Avago Technologies
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Description
The new Avago ALMD-xx3D LED series has the same or just
slightly less luminous intensity than conventional high
brightness, through-hole LEDs.
The new LED lamps can be assembled using common SMT
assembly processes and are compatible with industrial reflow
soldering processes.
The LEDs are made with an advanced optical grade epoxy for
superior performance in outdoor sign applications.
For easy pick and place assembly, the LEDs are shipped in
EIA-compliant tape and reel. Every reel is shipped from a single
intensity and color bin– except the red color–for better
uniformity.
CAUTION InGaN devices are Class 1C HBM ESD sensitive,
AlInGaP devices are Class 1B ESD sensitive per
JEDEC Standard. Please observe appropriate
precautions during handling and processing.
Refer to Application Note AN-1142 for additional
details.
CAUTION Customer is advised to keep the LED in the MBB
when not in use as prolonged exposure to
environment might cause the silver-plated leads
to tarnish, which might cause difficulties in
soldering.
Features
Compact form factor
High brightness material
Available in Red, Amber, Green, and Blue colors
—Red AlInGaP 626 nm
—Amber AlInGaP 590 nm
—Green InGaN 525 nm
—Blue InGaN 470 nm
JEDEC MSL 2A
Compatible with industrial reflow soldering process
Typical Viewing angle: 30°
Tinted, non-diffused
Applications
Variable message signs
ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
High Brightness SMT Round LED Lamps
Amber, Red, Green, and Blue Tinted LEDs
Data Sheet
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Package Dimensions
Package Dimensions
NOTE
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm unless other specified.
3. Copper lead frame.
Device Selection Guide
Part Number Color and Dominant
Wavelength d (nm) Typa
a. Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
Luminous Intensity Iv (mcd)b,c,d
b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
c. The optical axis is closely aligned with the package mechanical axis.
d. Tolerance for each bin limit is ± 15%.
Viewing Angle Typ - ° e
e. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
Min Max
ALMD-EG3D-VX002 Red 626 4200 9300 30°
ALMD-EL3D-VX002 Amber 590 4200 9300
ALMD-CM3D-Y1002 Green 525 9300 21000
ALMD-CB3D-SU002 Blue 470 1900 4200
CA
1.4 (4x)
Package Marking
C
C
AA
4.20 ± 0.20
4.20 ± 0.20
4.75 ± 0.50
2.50 ± 0.20
3.40 ± 0.50
6.50 ± 0.50
A: Anode
C: Cathode
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Part Numbering System
Part Numbering System
Absolute Maximum Rating, TJ = 25 °C
A L M D - x1 x2 x3 x4 - x5 x6 x7 x8 x9
Code Description Option
x1 Package type E
C
Round AlInGaP
Round InGaN
x2 Color B
G
L
M
Blue
Red
Amber
Green
x3 Viewing angle 3 30°
x4 Product specification designation D
x5 Minimum intensity bin Refer to device selection guide
x6 Maximum intensity bin Refer to device selection guide
x7 Color bin selection 0 Full distribution
x8x9 Packaging option 02 Tested 20 mA, 13-inch carrier tape
Parameter Red and Amber Blue and Green Unit
DC Forward Current a
a. Derate linearly as shown in Figure 4 and Figure 9.
50 30 mA
Peak Forward Current 100b
b. Duty Factor 30%, frequency 1 kHz.
100c
c. Duty Factor 10%, frequency 1 kHz.
mA
Power Dissipation 120 114 mW
Reverse Voltage 5 (IR = 100 μA)d
d. Indicates product final testing; long-term reverse bias is not recommended.
