TEA1533AT/N1,118 - NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 2002 May 31 2002 Aug 23

INTEGRATED CIRCUITS

TEA1533T; TEA1533AT

GreenChipTMII SMPS control IC

2002 Aug 23 2

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

FEATURES

Distinctive features

•Universal mains supply operation (70 to 276 V AC)

•High level of integration, giving a very low external

component count.

Green features

•Valley or zero voltage switching for minimum switching

losses

•Efficient quasi-resonant operation at high power levels

•Frequency reduction at low power standby for improved

system efficiency (<3 W)

•Cycle skipping mode at very low loads; Pi <300 mW at

no-load operation for a typical adapter application

•On-chip start-up current source.

Protection features

•Safe restart mode for system fault conditions

•Continuous mode protection by means of

demagnetization detection (zero switch-on current)

•Accurateandadjustableovervoltageprotection(latched

in TEA1533T, safe restart in TEA1533AT)

•Short winding protection

•Undervoltage protection (foldback during overload)

•Overtemperature protection (latched in TEA1533T, safe

restart in TEA1533AT)

•Low and adjustable overcurrent protection trip level

•Soft (re)start

•Mains voltage-dependent operation enabling level.

APPLICATIONS

Besides typical application areas, i.e. adapters and

chargers, the device can be used in TV and monitor

supplies and all applications that demand an efficient and

cost-effective solution up to 250 W.

MGU499

TEA1533T

TEA1533AT

Fig.1 Basic application diagram.

2002 Aug 23 3

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

GENERAL DESCRIPTION

The GreenChip(1)II is the second generation of green

Switched Mode Power Supply (SMPS) control ICs

operatingdirectlyfromtherectifieduniversalmains.A high

level of integration leads to a cost effective power supply

with a very low number of external components.

The special built-in green functions allow the efficiency to

be optimum at all power levels. This holds for

quasi-resonant operation at high power levels, as well as

fixed frequency operation with valley switching at medium

power levels. At low power (standby) levels, the system

operates at a reduced frequency and with valley detection.

The proprietary high voltage BCD800 process makes

direct start-up possible from the rectified mains voltage in

an effective and green way. A second low voltage

BICMOS IC is used for accurate, high-speed protection

functions and control.

Highly efficient and reliable supplies can easily be

designed using the GreenChipII control IC.

(1) GreenChip is a trademark of Koninklijke Philips

Electronics N.V.

ORDERING INFORMATION

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TEA1533T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

TEA1533AT

2002 Aug 23 4

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

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BLOCK DIAGRAM

ok, full pagewidth

SUPPLY

MANAGEMENT

internal

supply UVLO start

M-level

VCC 2

GND S1

CTRL

FREQUENCY

CONTROL

VOLTAGE

CONTROLLED

OSCILLATOR

DEMAG

SHORT

PROTECTION

LOGIC

OVER-

VOLTAGE

PROTECTION

OVERPOWER

PROTECTION

short

winding

soft

start

OVER-

TEMPERATURE

PROTECTION

UVLO Q

MAXIMUM

ON-TIME

PROTECTION

POWER-ON

RESET

−1

UP/DOWN

COUNTER

VALLEY

OCP

TEA1533T

TEA1533AT

100

clamp

DRIVER

START-UP

CURRENT SOURCE

0.88 V

0.5 V

9Isense

11 DRIVER

MGU500

7DEM

14 DRAIN

12, 13 HVS

n.c.

OCP

LEB

blank

Iss

Iprot(CTRL)

2.5 V

burst

detect SQ

CC < 4.5 V

or UVLO

(TEA1533AT) Q

Iprot(DEM)

Fig.2 Block diagram.

2002 Aug 23 5

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

PINNING FUNCTIONAL DESCRIPTION

The TEA1533 is the controller of a compact flyback

converter, and is situated at the primary side. An auxiliary

winding of the transformer provides demagnetization

detection and powers the IC after start-up.

The TEA1533 can operate in multi modes (see Fig.4).

