1. Product profile
1.1 General description
Low capacitance 7-fold bidirectional ESD protection diode arrays in small plastic
packages designed for the protection of up to seven transmission or data lines from
damage caused by ElectroStatic Discharge (ESD) and other transients.
1.2 Features
1.3 Applications
1.4 Quick reference data
PESD5V0L7BAS;
PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode
arrays
Rev. 02 — 25 November 2004 Product data sheet
Table 1: Product overview
Type number Package
Name Philips
PESD5V0L7BAS TSSOP8 SOT505-1
PESD5V0L7BS SO8 SOT96-1
■ESD protection of up to seven lines ■Ultra low leakage current: IRM = 3 nA
■Low diode capacitance ■ESD protection of up to 10 kV
■Max. peak pulse power: Ppp = 35 W ■IEC 61000-4-2, level 4 (ESD)
■Low clamping voltage: V(CL)R = 17 V ■IEC 61000-4-5 (surge); Ipp = 2.5 A.
■Computers and peripherals ■High speed data lines
■Communication systems ■Parallel ports.
■Audio and video equipment
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse stand-off voltage - - 5 V
Cddiode capacitance VR = 0 V;
f = 1 MHz - 8 10 pF
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 2 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
2. Pinning information
3. Ordering information
4. Marking
Table 3: Pinning
Pin Description Simplified outline Symbol
TSSOP8
1 cathode 1
2 cathode 2
3 cathode 3
4 cathode 4
5 cathode 5
6 cathode 6
7 cathode 7
8 cathode 8
SO8
1 cathode 1
2 cathode 2
3 cathode 3
4 cathode 4
5 cathode 5
6 cathode 6
7 cathode 7
8 cathode 8
14
85 8
7
6
5
1
2
3
4
sym005
4
5
1
88
7
6
5
1
2
3
4
sym005
Table 4: Ordering information
Type number Package
Name Description Version
PESD5V0L7BAS TSSOP8 plastic thin shrink small outline package; 8 leads;
body width 3 mm SOT505-1
PESD5V0L7BS SO8 plastic small outline package; 8 leads;
body width 3.9 mm SOT96-1
Table 5: Marking codes
Type number Marking code
PESD5V0L7BAS 5V0L7B
PESD5V0L7BS 5V0L7BS
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 3 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
5. Limiting values
[1] Non-repetitive current pulse 8/20 µs exponentially decaying waveform according to IEC61000-4-5; see
Figure 1.
[1] Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses; see Figure 2.
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
Ppp peak pulse power 8/20 µs pulse [1] -35W
Ipp peak pulse current 8/20 µs pulse [1] - 2.5 A
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 7: ESD maximum ratings
Symbol Parameter Conditions Min Max Unit
ESD electrostatic discharge
capability IEC 61000-4-2
(contact discharge) [1] -10kV
HBM MIL-STD883 - 10 kV
Table 8: ESD standards compliance
ESD Standard Conditions
IEC 61000-4-2, level 4 (ESD); see Figure 2 > 8 kV (contact)
HBM MIL-STD883, class 3 > 4 kV
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 4 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
Fig 1. 8/20 µs pulse waveform according to
IEC 61000-4-5. Fig 2. ElectroStatic Discharge (ESD) pulse waveform
according to IEC 61000-4-2.
t (µs)
0403010 20
001aaa630
40
80
120
Ipp
(%)
0
e−t
100 % Ipp; 8 µs
50 % Ipp; 20 µs
001aaa191
Ipp
100 %
90 %
t
30 ns 60 ns
10 %
tr = 0.7 to 1 ns
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 5 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
6. Characteristics
[1] Non-repetitive current pulse 8/20 µs exponentially decaying waveform according to IEC61000-4-5; see Figure 1.
Table 9: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRWM reverse stand-off voltage - - 5 V
IRM reverse leakage current VRWM = 5 V; see Figure 6 - 3 25 nA
V(CL)R clamping voltage Ipp = 1 A [1] - - 11 V
Ipp = 2.5 A [1] - - 17 V
V(BR) breakdown voltage IR = 1 mA 7.2 7.6 7.9 V
rdif differential resistance IR = 1 mA - - 100 Ω
Cddiode capacitance VR = 0 V; f = 1 MHz;
see Figure 5 - 8 10 pF
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 6 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
Tamb = 25 °C.
