetization Minimum and maximum `on-time' The system will be in discontinuous conduction mode all the time. The oscillator will not start a new primary stroke until the secondary stroke has ended. The minimum `on-time' of the SMPS is determined by the Leading Edge Blanking (LEB) time. The IC limits the `on-time' to 50 s. When the system desires an `on-time' longer than 50 s, a fault condition is assumed (e.g. removed Ci in Fig.11), the IC will stop switching and enter the safe restart mode. Demagnetization features a cycle-by-cycle output short-circuit protection by immediately lowering the frequency (longer off-time), thereby reducing the power level. Demagnetization recognition is suppressed during the first tsuppr time. This suppression may be necessary in applications where the transformer has a large leakage inductance, at low output voltages and at start-up. If pin DEM is open-circuit or not connected, a fault condition is assumed and the converter will stop operating immediately. Operation will recommence as soon as the fault condition is removed. If pin DEM is shorted to ground, again a fault condition is assumed and the converter will stop operating after the first stroke. The converter will subsequently enter the safe restart mode. This situation will persist until the short-circuit is removed. 2002 Aug 23 7 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT OverVoltage Protection (OVP) Valley switching An OVP mode is implemented in the GreenChip series. This works for the TEA1533 by sensing the auxiliary voltage via the current flowing into pin DEM during the secondary stroke. The auxiliary winding voltage is a well-defined replica of the output voltage. Any voltage spikes are averaged by an internal filter. A new cycle starts when the power MOSFET is switched on (see Fig.8). After the `on-time' (which is determined by the `sense' voltage and the internal control voltage), the switch is opened and the secondary stroke starts. After the secondary stroke, the drain voltage shows an oscillation 1 with a frequency of approximately ----------------------------------------------2 x x ( Lp x Cd ) If the output voltage exceeds the OVP trip level, an internal counter starts counting subsequent OVP events. The counter has been added to prevent incorrect OVP detections which might occur during ESD or lightning events. If the output voltage exceeds the OVP trip level a few times and not again in a subsequent cycle, the internal counter will count down with twice the speed compared with counting up. However, when typical 10 cycles of subsequent OVP events are detected, the IC assumes a true OVP and the OVP circuit switches the power MOSFET off. Next, the controller waits until the UVLO level is reached on pin VCC. When VCC drops to UVLO, capacitor CVCC will be recharged to the Vstart level. where Lp is the primary self inductance of the transformer and Cd is the capacitance on the drain node. As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for the lowest drain voltage before starting a new primary stroke. This method is called valley detection. Figure 8 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the oscillator signal. In an optimum design, the reflected secondary voltage on the primary side will force the drain voltage to zero. Thus, zero voltage switching is very possible, preventing large Regarding the TEA1533T, this IC will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc. Operation only recommences when the VCC voltage drops below a level of approximately 4.5 V (practically when Vmains has been disconnected for a short period). 1 2 capacitive switching losses P = --- x C x V x f and 2 allowing high frequency operation, which results in small and cost effective inductors. Regarding the TEA1533AT, switching starts again (safe restart mode) when the Vstart level is reached. This process is repeated as long as the OVP condition exists. The output voltage Vo(OVP) at which the OVP function trips, can be set by the demagnetization resistor, RDEM: V o ( OVP ) = Ns ----------- { I (OVP)(DEM) x R DEM + V clamp(DEM)(pos) } N aux where Ns is the number of secondary turns and Naux is the number of auxiliary turns of the transformer. Current I(OVP)(DEM) is internally trimmed. The value of RDEM can be adjusted to the turns ratio of the transformer, thus making an accurate OVP possible. 2002 Aug 23 8 Philips Semiconductors Product specification GreenChipTMII SMPS control IC primary stroke handbook, full pagewidth TEA1533T; TEA1533AT secondary ringing secondary stroke drain valley secondary stroke B A oscillator MGU235 A: Start of new cycle at lowest drain voltage. B: Start of new cycle in a classical PWM system at high drain voltage. Fig.8 Signals for valley switching. OverCurrent Protection (OCP) N aux where: N = ----------Np The cycle-by-cycle peak drain current limit circuit uses the external source resistor to measure the current accurately. This allows optimum size determination of the transformer core (cost issue). The circuit is activated after the leading edge blanking time, tleb. The OCP circuit limits the `sense' voltage to an internal level. The current information is used to adjust the peak drain current, which is measured via pin Isense. The internal compensation is such that an almost mains independent maximum output power can be realized. The OPP curve is given in Fig.9. OverPower Protection (OPP) During the primary stroke, the rectified mains input voltage is measured by sensing the current drawn from pin DEM. This current is dependent on the mains voltage, according V aux N x V mains to the following formula: I DEM --------------- -------------------------R DEM R DEM 2002 Aug 23 9 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT Control pin protection If pin CTRL is open-circuit or not connected, a fault condition is assumed and the converter will stop switching. Operation will recommence as soon as the fault condition is removed. MGU236 handbook, halfpage Vsense(max) 0.52 V (typ) Burst mode standby 0.3 V (typ) -100 A (typ) IDEM Pin CTRL is also used to implement the burst mode standby. In burst mode standby, the power supply enters a special low dissipation state. Figure 11 shows a flyback converter using the burst mode standby function. The system enters burst mode standby when the microcontroller activates NPN transistor T1 on the secondary side. -24 A (typ) Fig.9 OPP correction curve. When the voltage on Cmicro exceeds a certain voltage, measured by the microcontroller, the opto-coupler is activated by T1, sending a large current signal to pin CTRL. In response to this signal, the IC stops switching and enters a `hiccup' mode. This burst activation signal should be present for longer than the `burst blank' period (typically 30 s): the blanking time prevents false burst triggering due to spikes. Figure 12 shows the burst mode standby signals. The hiccup mode during burst mode standby operation does not differ from the hiccup mode at safe restart during a system fault condition (e.g. output short-circuit). The power is reduced during soft restart mode. Short winding protection After the leading edge blanking time, the short winding protection circuit is activated. If the `sense' voltage exceeds the short winding protection voltage Vswp, the converter will stop switching. Once VCC drops below the UVLO level, capacitor CVCC will be recharged and the supply will restart again. This cycle will be repeated until the short-circuit is removed (safe restart mode). The short winding protection will also protect in case of a secondary diode short-circuit. Burst mode standby operation continues until the microcontroller stops activating transistor T1. The system then enters the start-up sequence and begins normal switching behaviour. OverTemperature Protection (OTP) An accurate temperature protection is provided in the circuit. When the junction temperature exceeds the thermal shutdown temperature, the IC will stop switching. When VCC drops to UVLO, capacitor CVCC will be recharged to the Vstart level. V th I burstmode = ---------------+I R CTRL th(on) Regarding the TEA1533T, this IC will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc. Operation only recommences when the VCC voltage drops below a level of approximately 4.5 V (practically when the Vmains has been disconnected for a short period). Regarding the TEA1533AT, when the Vstart level is reached, switching starts again (safe restart mode). This process is repeated as long as the OTP condition exists. 