The next converter stroke is started only after

demagnetization of the transformer current (zero current

switching), while the drain voltage has reached the lowest

voltage to prevent switching losses (green function). The

primary resonant circuit of the primary inductance and

draincapacitorensuresthis quasi-resonantoperation.The

design can be optimized in such a way that zero voltage

switching can be reached over almost the universal mains

range.

To prevent very high frequency operation at lower loads,

the quasi-resonant operation changes smoothly in fixed

frequency PWM control.

At very low power (standby) levels, the frequency is

controlled down, via the VCO, to a minimum frequency of

approximately 25 kHz.

Start-up, mains enabling operation level and

undervoltage lock-out

Initially, the IC is self supplying from the rectified mains

voltage via pin DRAIN (see Figs 11 and 12). Supply

capacitor CVCC is charged by the internal start-up current

source to approximately 4 V or higher, depending on the

voltage on pin DRAIN.

SYMBOL PIN DESCRIPTION

n.c. 1 not connected

VCC 2 supply voltage

GND 3 ground

n.c. 4 not connected

n.c. 5 not connected

CTRL 6 control input

DEM 7 input from auxiliary winding for

demagnetization timing, overvoltage

and overpower protection

n.c. 8 not connected

Isense 9 programmable current sense input

n.c. 10 not connected

DRIVER 11 gate driver output

HVS 12 high voltage safety spacer, not

connected

HVS 13 high voltage safety spacer, not

connected

DRAIN 14 drain of external MOS switch, input for

start-up current and valley sensing

handbook, halfpage

TEA1533T

TEA1533AT

MGU501

n.c.

VCC

GND

n.c.

CTRL

DEM

DRAIN

HVS

DRIVER

n.c.

Isense

n.c.

Fig.3 Pin configuration.

handbook, halfpage

VCO fixed quasi resonant

P (W)

MGU508

(kHz)

175

Fig.4 Multi modes operation.

2002 Aug 23 6

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

Once the drain voltage exceeds the M-level

(mains-dependent operation-enabling level), the start-up

current source will continue charging capacitor CVCC

(switch S1 will be opened); see Fig.2. The IC will activate

the converter as soon as the voltage on pin VCC passes

the VCC(start) level. The IC supply is taken over by the

auxiliary winding as soon as the output voltage reaches its

intended level and the IC supply from the mains voltage is

subsequently stopped for high efficiency operation (green

function).

The moment the voltage on pin VCC drops below the

undervoltage lock-out level, the IC stops switching and

enters a safe restart from the rectified mains voltage.

Inhibiting the auxiliary supply by external means causes

the converter to operate in a stable, well defined burst

mode.

Supply management

All (internal) reference voltages are derived from a

temperature compensated, on-chip band gap circuit.

Current mode control

Current mode control is used for its good line regulation

behaviour.

The ‘on-time’ is controlled by the internally inverted control

voltage, which is compared with the primary current

information. The primary current is sensed across an

external resistor. The driver output is latched in the logic,

preventing multiple switch-on.

The internal control voltage is inversely proportional to the

external control pin voltage, with an offset of 1.5 V. This

means that a voltage range from 1 to 1.5 V on pin CTRL

will result in an internal control voltage range from

0.5 to 0 V (a high external control voltage results in a low

duty cycle).

Oscillator

The maximum fixed frequency of the oscillator is set by an

internal current source and capacitor. The maximum

frequency is reduced once the control voltage enters the

VCO control window. Then, the maximum frequency

changeslinearly with the controlvoltage until the minimum

frequency is reached (see Figs 5 and 6).

Cycle skipping

At very low power levels, a cycle skipping mode will be

activated. A high control voltage will reduce the switching

frequency to a minimum of 25 kHz. If the voltage on the

control pin is raised even more, switch-on of the external

power MOSFET will be inhibited until the voltage on the

control pin has dropped to a lower value again (see Fig.7).

For system accuracy it is not the absolute voltage on the

control pin that will trigger the cycle skipping mode, but a

signal derived from the internal VCO will be used.

