LM5010
LM5010 High Voltage 1A Step Down Switching Regulator
Literature Number: SNVS307E
LM5010
High Voltage 1A Step Down Switching Regulator
General Description
The LM5010 Step Down Switching Regulator features all the
functions needed to implement a low cost, efficient, buck
bias regulator capable of supplying in excess of 1A load
current. This high voltage regulator contains an N-Channel
Buck Switch, and is available in thermally enhanced LLP-10
and TSSOP-14EP packages. The hysteretic regulation
scheme requires no loop compensation, results in fast load
transient response, and simplifies circuit implementation.
The operating frequency remains constant with line and load
variations due to the inverse relationship between the input
voltage and the on-time. The valley current limit detection is
set at 1.25A. Additional features include: V
CC
under-voltage
lockout, thermal shutdown, gate drive under-voltage lockout,
and maximum duty cycle limiter.
Features
nInput Voltage Range: 8V to 75V
nValley Current Limit At 1.25A
nSwitching Frequency Can Exceed 1 MHz
nIntegrated N-Channel Buck Switch
nIntegrated Startup Regulator
nNo Loop Compensation Required
nUltra-Fast Transient Response
nOperating Frequency Remains Constant With Load and
Line Variations
nMaximum Duty Cycle Limited During Startup
nAdjustable Output Voltage
nPrecision 2.5V Feedback Reference
nThermal shutdown
Typical Applications
nHigh Efficiency Point-Of-Load (POL) Regulator
nNon-Isolated Telecommunications Buck Regulator
nSecondary High Voltage Post Regulator
nAutomotive Systems
Package
nLLP-10 (4 mmx4mm)
nTSSOP-14EP
nBoth Packages Have Exposed Thermal Pad For
Improved Heat Dissipation
20119943
Basic Stepdown Regulator
February 2005
LM5010 High Voltage 1A Step Down Switching Regulator
© 2005 National Semiconductor Corporation DS201199 www.national.com
Connection Diagrams
20119902
20119903
Ordering Information
Order Number Package Type NSC Package Drawing Supplied As
LM5010SD LLP-10 (4x4) SDC10A 1000 Units on Tape and Reel
LM5010SDX LLP-10 (4x4) SDC10A 4500 Units on Tape and Reel
LM5010MH TSSOP-14EP MXA14A 94 Units in Rail
LM5010MHX TSSOP-14EP MXA14A 2500 Units on Tape and Reel
LM5010
www.national.com 2
Pin Description
PIN NUMBER
NAME DESCRIPTION APPLICATION INFORMATIONLLP-10 TSSOP-14
1 2 SW Switching Node Internally connected to the buck switch source.
Connect to the inductor, free-wheeling diode, and
bootstrap capacitor.
2 3 BST Boost pin for bootstrap capacitor Connect a 0.022 µF capacitor from SW to this pin.
The capacitor is charged from V
CC
via an internal
diode during each off-time.
34I
SEN
Current sense The re-circulating current flows through the internal
sense resistor, and out of this pin to the
free-wheeling diode. Current limit is nominally set at
1.25A.
45S
GND
Sense Ground Re-circulating current flows into this pin to the
current sense resistor.
5 6 RTN Circuit Ground Ground for all internal circuitry other than the current
limit detection.
6 9 FB Feedback input from the
regulated output
Internally connected to the regulation and
over-voltage comparators. The regulation level is
2.5V.
7 10 SS Softstart An internal 11.5 µA current source charges an
external capacitor to 2.5V, providing the softstart
function.
811R
ON
/SD On-time control and shutdown An external resistor from V
IN
to this pin sets the
buck switch on-time. Grounding this pin shuts down
the regulator.
912V
CC
Output from the startup regulator Nominally regulates at 7.0V. An external voltage
(7.5V-14V) can be applied to this pin to reduce
internal dissipation. An internal diode connects V
CC
to V
IN
.
10 13 V
IN
Input supply voltage Nominal input range is 8.0V to 75V.