Fig 3. Peak pulse power as a function of exponential
pulse duration tp; typical values. Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical
values.
Tamb = 25 °C; f = 1 MHz.
Fig 5. Diode capacitance as a function of reverse
voltage; typical values. Fig 6. Relative variation of reverse leakage current as
a function of junction temperature; typical
values.
001aaa192
tp (µs)
110
4
103
10 102
10
102
Ppp
(W)
1
Tj (°C)
0 20015050 100
001aaa193
0.4
0.8
1.2
Ppp
0
Ppp(25˚C)
VR (V)
054231
001aaa142
7
8
9
Cd
(pF)
6
001aaa143
1
10
IRM
0
Tj (°C)
−100 150100050−50
IRM(25°C)
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 7 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
Fig 7. ESD clamping test set-up and waveforms.
006aaa062
450 Ω
50 Ω
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
DUT: PESD5V0L7BAS
PESD5V0L7BS
RG 223/U
50 Ω coax
RZ
CZ
ESD TESTER 4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
vertical scale = 200 V/div
horizontal scale = 50 ns/div vertical scale = 10 V/div
horizontal scale = 50 ns/div
vertical scale = 200 V/div
horizontal scale = 50 ns/div vertical scale = 10 V/div
horizontal scale = 50 ns/div
GND
GND
GND
unclamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network) clamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
GND
unclamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network) clamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 8 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
7. Application information
The PESD5V0L7BAS and the PESD5V0L7BS are designed for protection of up to seven
bidirectional data lines from the damage caused by ElectroStatic Discharge (ESD) and
surge pulses. The PESD5V0L7BAS and the PESD5V0L7BS may be used on lines whose
signal polarities are above and below ground.
The PESD5V0L7BAS and the PESD5V0L7BS provide a surge capability of 35 W per line
for a 8/20 µs waveform.
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, EFT and surge transients.
The following guidelines are recommended:
1. Place the protection device as close as possible to the input terminal or connector.
2. Minimize the path length between the protection device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all printed-circuit board conductive loops including power and group loops.
6. Minimize the length of transient return paths to ground.
7. Avoid using shared return paths to a common ground point.
8. Ground planes should be used whenever possible.
9. Use vias for multilayer printed-circuit boards.
Fig 8. Typical application for ESD protection of seven lines carrying bidirectional data.
006aaa063
high speed
data lines
PESD5V0L7BAS
PESD5V0L7BS
GND
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 9 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
8. Package outline
Fig 9. Package outline SOT505-1 (TSSOP8).
UNIT A1
A
max. A2A3bpLHELpwyv
ceD(1) E(2) Z(1) θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.45
0.25 0.28
0.15 3.1
2.9 3.1
2.9 0.65 5.1
4.7 0.70
0.35 6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1 99-04-09
03-02-18
wM
bp
D
Z
e
0.25
14
85
θ
A
A2A1
Lp
(A3)
detail X
L
HE
E
c
vMA
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
1.1
pin 1 index
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 10 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
Fig 10. Package outline SOT96-1 (SO8/MS-012).
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.05 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
99-12-27
03-02-18
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 11 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
9. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Table 10: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
1000 2500
PESD5V0L7BAS SOT505-1 8 mm pitch, 12 mm tape and reel - -118
PESD5V0L7BS SOT96-1 8 mm pitch, 12 mm tape and reel -115 -118
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 12 of 14
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
10. Revision history
Table 11: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PESD5V0L7BAS_BS_2 20041125 Product data sheet - 9397 750 13705 PESD5V0L7BS_1
Modifications: •The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•PESD5V0L7BAS added
•Table 1: product overview added
•Section 9 Packing information added
PESD5V0L7BS_1 20040315 Product specification - 9397 750 12249 -
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
9397 750 13705 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 25 November 2004 13 of 14
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 25 November 2004
Document number: 9397 750 13705
Published in The Netherlands
Philips Semiconductors PESD5V0L7BAS; PESD5V0L7BS
Low capacitance 7-fold bidirectional ESD protection diode arrays
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Application information. . . . . . . . . . . . . . . . . . . 8
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Packing information. . . . . . . . . . . . . . . . . . . . . 11
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 13
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 Contact information . . . . . . . . . . . . . . . . . . . . 13
