BGS14PN10 SP4T high linearity, high power RF Switch Data Sheet Revision 1.3 - 2016-08-24 Power Management & Multimarket Edition 2016-08-24 Published by Infineon Technologies AG 81726 Munich, Germany c 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGS14PN10 Confidential Revision History Document No.: BGS14PN10.pdf Revision History: 1.3 Previous Version: 1.2 Page Subjects (major changes since last revision) 1 Updated title Trademarks of Infineon Technologies AG AURIXTM , C166TM , CanPAKTM , CIPOSTM , CIPURSETM ,CoolGaNTM ,CoolMOSTM , CoolSETTM , CoolSiCTM , CORECONTROLTM , DAVETM , DI-POLTM ,EasyPIMTM , EconoBRIDGETM , EconoDUALTM , EconoPACKTM , EconoPIMTM , EiceDRIVERTM , eupecTM , FCOSTM , HITFETTM , HybridPACKTM , ISOFACETM , I2 RFTM , IsoPACKTM , MIPAQTM , ModSTACKTM , my-dTM , NovalithICTM , OmniTuneTM , OptiMOSTM , ORIGATM , OPTIGATM , PROFETTM , PRO-SILTM , PRIMARIONTM , PrimePACKTM , RASICTM , ReverSaveTM , SatRICTM , SIEGETTM , SIPMOSTM , SOLID FLASHTM , SmartLEWISTM , TEMPFETTM , thinQ!TM , TriCoreTM , TRENCHSTOPTM . Other Trademarks Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM , ARMTM , MULTI-ICETM , PRIMECELLTM , REALVIEWTM , THUMBTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM , FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM , NUCLEUSTM of Mentor Graphics Corporation. MifareTM of NXP. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Sattelite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM , PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM , WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2012-12-13 Data Sheet 3 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential Contents Contents 1 Features 5 2 Product Description 6 3 Maximum Ratings 7 4 Operation Ranges 8 5 Logic Table 8 6 RF Characteristics for RF1 and RF3 9 7 RF Characteristics for RF2 and RF4 10 8 RF large signal parameter 11 9 Package Outline and Pin Configuration 13 List of Figures 1 2 3 4 5 6 BGS14PN10 block diagram . . Pinout (top view) . . . . . . . . Package Dimensions Drawing . Land pattern and stencil mask Marking . . . . . . . . . . . . . Tape drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 14 14 15 15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 8 8 8 9 10 11 11 12 12 12 13 13 List of Tables 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Ordering Information . . . . . Maximum Ratings, Table I . . Maximum Ratings, Table II . . Operation Ranges . . . . . . Logic Table . . . . . . . . . . RF Specifications . . . . . . . RF Specifications . . . . . . . RF large signal Specifications RF large signal Specifications Logic Table . . . . . . . . . . Logic Table . . . . . . . . . . Logic Table . . . . . . . . . . Pin description . . . . . . . . Mechanical data . . . . . . . Data Sheet . . . . . . . . . . . . . . 