1. General description
The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in
an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump
wafer level chip-size package (WLCSP8). The device is fabricated in a 1 µm
Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily
developed for portable digital audio applications.
The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be
used at low supply voltages.
2. Features
nWide temperature range
nNo switch ON/OFF clicks
nExcellent power supply ripple rejection
nLow power consumption
nShort-circuit resistant
nHigh performance
uHigh signal-to-noise ratio
uHigh slew rate
uLow distortion
nLarge output voltage swing
3. Quick reference data
TDA1308; TDA1308A
Class-AB stereo headphone driver
Rev. 04 — 25 January 2007 Product data sheet
Table 1. Quick reference data
V
DD
=5V; V
SS
=0V; T
amb
=25
°
C; f
i
= 1 kHz; R
L
=32
Ω
; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VDD supply voltage TDA1308
single supply 3.0 5.0 7.0 V
dual supply 1.5 2.5 3.5 V
TDA1308A
single supply 2.4 5.0 7.0 V
dual supply 1.2 2.5 3.5 V
VSS negative supply
voltage TDA1308; dual supply −1.5 −2.5 −3.5 V
TDA1308A; dual supply −1.2 −2.5 −3.5 V
IDD supply current no load - 3 5 mA
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 2 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
[1] VDD =5V; V
O(p-p) = 3.5 V (at 0 dB).
[2] VDD = 2.4 V; VO(p-p) = 1.62 V (at −4.8 dBV); for TDA1308A only.
[3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.
4. Ordering information
Ptot total power
dissipation no load - 15 25 mW
Pomaximum output
power (THD + N)/S < 0.1 % [1] - 4080mW
(THD + N)/S total harmonic
distortion plus
noise-to-signal
ratio
[1] - 0.03 0.06 %
[1] -−70 −65 dB
RL=5kΩ[2] -−92 −89 dB
RL=5kΩ[3] -−52 −40 dB
RL=5kΩ-−101 - dB
S/N signal-to-noise
ratio 100 110 - dB
αcs channel
separation -70-dB
RL=5kΩ[1] - 105 - dB
PSRR power supply
ripple rejection fi= 100 Hz;
Vripple(p-p) = 100 mV -90-dB
Tamb ambient
temperature −40 - +85 °C
Table 1. Quick reference data
…continued
V
DD
=5V; V
SS
=0V; T
amb
=25
°
C; f
i
= 1 kHz; R
L
=32
Ω
; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Ordering information
Type number Package
Name Description Version
TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TDA1308T SO8 plastic small outline package; 8 leads; body width
3.9 mm SOT96-1
TDA1308AT SO8 plastic small outline package; 8 leads; body width
3.9 mm SOT96-1
TDA1308AUK WLCSP8 wafer level chip-size package; 8 bumps;
0.61 ×0.84 ×0.38 mm TDA1308AUK
TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads;
body width 3 mm SOT505-1
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 3 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
5. Block diagram
6. Pinning information
6.1 Pinning
6.2 Pin description
Fig 1. Block diagram
2
1
3
4
8
7
6
5
INA(neg)
TDA1308(A)
OUTA
mka779
VSS
VDD
INA(pos)
INB(neg)
INB(pos)
OUTB
Fig 2. Pin configuration TDA1308(A) Fig 3. Pin configuration TDA1308AUK
TDA1308(A)
OUTA VDD
INA(neg) OUTB
INA(pos) INB(neg)
VSS INB(pos)
001aaf782
1
2
3
4
6
5
8
7
123
A
B
C
D
TDA1308AUK
E
001aaf800
Transparent top view
bump A1
index area
Table 3. Pin description TDA1308(A)
Symbol Pin Description
OUTA 1 output A
INA(neg) 2 inverting input A
INA(pos) 3 non-inverting input A
VSS 4 negative supply
INB(pos) 5 non-inverting input B
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 4 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
7. Internal circuitry
INB(neg) 6 inverting input B
OUTB 7 output B
VDD 8 positive supply
Table 4. Pin description TDA1308AUK
Symbol Pin Description
OUTA A1 output A
VSS A3 negative supply
INA(pos) B2 non-inverting input A
OUTB C1 output B
INA(neg) C3 inverting input A
INB(neg) D2 inverting input B
VDD E1 positive supply
INB(pos) E3 non-inverting input B
Table 3. Pin description TDA1308(A)
…continued
Symbol Pin Description
Fig 4. Equivalent schematic diagram
mka781
A1
A2
M2 M3
M6
M5
M4
I1
Cm
VDD
INA/B(neg)
INA/B(pos)
OUTA/B
VSS
D4
M1
D3D2D1
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 5 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
8. Limiting values
[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
[2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.
9. Thermal characteristics
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0 8.0 V
tSC(O) output short-circuit duration Tamb =25°C;
Ptot =1W 20 - s
Tstg storage temperature −65 +150 °C
Tamb ambient temperature −40 +85 °C
Vesd electrostatic discharge
voltage HBM [1] −2+2kV
MM [2] −200 +200 V
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction
to ambient
DIP8 109 K/W
SO8 210 K/W
TSSOP8 220 K/W
WLCSP8 1000 K/W
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 6 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
10. Characteristics
Table 7. Characteristics
V
DD
=5V; V
SS
=0V; T
amb
=25
°
C; f
i
= 1 kHz; R
L
=32
Ω
; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
VDD supply voltage TDA1308
single supply 3.0 5.0 7.0 V
dual supply 1.5 2.5 3.5 V
TDA1308A
single supply 2.4 5.0 7.0 V
dual supply 1.2 2.5 3.5 V
VSS negative supply voltage TDA1308; dual supply −1.5 −2.5 −3.5 V
TDA1308A; dual supply −1.2 −2.5 −3.5 V
IDD supply current no load - 3 5 mA
Ptot total power dissipation no load - 15 25 mW
Static characteristics
VI(os) input offset voltage - 10 - mV
Ibias input bias current - 10 - pA
VCM common mode voltage 0 - 3.5 pA
GVopen-loop voltage gain RL=5kΩ-70-dB
IOmaximum output current - 60 - mA
ROoutput resistance (THD + N)/S < 0.1 % - 0.25 - Ω
VOoutput voltage swing [1] 0.75 - 4.25 V
RL=16Ω[1] 1.5 - 3.5 V
RL=5kΩ[1] 0.1 - 4.9 V
αcs channel separation - 70 - dB
RL=5kΩ[1] - 105 - dB
PSRR power supply ripple rejection fi= 100 Hz; Vripple(p-p) = 100 mV - 90 - dB
CLload capacitance - - 200 pF
Dynamic characteristics
(THD + N)/S total harmonic distortion
plus noise-to-signal ratio [2] - 0.03 0.06 %
[2] -−70 −65 dB
RL=5kΩ[3] -−92 −89 dB
RL=5kΩ[3] -−52 −40 dB
RL=5kΩ[3] - 0.25 1.0 %
RL=5kΩ[2] -−101 - dB
RL=5kΩ[2] - 0.0009 - %
S/N signal-to-noise ratio 100 110 - dB
fGunity gain frequency open-loop; RL=5kΩ- 5.5 - MHz
Pomaximum output power (THD + N)/S < 0.1 % - 40 80 mW
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 7 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
[1] Values are proportional to VDD; (THD + N)/S < 0.1 %.
[2] VDD =5V; V
O(p-p) = 3.5 V (at 0 dB).
[3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.
11. Application information
Ciinput capacitance - 3 - pF
SR slew rate unity gain inverting - 5 - V/µs
B bandwidth unity gain inverting - 20 - kHz
Table 7. Characteristics
…continued
V
DD
=5V; V
SS
=0V; T
amb
=25
°
C; f
i
= 1 kHz; R
L
=32
Ω
; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Fig 5. Example of application with TDA1545A (stereo continuous calibration DAC)
mka783
1
2
3
5
6
74
8
R5
10 kΩ
R6
10 kΩ
C3
1 µF
R1
22 kΩ
C8
C7
R4
C4
R3
C5
1 nF
R2
BCK
WS
DATA
VDD
Vref
5
4
1
2
36
7
8
3.9 kΩ
33 kΩ
C2
10 µFC1
100 nF
3.9 kΩ
1 nF
100 µF
100 µF
C6
100 µF
TDA1308(A)TDA1545A
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 8 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
12. Test information
Fig 6. Measurement circuit for inverting application
mka782
1
2
3
5
6
74
8
RL
VOUTA
VDD
VINA
VINB
Vref
(typ. 2.5 V)
RL
VOUTB
3.9 kΩ
3.9 kΩ
3.9 kΩ
3.9 kΩ
100 µF
100 µF
C6
100 µF
TDA1308(A)
Fig 7. Open-loop gain as a function of input frequency Fig 8. Crosstalk as a function of input frequency
0
40
80
mka784
10−210−3fi (Hz)
Gv
(dB)
10−410−510−610−710−8
no load
RL = 32 Ω
−130
−110
−70
−90
mka785
10−2
10−110−310−410−5
fi (Hz)
Gv
(dB)
32 Ω
RL = 16 Ω
5 kΩ
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 9 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
12.1 Quality information
The
General Quality Specification for Integrated Circuits, SNW-FQ-611
is applicable.