Remark 1:Iftheno-load requirement of the system is such

that the output voltage can be regulated to its intended

level at a switching frequency of 25 kHz or above, the

cycle skipping mode will not be activated.

Remark 2: As switching will stop when the voltage on the

control pin is raised above a certain level, the burst mode

has to be activated by a microcontroller or any other circuit

sending a 30 µs, 16 mA pulse to the control input

(pin CTRL) of the IC.

handbook, halfpage

VCTRL

1 V

(typ)

0.52 V

1.5 V

(typ)

MGU233

Vsense(max)

Fig.5 Vsense(max) voltage as function of VCTRL.

handbook, halfpage

Vsense(max) (V)

MGU509

(kHz)

175 175 kHz

VCO2

level VCO1

level

Fig.6 VCO frequency as function of Vsense(max)

2002 Aug 23 7

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

handbook, full pagewidth

MGU510

1.5 V − VCTRL

Isense

fosc

fmax

fmin

Vx (mV)

CTRL

current

comparator

cycle

skipping

150 mV

OSCILLATOR

DRIVER DRIVER

Vx (mV)

dV2dV1150

Fig.7 The cycle skipping circuitry.

The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.

Demagnetization

The system will be in discontinuous conduction mode all

the time. The oscillator will not start a new primary stroke

until the secondary stroke has ended.

Demagnetization features a cycle-by-cycle output

short-circuit protection by immediately lowering the

frequency (longer off-time), thereby reducing the power

level.

Demagnetizationrecognitionis suppressed during the first

tsuppr time. This suppression may be necessary in

applications where the transformer has a large leakage

inductance, at low output voltages and at start-up.

If pin DEM is open-circuit or not connected, a fault

condition is assumed and the converter will stop operating

immediately. Operation will recommence as soon as the

fault condition is removed.

If pin DEM is shorted to ground, again a fault condition is

assumed and the converter will stop operating after the

first stroke. The converter will subsequently enter the safe

restart mode. This situation will persist until the

short-circuit is removed.

Minimum and maximum ‘on-time’

The minimum ‘on-time’ of the SMPS is determined by the

Leading Edge Blanking (LEB) time. The IC limits the

‘on-time’ to 50 µs. When the system desires an ‘on-time’

longer than 50 µs, a fault condition is assumed (e.g.

removed Ciin Fig.11), the IC will stop switching and enter

the safe restart mode.

2002 Aug 23 8

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

OverVoltage Protection (OVP)

An OVP mode is implemented in the GreenChip series.

This works for the TEA1533 by sensing the auxiliary

voltage via the current flowing into pin DEM during the

secondary stroke. The auxiliary winding voltage is a

well-defined replica of the output voltage. Any voltage

spikes are averaged by an internal filter.

Iftheoutputvoltageexceeds the OVP trip level, an internal

counter starts counting subsequent OVP events. The

counter has been added to prevent incorrect OVP

detections which might occur during ESD or lightning

events. If the output voltage exceeds the OVP trip level a

few times and not again in a subsequent cycle, the internal

counter will count down with twice the speed compared

with counting up. However, when typical 10 cycles of

subsequent OVP events are detected, the IC assumes a

true OVP and the OVP circuit switches the power

MOSFET off. Next, the controller waits until the UVLO

level is reached on pin VCC. When VCC drops to UVLO,

capacitor CVCC will be recharged to the Vstart level.

Regarding the TEA1533T, this IC will not start switching

again. Subsequently, VCC will drop again to the UVLO

level, etc. Operation only recommences when the VCC

voltage drops below a level of approximately 4.5 V

(practically when Vmains has been disconnected for a short

period).

Regarding the TEA1533AT, switching starts again (safe

restart mode) when the Vstart level is reached. This

process is repeated as long as the OVP condition exists.

TheoutputvoltageVo(OVP) atwhich the OVP function trips,

can be set by the demagnetization resistor, RDEM:

where Nsis the number of secondary turns and Naux is the

number of auxiliary turns of the transformer.

Current I(OVP)(DEM) is internally trimmed.

The value of RDEM can be adjusted to the turns ratio of the

transformer, thus making an accurate OVP possible.

