Express-SL/SLE COM Express Basic Size Type 6 Module with 6th Gen Intel(R) CoreTM, Intel(R) Xeon(R) and Celeron(R) Processor Features 6th Gen Intel(R) CoreTM, Intel(R) Xeon(R) and Celeron(R) Processor Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz New (supports both ECC and non-ECC memory) 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3) GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0 Supports Smart Embedded Management Agent (SEMA(R)) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System CPU Debug Headers Mobile Intel(R) Xeon(R), CoreTM and Celeron(R) Processors - 14nm Xeon(R) E3-1515M v5 2.8/3.7GHz (Turbo), 45W (4C/GT4e) Xeon(R) E3-1505M v5 2.8/3.7GHz (Turbo), 45W (4C/GT2) Xeon(R) E3-1505L v5 2.0/2.8GHz (Turbo), 25W (4C/GT2) CoreTM i7-6820EQ 2.8/3.5GHz (Turbo), 45W (4C/GT2) CoreTM i7-6822EQ 2.0/2.8GHz (Turbo), 25W (4C/GT2) CoreTM i5-6440EQ 2.7/3.4GHz (Turbo), 45W (4C/GT2) CoreTM i5-6442EQ 1.9/2.7GHz (Turbo), 25W (4C/GT2) CoreTM i3-6100E 2.7GHz (no Turbo), 35W (2C/GT2) CoreTM i3-6102E 1.9GHz (no Turbo), 25W (2C/GT2) Celeron(R) G3900E 2.4GHz (no Turbo), 35W (2C/GT1) Celeron(R) G3902E 1.6GHz (no Turbo), 25W (2C/GT1) Supports: Intel(R) VT, Intel(R) TXT, Intel(R) SSE4.2, Intel(R) HT Technology, Intel(R) 64 Architecture, Execute Disable Bit, Intel(R) Turbo Boost Technology 2.0, Intel(R) AVX2, Intel(R) AES-NI, PCLMULQDQ Instruction, Intel(R) Secure Key and Intel(R) TSX. 40-pin flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset Note: Availability of the features may vary between processor SKUs. Memory Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH) Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel(R) AMT 11.0 support Cache Video GPU Feature Support Intel(R) Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC eDP 4 lane support optional, in place of LVDS Audio 8MB for Xeon(R) and CoreTM i7, 6MB for CoreTM i5, 3MB for CoreTM i3, 2MB for Celeron(R) Chipset PCH Intel(R) HD Audio integrated in chipset CM236 (supports ECC memory, Intel(R) AMT) QM170 (supports non-ECC, Intel(R) AMT) HM170 (supports non-ECC, no Intel(R) AMT support) Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 2 PCI Express x2 (Gen3): CD connector, Lanes 6/7 LPC bus, SMBus (system) , I2C (user) Audio Codec located on carrier Express-BASE6 (ALC886 standard supported) Ethernet Intel(R) MAC/PHY: i219LM/V (LM with AMT 11.0 support) Interface: 10/100/1000 GbE connection Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Specifications I/O Interfaces USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7) SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirection GPIO: 4 GPO and 4 GPI Super I/O Supported on carrier if needed (standard support for W83627DHG-P) TPM Chipset: Atmel AT97SC3204 Type: TPM1.2/2.0 (TPM 2.0 support with project basis) Power Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Wide Input: ATX = 8.5-20 V / 5Vsb 5% or AT = 8.5 ~20V (Standard temp. only) Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving Operating Systems Standard Support Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit, VxWorks Mechanical and Environmental Form Factor: PICMG COM.0, Rev 2.1 Type 6 Dimension: Basic size, 125 mm x 95 mm Operating Temperature