1,7,8,14 NC No connection. No internal connection.
LM5010
www.national.com3
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
IN
to GND 76V
BST to GND 90V
SW to GND (Steady State) -1.5V
BST to V
CC
76V
BST to SW 14V
V
CC
to GND 14V
S
GND
to RTN -0.3V to +0.3V
SS to RTN -0.3V to 4V
V
IN
to SW 76V
Current Out of I
SEN
See Text
All Other Inputs to GND -0.3 to 7V
ESD Rating (Note 2)
Human Body Model 2kV
Storage Temperature Range -55˚C to +150˚C
Lead Temperature (Soldering 4 sec) (Note 4) 260˚C
Operating Ratings (Note 1)
V
IN
8V to 75V
Operating Junction Temperature −40˚C to + 125˚C
Electrical Charateristics
Specifications with standard typeface are for T
J
= 25˚C, and those with boldface type apply over full Operating Junction
Temperature range.V
IN
= 48V, R
ON
= 200k, unless otherwise stated (Note 5) and (Note 6).
Symbol Parameter Conditions Min Typ Max Units
V
CC
Regulator
V
CC
Reg V
CC
regulated output 6.6 77.4 Volts
V
IN
-V
CC
I
CC
= 0 mA, F
S
<200 kHz
7.5V V
IN
8.0V
1.3 V
V
CC
output impedance
(0 mA I
CC
5 mA)
V
IN
= 8.0V
V
IN
= 48V
140
2.5
V
CC
current limit (Note 3) V
CC
=0V 10 mA
UVLO
VCC
V
CC
under-voltage lockout
threshold
V
CC
increasing 5.8 V
UVLO
VCC
hysteresis V
CC
decreasing 145 mV
UVLO
VCC
filter delay 100 mV overdrive 3 µs
I
IN
operating current Non-switching, FB = 3V 650 850 µA
I
IN
shutdown current R
ON
/SD=0V 95 200 µA
Switch Characteristics
Rds(on) Buck Switch Rds(on) I
TEST
= 200 mA 0.35 0.80
UVLO
GD
Gate Drive UVLO V
BST
-V
SW
Increasing 3.0 4.3 5.0 V
UVLO
GD
hysteresis 440 mV
Softstart Pin
Pull-up voltage 2.5 V
Internal current source 11.5 µA
Current Limit
I
LIM
Threshold Current out of I
SEN
11.25 1.5 A
Resistance from I
SEN
to S
GND
130 m
Response time 150 ns
On Timer, R
ON
/SD Pin
t
ON
- 1 On-time V
IN
= 10V, R
ON
= 200 k2.1 2.75 3.4 µs
t
ON
- 2 On-time V
IN
= 75V, R
ON
= 200 k290 390 490 ns
Shutdown threshold Voltage at R
ON
/SD rising 0.35 0.65 1.1 V
Threshold hysteresis Voltage at R
ON
/SD falling 40 mV
Off Timer
t
OFF
Off-time 265 ns
LM5010
www.national.com 4
Electrical Charateristics (Continued)
Specifications with standard typeface are for T
J
= 25˚C, and those with boldface type apply over full Operating Junction
Temperature range.V
IN
= 48V, R
ON
= 200k, unless otherwise stated (Note 5) and (Note 6).
Symbol Parameter Conditions Min Typ Max Units
Regulation and Over-Voltage Comparators (FB Pin)
V
REF
FB regulation threshold SS pin = steady state 2.445 2.5 2.550 V
FB over-voltage threshold 2.9 V
FB bias current 1 nA
Thermal Shutdown
T
SD
Thermal shutdown
temperature
175 ˚C
Thermal shutdown hysteresis 20 ˚C
Thermal Resistance
θ
JA
Junction to Ambient SDC Package
MXA Package
40
40 ˚C/W
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin.
Note 3: VCC provides bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
Note 4: For detailed information on soldering plastic TSSOP and LLP packages refer to the Packaging Data Book available from National Semiconductor
Corporation.
