AMPLIMITE HD-22 Straight Front Metal Shell Connectors 114-13199
Rev
A10
of 12 Tyco Electronics Corporation
B. Soldering Guidelines
AMPLIMITE HD–22 Straight Front Metal Shell Connectors can be soldered using wave or equivalent
soldering techniques. The temperatures and exposure time shall be within the ranges specified in
Figure 10.
Manual 402-40 provides some guidelines for establishing soldering practices. Refer to Paragraph 2.4, Manuals.
SOLDERING TEMPERATURE TIME
PROCESS CELSIUS FAHRENHEIT (At Max Temp)
WAVE SOLDERING 265
°
+5
°
s
509
°
+9
°
s
10 +.5 Seconds
s
Wave Temperature
Figure 10
C. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. The following is a listing of common cleaning solvents
that will not affect the connectors for the time and temperature specified. See Figure 11.
Cleaners must be free of dissolved flux and other contaminants. We recommend cleaning with the pc
board on its edge. If using an aqueous cleaner, we recommend standard equipment such as a soak–tank
or an automatic in–line machine.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however Tyco
Electronics does not recommend them because of the harmful occupational and environmental effects. Both are
carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earth's ozone layer.
If you have a particular solvent that is not listed, contact the Tooling Assistance Center or Product Information number
at the bottom of page 1.
CLEANER TIME TEMPERATURE
NAME TYPE (Minutes) (Maximum)
ALPHA 2110 Aqueous 1 132
_
C [270
_
F]
BIOACT EC-7 Solvent 5 100
_
C [212
_
F]
Butyl CARBITOL Solvent 1 Ambient Room
Isopropyl Alcohol Solvent 5 100
_
C [212
_
F]
KESTER 5778 Aqueous 5 100
_
C [212
_
F]
KESTER 5779 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 520 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 530 Aqueous 5 100
_
C [212
_
F]
Terpene Solvent Solvent 5 100
_
C [212
_
F]
Figure 11
D. Drying
When drying cleaned assemblies and printed circuit boards, make certain that temperature limitations are
not exceeded: –55
_
to 105
_
C [–67
_
to 221
_
F]. Excessive temperatures may cause housing degradation.
NOTE
i
DANGER
NOTE
i