MPC5646C Microcontroller DataSheet, Rev. 5.1
Freescale2
Table of Contents
1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Document Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3 Package pinouts and signal descriptions . . . . . . . . . . . . . . . . .9
3.1 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.2 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
3.3 Functional ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
4.1 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . .38
4.2 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.2.1 NVUSRO [PAD3V5V(0)] field description . . . . .39
4.2.2 NVUSRO [PAD3V5V(1)] field description . . . . .39
4.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . .39
4.4 Recommended operating conditions . . . . . . . . . . . . . .41
4.5 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . .44
4.5.1 Package thermal characteristics . . . . . . . . . . . .44
4.5.2 Power considerations . . . . . . . . . . . . . . . . . . . .44
4.6 I/O pad electrical characteristics. . . . . . . . . . . . . . . . . .45
4.6.1 I/O pad types . . . . . . . . . . . . . . . . . . . . . . . . . . .45
4.6.2 I/O input DC characteristics. . . . . . . . . . . . . . . .45
4.6.3 I/O output DC characteristics. . . . . . . . . . . . . . .46
4.6.4 Output pin transition times. . . . . . . . . . . . . . . . .49
4.6.5 I/O pad current specification . . . . . . . . . . . . . . .50
4.7 RESET electrical characteristics. . . . . . . . . . . . . . . . . .52
4.8 Power management electrical characteristics. . . . . . . .54
4.8.1 Voltage regulator electrical characteristics . . . .54
4.8.2 VDD_BV options . . . . . . . . . . . . . . . . . . . . . . . .55
4.8.3 Voltage monitor electrical characteristics. . . . . .56
4.9 Low voltage domain power consumption . . . . . . . . . . .57
4.10 Flash memory electrical characteristics . . . . . . . . . . . .59
4.10.1 Program/Erase characteristics. . . . . . . . . . . . . .59
4.10.2 Flash memory power supply DC characteristics61
4.10.3 Flash memory start-up/switch-off timings . . . . .62
4.11 Electromagnetic compatibility (EMC) characteristics . .62
4.11.1 Designing hardened software
to avoid noise problems . . . . . . . . . . . . . . . . . . . . . . . .62
4.11.2 Electromagnetic interference (EMI) . . . . . . . . . 63
4.11.3 Absolute ma ximum ratings (electrical sensitivity)63
4.12 Fast external crystal oscillator (4–40 MHz)
electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
4.13 Slow external crystal oscillator (32 kHz)
electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
4.14 FMPLL electrical characteristics . . . . . . . . . . . . . . . . . 69
4.15 Fast internal RC oscillator (16 MHz)
electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
4.16 Slow internal RC oscillator (128 kHz)
electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.17 ADC electrical characteristics . . . . . . . . . . . . . . . . . . . 71
4.17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
4.18 Fast Ethernet Controller . . . . . . . . . . . . . . . . . . . . . . . 81
4.18.1 MII Receive Signal Timing
(RXD[3:0], RX_DV, RX_ER, and RX_CLK). . . . . . . . . 81
4.18.2 MII Transmit Signal Timing
(TXD[3:0], TX_EN, TX_ER, TX_CLK) . . . . . . . . . . . . . 81
4.18.3 MII Async Inputs Signal Timing
(CRS and COL). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
4.18.4 MII Serial Management Channel Timing
(MDIO and MDC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
4.19 On-chip peripherals. . . . . . . . . . . . . . . . . . . . . . . . . . . 84
4.19.1 Current consumption . . . . . . . . . . . . . . . . . . . . 84
4.19.2 DSPI characteristics. . . . . . . . . . . . . . . . . . . . . 86
4.19.3 Nexus characteristics. . . . . . . . . . . . . . . . . . . . 94
4.19.4 JTAG characteristics . . . . . . . . . . . . . . . . . . . . 96
5 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
5.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . 98
5.1.1 176 LQFP package mechanical drawing . . . . . 98
5.1.2 208 LQFP package mechanical drawing . . . . 101
5.1.3 256 MAPBGA package mechanical drawing . 106
6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
7 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109