Note 5: Typical specifications represent the most likely parametric norm at 25˚C operation.
Note 6: All limits are guaranteed. All electrical characteristics having room temperature limits are tested during production with TA= 25˚C. All hot and cold limits are
guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
LM5010
www.national.com5
Typical Application Circuit and Block Diagram
(pin numbers are for the LLP-10 package)
20119944
FIGURE 1.
LM5010
www.national.com 6
Typical Performance Characteristics
20119904
FIGURE 2. V
CC
vs V
IN
20119905
FIGURE 3. V
CC
vs I
CC
20119906
FIGURE 4. I
CC
vs Externally Applied V
CC
20119907
FIGURE 5. On-Time vs V
IN
and R
ON
LM5010
www.national.com7
Typical Performance
Characteristics (Continued)
20119908
FIGURE 6. Voltage at R
ON
/SD Pin
20119910
FIGURE 7. I
IN
vs V
IN
LM5010
www.national.com 8
Typical Performance Characteristics (Continued)
Functional Description
The LM5010 Step Down Switching Regulator features all the
functions needed to implement a low cost, efficient buck bias
power converter capable of supplying in excess of 1A to the
load. This high voltage regulator contains an N-Channel
buck switch, is easy to implement, and is available in the
thermally enhanced LLP-10 and TSSOP-14EP packages.
The regulator’s operation is based on a hysteretic control
scheme, and uses an on-time which varies inversely with
V
IN
. This feature results in the operating frequency remain-
ing relatively constant with load and input voltage variations.
The switching frequency can range from 100 kHz to >1.0
MHz. The hysteretic control requires no loop compensation
resulting in very fast load transient response. The valley
current limit detection circuit, internally set at 1.25A, holds
the buck switch off until the high current level subsides.
Figure 1 shows the functional block diagram. The LM5010
can be applied in numerous applications to efficiently regu-
late down higher voltages. This regulator is well suited for
48V telecom applications, as well as the new 42V automo-
tive power bus. Implemented as a Point-of-Load regulator
following a highly efficient intermediate bus converter can
result in high overall system efficiency. Features include:
Thermal shutdown, V
CC
under-voltage lockout, gate drive
under-voltage lockout, and maximum duty cycle limit.
Hysteretic Control Circuit
Overview
The LM5010 buck DC-DC regulator employs a control
scheme based on a comparator and a one-shot on-timer,
with the output voltage feedback (FB) compared to an inter-
nal reference (2.5V). If the FB voltage is below the reference
the buck switch is turned on for a time period determined by
the input voltage and a programming resistor (R
ON
). Follow-
ing the on-time the switch remains off for 265 ns, or until the
FB voltage falls below the reference, whichever is longer.
The buck switch then turns on for another on-time period.
20119911
FIGURE 8. Startup Sequence
LM5010
www.national.com9
Hysteretic Control Circuit
Overview (Continued)
Typically when the load current increases suddenly, the off-
times are temporarily at the minimum of 265 ns. Once regu-
lation is established, the off-time resumes its normal value.
The output voltage is set by two external resistors (R1, R2).
The regulated output voltage is calculated as follows:
V
OUT
= 2.5V x (R1 + R2) / R2 (1)
Output voltage regulation is based on ripple voltage at the
feedback input, requiring a minimum amount of ESR for the
output capacitor C2. The LM5010 requires a minimum of 25
mV of ripple voltage at the FB pin. In cases where the
capacitor’s ESR is insufficient additional series resistance
may be required (R3 in Figure 1 ).
When in regulation, the LM5010 operates in continuous
conduction mode at heavy load currents and discontinuous
conduction mode at light load currents. In continuous con-
duction mode current always flows through the inductor,
never reaching zero during the off-time. In this mode the
operating frequency remains relatively constant with load
and line variations. The minimum load current for continuous
conduction mode is one-half the inductor’s ripple current
amplitude. The approximate operating frequency is calcu-
lated as follows:
(2)
The buck switch duty cycle is approximately equal to:
(3)
At low load current, the circuit operates in discontinuous
conduction mode, during which the inductor current ramps
up from zero to a peak during the on-time, then ramps back
to zero before the end of the off-time. The next on-time
period starts when the voltage at FB falls below the refer-
ence - until then the inductor current remains zero, and the
load current is supplied by the output capacitor (C2). In this
mode the operating frequency is lower than in continuous
conduction mode, and varies with load current. Conversion
efficiency is maintained at light loads since the switching
losses reduce with the reduction in load and frequency. The
approximate discontinuous operating frequency can be cal-
culated as follows:
(4)
where R
L
= the load resistance.
For applications where lower output voltage ripple is re-
quired the output can be taken directly from a low ESR
output capacitor as shown in Figure 9. However, R3 slightly
degrades the load regulation.
Start-up Regulator (V
CC
)
The startup regulator is integral to the LM5010. The input pin
(V
IN
) can be connected directly to line voltages up to 75V.
The V
CC
output is regulated at 7.0V, ±6%, and is current
limited to 10 mA. Upon power up the regulator sources
current into the external capacitor at V
CC
(C3). With a 0.1 µF
capacitor at V
CC
, approximately 58 µs are required for the
V
CC
voltage to reach the under-voltage lockout threshold
(UVLO) of 5.8V (t1 in Figure 8), at which time the buck switch
is enabled, and the softstart pin is released to allow the
softstart capacitor (C6) to charge up. V
OUT
then increases to
its regulated value as the softstart voltage increases (t2 in
Figure 8).
The minimum input operating voltage is determined by the
regulator’s dropout voltage, the V
CC
UVLO falling threshold
()5.65V), and the frequency. When V
CC
falls below the
falling threshold the V
CC
UVLO activates to shut off the buck
switch and ground the softstart pin. If V
CC
is externally
loaded, the minimum input voltage increases since the out-
put impedance at V
CC
is )140at low V
IN
. See Figures 2
and 3. In applications involving a high value for V
IN
where
power dissipation in the startup regulator is a concern, an
auxiliary voltage can be diode connected to the V
CC
pin
(Figure 10). Setting the auxiliary voltage to between 7.5V
and 14V shuts off the internal regulator, reducing internal
power dissipation. The current required into the V
CC
pin is
shown in Figure 4. Internally a diode connects V
CC
to V
IN
.
20119915
FIGURE 9. Low Ripple Output Configuration
LM5010
www.national.com 10
Start-up Regulator (V
CC
)(Continued)
Regulation Comparator
The feedback voltage at FB is compared to the voltage at the
Softstart pin (2.5V, ±2%). In normal operation (the output
voltage is regulated) an on-time period is initiated when the
voltage at FB falls below 2.5V. The buck switch stays on for
the on-time causing the FB voltage to rise above 2.5V. After
the on-time period the buck switch stays off until the FB
voltage falls below 2.5V. Bias current at the FB pin is less
than 5 nA over temperature.
Over-Voltage Comparator
The feedback voltage at FB is compared to an internal 2.9V
reference. If the voltage at FB rises above 2.9V the on-time
is immediately terminated. This condition can occur if the
input voltage, or the output load, change suddenly. The buck
switch will not turn on again until the voltage at FB falls below
2.5V.
ON-Time Control
The on-time of the internal switch (see Figure 5) is deter-
mined by the R
ON
resistor and the input voltage (V
IN
), cal-
culated from the following:
(5)
The inverse relationship of t
ON
vs. V
IN
results in a nearly
constant frequency as V
IN
is varied. If the application re-
quires a high frequency the minimum value for t
ON
, and
consequently R
ON
, is limited by the off-time (265 ns, ±15%)
which limits the maximum duty cycle at minimum V
IN
. The
tolerance for Equation 5 is ±25%. Frequencies in excess of
1 MHz are possible with the LM5010.
Shutdown
The LM5010 can be remotely shut down by taking the
R
ON
/SD pin below 0.65V. See Figure 11. In this mode the
softstart pin is internally grounded, the on-timer is disabled,
and the input current at V
IN
is reduced (Figure 7). Releasing
the R
ON
/SD pin allows normal operation to resume. When
the switch is open, the nominal voltage at R
ON
/SD is shown
in Figure 6.
20119916
FIGURE 10. Self Biased Configuration
20119918
FIGURE 11. Shutdown Implementation
LM5010
www.national.com11
Current Limit
Current limit detection occurs during the off-time by monitor-
ing the recirculating current through the free-wheeling diode
(D1). The detection threshold is 1.25A, ±0.25A. Referring to
Figure 1, when the buck switch is off the inductor current
flows through the load, into S
GND
, through the sense resistor,
out of I
SEN
and through D1. If that current exceeds the
threshold the current limit comparator output switches to
delay the start of the next on-time period. The next on-time
starts when the current out of I
SEN
is below the threshold and
the voltage at FB is below 2.5V. If the overload condition
persists causing the inductor current to exceed the threshold
during each on-time, that is detected at the beginning of
each off-time. The operating frequency is lower due to
longer-than-normal off-times.
Figure 12 illustrates the inductor current waveform. During
normal operation the load current is I
O
, the average of the
ripple waveform. When the load resistance decreases the
current ratchets up until the lower peak attempts to exceed
the threshold. During the Current Limited portion of Figure
12, the current ramps down to the threshold during each
off-time, initiating the next on-time (assuming the voltage at
FB is <2.5V). During each on-time the current ramps up an
amount equal to:
(6)
During this time the LM5010 is in a constant current mode,
with an average load current (I
OCL
) equal to the threshold +
I/2.
The “valley current limit” technique allows the load current to
exceed the current limit threshold as long as the lower peak
of the inductor current is less than the threshold.
The current limit threshold can be increased by connecting
an external resistor (R
CL
) between S
GND
and I
SEN
. The
external resistor typically is less than 1, and its calculation
is explained in the Applications Information section.
The peak current out of SW and I
SEN
must not exceed 3.5A.
The average current out of SW must be less than 3A, and
the average current out of I
SEN
must be less than 2A.
N - Channel Buck Switch and
Driver
The LM5010 integrates an N-Channel buck switch and as-
sociated floating high voltage gate driver. The peak current
through the buck switch must not be allowed to exceed 3.5A,
and the average current must be less than 3A. The gate
driver circuit is powered by the external bootstrap capacitor
between BST and SW (C4). During each off-time, the SW pin
is at approximately -1V, and C4 is re-charged from V
CC
through the internal high voltage diode. The minimum off-
time of 265 ns ensures a minimum time each cycle to
recharge the bootstrap capacitor. A 0.022 µF ceramic ca-
pacitor is recommended for C4.
Softstart
The softstart feature allows the converter to gradually reach
a steady state operating point, thereby reducing startup
stresses and current surges. Upon turn-on, after V
CC
reaches the under-voltage threshold (t1 in Figure 8), an
internal 11.5 µA current source charges the external capaci-
tor at the Softstart pin to 2.5V (t2 in Figure 8). The ramping
voltage at SS (and at the non-inverting input of the regulation
comparator) ramps up the output voltage in a controlled
manner. This feature keeps the load current from going to
current limit during startup, thereby reducing inrush currents.
An internal switch grounds the Softstart pin if V
CC
is below
the under-voltage lockout threshold, if a thermal shutdown
occurs, or if the circuit is shutdown using the R
ON
/SD pin.