Valley switching

A new cycle starts when the power MOSFET is switched

on (see Fig.8). After the ‘on-time’ (which is determined by

the ‘sense’ voltage and the internal control voltage), the

switchisopenedand the secondary stroke starts. After the

secondary stroke, the drain voltage shows an oscillation

with a frequency of approximately

where Lpis the primary self inductance of the transformer

and Cd is the capacitance on the drain node.

As soon as the oscillator voltage is high again and the

secondary stroke has ended, the circuit waits for the

lowest drain voltage before starting a new primary stroke.

This method is called valley detection. Figure 8 shows the

drain voltage together with the valley signal, the signal

indicating the secondary stroke and the oscillator signal.

In an optimum design, the reflected secondary voltage on

the primary side will force the drain voltage to zero. Thus,

zero voltage switching is very possible, preventing large

capacitive switching losses and

allowing high frequency operation, which results in small

and cost effective inductors.

Vo OVP()

aux

----------- I(OVP)(DEM) RDEM

×Vclamp(DEM)(pos)

+{}

2π×L

×()×

-----------------------------------------------

--- CV

×f××=





2002 Aug 23 9

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

handbook, full pagewidth

drain

secondary

stroke

MGU235

secondary

ringing

primary

stroke

valley

secondary

stroke

oscillator

A: Start of new cycle at lowest drain voltage.

B: Start of new cycle in a classical PWM system at high drain voltage.

Fig.8 Signals for valley switching.

OverCurrent Protection (OCP)

The cycle-by-cycle peak drain current limit circuit uses the

externalsourceresistorto measure the current accurately.

This allows optimum size determination of the transformer

core (cost issue). The circuit is activated after the leading

edge blanking time, tleb. The OCP circuit limits the ‘sense’

voltage to an internal level.

OverPower Protection (OPP)

Duringthe primary stroke, therectified mains input voltage

is measured by sensing the current drawn from pin DEM.

This current is dependent on the mains voltage, according

to the following formula:

where:

The current information is used to adjust the peak drain

current, which is measured via pin Isense. The internal

compensation is such that an almost mains independent

maximum output power can be realized.

The OPP curve is given in Fig.9.

IDEM Vaux

RDEM

--------------- NV

mains

RDEM

--------------------------

≈≈

aux

------------

2002 Aug 23 10

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

Short winding protection

After the leading edge blanking time, the short winding

protection circuit is activated. If the ‘sense’ voltage

exceeds the short winding protection voltage Vswp, the

converter will stop switching. Once VCC drops below the

UVLO level, capacitor CVCC will be recharged and the

supply will restart again. This cycle will be repeated until

the short-circuit is removed (safe restart mode).

The short winding protection will also protect in case of a

secondary diode short-circuit.

OverTemperature Protection (OTP)

An accurate temperature protection is provided in the

circuit. When the junction temperature exceeds the

thermal shutdown temperature, the IC will stop switching.

When VCC drops to UVLO, capacitor CVCC will be

recharged to the Vstart level.

Regarding the TEA1533T, this IC will not start switching

again. Subsequently, VCC will drop again to the UVLO

level, etc. Operation only recommences when the VCC

voltage drops below a level of approximately 4.5 V

(practically when the Vmains has been disconnected for a

short period).

Regarding the TEA1533AT, when the Vstart level is

reached, switching starts again (safe restart mode). This

process is repeated as long as the OTP condition exists.

Control pin protection

If pin CTRL is open-circuit or not connected, a fault

conditionisassumedandtheconverterwillstopswitching.

Operation will recommence as soon as the fault condition

is removed.

Burst mode standby

Pin CTRL is also used to implement the burst mode

standby. In burst mode standby, the power supply enters

a special low dissipation state. Figure 11 shows a flyback

converter using the burst mode standby function. The

system enters burst mode standby when the

microcontroller activates NPN transistor T1 on the

secondary side.