5 (IR = 10 μA)dV
LED Junction Temperature 110 °C
Operating Temperature Range –40 to +85 °C
Storage Temperature Range –40 to +100 °C
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Electrical/Optical Characteristics, TJ = 25 °C
Electrical/Optical Characteristics, TJ = 25 °C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red
Amber
Green
Blue
VF1.8
1.8
2.8
2.8
2.1
2.1
3.2
3.2
2.4
2.4
3.8
3.8
VI
F = 20 mA
Reverse Voltage
Red and Amber
Green and Blue
VR5
5
V
IR = 100 μA
IR = 10 μA
Dominant Wavelengtha
Red
Amber
Green
Blue
a. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
d618.0
584.5
519.0
460.0
626.0
590.0
525.0
470.0
630.0
594.5
539.0
480.0
IF = 20 mA
Peak Wavelength
Red
Amber
Green
Blue
PEAK 634
594
516
464
nm Peak of Wavelength of Spectral Distribution at
IF = 20 mA
Thermal Resistance RJ-PIN 130 °C/W LED Junction-to-Pin
Luminous Efficacyb
Red
Amber
Green
Blue
b. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous
efficacy in lumens/watt.
V200
520
530
65
lm/W Emitted Luminous Power/Emitted Radiant
Power
Thermal coefficient of d
Red
Amber
Green
Blue
0.059
0.103
0.028
0.024
nm/°C IF = 20 mA; +25 °C ≤ TJ ≤ +100 °C
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
AlInGaP
AlInGaP
Figure 1 Relative Intensity vs. Wavelength Figure 2 Forward Current vs. Forward Voltage
0
0.2
0.4
0.6
0.8
1
500 550 600 650
WAVELENGTH - nm
RELATIVE INTENSITY
Red
Amber
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5
3
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
Figure 3 Relative Intensity vs. Forward Current Figure 4 Maximum Forward Current vs. Ambient Temperature
NOTE RJ-A = 460 °C/W.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 20 40 60 80 100
FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Red
Amber
0
10
20
30
40
50
60
020406080
100
T
A
- AMBIENT TEMPERATURE (°C)
MAXIMUM FORWARD CURRENT - mA
Figure 5 Relative Dominant Wavelength Shift vs. Forward Current
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20406080100
FORWARD CURRENT - mA
RELATIVE DOMINANT WAVELENGTH
SHIFT(NORMALIZED AT 20mA) - nm
Red
Amber
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
InGaN
InGaN
Figure 6 Relative Intensity vs. Wavelength Figure 7 Forward Current vs. Forward Voltage
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
0
20
40
60
80
100
012345
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
Figure 8 Relative Intensity vs. Forward Current Figure 9 Maximum Forward Current vs. Ambient Temperature
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 20 40 60 80 100 120
DC FORWARD CURRENT-mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Green
Blue
Figure 10 Dominant Wavelength Shift vs. Forward Current
-10
-5
0
5
10
0 20406080100
FORWARD CURRENT-mA
RELATIVE DOMINANT
WAVELENGTH SHIFT -nm
Green
Blue
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
InGaN
Figure 11 Radiation Pattern for X Axis Figure 12 Component Axis for Radiation Pattern
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
X
X
Package Marking
C
C
AA
Figure 13 Relative Intensity Shift vs. Junction Temperature Figure 14 Forward Voltage Shift vs. Junction Temperature
0.1
1
10
-40 -15 10 35 60 85
NORMALZIED INTENSITY (PHOTO)
Red
Amber
Blue
Green
TJ - JUNCTION TEMPERATURE
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
-40 -15 10 35 60 85
TJ - JUNCTION TEMPERATURE
FORWARD VOLTAGE SHIFT-V
Red
Amber
Green
Blue
Figure 15 Recommended Soldering Land Pattern
NOTE Recommended stencil thickness is 0.1524 mm
(6 mils) minimum and above.
5.2
2.1
4.0
0.7
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
InGaN
Figure 16 Carrier Tape Dimension
Figure 17 Reel Dimension
4.50±0.20
2.20±0.20
2.00±0.20
4.00±0.20
8.00±0.20
16.00±0.30
7.50±0.20
1.75±0.20
7.10±0.20
5.30±0.20
0.50±0.10
1.80±0.20
5.20±0.20
O 1.55±0.20
O 1.60±0.20
O 100 ± 0.50
O 330 MAX.