Thermal Shutdown
The LM5010 should be operated so the junction temperature
does not exceed 125˚C. If the junction temperature in-
creases above that, an internal Thermal Shutdown circuit
activates (typically) at 175˚C, taking the controller to a low
power reset state by disabling the buck switch and the
on-timer, and grounding the Softstart pin. This feature helps
prevent catastrophic failures from accidental device over-
20119920
FIGURE 12. Inductor Current - Current Limit Operation
LM5010
www.national.com 12
Thermal Shutdown (Continued)
heating. When the junction temperature reduces below
155˚C (typical hysteresis = 20˚C), the Softstart pin is re-
leased and normal operation resumes.
Applications Information
EXTERNAL COMPONENTS
The procedure for calculating the external components is
illustrated with a design example. The circuit in Figure 1 is to
be configured for the following specifications:
V
OUT
= 10V
V
IN
= 15V to 75V
F
S
= 625 kHz
Minimum load current = 150 mA
Maximum load current = 1.0A
Softstart time=5ms.
R1 and R2:The ratio of these resistors is calculated from:
R1/R2 = (V
OUT
/2.5V) - 1 (7)
R1/R2 calculates to 3.0. The resistors should be chosen
from standard value resistors in the range of 1.0 k-10k.
Values of 3.0 kfor R1, and 1.0 kfor R2 will be used.
R
ON
,F
S
:R
ON
sets the on-time, and can be chosen using
Equation 2 to set a nominal frequency, or from Equation 5 if
the on-time at a particular V
IN
is important. A higher fre-
quency generally means a smaller inductor and capacitors
(value, size and cost), but higher switching losses. A lower
frequency means a higher efficiency, but with larger compo-
nents. If PC board space is tight, a higher frequency is better.
The resulting on-time and frequency have a ±25% toler-
ance. Re-arranging Equation 2 ,
The next larger standard value (137 k) is chosen for R
ON
,
yielding a nominal frequency of 618 kHz.
L1: The inductor value is determined based on the load
current, ripple current, and the minimum and maximum input
voltage (V
IN(min)
,V
IN(max)
). Refer to Figure 13 .
To keep the circuit in continuous conduction mode, the maxi-
mum allowed ripple current is twice the minimum load cur-
rent, or 300 mAp-p. Using this value of ripple current, the
inductor (L1) is calculated using the following:
(8)
where F
S(min)
is the minimum frequency (F
S
- 25%).
This provides a minimum value for L1 - the next higher
standard value (100 µH) will be used. L1 must be rated for
the peak current (I
PK+
) to prevent saturation. The peak cur-
rent occurs at maximum load current with maximum ripple.
The maximum ripple is calculated by re-arranging Equation
8 using V
IN(max)
,F
S(min)
, and the minimum inductor value,
based on the manufacturer’s tolerance. Assume, for this
exercise, the inductor’s tolerance is ±20%.
(9)
I
PK+
= 1.0A + 0.234A / 2 = 1.117A
R
CL
:Since it is obvious that the lower peak of the inductor
current waveform does not exceed 1.0A at maximum load
current (see Figure 13), it is not necessary to increase the
current limit threshold. Therefore R
CL
is not needed for this
exercise. For applications where the lower peak exceeds
1.0A, see the section below on increasing the current limit
threshold.
C2 and R3: Since the LM5010 requires a minimum of 25
mVp-p of ripple at the FB pin for proper operation, the
required ripple at V
OUT1
is increased by R1 and R2. This
necessary ripple is created by the inductor ripple current
acting on C2’s ESR + R3. First, the minimum ripple current is
determined.
20119922
FIGURE 13. Inductor Current
LM5010
www.national.com13
Applications Information (Continued)
(10)
The minimum ESR for C2 is then equal to:
If the capacitor used for C2 does not have sufficient ESR, R3
is added in series as shown in Figure 1. C2 should generally
be no smaller than 3.3 µF, although that is dependent on the
frequency and the allowable ripple amplitude at V
OUT1
. Ex-
perimentation is usually necessary to determine the mini-
mum value for C2, as the nature of the load may require a
larger value. A load which creates significant transients re-
quires a larger value for C2 than a non-varying load.