When the voltage on Cmicro exceeds a certain voltage,

measured by the microcontroller, the opto-coupler is

activated by T1, sending a large current signal to

pin CTRL.Inresponsetothissignal, theICstopsswitching

and enters a ‘hiccup’ mode. This burst activation signal

should be present for longer than the ‘burst blank’ period

(typically 30 µs): the blanking time prevents false burst

triggering due to spikes. Figure 12 shows the burst mode

standby signals. The hiccup mode during burst mode

standby operation does not differ from the hiccup mode at

safe restart during a system fault condition (e.g. output

short-circuit). The power is reduced during soft restart

mode.

Burst mode standby operation continues until the

microcontroller stops activating transistor T1. The system

then enters the start-up sequence and begins normal

switching behaviour.

handbook, halfpage

MGU236

0.52 V

(typ)

0.3 V

(typ)

IDEM

Vsense(max)

−24 µA

(typ)

−100 µA

(typ)

Fig.9 OPP correction curve.

Iburstmode Vth

RCTRL

---------------- Ith(on)

2002 Aug 23 11

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

Soft start-up

To prevent transformer rattle during hiccup, the

transformer peak current is slowly increased by the soft

start function. This can be achieved by inserting a resistor

and a capacitor between pin Isense and the sense resistor

(see Fig.10). An internal current source charges the

capacitor to V = ISS ×RSS, with a maximum of

approximately 0.5 V.

The start level and the time constant of the increasing

primary current level can be adjusted externally by

changing the values of RSS and CSS.

The charging current ISS will flow as long as the voltage on

pin Isense is below approximately 0.5 V. If the voltage on

pin Isense exceeds 0.5 V, the soft start current source will

start limiting the current ISS. At the VCC(start) level, the ISS

current source is completely switched off.

Since the soft start current ISS is subtracted from pin VCC

chargingcurrent, the RSS valuewillaffectthe VCC charging

current level by a maximum of 60 µA (typical value).

Driver

The driver circuit to the gate of the power MOSFET has a

current sourcing capability of 170 mA typical and a current

sink capability of 700 mA typical. This permits fast turn-on

and turn-off of the power MOSFET for efficient operation.

A low driver source current has been chosen to limit the

∆V/∆t at switch-on. This reduces Electro Magnetic

Interference (EMI) and also limits the current spikes

across Rsense.

Iprimary(max) Vocp ISS RSS

×()–

sense

-----------------------------------------------

τRSS CSS

×=

handbook, halfpage

CSS

RSS

Isense

Rsense

ISS

Vocp

start-up

MGU502

0.5 V

Fig.10 Soft start.

2002 Aug 23 12

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.

Notes

1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current

driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the

maximum power rating is not violated.

2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.

THERMAL CHARACTERISTICS

Note

1. With pin GND connected to sufficient copper area on the printed-circuit board.

QUALITY SPECIFICATION

In accordance with ‘SNW-FQ-611-D’.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

Voltages

VCC supply voltage continuous −0.4 +20 V

VCTRL voltage on pin CTRL −0.4 +5 V

VDEM voltage on pin DEM current limited −0.4 −V

Vsense voltage on pin Isense current limited −0.4 −V

VDRAIN voltage on pin DRAIN −0.4 +650 V

Currents

ICTRL current on pin CTRL d < 10% −50 mA

IDEM current on pin DEM −250 +250 µA

Isense current on pin Isense −1 +10 mA

IDRIVER current on pin DRIVER d < 10% −0.8 +2 A

IDRAIN current on pin DRAIN −5mA

General

Ptot total power dissipation Tamb <70°C−0.75 W

Tstg storage temperature −55 +150 °C

Tjoperating junction temperature −20 +145 °C

Vesd electrostatic discharge voltage

pins 1 to 13 HBM class 1; note 2 −2000 V

pin DRAIN HBM class 1; note 2 −1500 V

any pin MM; note 3 −400 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air; note 1 100 K/W

2002 Aug 23 13

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

CHARACTERISTICS

Tamb =25°C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when ﬂowing into

the IC; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Start-up current source (pin DRAIN)