Fig 9. Output power as a function of supply voltage Fig 10. Total harmonic distortion plus noise-to-signal
ratio as a function of input frequency
3
Po
(mW)
4VDD (V)
5
100
10
20
40
60
mka786
RL = 16 Ω
32 Ω
8 Ω
−110
−90
−70
−50
mka787
10−110−210−310−410−5
fi (Hz)
RL = 5 kΩ; VO(p−p) = 3.5 V
RL = 32 Ω; Po = 50 mW
RL = 16 Ω; Po = 50 mW
(THD+N)/S
(dB)
Fig 11. Total harmonic distortion plus noise-to-signal ratio as a function of output voltage
level
−40
−80
−100
−60
mka788
10−210−1110
RL = 8 Ω
16 Ω
32 Ω
5 kΩ
fi = 1 kHz
VO(p−p) (V)
(THD+N)/S
(dB)
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 10 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
13. Package outline
Fig 12. Package outline SOT97-1 (DIP8)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT97-1 99-12-27
03-02-13
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0450.17 0.02 0.13
b2
050G01 MO-001 SC-504-8
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 11 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
Fig 13. Package outline SOT96-1 (SO8)
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.05 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
99-12-27
03-02-18
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 12 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
Fig 14. Package outline SOT505-1 (TSSOP8)
UNIT A1
A
max. A2A3bpLHELpwyv
ceD(1) E(2) Z(1) θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.45
0.25 0.28
0.15 3.1
2.9 3.1
2.9 0.65 5.1
4.7 0.70
0.35 6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1 99-04-09
03-02-18
wM
bp
D
Z
e
0.25
14
85
θ
A
A2A1
Lp
(A3)
detail X
L
HE
E
c
vMA
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
1.1
pin 1 index
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 13 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
Fig 15. Package outline TDA1308AUK (WLCSP8)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
TDA1308AUK
TDA1308AUK
06-11-20
06-12-15
UNIT A
max
mm 0.49 0.10
0.07 0.39
0.37 0.65
0.57 0.88
0.80 0.396 0.588 0.05 0.08
A1
DIMENSIONS (mm are the original dimensions)
WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm
0 0.25 0.5 mm
scale
A2b
0.123
0.091
D E e1e2v
0.15
w y
b
e2
e1
1/4 e2
1/2 e2
1/2 e1AC B
∅ vMC∅ wM
3
A
C
B
D
E
12
B A
bump A1
index area
D
E
C
y
X
AA2
A1
detail X
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 14 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
14. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
•Through-hole components
•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•Board specifications, including the board finish, solder masks and vias
•Package footprints, including solder thieves and orientation
•The moisture sensitivity level of the packages
•Package placement
•Inspection and repair
•Lead-free soldering versus PbSn soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
•Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
•Solder bath specifications, including temperature and impurities
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 15 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
•Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 16) than a PbSn process, thus
reducing the process window
•Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
•Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 16.
Table 8. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 9. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 16 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 17 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
15. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TDA1308_A_4 20070125 Product data sheet - TDA1308_A_3
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors
•Legal texts have been adapted to the new company name where appropriate
•Type number TDA1308AUK has been added
TDA1308_A_3 20020719 Product specification - TDA1308_A_2
TDA1308_A_2 20020227 Product specification - TDA1308_1
TDA1308_1 19940905 Product specification - -
TDA1308_A_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 25 January 2007 18 of 19
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors TDA1308; TDA1308A
Class-AB stereo headphone driver
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 January 2007
Document identifier: TDA1308_A_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Application information. . . . . . . . . . . . . . . . . . . 7
12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
12.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 14
14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 14
14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 14
14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 15
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
17 Contact information. . . . . . . . . . . . . . . . . . . . . 18
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