D1: The important parameters are reverse recovery time and
forward voltage drop. The reverse recovery time determines
how long the current surge lasts each time the buck switch is
turned on. The forward voltage drop is significant in the
event the output is short-circuited as it is mainly this diode’s
voltage (plus the voltage across the current limit sense re-
sistor) which forces the inductor current to decrease during
the off-time. For this reason, a higher voltage is better,
although that affects efficiency. A reverse recovery time of
)30 ns, and a forward voltage drop of )0.75V are preferred.
The reverse leakage specification is important as that can
significantly affect efficiency. Other types of diodes may have
a lower forward voltage drop, but may have longer recovery
times, or greater reverse leakage. D1 should be rated for the
maximum V
IN
, and for the peak current when in current limit
(I
PK
in Figure 11) which is equal to:
I
PK
= 1.5A + I
OR(max)
= 1.734A
where 1.5A is the maximum guaranteed current limit thresh-
old, and the maximum ripple current was previously calcu-
lated as 234 mAp-p. Note that this calculation is valid only
when R
CL
is not required.
C1: Assuming the voltage supply feeding V
IN
has a source
impedance greater than zero, this capacitor limits the ripple
voltage at V
IN
while supplying most of the switch current
during the on-time. At maximum load current, when the buck
switch turns on, the current into V
IN
increases to the lower
peak of the output current waveform, ramps up to the peak
value, then drops to zero at turn-off. The average current into
V
IN
during this on-time is the load current. For a worst case
calculation, C1 must supply this average load current during
the maximum on-time. The maximum on-time is calculated
using Equation 5, with a 25% tolerance added:
C1 is calculated from:
where I
O
is the load current, and V is the allowable ripple
voltage at V
IN
(1V for this example). Quality ceramic capaci-
tors with a low ESR should be used for C1. To allow for
capacitor tolerances and voltage effects, a 2.2 µF capacitor
will be used
C3: The capacitor at the V
CC
pin provides not only noise
filtering and stability, but also prevents false triggering of the
V
CC
UVLO at the buck switch on/off transitions. For this
reason, C3 should be no smaller than 0.1 µF, and should be
a good quality, low ESR, ceramic capacitor. This capacitor
also determines the initial startup delay (t1 in Figure 8).
C4: The recommended value for C4 is 0.022 µF. A high
quality ceramic capacitor with low ESR is recommended as
C4 supplies the surge current to charge the buck switch gate
at turn-on. A low ESR also ensures a complete recharge
during each off-time.
C5: This capacitor suppresses transients and ringing due to
long lead inductance at V
IN
. A low ESR, 0.1 µF ceramic chip
capacitor is recommended, located physically close to the
LM5010.
C6: The capacitor at the SS pin determines the softstart
time, i.e. the time for the reference voltage at the regulation
comparator, and the output voltage, to reach their final value.
The time is determined from the following:
Fora5mssoftstart time, C6 calculates to 0.022 µF.
FINAL CIRCUIT
The final circuit is shown in Figure 14, and its performance is
shown in Figures 15 - 18.