4 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential BGS14PN10 SP4T high linearity, high power RF Switch 1 Features * High max RF power: 40 dBm CW @ 900 MHz, room temperature * Two ultra-low loss ports (RF1 and RF3): 0.19 dB @ f=0.9 GHz, PIN =38 dBm 0.29 dB @ f=1.9 GHz, PIN =38 dBm 0.51 dB @ f=2.7 GHz, PIN =33 dBm 1.20 dB @ f=3.8 GHz, PIN =33 dBm 1.90 dB @ f=5.8 GHz, PIN =33 dBm * Two low loss ports (RF2 and RF4): 0.32 dB @ f=0.9 GHz, PIN =38 dBm 0.40 dB @ f=1.9 GHz, PIN =38 dBm 0.64 dB @ f=2.7 GHz, PIN =33 dBm 1.19 dB @ f=3.8 GHz, PIN =33 dBm 1.78 dB @ f=5.8 GHz, PIN =33 dBm * No DC decoupling components required, if no external DC is applied on RF ports * High ESD robustness * Low harmonic generation * High linearity RF1/RF3 72 dBm IIP3 RF2/RF4 74 dBm IIP3 * No power supply blocking required * Supply voltage range: 1.8 to 3.6 V * No insertion loss change within supply voltage range * No linearity change within supply voltage range * Suitable for EDGE / C2K / LTE / WCDMA / SV-LTE Applications * Mobile cellular Rx/Tx applications, suitable for LTE/3G * Applicable for main path and entire RF-Front-end without any power restrictions in mobile communication DL/UL CA and MIMO Micro/Pico Cells / Cellular base stations Test equipment Suitable for SV-LTE * 0.5 to 6.0 GHz coverage * Small form factor 1.1 mm x 1.5 mm * 400 m pad pitch * RoHS and WEEE compliant package Data Sheet 5 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential 2 Product Description The BGS14PN10 is a Single Pole Quad Throw (SP4T) RF antenna aperture switch optimized for mobile phone applications up to 6.0 GHz. This single supply chip integrates on-chip CMOS logic driven by a two simple, CMOS or TTL compatible control input signals. Unlike GaAs technology, the 0.1 dB compression point exceeds the switch maximum input power level, resulting in linear performance at all signal levels and external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. Table 1: Ordering Information Type Package Marking Chip BGS14PN10 TSNP10-1 4P M4821C Data Sheet 6 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential VBATT RFC Voltage Regulator CTRL1 CTRL2 Driver Chargepump GND RF2 RF3 RF1 RF4 Figure 1: BGS14PN10 block diagram 3 Maximum Ratings Table 2: Maximum Ratings, Table I at TA = 25 C, unless otherwise specified Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition 1) Frequency Range f 0.5 - - GHz Supply voltage VDD -0.5 - 3.6 V - - Storage temperature range TSTG -55 - 150 RF input power PRF _TRx - - 40 dBm C ESD capability Human Body Model VESDHBM -1 - +1 kV ESD capability ANT port (according VESDANT -8 - +8 kV 125 IEC 61000-4-2 contact) Junction temperature 1) 25% duty cycle On application board with 27nH shunt inductor Tj - - C - Switch has no highpass response. There is also a high ohmic DC to the RF path. The DC voltage at RF ports VRFDC has to be 0V. Data Sheet 7 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential Table 3: Maximum Ratings, Table II at TA = 25 C, unless otherwise specified Parameter Symbol Maximum DC-voltage on RF-Ports Values Unit Note / Test Condition 0 V No DC voltages allowed on 3.3 V - Unit Note / Test Condition Min. Typ. Max. VRFDC 0 - VCTRL -0.7 - and RF-Ground RF-Ports Control Voltage Levels 4 Operation Ranges Table 4: Operation Ranges Parameter Symbol Values Min. Typ. Max. Supply voltage VDD 1.8 2.85 3.6 V - Supply current1) IDD - 75 120 A - Control voltage low VCtrl,low 0 0.45 V - Control voltage high VCtrl,high 1.2 1.8 2.85 V VCtrl,high VDD Control current low ICtrl,low -1 0 1 A - Control current high ICtrl,high -1 0 1 A VCtrl,high VDD C Ambient temperature TA -40 25 85 RF switching time 2) tsw 1 2 5 s - 10 30 s - Startup time 2) tsw - A = -30 C - +85 C, VBATT = 1.8 - 3.6 V 2) , Represents actual alpha status. To be updated. 