Standard: 0C to 60C Extreme Ruggeed: -40C to +85C (build option) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Intelligent Middleware SEMA(R) Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM) Extended Support (BSP) WES 7 32/64-bit, Linux 64-bit, VxWorks Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Functional Diagram SODIMM 1 XDP 60 1867/2133 MHz 4-16 GB DDR4 Mobile Intel(R) Xeon(R) SODIMM 2 6th Gen Intel(R) CoreTM i7/i5/i3 Processor 1867/2133 MHz 4-16 GB DDR4 single/dual 18/24 bit LVDS eDP - LVDS DDI 2 DP/HDMI/DVI Intel(R) Celeron(R) Processor DDI 3 DP/HDMI/DVI (formerly "Skylake-H") PCIe x16 (Gen3) 2 x8 or 1 x8 + 2 x4 UMI eDP x4 lanes (optional) DDI 1 DP/HDMI/DVI 6x PCIex1 (Gen3) (port 0-5) 2x PCIe x1 (Gen3) (port 6/7) PCIe x1 LAN I219 4x SATA 6Gb/s (port 0/1/2/3) 8x USB 2.0 HD Audio UART0/1 LPC to UART Debug header TPM Mobile Intel(R) QM170/HM170/ CM236 Chipset 4x USB 3.0 (port 0/1/2/3) LPC bus SMBus GPIO SPI 0 BIOS SMBus 4x GPO, 4x GPI New SEMA BMC GP I2C DDC I2C SPI_CS# SPI SPI 1 BIOS LM73 Sensor Ordering Information Accessories Express-SLE-E3-1515M v5 Basic COM Express Type 6 module with Intel(R) Xeon(R) E3-1515M v5 and GT4e level graphics, CM236 chipset, support ECC Express-SLE-E3-1505M v5 Basic COM Express Type 6 module with Intel(R) Xeon(R) E3-1505M v5 and GT2 level graphics, CM236 chipset, support ECC Express-SLE-E3-1505L v5 Basic COM Express Type 6 module with Intel(R) Xeon(R) E3-1505L v5 and GT2 level graphics, CM236 chipset, support ECC Express-SL-i7-6820EQ Basic COM Express Type 6 module with Intel(R) CoreTM i7-6820EQ and GT2 level graphics, QM170 chipset Express-SL-i7-6822EQ Basic COM Express Type 6 module with Intel(R) CoreTM i7-6822EQ, and GT2 level graphics, QM170 chipset Express-SL-i5-6440EQ Basic COM Express Type 6 module with Intel(R) CoreTM i5-6440EQ and GT2 level graphics, QM170 chipset Express-SL-i5-6442EQ Basic COM Express Type 6 module with Intel(R) CoreTM i5-6442EQ and GT2 level graphics, QM170 chipset Express-SL-i3-6100E Basic COM Express Type 6 module with Intel(R) CoreTM i3-6100E and GT2 level graphics, HM170 chipset Express-SL-i3-6102E Basic COM Express Type 6 module with Intel(R) CoreTM i3-6102E and GT2 level graphics, HM170 chipset Express-SL-G3900E Basic COM Express Type 6 module with Intel(R) Celeron(R) G3900E and GT1 level graphics, HM170 chipset Express-SL-G3902E Basic COM Express Type 6 module with Intel(R) Celeron(R) G3902E and GT1 level graphics, HM170 chipset Heat Spreaders HTS-SL-B Heatspreader for Express-SL with threaded standoffs for bottom mounting HTS-SL-BT Heatspreader for Express-SL with through hole standoffs for top mounting Passive Heatsinks THS-SL-BL Low profile heatsink for Express-SL with threaded standoffs for bottom mounting THS-SL-BT Low profile heatsink for Express-SL with through hole standoffs for top mounting THSH-SL-BL High profile heatsink for Express-SL with threaded standoffs for bottom mounting Active Heatsink THSF-SL-BL High profile heatsink with fan for Express-SL with threaded standoffs for bottom mounting Starter Kit Starterkit-COM Express 6 PLUS COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Feb. 24, 2017. (c)2017 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.