HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Prelimi nary Data
Issued Date : 2000.04.15
Revised Date : 2000. 04.20
Page No. : 1/3
HSMC Product Specifi cation
HSMA400X Series
1.0AMP. SURFACE MOUNT RE CTIFIE RS
Features
• For surface mounted application
• Low forward voltage drop
• High current capability
• Easy pick and place
• High surge current capability
• Plastic material used carries Underwriters Laboratory Classification 94V-0
• High temperature soldering: 250°C/10 seconds at terminals
Mechanical Data
• Case: SMA/DO-214AC Molded Plastic.
• Terminals: Solder plated.
• Polarity: Indicated by cathode band.
• Packaging: 12mm tape per EIA STD RS-481.
• Weight: 0.064 gram.
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resist ive
or inductive load. For capacitive load, derate current by 20%.
Type Number HSMA
4001 HSMA
4002 HSMA
4003 HSMA
4004 HSMA
4005 HSMA
4006 HSMA
4007 Units
Maximum Recurrent Peak Reverse Voltage 50 100 200 400 600 800 1000 V
Maximum RMS Voltage 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage 50 100 200 400 600 800 1000 V
Maximum Average
Forward Rectified Current @TL=110°C1A
Peak Forward Surge Current, 8.3ms Single
Half Sine-wave Superimposed on
Rated Load(JEDEC method) 30 A
Maximum Instantaneous
Forward Voltage @ 1.0A 1.1 V
Maximum DC Reverse Current at
Rated DC Blocking Volt age 5(@Ta=25°C)
50(@Ta=125°C) uA
Maximum Reverse Recovery Time (Note 1) 1.8 uS
Typical Junction Capacitance (Note 2) 12 pF
Operating Temperature Range Tj -55 to +150 °C
Storage Temperature Range Tstg -55 to +150 °C
Note1: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note2: Measured at 1 MHz and Applied VR=4.0Volts
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Prelimi nary Data
Issued Date : 2000.04.15
Revised Date : 2000. 04.20
Page No. : 2/3
HSMC Product Specifi cation
Characteristics Curve
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Prelimi nary Data
Issued Date : 2000.04.15
Revised Date : 2000. 04.20
Page No. : 3/3
HSMC Product Specifi cation
SMA/DO-214AC Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.5000 0.0642 1.27 1.63 E 0.0299 0.0598 0.76 1.52
B 0.0901 0.1150 2.29 2.92 F 0.0039 0.0079 0.10 0.20
C 0.1575 0.1811 4.00 4.60 G 0.1890 0.2201 4.80 5.59
D 0.0783 0.1028 1.99 2.61 H 0.0059 0.0122 0.15 0.31
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controll i ng dimens ion : millim eters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing m ethod, please contact your l ocal HSMC sal es office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin famil y, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liabilit y for any cons equence of customer product design, infringem ent of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerit y Mic roel ectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hs i n-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
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