1) T 5 Logic Table Table 5: Logic Table CTRL 1 CTRL 2 Mode 0 0 RF1 connected to ANT 0 1 RF2 connected to ANT 1 0 RF3 connected to ANT 1 1 RF4 connected to ANT Data Sheet 8 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential 6 RF Characteristics for RF1 and RF3 Table 6: RF Specifications Parameter Symbol Values Unit Min. Typ. Max. - 0.18 0.26 dB - 0.29 0.36 dB - 0.30 0.41 dB 2171 - 2690 MHz - 0.51 0.68 dB 3400 - 3800 MHz - 1.20 1.40 dB 5150 - 5850 MHz - 1.90 2.35 dB 23 30 - dB 16 19 - dB All Ports @ 1981 - 2170 MHz 14 17 - dB All Ports @ 2171 - 2690 MHz All Ports @ 3400 - 3800 MHz 11 7 12 8 - - dB dB All Ports @ 5150 - 5850 MHz 6 7 - dB 34 41 - dB 27 32 - dB Note / Test Condition Insertion Loss 698 - 960 MHz 1710 - 1980 MHz 1981 - 2170 MHz IL Return Loss All Ports @ 698 - 915 MHz All Ports @ 1710 - 1980 MHz RL VDD = 1.8 - 3.6 V , TA = -30 ... +85 C, Z0 = 50 , PIN up to 38 dBm Isolation RFC 698 - 915 MHz 1710 - 1980 MHz 1981 - 2170 MHz ISO 26 30 - dB 2171 - 2690 MHz 24 28 - dB 3400 - 3800 MHz 20 24 - dB 5150 - 5850 MHz 15 18 - dB 43 50 - dB 34 38 - dB Isolation RF1,2,3,4 - RF4,3,2,1 698 - 915 MHz 1710 - 1980 MHz 1981 - 2170 MHz ISO 33 36 - dB 2170 - 2690 MHz 30 33 - dB 3400 - 3800 MHz 24 28 - dB 5150 - 5850 MHz 18 21 - dB Data Sheet 9 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential 7 RF Characteristics for RF2 and RF4 Table 7: RF Specifications Parameter Symbol Values Unit Min. Typ. Max. - 0.30 0.40 dB - 0.40 0.50 dB - 0.41 0.54 dB 2171 - 2690 MHz - 0.64 0.80 dB 3400 - 3800 MHz - 1.19 1.45 dB 5150 - 5850 MHz - 1.78 2.09 dB 23 27 - dB 17 20 - dB All Ports @ 1981 - 2170 MHz 14 18 - dB All Ports @ 2171 - 2690 MHz All Ports @ 3400 - 3800 MHz 11 7 15 9 - - dB dB All Ports @ 5150 - 5850 MHz 6 8 - dB 34 41 - dB 27 32 - dB Note / Test Condition Insertion Loss 698 - 960 MHz 1710 - 1980 MHz 1981 - 2170 MHz IL Return Loss All Ports @ 698 - 915 MHz All Ports @ 1710 - 1980 MHz RL VDD = 1.8 - 3.6 V , TA = -30 ... +85 C, Z0 = 50 , PIN up to 38 dBm Isolation RFC 698 - 915 MHz 1710 - 1980 MHz 1981 - 2170 MHz ISO 26 30 - dB 2171 - 2690 MHz 24 28 - dB 3400 - 3800 MHz 20 24 - dB 5150 - 5850 MHz 14 18 - dB 43 50 - dB 34 38 - dB Isolation RF1,2,3 - RF3,2,1 698 - 915 MHz 1710 - 1980 MHz 1981 - 2170 MHz ISO 33 36 - dB 2170 - 2690 MHz 30 33 - dB 3400 - 3800 MHz 24 28 - dB 5150 - 5850 MHz 18 21 - dB Data Sheet 10 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential 8 RF large signal parameter Table 8: RF large signal specifications for RF1 and RF3 Parameter Symbol Max. RF input power - Values Unit Note / Test Condition Min. Typ. Max. - - 38 dBm for typical Hx behavior Harmonic Generation up to 12.75 GHz(1,2,3) Second Order Harmonics PH2 - -100 - dBc 25 dBm, 50, CW mode Third Order Harmonics PH3 - -115 - dBc 25 dBm, 50, CW mode All RF Ports PHx - -100 - dBc 25 dBm, 50, CW mode Intermodulation Distortion IMD2 (1,2,3) IIP2, low IIP2,l - 110 - dBm IIP2, high IIP2,h - 125 - dBm IIP3 - 72 - dBm IIP3 conditions table 9 IIP3,SV - 73 - dBm SV-LTE conditions table 10 IIP2 conditions table 8 Intermodulation Distortion