16.40 ± 0.20
13.00 ± 0.20
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Intensity Bin Limit Table (1.3:1 lv Bin Ratio)
Figure 18 Unit Orientation from Reel
Intensity Bin Limit Table (1.3:1 lv Bin
Ratio)
Tolerance for each bin limit is ± 15%.
VF Bin Table (V at 20 mA) for Red and
Amber
Tolerance for each bin limit is ± 0.05 V.
2 anode leads lead unreeling direction
Bin
Intensity (mcd) at 20 mA
Min Max
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
1 16000 21000
Bin ID Min Max
VD1.8 2.0
VA2.0 2.2
VB2.2 2.4
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Red Color Range
Red Color Range
Tolerance for each bin limit is ± 0.5 nm.
Amber Color Range
Tolerance for each bin limit is ± 0.5 nm.
Green Color Range
Tolerance for each bin limit is ± 0.5 nm.
Blue Color Range
Tolerance for each bin limit is ± 0.5 nm.
Min Dom Max Dom X min Y Min X max Y max
618.0 630.0 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Bin Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 584.5 587.0 0.5420 0.4580 0.5530 0.4400
0.5370 0.4550 0.5570 0.4420
2 587.0 589.5 0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
4 589.5 592.0 0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
6 592.0 594.5 0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Bin Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 519.0 523.0 0.0667 0.8323 0.1450 0.7319
0.1200 0.7375 0.0979 0.8316
2 523.0 527.0 0.0979 0.8316 0.1711 0.7218
0.1450 0.7319 0.1305 0.8189
3 527.0 531.0 0.1305 0.8189 0.1967 0.7077
0.1711 0.7218 0.1625 0.8012
4 531.0 535.0 0.1625 0.8012 0.2210 0.6920
0.1967 0.7077 0.1929 0.7816
5 535.0 539.0 0.1929 0.7816 0.2445 0.6747
0.2210 0.6920 0.2233 0.7600
Bin Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2 464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
3 468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
4 472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
5 476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Packing Label
Packing Label
(i) Mother Label (Available on MBB Bag)
(ii) Baby Label (Available on Plastic Reel)
For acronyms and definitions, see the next page.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: OEAT01
Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e4 Max Temp 260C MSL 2a
(1P) PART #: Part Number
(1T) Lot #: Lot Number
(9D)MFG Date: Manufacturing Date
C/0: Country of Origin
(1T) TAPE DATE: Taping Date
(Q) QTY: Quantity
(9D) Date Code: Date Code
BABY LABEL COSBOO1B V0.0
CAT Intensity Bin
BIN Refer to Below information
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Soldering
Acronyms and Definitions
BIN:
(i) Color bin only or VF bin only
(Applicable for part numbers with color bins but without
VF bin or part numbers with VF bins and no color bin)
(ii) Color bin incorporated with VF bin
Applicable for part numbers that have both color bin and
VFbin
Example:
a. Color bin only or VF bin only
BIN: 4 (represent color bin 4 only)
BIN: VA (represent VF bin “VA” only)
b. Color bin incorporate with VF bin
BIN: 4 VA
VA: VF bin “VA”
4: Color bin 4 only
Soldering
Recommended reflow soldering condition:
(i) Leaded reflow soldering (ii) Lead-free reflow soldering
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°
C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
1. Reflow soldering must not be done more than two times.
Make sure you take the necessary precautions for handling
a moisture-sensitive device, as stated in the following
section.
2. Recommended board reflow direction:
3. Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
4. It is preferred that you use reflow soldering to solder the
LED. Use hand soldering only for rework if unavoidable but
must be strictly controlled to the following conditions:
—Soldering iron tip temperature = 320 °C max.
—Soldering duration = 3 sec max.
—Number of cycles = 1 only
—Power of soldering iron = 50 W max.
5. Do not touch the LED body with a hot soldering iron
except the soldering terminals as this may damage the
LED.
6. For de-soldering, it is recommended that you use a double
flat tip.
7. Please confirm beforehand whether the functionality and
performance of the LED is affected by hand soldering.
REFLOW SOLDERING
Avago Technologies
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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
Data Sheet
Precautionary Notes
Precautionary Notes
1. Handling precautions
For automated pick and place, Avago has tested nozzle
size below made with urethane material to be working fine
with this LED. However, due to the possibility of variations
in other parameters such as pick and place machine
maker/model and other settings of the machine, customer
is recommended to verify the nozzle selected.
NOTE
a. Nozzle tip should touch the LED flange during pick
and place.
b. Outer dimensions of the nozzle should be able to fit
into the carrier tape pocket.
2. Handling of moisture-sensitive device
This product has a Moisture Sensitive Level 2a rating per
JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
a. Before use
An unopened moisture barrier bag (MBB) can be
stored at <40 °C / 90%RH for 12 months. If the
actual shelf life has exceeded 12 months and the
humidity indicator card (HIC) indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
It is recommended that the MBB not be opened
prior to assembly (e.g., for IQC).
b. Control after opening the MBB
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
The LEDs must be kept at <30 °C / 60%RH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
c. Control for unfinished reel
Unused LEDs must be stored in a sealed MBB with
desiccant or desiccator at <5%RH.
d. Control of assembled boards
If the PCB soldered with the LEDs is to be
subjected to other high temperature processes,
the PCB must be stored in sealed MBB with
desiccant or desiccator at <5%RH to ensure that
all LEDs have not exceeded their floor life of
672 hours.
e. Baking is required if:
The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
The LEDs are exposed to condition of >30°C / 60%
RH at any time.
The LED floor life exceeded 672 hrs.
The recommended baking condition is: 60 °C ±5 ºC for
20 hrs. Baking should only be done once.
f. Storage
The soldering terminals of these Avago LEDs are
silver plated. If the LEDs are being exposed in
ambient environment for too long, the silver
plating might be oxidized and thus affecting its
solderability performance. As such, unused LEDs
must be kept in sealed MBB with desiccant or in
desiccator at <5%RH.
3. Application precautions
a. Drive current of the LED must not exceed the
maximum allowable limit across temperature as
stated in the data sheet. Constant current driving is
recommended to ensure consistent performance.
b. LEDs do exhibit slightly different characteristics at
different drive currents that might result in larger
performance variations (i.e., intensity, wavelength,
and forward voltage). The user is recommended to set
the application current as close as possible to the test
current to minimize these variations.
c. The LED is not intended for reverse bias. Do use other
appropriate components for such purposes. When
driving the LED in matrix form, it is crucial to ensure
that the reverse bias voltage does not exceed the
allowable limit of the LED.
d. Avoid rapid change in ambient temperature,
especially in high humidity environments, because
this will cause condensation on the LED.
e. If the LED is intended to be used in outdoor or harsh
environments, the LED leads must be protected with
suitable potting material against damages caused by
rain water, oil, corrosive gases, etc. It is recommended
to have louver or shade to reduce direct sunlight on
the LEDs.
Pick & Place nozzle
LED ange
>3.5mm 4.8 mm
4.4 mm
3.9 mm
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago Technologies and the A logo are trademarks of Avago Technologies in the United
States and other countries. All other brand and product names may be trademarks of their
respective companies.
Data subject to change. Copyright © 2015–2016 Avago Technologies. All Rights Reserved.
AV02-2372EN – April 15, 2016
4. Eye safety precautions
LEDs may pose optical hazards when in operation. It is not
advisable to view directly at operating LEDs because it
may be harmful to the eyes. For safety reasons, use
appropriate shielding or personal protective equipment.
DISCLAIMER: Avago’s products and software are not specifically
designed, manufactured or authorized for sale as parts,
components or assemblies for the planning, construction,
maintenance or direct operation of a nuclear facility or for use in
medical devices or applications. Customer is solely responsible,
and waives all rights to make claims against Avago or its suppliers,
for all loss, damage, expense or liability in connection with such
use.