IDRAIN supply current drawn from

pin DRAIN VCC =0V; V

DRAIN > 100 V 1.0 1.2 1.4 mA

with auxiliary supply;

VDRAIN > 100 V −100 300 µA

BVDSS breakdown voltage 650 −−V

M-level mains-dependent operation

enabling level 60 −100 V

Supply voltage management (pin VCC)

VCC(start) start-up voltage on VCC 10.3 11 11.7 V

VCC(UVLO) under voltage lock-out on VCC 8.1 8.7 9.3 V

VCC(hys) hysteresis voltage on VCC VCC(start) −VCC(UVLO) 2.0 2.3 2.6 V

ICC(h) pin VCC charging current, high VDRAIN > 100 V; VCC <3V −1.2 −1−0.8 mA

ICC(l) pin VCC charging current, low VDRAIN > 100 V;

3V<V

CC <V

CC(UVLO)

−1.2 −0.75 −0.45 mA

ICC(restart) pin VCC restart current VDRAIN > 100 V;

VCC(UVLO) <V

CC <V

CC(start)

−650 −550 −450 µA

ICC(oper) supply current under normal

operation no load on pin DRIVER 1.1 1.3 1.5 mA

ICC(burstmode) supply current while not switching −0.85 −mA

Demagnetization management (pin DEM)

Vth(DEM) demagnetization comparator

threshold voltage on pin DEM 50 100 150 mV

Iprot(DEM) protection current on pin DEM VDEM =50mV −50(1) −−10 nA

Vclamp(DEM)(neg) negative clamp voltage on

pin DEM IDEM =−150 µA−0.5 −0.25 −0.05 V

Vclamp(DEM)(pos) positive clamp voltage on

pin DEM IDEM = 250 µA 0.5 0.7 0.9 V

tsuppr suppression of transformer

ringing at start of secondary

stroke

1.1 1.5 1.9 µs

Pulse width modulator

ton(min) minimum on-time −tleb −ns

ton(max) maximum on-time latched 40 50 60 µs

Oscillator

fosc(l) oscillator low ﬁxed frequency VCTRL > 1.5 V 20 25 30 kHz

fosc(h) oscillator high ﬁxed frequency VCTRL < 1 V 145 175 205 kHz

Vvco(start) peak voltage on pin Isense, where

frequency reduction starts see Figs 6 and 7 −VCO1−mV

2002 Aug 23 14

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

Vvco(max) peak voltage on pin Isense, where

the frequency is equal to fosc(l)

−VCO1−25 −mV

Duty cycle control (pin CTRL)

VCTRL(min) minimum voltage on pin CTRL for

maximum duty cycle −1.0 −V

VCTRL(max) maximumvoltageon pin CTRL for

minimum duty cycle −1.5 −V

Iprot(CTRL) protection current on pin CTRL VCTRL = 1.5V −1(1) −0.8 -0.5 µA

Burst mode standby (pin CTRL)

Vth(burst)(on) burst mode standby active

threshold voltage Iburst = 6 mA 3.3 3.8 4.3 V

Ith(burst)(on) burst mode standby active current 16 −−mA

Ith(burst)(off) burst mode standby inactive

current −− 6mA

burst-blank burst mode standby blanking time 25 30 35 µs

Valley switch (pin DRAIN)

∆V/∆tvalley valley recognition voltage change −85 −+85 V/µs

tvalley-swon delay from valley recognition to

switch-on −150(1) −ns

Overcurrent and short winding protection (pin Isense)

Vsense(max) maximum source voltage OCP ∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V

tPD propagating delay from detecting

Vsense(max) to switch-off ∆V/∆t = 0.5 V/µs−140 185 ns

Vswp short winding protection voltage 0.83 0.88 0.96 V

tleb blanking time for current and

short winding protection 300 370 440 ns

ISS soft start current Vsense < 0.5 V 45 60 75 µA

Overvoltage protection (pin DEM)

IOVP(DEM) OVP current on pin DEM set by resistor RDEM, see

Section “OverVoltage

Protection (OVP)”

54 60 66 µA

Overpower protection (pin DEM)

