UBA3070T/N1 - NXP SEMICONDUCTORS - Datasheet.Directory

1. General description

The UBA3070 driver IC is the first member of a first generation of power-efficient LED

backlight driver ICs. Highly efficient, flexible and reliable LED drivers can easily be

designed using the UBA3070 control IC.

2. Features and benefits

Switch-mode buck controller that drives strings of LEDs up to 600 V power-efficiently

Controller with power-efficient Boundary Conduction Mode (BCM) operation:

Virtually no reverse recove ry losses in freewheel diode

Zero Current Switching (ZCS) at switch, switch-on

Zero voltage or valley switching at switch, switch-on

Minimal required inductance value and size

Suitable for direct Pulse Width Modulation (PWM) dimming

Fast transient response through cycle-by-cycle current control, thereby:

Preventing over or undershoots in the Light Emitting Diode (LED) current

Enabling efficient PWM dimming by quickly turning the converter on and off and

thus removing the need for extra dimming switche s and high-side drivers

Single controlled input voltage required for all UBA3070 driven LED strings in RGB or

white backlighting units

No binning on LED forward voltage required

Protections:

UnderVoltage LockOut (UVLO)

Leading Edge Blanking (LEB)

OverCurrent Protection (OCP)

OverTemperature Protection (OTP)

Low cost LED driver solutio n :

No fast-switching Schottky diode required due to ZCS

No dimming switch or high-side driver required for PWM dimming

Operates with smaller inductor then a comparable fixed-frequency Continuous

Conduction Mode (CCM) controller

3. Applications

The UBA3070 is suitable for high voltage LED lighting application:

LED backlighting in LCD televisions and monitors

General lighting applications

The UBA3070 application is most efficient when driving long LED strings

UBA3070

LED backlight driver IC

Rev. 3 — 9 December 2010 Product data sheet

Product data sheet Rev. 3 — 9 December 2010 2 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

4. Ordering information

5. Block diagram

Table 1. Ordering information

Type number Package

Name Description Version

UBA3070T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

Fig 1. Block diagram of single channel 8-pin LED backlight controller UBA3070 IC

SUPPLY

MANAGEMENT

OSCILLATOR

POWER-ON

RESET

OVER-

TEMPERATURE

PROTECTION

MASK

PROTECTION

VCC

Internal

supply

UVLO Start

GND

PWM

LOGIC

VALLEY DRAIN

MASK

GATE

clamp

Iprot(mask)

100

Iprot(PWM)

UVLO

DRIVER

0.88 V

0.5 V

Short

winding

VCC < 4.5 V

Istartup(soft)

soft

start

0.5 V

SENSE

LEB

Blank

014aaa257

−

Product data sheet Rev. 3 — 9 December 2010 3 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Basic application diagram

VCC

GND

PWM

MASK

GATE

SENSE

DRAIN

HVS

Vsupply

12 V

PWM

014aaa092

UBA3070

Fig 3. Pin configuration SO8

UBA3070

VCC DRAIN

GND HVS

PWM GATE

MASK SENSE

014aaa094

Tabl e 2. Pin description

Symbol Pin S08 Description

VCC 1supply voltage

GND 2 ground

PWM 3PWM input voltage

MASK 4masking input voltage

SENSE 5resistor programmable current sense input

GATE 6gate driver output

HVS 7high voltage safety spacer: not connected

DRAIN 8drain of external MOSFET switch: input for valley sensing

Product data sheet Rev. 3 — 9 December 2010 4 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

7. Functional description

The UBA3070 is a monolithic driver IC for controlling the current through LED strings e.g.

45 green/blue/white LEDs connected in series making the UBA3070 IC especially suitable

as an LED driver.

The driver st age enables optimal per formance for serie s connected LED strings in 0D, 1D

and 2D segmented Backlight Units (BLUs). Since the UBA3070 drives an external power

device, it can be used for all kinds of BLU designs ranging from high-power to low-power

LEDs, and high-voltage to low-voltage LED strings. Therefore, the UBA3070 is an

excellent driver solution for all types of LEDs and LCD screen sizes. Combining the

UBA3070 with suitable power devices means the quantity of drivers can be minimized by

optimizing the quantity of series LEDs.

Each driver stage consists of a buck converter operating in BCM with its peak level

determined by an external sense resistor. Since the peak and zero levels are fixed by

design, the converter behaves as a current source. This gives an average LED current

throughput that is half the peak value of that through the inductor. The ripple current

through the LEDs can be selected by connectin g an exter nal capacitor in parallel with the

LEDs.