2002 Aug 23 10 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT Soft start-up Driver To prevent transformer rattle during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin Isense and the sense resistor (see Fig.10). An internal current source charges the capacitor to V = ISS x RSS, with a maximum of approximately 0.5 V. The driver circuit to the gate of the power MOSFET has a current sourcing capability of 170 mA typical and a current sink capability of 700 mA typical. This permits fast turn-on and turn-off of the power MOSFET for efficient operation. A low driver source current has been chosen to limit the V/t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the current spikes across Rsense. The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of RSS and CSS. V ocp - ( I SS x R SS ) I primary(max) = ---------------------------------------------R sense = R SS x C SS The charging current ISS will flow as long as the voltage on pin Isense is below approximately 0.5 V. If the voltage on pin Isense exceeds 0.5 V, the soft start current source will start limiting the current ISS. At the VCC(start) level, the ISS current source is completely switched off. Since the soft start current ISS is subtracted from pin VCC charging current, the RSS value will affect the VCC charging current level by a maximum of 60 A (typical value). handbook, halfpage ISS 0.5 V start-up RSS 9 Isense Vocp CSS Rsense MGU502 Fig.10 Soft start. 2002 Aug 23 11 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Voltages -0.4 VCC supply voltage continuous +20 V VCTRL voltage on pin CTRL -0.4 +5 V VDEM voltage on pin DEM current limited -0.4 - V Vsense voltage on pin Isense current limited -0.4 - V VDRAIN voltage on pin DRAIN -0.4 +650 V Currents ICTRL current on pin CTRL - 50 mA IDEM current on pin DEM -250 +250 A Isense current on pin Isense -1 +10 mA IDRIVER current on pin DRIVER -0.8 +2 A IDRAIN current on pin DRAIN - 5 mA d < 10% d < 10% General Ptot total power dissipation - 0.75 W Tstg storage temperature Tamb < 70 C -55 +150 C Tj operating junction temperature -20 +145 C Vesd electrostatic discharge voltage pins 1 to 13 HBM class 1; note 2 - 2000 V pin DRAIN HBM class 1; note 2 - 1500 V any pin MM; note 3 - 400 V Notes 1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated. 2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient in free air; note 1 Note 1. With pin GND connected to sufficient copper area on the printed-circuit board. QUALITY SPECIFICATION In accordance with `SNW-FQ-611-D'. 2002 Aug 23 12 VALUE UNIT 100 K/W Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT CHARACTERISTICS Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Start-up current source (pin DRAIN) IDRAIN supply current drawn from pin DRAIN VCC = 0 V; VDRAIN > 100 V 1.0 1.2 1.4 mA with auxiliary supply; VDRAIN > 100 V - 100 300 A BVDSS breakdown voltage 650 - - V M-level mains-dependent operation enabling level 60 - 100 V Supply voltage management (pin VCC) VCC(start) start-up voltage on VCC 10.3 11 11.7 V VCC(UVLO) under voltage lock-out on VCC 8.1 8.7 9.3 V VCC(hys) hysteresis voltage on VCC VCC(start) - VCC(UVLO) 2.0 2.3 2.6 V ICC(h) pin VCC charging current, high VDRAIN > 100 V; VCC < 3V -1.2 -1 -0.8 mA ICC(l) pin VCC charging current, low VDRAIN > 100 V; 3 V < VCC < VCC(UVLO) -1.2 -0.75 -0.45 mA ICC(restart) pin VCC restart current VDRAIN > 100 V; -650 VCC(UVLO) < VCC < VCC(start) -550 -450 A ICC(oper) supply current under normal operation no load on pin DRIVER 1.1 1.3 1.5 mA ICC(burstmode) supply current while not switching - 0.85 - mA 50 100 150 mV VDEM = 50 mV -50(1) - -10 nA Vclamp(DEM)(neg) negative clamp voltage on pin DEM IDEM = -150 A -0.5 -0.25 -0.05 V Vclamp(DEM)(pos) positive clamp voltage on pin DEM IDEM = 250 A 0.5 0.7 0.9 V 1.1 1.5 1.9 s - tleb - ns 40 50 60 s Demagnetization management (pin DEM) Vth(DEM) demagnetization comparator threshold voltage on pin DEM Iprot(DEM) protection current on pin DEM tsuppr suppression of transformer ringing at start of secondary stroke Pulse width modulator ton(min) minimum on-time ton(max) maximum on-time latched Oscillator fosc(l) oscillator low fixed frequency VCTRL > 1.5 V 20 25 30 kHz fosc(h) oscillator high fixed frequency VCTRL < 1 V 145 175 205 kHz Vvco(start) peak voltage on pin Isense, where frequency reduction starts see Figs 6 and 7 - VCO1 - mV 2002 Aug 23 13 Philips Semiconductors Product specification GreenChipTMII SMPS control IC SYMBOL Vvco(max) TEA1533T; TEA1533AT PARAMETER CONDITIONS peak voltage on pin Isense, where the frequency is equal to fosc(l) MIN. TYP. MAX. - VCO1 - 25 - UNIT mV Duty cycle control (pin CTRL) VCTRL(min) minimum voltage on pin CTRL for maximum duty cycle - 1.0 - V VCTRL(max) maximum voltage on pin CTRL for minimum duty cycle - 1.5 - V Iprot(CTRL) protection current on pin CTRL VCTRL = 1.5V -1(1) -0.8 -0.5 A Iburst = 6 mA 3.3 3.8 4.3 V Burst mode standby (pin CTRL) Vth(burst)(on) burst mode standby active threshold voltage Ith(burst)(on) burst mode standby active current 16 - - mA Ith(burst)(off) burst mode standby inactive current - - 6 mA tburst-blank burst mode standby blanking time 25 30 35 s Valley switch (pin DRAIN) V/tvalley valley recognition voltage change -85 - +85 V/s tvalley-swon delay from valley recognition to switch-on - 150(1) - ns Overcurrent and short winding protection (pin Isense) Vsense(max) maximum source voltage OCP V/t = 0.1 V/s 0.48 0.52 0.56 V tPD propagating delay from detecting Vsense(max) to switch-off V/t = 0.5 V/s - 140 185 ns Vswp short winding protection voltage 0.83 0.88 0.96 V tleb blanking time for current and short winding protection 300 370 440 ns ISS soft start current Vsense < 0.5 V 45 60 75 A set by resistor RDEM, see Section "OverVoltage Protection (OVP)" 54 60 66 A set by resistor RDEM, see Section "OverPower Protection (OPP)" - -24 - A - -100 - A Overvoltage protection (pin DEM) IOVP(DEM) OVP current on pin DEM Overpower protection (pin DEM) IOPP(DEM) OPP current on pin DEM to start OPP correction, set by the demagnetization resistor RDEM IOPP50%(DEM) OPP current on pin DEM, where maximum source voltage is limited to 0.3 V 2002 Aug 23 14 Philips Semiconductors Product specification GreenChipTMII SMPS control IC SYMBOL PARAMETER TEA1533T; TEA1533AT CONDITIONS MIN. TYP. MAX. UNIT Driver (pin DRIVER) Isource source current capability of driver VCC = 9.5 V; VDRIVER = 2 V - -170 -88 mA Isink sink current capability of driver VCC= 9.5 V; VDRIVER = 2 V - 300 - mA VCC = 9.5 V; VDRIVER = 9.5 V 400 700 - mA VCC > 12 V - 11.5 12 V Vo(max) maximum output voltage of the driver Overtemperature protection Tprot(max) maximum temperature protection level 130 140 150 C Tprot(hys) hysteresis for the temperature protection level - 8(1) - C Note 1. Guaranteed by design. 2002 Aug 23 15 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT APPLICATION INFORMATION A converter with the TEA1533 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage with a feedback circuit. Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains during start-up and via the auxiliary winding during operation. A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the maximum primary peak current. Vmains handbook, full pagewidth Do Vi Vo Ci CVCC VCC GND 1 14 2 13 3 12 4 TEA1533T 11 Np DRAIN HVS HVS Ns Co n.c. n.c. power MOSFET DRIVER TEA1533AT 10 5 CCTRL CTRL RCTRL DEM 6 9 7 8 RSS Isense CSS Rsense Dmicro VC RDEM Naux Cmicro standby pulse MICROCONTROLLER Rreg1 T1 Rreg2 MGU503 Fig.11 Flyback configuration with secondary sensing using the burst mode standby. 2002 Aug 23 16 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT handbook, full pagewidth Vi VD (power MOSFET) Vi Vo VCC Vgate M-level burst mode VC start-up sequence normal operation overvoltage protection (TEA1533AT) output short-circuit Fig.12 Typical waveforms. 2002 Aug 23 17 burst mode standby normal operation MGU504 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT PACKAGE OUTLINE SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.244 0.039 0.041 0.228 0.016 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 2002 Aug 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 18 o 8 0o Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. To overcome these problems the double-wave soldering method was specifically developed. 2002 Aug 23 19 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable(3) HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(4), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(2) suitable suitable suitable not recommended(4)(5) suitable not recommended(6) suitable Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2002 Aug 23 20 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2002 Aug 23 21 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT NOTES 2002 Aug 23 22 Philips Semiconductors Product specification GreenChipTMII SMPS control IC TEA1533T; TEA1533AT NOTES 2002 Aug 23 23 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA74 (c) Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613502/02/pp24 Date of release: 2002 Aug 23 Document order number: 9397 750 10262