1. Product profile
1.1 General description
Planar low capacitance Schottky barrier diodes with an integrated guard ring for stress
protection, encapsulated in very small SMD plastic packages.
1.2 Features
■Very low diode capacitance
■Low forward voltage
■Very small SMD plastic packages.
1.3 Applications
■Digital applications:
◆Ultra high-speed switching
◆Clamping circuits.
■RF applications:
◆Diode ring mixer
◆RF detector
◆RF voltage doubler.
1.4 Quick reference data
1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
Rev. 03 — 24 November 2004 Product data sheet
Table 1: Product overview
Type number Package Configuration
Philips JEITA
1PS66SB62 SOT666 - triple isolated diode
1PS76SB62 SOD323 SC-76 single diode
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current - - 20 mA
VRreverse voltage - - 40 V
Cddiode capacitance VR = 0 V; f = 1 MHz - - 0.6 pF
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 2 of 10
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
Table 3: Pinning
Pin Description Simplified outline Symbol
1PS66SB62 (SOT666)
1 anode (diode 1)
2 anode (diode 2)
3 anode (diode 3)
4 cathode (diode 3)
5 cathode (diode 2)
6 cathode (diode 1)
1PS76SB62 (SOD323)
1 cathode [1]
2 anode
SOT666
123
456 6
1
5
2
4
3
sym046
21
sym001
12
Table 4: Ordering information
Type number Package
Name Description Version
1PS66SB62 - plastic surface mounted package; 6 leads SOT666
1PS76SB62 SC-76 plastic surface mounted package; 2 leads SOD323
Table 5: Marking codes
Type number Marking code
1PS66SB62 N3
1PS76SB62 S6
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 3 of 10
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
5. Limiting values
6. Thermal characteristics
[1] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating will be available on request.
[2] Refer to SOT666 standard mounting conditions.
[3] Reflow soldering is the only recommended soldering method.
[4] Refer to SOD323 (SC-76) standard mounting conditions.
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 40 V
IFforward current - 20 mA
Tjjunction temperature - 125 °C
Tamb ambient temperature −65 +125 °C
Tstg storage temperature −65 +150 °C
Table 7: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
SOT666 [2] [3] - - 700 K/W
SOD323 [4] - - 450 K/W
Table 8: Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF = 2 mA; see Figure 1 [1] - - 800 mV
IRreverse current VR = 40 V; see Figure 2 [1] --1µA
Cddiode capacitance VR = 0 V; f = 1 MHz;
see Figure 3 - - 0.6 pF
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 4 of 10
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
(1) Tamb = 125 °C.
(2) Tamb =85°C.
(3) Tamb =25°C.
(1) Tamb = 125 °C.
(2) Tamb =85°C.
(3) Tamb =25°C.
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
Tamb =25°C; f = 1 MHz.
Fig 3. Diode capacitance as a function of reverse voltage; typical values
20
(1)
(2)
VF (V)
IF
(mA)
0.4 0.8 1.2 1.6
10
1
10−1
10−2
mld553
(3)
4020100
(1)
(2)
(3)
VR (V)
IR
(nA)
30
mld554
104
103
102
10
1
10−1
0VR (V)
Cd
(pF)
10 20 40
0.40
0.20
0.36
30
0.32
0.28
0.24
mld555
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 5 of 10
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
8. Package outline
Fig 4. Package outline SOT666
UNIT bpcDE e1HELpw
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
01-08-27
04-11-08
IEC JEDEC JEITA
mm 0.27
0.17 0.18
0.08 1.7
1.5 1.3
1.1 0.5
e
1.0 1.7
1.5 0.1
y
0.1
DIMENSIONS (mm are the original dimensions)
0.3
0.1
SOT666
bp
pin 1 index
D
e1
e
A
Lp
detail X
HE
E
A
S
0 1 2 mm
scale
A
0.6
0.5
c
X
123
456
Plastic surface mounted package; 6 leads SOT666
YS
wMA
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 6 of 10
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
Fig 5. Package outline SOD323 (SC-76)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOD323 SC-76
SOD323
99-09-13
03-12-17
Note
1. The marking bar indicates the cathode
UNIT A
mm 0.05
1.1
0.8 0.40
0.25 0.25
0.10 1.8
1.6 1.35
1.15 2.7
2.3 0.45
0.15
A1
max
DIMENSIONS (mm are the original dimensions)
Plastic surface mounted package; 2 leads
01
(1)
21
2 mm
scale
bpc D E HDQ
0.25
0.15
Lpv
0.2
A
D
A
E
Lp
bp
detail X
A1c
Q
HDvA
M
X
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 7 of 10
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
9. Packing information
[1] For further information and the availability of packing methods see Section 14.
Table 9: Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 4000 10000
1PS66SB62 SOT666 4 mm pitch, 8 mm tape and reel - -115 -
1PS76SB62 SOD323 4 mm pitch, 8 mm tape and reel -115 - -135
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 8 of 10
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
10. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
1PS66SB62_
1PS76SB62_3 20041124 Product data sheet - 9397 750 13845 1PS76SB62_2
Modifications: •The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•Type number 1PS66SB62 added
•Section 1.1: text redefined
•Section 1.2: text redefined
•Section 1.3: RF applications added
•Table 2: table added
•Table 9: table added.
1PS76SB62_2 20040126 Product specification - 9397 750 12622 1PS76SB62_1
1PS76SB62_1 20010216 Product specification - 9397 750 08024 -
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
9397 750 13845 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 03 — 24 November 2004 9 of 10
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 24 November 2004
Document number: 9397 750 13845
Published in The Netherlands
Philips Semiconductors 1PS66SB62; 1PS76SB62
40 V, 20 mA low Cd Schottky barrier diodes
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 7
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 9
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information . . . . . . . . . . . . . . . . . . . . . 9