7.1 Supply management and UVLO

As long as VCC is below the VCC(startup) level of typically 10 V, the supply current remains

below 600 μA. The UBA3070 IC activates the conv erter as soon as the voltage on the VCC

pin passes the VCC(startup) level. When the voltage on VCC pin drops below the UVLO

voltage typically 8.7 V the UBA3070 IC stops switching.

7.2 Current control and PWM

If the PWM input is HIGH (> 2 V) the converter is disabled and does not switch and, LED

current remains at zero. When the PWM input pin is LOW (< 0.5 V) the converter is

enabled and operates as follows.

The external Field-Effect Transistor (FET) is turned on and current in the inductor begins

to build up. During the charg ing phase of the inductor the current is sensed across an

external sense resistor. The internal driver turns off the external FET on detecting a

voltage level of 0.52 V at the SENSE pin. The inductor now starts to freewheel its current

through the exte rn al dio de an d starts dischar ging.

Following the discharge period the switch node rings. On detection of a valley or zero

voltage on the switch node the internal driver turns on the external FET. As the FET is at

zero current and minimal voltage, this results in minimal power losses and

ElectroMagnetic Interference (EMI). The conversion cycle is repeated as described

above, until the PWM input signal is driven high to disable the converter and steers the

LED current to zero.

If the PWM pin is open circuit or no t con n ec ted , a fa ult co nditio n is assumed and the

converter stops switching. Op eration restarts as soon as the fault condition is removed.

Product data sheet Rev. 3 — 9 December 2010 5 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

7.3 Masking and valley switching

The MASK pin ensures that switch-on of the converter is at a valley during ringing and not

at a peak during freewheeling of the inductor . If the volt age level at the MASK pin is above

100 mV, then switch-on of the switching FET is prevented. If the voltage level is below

100 mV, then switch-o n pr eve ntio n of th e FET is released and at th e mo men t of valley

detection the FET is turned on. The signal for the MASK pin can be derived from the

signal at the switch node as shown in Figure 2. The current flowing into the MASK pin

must be lower than the typical stop current of 60 μA.

If the MASK pin is open circu it or no t conn ec ted , a fa ult co nd itio n is ass um e d an d the

converter stops operating immediately. Operation restarts as soon as the fault cond ition is

removed.

7.4 Conversion frequency

The maximum conversio n freq uency of the UBA3 070 is limited to 175 kHz. However, due

to production spread, the maximum conversion frequency of an individual UBA3070

sample can be as low as 145 kHz. Therefore, an inductance value must be selected so

that the applications conversion freq uency always remains below 145 kHz after taking into

account variations due to the supply volta ge, LED string voltage and component spread.

There is no limitation for the minimum conversion frequency.

7.5 Minimum on-time

The LEB time, typ ically 370 ns is a fixed dela y that determines the minimum on-time of the

controller. The LEB time prevents the MOSFET switch from switching off unintentionally

(due to coupling to the sense node) directly after the start of a conversion cycle.

7.6 OverCurrent Protection (OCP)

As the converter acts as a current source it is self-protected from overcurrent by an extra

level of protection, i.e. a second trip level of typically 0.88 V applied to the short-winding/

sense node as sh own in Figure 1. This second trip level is designed to protect the

convertor against short-circuits in external components e.g. in the diodes, inductors,

capacitors and/or LEDs. If a short-circuit is detected the convertor stops switching.

7.7 OverTemperature Protection (OTP)

OTP is provided in the UBA3070 IC and functions as follows. When the junction

temperature exceeds the thermal shutdown temperature of typically 140 °C the co nver te r

stops switching.

7.8 Driver

The driver circuit to the gate of the power FET has a current sourcing capability of

approximately 135 mA and a current sinking capability of 560 mA. This capability means

the FET operates more efficiently with fast switch-on and switch-off cycles. A low driver

source current has been chosen to limit the ΔV/Δt at switch-on thereby reducing EMI and

voltage spikes across Rsense.

Product data sheet Rev. 3 — 9 December 2010 6 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

8. Limiting values

[1] All voltages are measured with respect to ground; positive currents flow into the UBA3070 IC. The VCC pin

may not be current driven. The voltage ratings are valid provided other ratings are not violated. The current

ratings are valid provided the maximum power rating is not violated.

[2] Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

[3] Machine Model (MM): equivalent to dischar ging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω

resistor.

9. Thermal characteristics

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).[1]

Symbol Parameter Conditions Min Max Unit[1]

Voltages

VCC supply voltage current limited −0.4 +20 V

VPWM voltage on pin PWM −0.4 +5 V

VMASK voltage on pin MASK current limited −0.4 - V

VSENSE voltage on pin SENSE current limited −0.4 - V

VDRAIN voltage on pin DRAIN −0.4 +650 V

Currents

IPWM current on pin PWM - 5 mA

IMASK current on pin MASK −250 +250 μA

ISENSE current on pin SENSE −1+10 mA

IGATE current on pin GATE d < 10 % −0.8 +2 A

IDRAIN current on pin DRAIN - 5 mA

General

Ptot total power dissipation Tamb < 70 °C - 0.5 W

Tstg storage temperature −55 +150 °C

Tjjunctio n temperature −40 +145 °C

ESD

VESD electrostatic discharge

voltage - - -

all pins except pins

DRAIN and VCC;

HBM class 1

[2] -2000 V

pins DRAIN and VCC;

HBM class 1 [2] -1500 V

any pin; MM [3] -200 V

Table 4. Th ermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resist ance from junction

to ambient in free air 150 K/W

Product data sheet Rev. 3 — 9 December 2010 7 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

10. Characteristics

Table 5. Characteristics

Tamb = 25

C; VCC = 15 V; all voltages are measured with respect to groun d; currents are positive when flowing into the

UBA3070 IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VBR breakdown voltage 650 - - V

Supply voltage management (VCC pin)

VCC(startup) start-up supply voltage 9.3 10 10.6 V

VCC(UVLO) undervoltage lockout supply

voltage 8.1 8.7 9.3 V

VCC(hys) hysteresis of supply voltage VCC(startup) − VCC(UVLO) 1.0 1.3 1.6 V

ICC(oper) operating supply current no load on GATE pin 1.1 1.3 1.5 mA

ICC(startup) start-up supply current VCC < VCC(startup) - - 600 μA

ICC(prot) protection supply cu rrent VCC > VCC(UVLO) -0.85 -mA

Masking manage ment (MASK pin)

Vth(MASK) threshold voltage on pin MASK 50 100 150 mV

Vclamp(neg)(MASK) negative clamp voltage on pin

MASK IMASK = −150 μA−0.5 −0.25 −0.05 V

Vclamp(pos)(MASK) positive clamp voltage on pin

MASK IMASK = 250 μA0.5 0.7 0.9 V

Istop(pos)(MASK) positive stop current on pin MASK 54 60 66 μA

tsup(xfmr_ring) transformer ringing suppression

time start secondary stroke 1.1 1.5 1.9 μs

Iprot(MASK) protection current on pin MASK VMASK = 50 mV −50[1] -−10 nA

Oscillator

fosc(high) high oscillator frequency VPWM is LOW 145 175 205 kHz

PWM duty cycle control (PWM pin)

VIL(en)ILED(PWM) LED current enable LOW-level

input voltage on pin PWM [2] - - 0.5 V

VIH(dis)ILED(PWM) LED current disable HIGH-level

input voltage on pin PWM [2] 2.0 - - V

Iprot(PWM) protection current on pin PWM VPWM = 1.5 V −1.0[1] −0.8 −0.5 μA

Valley switch (DRAIN pin)

(ΔV/Δt)vrec valley recognition voltage change

with time −85 -+85 V/μs

td(vrec-swon) valley recognition to switch-on

delay time -150[1] -ns

OCP ( SENSE pi n)

Vsense(max) maximum sense voltage ΔV/Δt = 0.1 V/μs0.48 0.52 0.56 V

tPD propagation delay ΔV/Δt = 0.5 V/μs - 140 185 ns

Vswp short-winding protection voltage 0.83 0.88 0.95 V

tleb leading edge blanking time 300 370 440 ns

Istartup(soft) soft startup current Rsense < 0.5 V 45 60 75 μA

Product data sheet Rev. 3 — 9 December 2010 8 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

[1] Guaranteed by design.

[2] When the voltage at the PWM pin is between 0.5 V to 2.0 V the peak current and the frequency is reduced.