IMD3 (1,2,3) IIP3 SV LTE Intermodulation (1,2,3) IIP3,SVLTE 1) Terminating Port Impedance: Z0 = 50 2) Supply Voltage: VDD = 1.8 - 3.6 V 3) On application board without any matching components Table 9: RF large signal specifications for RF2 and RF4 Parameter Symbol Max. RF input power - Values Unit Note / Test Condition Min. Typ. Max. - - 38 dBm for typical Hx behavior Harmonic Generation up to 12.75 GHz(1,2,3) Second Order Harmonics PH2 - -105 - dBc 25 dBm, 50, CW mode Third Order Harmonics PH3 - -105 - dBc 25 dBm, 50, CW mode All RF Ports PHx - -105 - dBc 25 dBm, 50, CW mode Intermodulation Distortion IMD2 (1,2,3) IIP2, low IIP2,l - 110 - dBm IIP2, high IIP2,h - 130 - dBm IIP3 - 74 - dBm IIP3 conditions table 9 IIP3,SV - 74 - dBm SV-LTE conditions table 10 IIP2 conditions table 8 Intermodulation Distortion IMD3 (1,2,3) IIP3 SV LTE Intermodulation IIP3,SVLTE 1) (1,2,3) Terminating Port Impedance: Z0 = 50 2) Supply Voltage: VDD = 1.8 - 3.6 V 3) On application board without any matching components Data Sheet 11 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential Table 10: IIP2 conditions table Band In-Band Frequency Blocker Frequency 1 Blocker Power 1 Blocker Frequency 2 Blocker Power 2 [MHz] [MHz] [dBm] [MHz] [dBm] Band 1 Low 2140 1950 20 190 -15 Band 1 High 2140 1950 20 4090 -15 Band 5 Low 881.5 836.5 20 45 -15 Band 5 High 881.5 836.5 20 1718 -15 In-Band Frequency Blocker Frequency 1 Blocker Power 1 Blocker Frequency 2 Blocker Power 2 Table 11: IIP3 conditions table Band [MHz] [MHz] [dBm] [MHz] [dBm] Band 1 2140 1950 20 1760 -15 Band 5 881.5 836.5 20 791.5 -15 In-Band Frequency Blocker Frequency 1 Blocker Power 1 Blocker Frequency 2 Blocker Power 2 Table 12: SV-LTE conditions table Band [MHz] [MHz] [dBm] [MHz] [dBm] Band 5 872 827 23 872 14 Band 13 747 786 23 747 14 Band 20 878 833 23 2544 14 Data Sheet 12 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential 9 Package Outline and Pin Configuration ANT 10 RF1 1 9 RF3 GND 2 8 GND RF2 3 7 RF4 VDD 4 6 CTRL 2 5 CTRL 1 Figure 2: Pinout (top view) Table 13: Pin Description Pin No. Name Pin Buffer Type Type Function 1 RF1 I/O RF1 2 GND GND Ground 3 RF2 I/O RF2 4 VDD PWR Supply voltage 5 CTRL 1 I Control Pin 1 6 CTRL 2 I Control Pin 2 7 RF4 I/O RF4 8 GND GND Ground 9 RF3 I/O RF3 10 ANT I/O Common RF / Antenna Table 14: Mechanical Data Parameter Symbol Value Unit X-Dimension X 1.1 0.05 mm Y-Dimension Y 1.5 0.05 mm Size Size 1.65 mm2 Height H 0.375 mm Data Sheet 13 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential Bottom view Top view 0.8 0.375 B 6 4 0.4 1.5 0.05 3 x 0.4 = 1.2 5 7 3 8 2 9 1 10 0.2 0.05 10x Pin 1 marking 0.1 B 0.4 0.02 MAX. 1.1 0.05 0.2 0.05 10x A 0.1 A TSNP-10-1-PO V01 Figure 3: Package Dimensions Drawing Optional solder mask dam 0.4 0.4 0.4 0.2 0.475 10x 0.25 0.4 0.475 10x 0.25 0.4 10x 0.25 Copper 0.4 Stencil apertures Solder mask TSNP-10-1-FP V01 Figure 4: Land pattern and stencil mask Data Sheet 14 Revision 1.3 - 2016-08-24 BGS14PN10 Confidential Pin 1 marking 4P Date code (YW) Type code TSNP-10-1MK V02 Figure 5: Marking 0.5 1.7 Pin 1 marking 8 4 1.3 TSNP-10-1-TP V01 Figure 6: Tape drawing Data Sheet 15 Revision 1.3 - 2016-08-24 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG