nanoX-BT Extreme Rugged COM Express(R) Mini Size Type 10 Module with Intel Atom(R) E3800 series or Celeron(R) Processor SoC Features Single, dual, quad-core Intel Atom(R) or Celeron(R) Processor SoC Up to 4GB soldered Dual Channel DDR3L at 1333MHz One DDI channel, one LVDS (build option, eDP) Three PCIe x1 GbE, two SATA 3Gb/s, four USB and one USB client Supports Smart Embedded Management Agent (SEMA(R)) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System CPU Single, dual, quad-core Intel Atom(R) or quad-core Celeron(R) Atom(R) E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333) Atom(R) E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333) Atom(R) E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066) Atom(R) E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066) Atom(R) E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066) Atom(R) E3805 1.33 GHz (No GFX) 3W (2C/1066) Celeron(R) N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)Celeron(R) J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333) Supports: Single, dual or quad Out-of-Order Execution (OOE) processor cores, Intel(R) VT-x, Intel(R) SSE4.1 and SSE4.2, Intel(R) 64 architecture, IA 32-bit , PCLMULQDQ Instruction DRNG, Intel(R) Thermal Monitor (TM1 & TM2) Note: Availability of features may vary between processor SKUs. Memory Single channel non-ECC 1333/1066 MHz soldered DDR3L memory up to 4GB (2GB or 4GB) Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS Cache Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data cache 2MB for E3845, N2930 and J1900 1MB for E3827, E3826, E3825 and E3805 512K for E3815 Expansion Busses 3 PCI Express x1 Gen2 (AB): Ianes 0/1/2; optional PCIe x4 (lose GbE) LPC bus, SMBus (system), I2C (user) SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Watchdog Timer Debug Headers 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset on break out board GPU Feature Support 7th generation Intel(R) graphics core architecture with four execution units supporting two independent displays 3D graphics hardware acceleration Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2 Video decode hardware acceleration including support for H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats Video encode hardware acceleration including support for H.264, MPEG2 and MVC formats Digital Display Interface One DDI channel supporting DisplayPort/HDMI/DVI LVDS/eDP Single channel 18/24-bit LVDS (BOM option support for 24-bit EDID panel) eDP support (build option) Audio Chipset Intel(R) HD Audio integrated in SOC Audio Codec Located on carrier miniBASE-10R Ethernet Intel(R) MAC/PHY: Intel(R) i210LM (MAC/PHY) Ethernet controller Interface: 10/100/1000 GbE connection Note: "Build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with "build options" will need to be created and may cause production lead times. Specifications I/O Interfaces USB: 1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and 1x USB 2.0 client (USB 7) SATA: Two SATA 3 Gb/s ports Serial: 2 UART ports COM 0/1 (COM 0 support console redirection) eMMC: Optional soldered on module bootable eMMC flash storage 8G to 32 GB SD: Optional, SD support multiplexed over GPIO pins eMMC and SD functions may vary between OS GPIO: 4 GPO and 4 GPI Super I/O On carrier if needed (standard support for W83627DHG-P) Power Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Wide Input: ATX = 5-14V / 5Vsb (standard temp. only) AT = 5-14V (standard temp. only) Management: ACPI 4.0 compliant, Smart Battery support Power States: C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5 ECO mode: Supports deep S5 (ECO mode) for power saving Mechanical and Environmental Form Factor: PICMG COM.0: Rev 2.1 Type 10 Dimension: Mini size: 84 mm x 55 mm Operating Temperature Standard: 0C to +60C Extreme Rugged: -40 to +85C (build option, AtomTM E38xx series only) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating Systems Standard Support Windows 7/8 32/64-bit, Windows 10 64-bit, Linux 32/64-bit Extended Support (BSP) WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit Note: "Build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with "build options" will need to be created and may cause production lead times. Functional Diagram eDP (optional) LVDS eDP to LVDS RTL2132 DDI1 eDP 1 lane DDI2 4 lanes 1x USB 1.1/2.0/3.0 (port 0) 3x USB 1.1/2.0 (port 1~3) 1x USB 1.1/2.0 client (port 7) Intel Atom(R) E3845 E3827 E3826 E3825 E3815 Soldered 1-2 GB DDR3L non ECC (only) Intel(R) Celeron(R) N2930 J1900 3 PCIe x1 Gen2 (port 0~2) PCIe x1 alternative route GbE i210 PCIe x1 Gen2 (port 3) (formerly "Baytrail") On break-out board XDP 60-pin 2x SATA 3Gb/s (port 0/1) eMMC HD Audio 8GB/16GB/ 32GB 2 UART (Tx/Rx) LPC Bus SDIO/MMC port 0 (optional) 4x GP0, 4x GPI GPIO PCA9535 SMBus GP I2C DDC I2C SPI_CS# SPI SEMA BMC SPI0 BIOS LM73 to CPU Ordering Information Accessories nanoX-BT-E3845-2G COM Express(R) Mini Size Type 10 with Intel Atom(R) E3845 at 1.91 GHz and 2GB non ECC DDR3L Heat Spreaders nanoX-BT-E3827-2G COM Express(R) Mini Size Type 10 with Intel Atom(R) E3827 at 1.75 GHz and 2GB non ECC DDR3L nanoX-BT-E3826-2G COM Express(R) Mini Size Type 10 with Intel Atom(R) E3826 at 1.46 GHz and 2GB non ECC DDR3L HTS-nXBT-B Heatspreader for nanoX-BT with threaded standoffs for bottom mounting HTS-nXBT-BT Heatspreader for nanoX-BT with through hole standoffs for top mounting Passive Heatsinks nanoX-BT-E3825-2G COM Express(R) Mini Size Type 10 with Intel Atom(R) E3825 at 1.33 GHz and 2GB non ECC DDR3L nanoX-BT-E3815-2G COM Express(R) Mini Size Type 10 with Intel Atom(R) E3815 at 1.46 GHz and 2GB non ECC DDR3L nanoX-BT-E3805-2G COM Express Mini Size Type 10 with Intel Atom(R) E3805 at 1.33 GHz and 2GB non ECC DDR3L nanoX-BT-N2930-2G COM Express Mini Size Type 10 with Intel(R) Celeron(R) N2930 at 1.83 GHz and 2GB non ECC DDR3L nanoX-BT-J1900-2G COM Express(R) Mini Size Type 10 with Intel(R) Celeron(R) J1900 at 2.00 GHz and 2GB non ECC DDR3L THS-nXBT-B Low profile heatsink for nanoX-BT with threaded standoffs for bottom mounting THS-nXBT-BT Low profile heatsink for nanoX-BT with through hole standoffs for top mounting THSM-nXBT-B High profile heatsink for nanoX-BT with threaded standoffs for bottom mounting Starter Kit COM Express Type 10 Starter Kit Plus COM Express formfactor starter kit with miniBase-10R carrier board, power supply, and accessory kit www.adlinktech.com All products and company names listed are trademarks or trade names of their respective companies. Updated Dec. 10, 2019. (c)2019 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.