Driver (GATE pin)

Isource source current VCC = 9.5 V;

VGATE = 2 V -−135 -mA

Isink sink current VCC = 9.5 V;

VGATE = 2 V -240 -mA

VCC = 9.5 V;

VGATE = 9.5 V -560 -mA

Vo(max) maximum output voltage VCC > 12 V -11.5 12 V

OTP

Tpl(max) maximum protection level

temperature 130 140 150 °C

Tpl(hys) protection level hyste r esis

temperature - 8 - °C

Table 5. Characteristics …continued

Tamb = 25

C; VCC = 15 V; all voltages are measured with respect to groun d; currents are positive when flowing into the

UBA3070 IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 3 — 9 December 2010 9 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

11. Package outline

Fig 4. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10

1.45

1.25 0.25 0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6

0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004

0.057

0.049 0.01 0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15 0.05 0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

Product data sheet Rev. 3 — 9 December 2010 10 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

12. Abbreviations

13. References

[1] UM10400 — UBA3070 V1.2 demo board

Table 6. Abbreviations

Acronym Description

BCM Boundary Conduction Mode

BLU Backlight Unit

CCM Continuous Conduction Mode

EMI ElectroMagnetic Interference

FET Field-Effect Transistor

HBM Human Body Model

IC Integrated Circuit

LCD Liquid Crystal Disp lay

LEB Leading Edge Blanking

LED Light Emitting Diode

MM Machine Model

MOSFET Metal-Oxide Semiconductor Field-Effect Transistor

OCP OverCurrent Protection

OTP OverTemperature Protection

PWM Pulse Width Modulation

RGB Red/Green/Blue

UVLO UnderVoltage LockOut

ZCS Zero Current Switching

Product data sheet Rev. 3 — 9 December 2010 11 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

14. Revision history

Table 7. Re vision history

Document ID Release date Data sheet status Change no tice Supersedes

UBA3070 v.3 20101209 Product data sheet -UBA3070 v.2

Modifications: •Minor updates.

UBA3070 v.2 20080212 Product data sheet -UBA3070 v.1

Modifications: •The minimum value for junction temperature has been updated in Table 3.

UBA3070 v.1 20080605 Product data sheet - -

Product data sheet Rev. 3 — 9 December 2010 12 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

15. Legal information

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[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

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Limiting values — Stress above one or more limiting values (as defined in

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Characteristics sections of this document is not warranted. Constant or

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Document status[1][2] Product status[3] Definition

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Product [short] dat a sheet Production This document cont ains the product specification.

Product data sheet Rev. 3 — 9 December 2010 13 of 16

NXP Semiconductors UBA3070

LED backlight driver IC

Quick reference data — The Quick reference data is an extract of the

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16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 3 — 9 December 2010 14 of 16

continued >>

NXP Semiconductors UBA3070

LED backlight driver IC

17. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2

Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .3

Table 3. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .6

Tab le 4. Thermal characteristics . . . . . . . . . . . . . . . . . . .6

Table 5. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .7

Table 6. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .10

Table 7. Revision history . . . . . . . . . . . . . . . . . . . . . . . .11

Product data sheet Rev. 3 — 9 December 2010 15 of 16

continued >>

NXP Semiconductors UBA3070

LED backlight driver IC

18. Figures

Fig 1. Block diagram of single channel 8-pin LED

backlight controller UBA3070 IC . . . . . . . . . . . . . .2

Fig 2. Basic application diagram . . . . . . . . . . . . . . . . . . .3

Fig 3. Pin configuration SO8 . . . . . . . . . . . . . . . . . . . . . .3

Fig 4. Package outline SOT96-1 (SO8). . . . . . . . . . . . . .9

NXP Semiconductors UBA3070

LED backlight driver IC

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 9 December 2010

Document identifier: UBA3070

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

19. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Sup ply ma nagement and UVLO. . . . . . . . . . . . 4

7.2 Current control and PWM. . . . . . . . . . . . . . . . . 4

7.3 Masking and valley switching . . . . . . . . . . . . . . 5

7.4 Conversion frequency. . . . . . . . . . . . . . . . . . . . 5

7.5 Minimum on-time . . . . . . . . . . . . . . . . . . . . . . . 5

7.6 OverCurrent Protection (OCP) . . . . . . . . . . . . . 5

7.7 OverTemperature Protection (OTP) . . . . . . . . . 5

7.8 Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Thermal characteristics . . . . . . . . . . . . . . . . . . 6

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10

13 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12

15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

16 Contact information. . . . . . . . . . . . . . . . . . . . . 13

17 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

18 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16