IOPP(DEM) OPP current on pin DEM to start

OPP correction, set by the

demagnetization resistor RDEM

set by resistor RDEM, see

Section “OverPower

Protection (OPP)”

−−24 −µA

OPP50%(DEM) OPP current on pin DEM, where

maximum source voltage is

limited to 0.3 V

−−100 −µA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2002 Aug 23 15

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

Note

1. Guaranteed by design.

Driver (pin DRIVER)

Isource source current capability of driver VCC = 9.5 V; VDRIVER =2V −−170 −88 mA

Isink sink current capability of driver VCC= 9.5 V; VDRIVER =2V −300 −mA

VCC = 9.5 V;

VDRIVER = 9.5 V 400 700 −mA

Vo(max) maximum output voltage of the

driver VCC >12V −11.5 12 V

Overtemperature protection

Tprot(max) maximum temperature protection

level 130 140 150 °C

Tprot(hys) hysteresis for the temperature

protection level −8(1) −°C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2002 Aug 23 16

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

APPLICATION INFORMATION

A converterwith the TEA1533 consists of an inputfilter, a transformer with a third winding(auxiliary), and anoutput stage

with a feedback circuit.

Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains

during start-up and via the auxiliary winding during operation.

A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the

maximum primary peak current.

handbook, full pagewidth

VCC

Vmains

RCTRL

RDEM

Rsense

Rreg1

Rreg2 T1

RSS

CSS

CCTRL

CVCC

VµC

GND

n.c.

CTRL

DEM

DRAIN

power

MOSFET

DRIVER

Isense

HVS

NpNs

Naux

MGU503

TEA1533T

TEA1533AT

MICRO-

CONTROLLER

standby

pulse

Cmicro

Dmicro

Fig.11 Flyback configuration with secondary sensing using the burst mode standby.

2002 Aug 23 17

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

handbook, full pagewidth

(power

MOSFET)

VCC

burst mode

M-level

VµC

start-up

sequence normal

operation normal

operation

overvoltage

protection

(TEA1533AT)

output

short-circuit burst mode standby

MGU504

Vgate

Fig.12 Typical waveforms.

2002 Aug 23 18

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 8.75

8.55 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT108-1

detail X

vMA

(A )

076E06 MS-012

pin 1 index

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.35

0.34 0.16

0.15 0.050

1.05

0.041

0.244

0.228 0.028

0.024 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

97-05-22

99-12-27

0 2.5 5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

2002 Aug 23 19

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

SOLDERING

Introduction to soldering surface mount packages

Thistext gives averybriefinsight to acomplextechnology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certainsurface mountICs,butit isnotsuitablefor finepitch

SMDs. In these situations reflow soldering is

recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuitboardbyscreenprinting,stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 220 °C for

thick/large packages, and below 235 °C for small/thin

packages.

Wave soldering

Conventional single wave soldering is not recommended

forsurface mountdevices(SMDs)or printed-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackages withleadsonfour sides,thefootprint must

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2002 Aug 23 20

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. FormoredetailedinformationontheBGApackages refer to the

“(LF)BGAApplicationNote

”(AN01026);orderacopy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE(1) SOLDERING METHOD

WAVE REFLOW(2)

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable

HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,

HVSON, SMS not suitable(3) suitable

PLCC(4), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(4)(5) suitable

SSOP, TSSOP, VSO not recommended(6) suitable

2002 Aug 23 21

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS(1) PRODUCT

STATUS(2) DEFINITIONS

Objective data Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

Product data Production This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Changes will be

communicated according to the Customer Product/Process Change

Notiﬁcation (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

atthese or at any otherconditionsabovethosegivenin the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarrantythatsuchapplications willbe

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingor sellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuse ofanyofthese products,conveysnolicence ortitle

under any patent, copyright, or mask work right to these

products,andmakesno representations or warranties that

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

2002 Aug 23 22

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

NOTES

2002 Aug 23 23

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC TEA1533T; TEA1533AT

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands 613502/02/pp24 Date of release: 2002 Aug 23 Document order number: 9397 750 10262