LM5010
www.national.com 14
Applications Information (Continued)
Item Description Part No. Package Value
C1 Ceramic Capacitor TDK C4532X7R2A225M 1812 2.2 µF, 100V
C2 Ceramic Capacitor TDK C4532X7R1E156M 1812 15 µF, 25V
C3 Ceramic Capacitor Kemet C0805C104K4RAC 0805 0.1 µF, 16V
C4, C6 Ceramic Capacitor Kemet C0805C223K4RAC 0805 0.022 µF, 16V
C5 Ceramic Capacitor TDK C2012X7R2A104M 0805 0.1 µF, 100V
D1 Ultra fast diode Central Semi CMR2U-01 SMB 100V, 2A
L1 Inductor TDK SLF10145 10.1 x 10.1 100 µH
R1 Resistor Vishay CRCW08053001F 0805 3.0 k
R2 Resistor Vishay CRCW08051001F 0805 1.0 k
R3 Resistor Vishay CRCW08052R80F 0805 2.8
R
ON
Resistor Vishay CRCW08051373F 0805 137 k
U1 Switching regulator National Semi LM5010
20119933
FIGURE 14. LM5010 Example Circuit
LM5010
www.national.com15
Applications Information (Continued)
INCREASING THE CURRENT LIMIT THRESHOLD
The current limit threshold is nominally 1.25A, with a mini-
mum guaranteed value of 1.0A. If, at maximum load current,
the lower peak of the inductor current (I
PK-
in Figure 13)
exceeds 1.0A, resistor R
CL
must be added between S
GND
and I
SEN
to increase the current limit threshold to equal or
exceed that lower peak current. This resistor diverts some of
the recirculating current from the internal sense resistor so
that a higher current level is needed to switch the internal
current limit comparator. I
PK-
is calculated from:
(11)
where I
O(max)
is the maximum load current, and I
OR(min)
is
the minimum ripple current calculated using Equation 10.
R
CL
is calculated from:
20119934
FIGURE 15. Efficiency vs V
IN
Circuit of Figure 14
20119935
FIGURE 16. Efficiency vs Load Current and V
IN
Circuit of Figure 14
20119936
FIGURE 17. Output Voltage Ripple vs V
IN
Circuit of Figure 14
20119937
FIGURE 18. Frequency vs V
IN
Circuit of Figure 14
LM5010
www.national.com 16
Applications Information (Continued)
(12)
where 0.11is the minimum value of the internal resistance
from S
GND
to I
SEN
. The next smaller standard value resistor
should be used for R
CL
. With the addition of R
CL
it is neces-
sary to check the average and peak current values to ensure
they do not exceed the LM5010 limits. At maximum load
current the average current through the internal sense resis-
tor is:
(13)
If I
AVE
is less than 2.0A no changes are necessary. If it
exceeds 2.0A, R
CL
must be reduced. The upper peak of the
inductor current (I
PK+
), at maximum load current, is calcu-
lated using the following:
(14)
where I
OR(max)
is calculated using Equation 9. If I
PK+
ex-
ceeds 3.5A , the inductor value must be increased to reduce
the ripple amplitude. This will necessitate recalculation of
I
OR(min)
,I
PK-
, and R
CL
.
When the circuit is in current limit, the upper peak current out
of the SW pin is
The inductor L1 and diode D1 must be rated for this current.
PC BOARD LAYOUT
The LM5010 regulation, over-voltage, and current limit com-
parators are very fast, and will respond to short duration
noise pulses. Layout considerations are therefore critical for
optimum performance. The layout must be as neat and
compact as possible, and all the components must be as
close as possible to their associated pins. The current loop
formed by D1, L1, C2, and the S
GND
and I
SEN
pins should be
as small as possible. The ground connection from C2 to C1
should be as short and direct as possible. If it is expected
that the internal dissipation of the LM5010 will produce high
junction temperatures during normal operation, good use of
the PC board’s ground plane can help considerably to dissi-
pate heat. The exposed pad on the IC package bottom can
be soldered to a ground plane, and that plane should both
extend from beneath the IC, and be connected to exposed
ground plane on the board’s other side using as many vias
as possible. The exposed pad is internally connected to the
IC substrate.
The use of wide PC board traces at the pins, where possible,
can help conduct heat away from the IC. The four No Con-
nect pins on the TSSOP package are not electrically con-
nected to any part of the IC, and may be connected to
ground plane to help dissipate heat from the package. Judi-
cious positioning of the PC board within the end product,
along with the use of any available air flow (forced or natural
convection) can help reduce the junction temperature.
LM5010
www.national.com17
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead TSSOP Package
NS Package Number MXA14A
10-Lead LLP Package
NS Package Number SDC10A
LM5010
www.national.com 18
Notes
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
LM5010 High Voltage 1A Step Down Switching Regulator
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated