LM340, A Series Three-Terminal Positive Fixed Voltage Regulators This family of fixed voltage regulators are monolithic integrated circuits capable of driving loads in excess of 1.0 A. These three-terminal regulators employ internal current limiting, thermal shutdown, and safe-area compensation. Devices are available with improved specifications, including a 2% output voltage tolerance, on A-suffix 5.0, 12 and 15 V device types. Although designed primarily as a fixed voltage regulator, these devices can be used with external components to obtain adjustable voltages and currents. This series of devices can be used with a series-pass transistor to boost output current capability at the nominal output voltage. * Output Current in Excess of 1.0 A * * * * * THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS SEMICONDUCTOR TECHNICAL DATA T SUFFIX PLASTIC PACKAGE CASE 221A No External Components Required Output Voltage Offered in 2% and 4% Tolerance* Internal Thermal Overload Protection Internal Short Circuit Current Limiting Output Transistor Safe-Area Compensation Pin 1. Input 2. Ground 3. Output 1 2 3 Heatsink surface is connected to Pin 2. Simplified Application Input ORDERING INFORMATION Device Output Voltage and Tolerance LM340T-5.0 5.0 V 4% LM340AT-5.0 5.0 V 2% LM340T-6.0 6.0 V 4% LM340T-8.0 8.0 V 4% LM340T-12 12 V 4% LM340AT-12 12 V 2% LM340T-15 15 V 4% LM340AT-15 15 V 2% LM340T-18 18 V 4% LM340T-24 24 V 4% Operating Temperature Range Cin* 0.33F LM340-XX Output CO** Package A common ground is required between the input and the output voltages. The input voltage must remain typically 1.7 V above the output voltage even during the low point on the input ripple voltage. TJ = 0 to +125C Plastic Power XX these two digits of the type number indicate voltage. * Cin is required if regulator is located an appreciable distance from power supply filter. ** CO is not needed for stability; however, it does improve transient response. If needed, use a 0.1 F ceramic disc. * 2% regulators are available in 5, 12 and 15 V devices. MOTOROLA ANALOG IC DEVICE DATA 3-89 LM340, A Series MAXIMUM RATINGS (TA = +25C unless otherwise noted.) Rating Input Voltage (5.0 V - 18 V) Input Voltage (24 V) Power Dissipation and Thermal Characteristics Plastic Package TA = +25C Derate above TA = +25C Thermal Resistance, Junction-to-Air TC= +25C Derate above TC = +75C (See Figure 1) Thermal Resistance, Junction-to-Case Storage Temperature Range Operating Junction Temperature Range Symbol Value Unit Vin 35 40 Vdc PD 1/JA JA Internally Limited 15.4 65 W mW/C C/W PD 1/JA JC Internally Limited 200 5.0 W mW/C C/W Tstg -65 to +150 C TJ 0 to +150 C Representative Schematic Diagram 1.0k Input 1.0k 210 6.7V 16k 100 1.0k 300 200 3.0k 3.6k 10pF 5.6k 6.4k 300 13 50 520 0.12 200 Output 40 pF 2.6k 6.0k 2.0k 3.9k 6.0k 3-90 2.8k Gnd MOTOROLA ANALOG IC DEVICE DATA LM340, A Series LM340-5.0 ELECTRICAL CHARACTERISTICS (Vin = 10 V, IO = 500 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 4.8 5.0 5.2 Vdc - - - - - - - - 50 50 25 50 - - - - - - 50 50 25 4.75 - 5.25 - - - 4.0 8.5 8.0 - - - - - - 1.0 0.5 1.0 Line Regulation (Note 2) 8.0 Vdc to 20 Vdc 7.0 Vdc to 25 Vdc (TJ = +25C) 8.0 Vdc to 12 Vdc, IO = 1.0 A 7.3 Vdc to 20 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation (Note 2) 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload Output Voltage 7.0 Vin 20 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO Quiescent Current IO = 1.0 A TJ = +25C IB mV mV Vdc mA Quiescent Current Change 7.0 Vin 25 Vdc, IO = 500 mA 5.0 mA IO 1.0 A, Vin = 10 V 7.5 Vin 20 Vdc, IO = 1.0 A IB Ripple Rejection IO = 1.0 A (TJ = +25C) RR 62 80 - dB Dropout Voltage mA VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 2.0 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 40 - V TCVO - 0.6 - mV/C IO - 2.4 - A 7.3 - - Vdc Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A NOTES: 1. Tlow to Thigh = 0 to +125C 2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used. DEFINITIONS Line Regulation - The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation - The change in output voltage for a change in load current at constant chip temperature. MOTOROLA ANALOG IC DEVICE DATA Maximum Power Dissipation - The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Current - That part of the input current that is not delivered to the load. Output Noise Voltage - The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range. 3-91 LM340, A Series LM340A-5.0 ELECTRICAL CHARACTERISTICS (Vin = 10 V, IO = 1.0 A, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 4.9 5.0 5.1 Vdc - - - - - 3.0 - - 10 10 12 4.0 - - - - - - 25 25 15 Line Regulation 7.5 Vdc to 20 Vdc, IO = 500 mA 7.3 Vdc to 25 Vdc (TJ = +25C) 8.0 Vdc to 12 Vdc 8.0 Vdc to 12 Vdc (TJ = +25C) Regline Load Regulation 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload mV mV Output Voltage 7.5 Vin 20 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO 4.8 - 5.2 Vdc Quiescent Current TJ = +25C IB - - - 3.5 6.5 6.0 mA - - - - - - 0.5 0.8 0.8 Quiescent Current Change 5.0 mA IO 1.0 A, Vin = 10 V 8.0 Vin 25 Vdc, IO = 500 mA 7.5 Vin 20 Vdc, IO = 1.0 A (TJ = +25C) IB Ripple Rejection 8.0 Vin 18 Vdc, f = 120 Hz IO = 500 mA IO = 1.0 A (TJ = +25C) RR mA dB 68 68 - 80 - - VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 2.0 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 40 - V TCVO - 0.6 - mV/C IO - 2.4 - A 7.3 - - Vdc Dropout Voltage Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A NOTE: 1. Tlow to Thigh = 0 to +125C 3-92 MOTOROLA ANALOG IC DEVICE DATA LM340, A Series LM340-6.0 ELECTRICAL CHARACTERISTICS (Vin = 11 V, IO = 500 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 5.75 6.0 6.25 Vdc - - - - - - - - 60 60 30 60 - - - - - - 60 60 30 5.7 - 6.3 - - - 4.0 8.5 8.0 - - - - - - 1.0 0.5 1.0 Line Regulation 9.0 Vdc to 21 Vdc 8.0 Vdc to 25 Vdc (TJ = +25C) 9.0 Vdc to 13 Vdc, IO = 1.0 A 8.3 Vdc to 21 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload Output Voltage 8.0 Vin 21 Vdc, 6.0 mA IO 1.0 A, PD 15 W VO Quiescent Current IO = 1.0 A TJ = +25C IB mV mV Vdc mA Quiescent Current Change 8.0 Vin 25 Vdc, IO = 500 mA 5.0 mA IO 1.0 A, Vin = 11 V 8.6 Vin 21 Vdc, IO = 1.0 A IB Ripple Rejection IO = 1.0 A (TJ = +25C) RR 59 78 - dB Dropout Voltage mA VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 1.9 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 45 - V TCVO - 0.7 - mV/C IO - 2.4 - A 8.3 - - Vdc Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A NOTE: 1. Tlow to Thigh = 0 to +125C MOTOROLA ANALOG IC DEVICE DATA 3-93 LM340, A Series LM340-8.0 ELECTRICAL CHARACTERISTICS (Vin = 14 V, IO = 500 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 7.7 8.0 8.3 Vdc - - - - - - - - 80 80 40 80 - - - - - - 80 80 40 7.6 - 8.4 - - - 4.0 8.5 8.0 - - - - - - 1.0 0.5 1.0 Line Regulation 11 Vdc to 23 Vdc 10.5 Vdc to 25 Vdc (TJ = +25C) 11 Vdc to 17 Vdc, IO = 1.0 A 10.5 Vdc to 23 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload Output Voltage 10.5 Vin 23 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO Quiescent Current IO = 1.0 A TJ = +25C IB mV mV Vdc mA Quiescent Current Change 10.5 Vin 25 Vdc, IO = 500 mA 5.0 mA IO 1.0 A, Vin = 14 V 10.6 Vin 23 Vdc, IO = 1.0 A IB Ripple Rejection IO = 1.0 A (TJ = +25C) RR 56 76 - dB Dropout Voltage mA VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 1.5 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 52 - V TCVO - 1.0 - mV/C IO - 2.4 - A 10.5 - - Vdc Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A NOTE: 1. Tlow to Thigh = 0 to +125C 3-94 MOTOROLA ANALOG IC DEVICE DATA LM340, A Series LM340-12 ELECTRICAL CHARACTERISTICS (Vin = 19 V, IO = 500 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 11.5 12 12.5 Vdc - - - - - - - - 120 120 60 120 - - - - - - 120 120 60 11.4 - 12.6 - - - 4.0 8.5 8.0 - - - - - - 1.0 0.5 1.0 Line Regulation (Note 2) 15 Vdc to 27 Vdc 14.6 Vdc to 30 Vdc (TJ = +25C) 16 Vdc to 22 Vdc, IO = 1.0 A 14.6 Vdc to 27 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation (Note 2) 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload Output Voltage 14.5 Vin 27 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO Quiescent Current IO = 1.0 A TJ = +25C IB mV mV Vdc mA Quiescent Current Change 14.5 Vin 30 Vdc, IO = 500 mA 5.0 mA IO 1.0 A, Vin = 19 V 14.8 Vin 27 Vdc, IO = 1.0 A IB Ripple Rejection IO = 1.0 A (TJ = +25C) RR 55 72 - dB Dropout Voltage mA VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 1.1 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 75 - V TCVO - 1.5 - mV/C IO - 2.4 - A 14.6 - - Vdc Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A NOTES: 1. Tlow to Thigh = 0 to +125C 2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used. MOTOROLA ANALOG IC DEVICE DATA 3-95 LM340, A Series LM340A-12 ELECTRICAL CHARACTERISTICS (Vin = 19 V, IO = 1.0 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 11.75 12 12.25 Vdc - - - - - 4.0 - - 18 18 30 9.0 - - - - - - 60 32 19 Line Regulation 14.8 Vdc to 27 Vdc, IO = 500 mA 14.5 Vdc to 30 Vdc (TJ = +25C) 16 Vdc to 22 Vdc 16 Vdc to 22 Vdc (TJ = +25C) Regline Load Regulation 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload mV mV Output Voltage 14.8 Vin 27 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO 11.5 - 12.5 Vdc Quiescent Current TJ = +25C IB - - - 3.5 6.5 6.0 mA - - - - - - 0.5 0.8 0.8 Quiescent Current Change 5.0 mA IO 1.0 A, Vin = 19 V 15 Vin 30 Vdc, IO = 500 mA 14.8 Vin 27 Vdc, IO = 1.0 A(TJ = +25C) IB Ripple Rejection 15 Vin 25 Vdc, f = 120 Hz IO = 500 mA IO = 1.0 A (TJ = +25C) RR mA dB 61 61 - 72 - - VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 1.1 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 75 - V TCVO - 1.5 - mV/C IO - 2.4 - A 14.5 - - Vdc Dropout Voltage Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) NOTE: 1. Tlow to Thigh = 0 to +125C 3-96 MOTOROLA ANALOG IC DEVICE DATA LM340, A Series LM340-15 ELECTRICAL CHARACTERISTICS (Vin = 23 V, IO = 500 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 14.4 15 15.6 Vdc - - - - - - - - 150 150 75 150 - - - - - - 150 150 75 14.25 - 15.75 - - - 4.0 8.5 8.0 - - - - - - 1.0 0.5 1.0 Line Regulation (Note 2) 18.5 Vdc to 30 Vdc 17.5 Vdc to 30 Vdc (TJ = +25C) 20 Vdc to 26 Vdc, IO = 1.0 A 17.7 Vdc to 30 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation (Note 2) 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload Output Voltage 17.5 Vin 30 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO Quiescent Current IO = 1.0 A TJ = +25C IB mV mV Vdc mA Quiescent Current Change 17.5 Vin 30 Vdc, IO = 500 mA 5.0 mA IO 1.0 A, Vin = 23 V 17.9 Vin 30 Vdc, IO = 1.0 A IB Ripple Rejection IO = 1.0 mA (TJ = +25C) RR 54 70 - dB VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 800 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 90 - V TCVO - 1.8 - mV/C IO - 2.4 - A 17.7 - - Vdc Dropout Voltage Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A mA NOTES: 1. Tlow to Thigh = 0 to +125C 2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used. MOTOROLA ANALOG IC DEVICE DATA 3-97 LM340, A Series LM340A-15 ELECTRICAL CHARACTERISTICS (Vin = 23 V, IO = 1.0 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 14.7 15 15.3 Vdc - - - - - 4.0 - - 22 22 30 10 - - - - 12 - 75 35 21 Line Regulation 17.9 Vdc to 30 Vdc, IO = 500 mA 17.5 Vdc to 30 Vdc (TJ = +25C) 20 Vdc to 26 Vdc, IO = 1.0 A 20 Vdc to 26 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload mV mV Output Voltage 17.9 Vin 30 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO 14.4 - 15.6 Vdc Quiescent Current TJ = +25C IB - - - 3.5 6.5 6.0 mA - - - - - - 0.5 0.8 0.8 Quiescent Current Change 5.0 mA IO 1.0 A, Vin = 23 V 17.9 Vin 30 Vdc, IO = 500 mA 17.9 Vin 30 Vdc, IO = 1.0 A (TJ = +25C) IB Ripple Rejection 18.5 Vin 28.5 Vdc, f = 120 Hz IO = 500 mA IO = 1.0 A (TJ = +25C) RR mA dB 60 60 - 70 - - VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 800 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 90 - V TCVO - 1.8 - mV/C IO - 2.4 - A 17.5 - - Vdc Dropout Voltage Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) NOTE: 1. Tlow to Thigh = 0 to +125C 3-98 MOTOROLA ANALOG IC DEVICE DATA LM340, A Series LM340-18 ELECTRICAL CHARACTERISTICS (Vin = 27 V, IO = 500 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 17.3 18 18.7 Vdc - - - - - - - - 180 180 90 180 - - - - - - 180 180 90 17.1 - 18.9 - - - 4.0 8.5 8.0 - - - - - - 1.0 0.5 1.0 Line Regulation 21.5 Vdc to 33 Vdc 21 Vdc to 33 Vdc (TJ = +25C) 24 Vdc to 30 Vdc, IO = 1.0 A 21 Vdc to 33 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload Output Voltage 21 Vin 33 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO Quiescent Current IO = 1.0 A TJ = +25C IB mV mV Vdc mA Quiescent Current Change 21 Vin 33 Vdc, IO = 500 mA 5.0 mA IO 1.0 A, Vin = 27 V 21 Vin 33 Vdc, IO = 1.0 A IB Ripple Rejection IO = 1.0 mA (TJ = +25C) RR 53 69 - dB Dropout Voltage mA VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 500 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 110 - V TCVO - 2.3 - mV/C IO - 2.4 - A 21 - - Vdc Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A NOTE: 1. Tlow to Thigh = 0 to +125C MOTOROLA ANALOG IC DEVICE DATA 3-99 LM340, A Series LM340-24 ELECTRICAL CHARACTERISTICS (Vin = 33 V, IO = 500 mA, TJ = Tlow to Thigh [Note 1], unless otherwise noted.) Characteristics Output Voltage (TJ = +25C) IO = 5.0 mA to 1.0 A Symbol Min Typ Max Unit VO 23 24 25 Vdc - - - - - - - - 240 240 120 240 - - - - - - 240 240 120 22.8 - 25.2 - - - 4.0 8.5 8.0 - - - - - - 1.0 0.5 1.0 Line Regulation 28 Vdc to 38 Vdc 27 Vdc to 38 Vdc (TJ = +25C) 30 Vdc to 36 Vdc, IO = 1.0 A 27.1 Vdc to 38 Vdc, IO = 1.0 A (TJ = +25C) Regline Load Regulation 5.0 mA IO 1.0 A 5.0 mA IO 1.5 A (TJ = +25C) 250 mA IO 750 mA (TJ = +25C) Regload Output Voltage 27 Vin 38 Vdc, 5.0 mA IO 1.0 A, PD 15 W VO Quiescent Current IO = 1.0 A TJ = +25C IB mV mV Vdc mA Quiescent Current Change 27 Vin 38 Vdc, IO = 500 mA 5.0 mA IO 1.0 A, Vin = 33 V 27.3 Vin 38 Vdc, IO = 1.0 A IB Ripple Rejection IO = 1.0 mA (TJ = +25C) RR 50 66 - dB Dropout Voltage mA VI - VO - 1.7 - Vdc Output Resistance (f = 1.0 kHz) rO - 2.0 - m Short Circuit Current Limit (TJ = +25C) ISC - 200 - A Output Noise Voltage (TA = +25C) 10 Hz f 100 kHz Vn - 170 - V TCVO - 3.0 - mV/C IO - 2.4 - A 27.1 - - Vdc Average Temperature Coefficient of Output Voltage IO = 5.0 mA Peak Output Current (TJ = +25C) Input Voltage to Maintain Line Regulation (TJ = +25C) IO = 1.0 A NOTE: 1. Tlow to Thigh = 0 to +125C 3-100 MOTOROLA ANALOG IC DEVICE DATA LM340, A Series VOLTAGE REGULATOR PERFORMANCE be caused by a change in either input voltage or the load current. Thermal regulation is a function of IC layout and die attach techniques, and usually occurs within 10 ms of a change in power dissipation. After 10 ms, additional changes in the output voltage are due to the temperature coefficient of the device. Figure 1 shows the line and thermal regulation response of a typical LM340AT-5.0 to a 10 W input pulse. The variation of the output voltage due to line regulation is labeled A and the thermal regulation component is labeled A. Figure 2 shows the load and thermal regulation response of a typical LM340AT-5.0 to a 15 W load pulse. The output voltage variation due to load regulation is labeled A and the thermal regulation component is labeled A. The performance of a voltage regulator is specified by its immunity to changes in load, input voltage, power dissipation, and temperature. Line and load regulation are tested with a pulse of short duration (< 100 s) and are strictly a function of electrical gain. However, pulse widths of longer duration (> 1.0 ms) are sufficient to affect temperature gradients across the die. These temperature gradients can cause a change in the output voltage, in addition to changes caused by line and load regulation. Longer pulse widths and thermal gradients make it desirable to specify thermal regulation. Thermal regulation is defined as the change in output voltage caused by a change in dissipated power for a specified time, and is expressed as a percentage output voltage change per watt. The change in dissipated power can 2 2 1 Vout , OUTPUT VOLTAGE DEVIATION (V) (2.0 mV/DIV) Figure 2. Load and Thermal Regulation 2 1 2 18 V Iout , OUTPUT CURRENT (A) Vout , OUTPUT Vin , INPUT VOLTAGE DEVIATION (V) VOLTAGE (V) (2.0 mV/DIV) Figure 1. Line and Thermal Regulation 8.0 V 2.0 0 t, TIME (2.0 ms/DIV) LM340AT-5.0 Vout = 5.0 V 1 = Regline = 4.4 mV Vin = 15 V 2 = Regtherm = 0.0020% VO/W Iout = 0 A 1.5 A 0 A t, TIME (2.0 ms/DIV) LM340AT-5.0 Vout = 5.0 V 1 = Regline = 2.4 mV Vin = 8.0 V 18 V 8.0 V 2 = Regtherm = 0.0030% VO/W Iout = 1.0 A Figure 3. Temperature Stability Figure 4. Output Impedance 100 Z O , OUTPUT IMPEDANCE ( ) NORMALIZED OUTPUT VOLTAGE 1.02 Vin - Vout = 5.0 V Iout = 100 mA 1.01 1.00 0.99 0.98 -90 -50 -10 30 70 110 TJ, JUNCTION TEMPERATURE (C) MOTOROLA ANALOG IC DEVICE DATA 150 190 10-1 10-2 Vout = 5.0 V Vin = 7.5 V Iout = 1.0 A CO = 0 TJ = 25C 10-3 10-4 1.0 10 100 1.0 k 10 k 100 k f, FREQUENCY (Hz) 1.0 M 10 M 100 M 3-101 LM340, A Series Figure 5. Ripple Rejection versus Frequency Figure 6. Ripple Rejection versus Output Current 100 Iout = 50 mA RR, RIPPLE REJECTION (dB) RR, RIPPLE REJECTION (dB) 100 80 Iout = 1.5 A Vout = 5.0 V Vin = 10 V CO = 0 TJ = 25C 60 40 80 Vout = 5.0 V Vin = 10 V Vin = 10 V CO = 0 f = 120 Hz TJ = 25C 60 40 20 1.0 10 100 1.0 k 10 k 100 k f, FREQUENCY (Hz) 1.0 M 10 M 30 0.01 100 M Figure 7. Quiescent Current versus Input Voltage 5.0 IB , QUIESCENT CURRENT (mA) IB , QUIESCENT CURRENT (mA) 3.0 TJ = 25C Vout = 5.0 V Iout = 1.0 A 2.0 1.0 0 0 10 20 30 Vin, INPUT VOLTAGE (Vdc) 4.0 3.0 TJ = 25C Vin - Vout = 5.0 V 2.0 1.0 0 0.01 40 Figure 9. Dropout Voltage 2.5 2.0 IO = 1.0 A 1.5 IO = 500 mA IO = 10 mA 0.5 0 -75 3.0 2.0 1.0 0 -50 -25 0 25 50 75 TA, AMBIENT TEMPERATURE (C) 10 4.0 Vout = 100 mV 1.0 0.1 1.0 Iout, OUTPUT CURRENT (A) Figure 10. Peak Output Current Iout , OUTPUT CURRENT (A) V in -Vout , INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V) 10 Figure 8. Quiescent Current versus Output Current 4.0 3-102 0.1 1.0 Iout, OUTPUT CURRENT (A) 100 125 TJ = 25C 0 10 20 30 40 Vin-Vout, INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V) MOTOROLA ANALOG IC DEVICE DATA Figure 12. Load Transient Response Vout , OUTPUT VOLTAGE DEVIATION (V) Figure 11. Line Transient Response 0.8 Vout = 5.0 V Iout = 150 mA CO = 0 TJ = 25C 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 Iout , OUTPUT CURRENT (A) Vin , INPUT VOLTAGE CHANGE (V) Vout , OUTPUT VOLTAGE DEVIATION (V) LM340, A Series 1.0 0.5 0 0 10 20 30 0.3 0.2 0.1 0 -0.1 Vout = 5.0 V Vin = 10 V CO = 0 TJ = 25C -0.2 -0.3 1.5 1.0 0.5 0 40 0 10 t, TIME (s) 20 30 40 t, TIME (s) Figure 13. Worst Case Power Dissipation versus Ambient Temperature (Case 221A) PD , POWER DISSIPATION (W) 20 16 HS = 5C/W 12 HS = 15C/W 8.0 4.0 0 -50 JC = 5C/W JA = 65C/W TJ(max) = 150C HS = 0C/W No Heatsink -25 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) MOTOROLA ANALOG IC DEVICE DATA 3-103 LM340, A Series APPLICATIONS INFORMATION Design Considerations The LM340, A series of fixed voltage regulators are designed with Thermal Overload Protection that shuts down the circuit when subjected to an excessive power overload condition, Internal Short Circuit Protection that limits the maximum current the circuit will pass, and Output Transistor Safe-Area Compensation that reduces the output short circuit current as the voltage across the pass transistor is increased. In many low current applications, compensation capacitors are not required. However, it is recommended that the regulator input be bypassed with a capacitor if the regulator is connected to the power supply filter with long wire lengths, or if the output load capacitance is large. An input bypass capacitor should be selected to provide good high-frequency characteristics to insure stable operation under all load conditions. A 0.33 F or larger tantalum, mylar, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with the shortest possible leads directly across the regulators input terminals. Normally good construction techniques should be used to minimize ground loops and lead resistance drops since the regulator has no external sense lead. Figure 14. Current Regulator Figure 15. Adjustable Output Regulator LM340-5.0 Input Output LM340-5.0 R 0.33F IO Input Constant Current to Grounded Load 7 - 0.33F These regulators can also be used as a current source when connected as above. In order to minimize dissipation the LM340-5.0 is chosen in this application. Resistor R determines the current as follows: 2 0.1F 6 + 1k 3 10k 4 MC1741G 5.0 V IO = + IQ R IQ Vout, 7.0 V to 20 V Vin - VO 2.0 V ^ 1.5 mA over line and load changes For example, a 1 A current source would require R to be a 5 , 10 W resistor and the output voltage compliance would be the input voltage less 7.0 V. The addition of an operational amplifier allows adjustment to higher or intermediate values while retaining regulation characteristics. The minimum voltage obtainable with this arrangement is 2.0 V greater than the regulator voltage. Figure 16. Current Boost Regulator Figure 17. Short Circuit Protection MJ2955 or Equiv Input RSC MJ2955 or Equiv. Input R LM340 Output 2N6049 or Equiv. R LM340 1.0F Output 0.1F 1.0F The LM340, A series can be current boosted with a PNP transistor. The MJ2955 provides current to 5.0 A. Resistor R in conjuction with the VBE of the PNP determines when the pass transistor begins conducting; this circuit is not short circuit proof. Input-output differential voltage minimum is increased by VBE of the pass transistor. 3-104 The circuit of Figure 17 can be modified to provide supply protection against short circuits by adding a short circuit sense resistor, RSC, and an additional PNP transistor. The current sensing PNP must be able to handle the short circuit current of the three-terminal regulator. Therefore, 4.0 A plastic power transistor is specified. MOTOROLA ANALOG IC DEVICE DATA Tape and Reel Options In Brief . . . Motorola offers the convenience of Tape and Reel packaging for our growing family of standard integrated circuit products. Reels are available to support the requirements of both first and second generation pick-and-place equipment. The packaging fully conforms to the latest EIA-481A specification. The antistatic embossed tape provides a secure cavity, sealed with a peel-back cover tape. MOTOROLA ANALOG IC DEVICE DATA Page Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12-2 Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12-4 Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-5 12-1 Tape and Reel Configurations Mechanical Polarization SOIC and Micro-8 DEVICES PLCC DEVICES Typical Typical PIN 1 User Direction of Feed User Direction of Feed DPAK and D2PAK DEVICES Typical User Direction of Feed 12-2 SOT-23 (5 Pin) DEVICES SOT-89 (3 Pin) DEVICES SOT-89 (5 Pin) DEVICES Typical Typical Typical User Direction of Feed User Direction of Feed User Direction of Feed MOTOROLA ANALOG IC DEVICE DATA Tape and Reel Configurations (continued) TO-92 Reel Styles STYLE A (Preferred) STYLE E Carrier Strip Carrier Strip Rounded Side Adhesive Tape Flat Side Adhesive Tape EEEEEEE EEEEEEE Feed EEEEEEE EEEEEEE Feed Flat side of transistor and adhesive tape visible. Rounded side of transistor and adhesive tape visible. TO-92 Ammo Pack Styles STYLE P (Preferred) STYLE M Adhesive Tape On Top Side Adhesive Tape On Top Side EEEEEEEE EEEEEEEE EEEEEEEE EEEEEEEE Flat Side Carrier Strip Rounded side of transistor and adhesive tape visible. Label EEEEEEE EEEEEEE EEEEEEE EEEEEEE Feed Feed Rounded Side Carrier Strip Flat side of transistor and adhesive tape visible. Label Style M ammo pack is equivalent to Style E of reel pack dependent on feed orientation from box. Style P ammo pack is equivalent to Styles A and B of reel pack dependent on feed orientation from box. TO-92 EIA Radial Tape in Fan Fold Box or On Reel H2A H2A H2B H2B H W2 H4 H5 T1 L1 H1 W1 W L T T2 F1 F2 P2 P1 MOTOROLA ANALOG IC DEVICE DATA P2 D P 12-3 Tape and Reel Information Table Tape p Width (mm) Devices(1) per Reel Reel Size (inch) Device Suffix SO-8, SOP-8 SO-14 SO-16 12 16 16 2,500 2,500 2,500 13 13 13 R2 R2 R2 SO-16L, SO-8+8L WIDE SO-20L WIDE SO-24L WIDE SO-28L WIDE SO-28L WIDE 16 24 24 24 32 1,000 1,000 1,000 1,000 1,000 13 13 13 13 13 R2 R2 R2 R2 R3 Micro-8 12 2,500 13 R2 PLCC-20 PLCC-28 PLCC-44 16 24 32 1,000 500 500 13 13 13 R2 R2 R2 PLCC-52 PLCC-68 PLCC-84 32 44 44 500 250 250 13 13 13 R2 R2 R2 TO-226AA (TO-92)(2) 18 2,000 13 RA, RE, RP, or RM (Ammo Pack) only DPAK 16 2,500 13 RK D2PAK 24 800 13 R4 SOT-23 (5 Pin) 8 3,000 7 TR SOT-89 (3/5 Pin) 12 1,000 7 T1 Package (1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned. (2) Integrated circuits in TO-226AA packages are available in Styes A and E only, with optional "Ammo Pack" (Suffix RP or RM). The RA and RP configurations are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office. 12-4 MOTOROLA ANALOG IC DEVICE DATA Analog MPQ Table Tape/Reel and Ammo Pack Package Type Package Code MPQ Case 775 Case 776 Case 777 0802 0804 0801 1000/reel 500/reel 500/reel Case 751 Case 751A Case 751B Case 751G Case 751D Case 751E Case 751F 0095 0096 0097 2003 2005 2008 2009 2500/reel 2500/reel 2500/reel 1000/reel 1000/reel 1000/reel 1000/reel Case 846A - 2500/reel Case 29 Case 29 0031 0031 2000/reel 2000/Ammo Pack Case 369A - 2500/reel Case 936 - 800/reel - 3000/reel - 1000/reel - 1000/reel PLCC SOIC Micro-8 TO-92 DPAK D2PAK SOT-23 (5 Pin) Case 1212 SOT-89 (3 Pin) Case 1213 SOT-89 (5 Pin) Case 1214 MOTOROLA ANALOG IC DEVICE DATA 12-5 12-6 MOTOROLA ANALOG IC DEVICE DATA Packaging Information In Brief . . . The packaging availability for each device type is indicated on the individual data sheets and the Selector Guide. All of the outline dimensions for the packages are given in this section. The maximum power consumption an integrated circuit can tolerate at a given operating ambient temperature can be found from the equation: PD(TA) = TJ(max) - TA RJA(Typ) where: PD(TA) = Power Dissipation allowable at a given operating ambient temperature. This must be greater than the sum of the products of the supply voltages and supply currents at the worst case operating condition. TJ(max) = Maximum operating Junction Temperature as listed in the Maximum Ratings Section. See individual data sheets for TJ(max) information. TA = Maximum desired operating Ambient Temperature RJA(Typ) = Typical Thermal Resistance Junction-toAmbient MOTOROLA ANALOG IC DEVICE DATA 13-1 Case Outline Dimensions LP, P, Z SUFFIX CASE 29-04 Plastic Package (TO-226AA/TO-92) ISSUE AD A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. DIMENSION F APPLIES BETWEEN P AND L. DIMENSION D AND J APPLY BETWEEN L AND K MINIMUM. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P 1 2 L F SEATING PLANE DIM A B C D F G H J K L N P R V K 3 D X X G J H V C SECTION X-X 1 N INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.022 0.016 0.019 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.41 0.55 0.41 0.48 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 --- N KC, T SUFFIX CASE 221A-06 Plastic Package ISSUE Y -T- F -B- 4 SEATING PLANE C T S 4 Q A U 1 2 3 H -Y- 1 2 3 K R L J G D 3 PL 0.25 (0.010) M B M Y NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.020 0.045 0.139 0.155 0.100 BSC --- 0.280 0.012 0.045 0.500 0.580 0.045 0.070 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.51 1.14 3.53 3.93 2.54 BSC --- 7.11 0.31 1.14 12.70 14.73 1.15 1.77 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 N 13-2 MOTOROLA ANALOG IC DEVICE DATA TH SUFFIX CASE 314A-03 Plastic Package ISSUE D -T- B -P- Q SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C E OPTIONAL CHAMFER A U F L DIM A B C D E F G J K L Q S U K 1 5 G 5X S D 0.014 (0.356) T, TV SUFFIX CASE 314B-05 Plastic Package ISSUE J M T P M OPTIONAL CHAMFER E A U L S W V F 1 5 5X G 5X 0.24 (0.610) M J T H D 0.10 (0.254) M T P N M -T- T SUFFIX CASE 314C-01 Plastic Package ISSUE A -Q- B MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 14.478 14.859 1.702 BSC 0.381 0.635 18.542 18.923 8.128 9.271 3.556 3.886 5.334 6.604 11.888 12.827 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C B -P- Q K J 5X INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.570 0.585 0.067 BSC 0.015 0.025 0.730 0.745 0.320 0.365 0.140 0.153 0.210 0.260 0.468 0.505 -T- SEATING PLANE DIM A B C D E F G H J K L N Q S U V W INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.850 0.935 0.067 BSC 0.166 BSC 0.015 0.025 0.900 1.100 0.320 0.365 0.320 BSC 0.140 0.153 --- 0.620 0.468 0.505 --- 0.735 0.090 0.110 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 21.590 23.749 1.702 BSC 4.216 BSC 0.381 0.635 22.860 27.940 8.128 9.271 8.128 BSC 3.556 3.886 --- 15.748 11.888 12.827 --- 18.669 2.286 2.794 SEATING PLANE C E A 1 2 3 4 5 L 1 DIM A B C D E G J K L Q K 5 G D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. INCHES MIN MAX 0.610 0.625 0.380 0.420 0.160 0.190 0.020 0.040 0.035 0.055 0.067 BSC 0.015 0.025 0.500 --- 0.355 0.370 0.139 0.147 MILLIMETERS MIN MAX 15.59 15.88 9.65 10.67 4.06 4.83 0.51 1.02 0.89 1.40 1.702 BSC 0.38 0.64 12.70 --- 9.02 9.40 3.53 3.73 5 PL 0.356 (0.014) M T Q MOTOROLA ANALOG IC DEVICE DATA M J 13-3 T, T1 SUFFIX CASE 314D-03 Plastic Package ISSUE D -T- SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. C -Q- B E U A L DIM A B C D E G H J K L Q U S 1 2 3 4 5 K S 12 3 45 J G D H 5 PL 0.356 (0.014) DT-1 SUFFIX CASE 369-07 Plastic Package (DPAK) ISSUE K M T Q C E R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 DIM A B C D E F G H J K R S V 4 A 1 2 3 S 1 -T- 2 K SEATING PLANE 3 J F H D G DT SUFFIX CASE 369A-13 Plastic Package (DPAK) ISSUE Y 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE C B E R 4 Z A S 1 3 2 3 U K F J L H D G 13-4 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 2.29 BSC 0.87 1.01 0.46 0.58 8.89 9.65 4.45 5.46 1.27 2.28 0.77 1.27 T M 4 1 INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.090 BSC 0.034 0.040 0.018 0.023 0.350 0.380 0.175 0.215 0.050 0.090 0.030 0.050 3 PL -T- V MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 25.908 27.051 8.128 9.271 3.556 3.886 2.667 2.972 13.792 14.783 M B V INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 1.020 1.065 0.320 0.365 0.140 0.153 0.105 0.117 0.543 0.582 2 PL 0.13 (0.005) M DIM A B C D E F G H J K L R S U V Z INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --- 0.030 0.050 0.138 --- MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --- 0.77 1.27 3.51 --- T MOTOROLA ANALOG IC DEVICE DATA DP1, N, P, P1 SUFFIX CASE 626-05 Plastic Package ISSUE K 8 5 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. -B- 1 4 F DIM A B C D F G H J K L M N -A- NOTE 2 L 8 C 1 J -T- N SEATING PLANE D M K INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC --- 10_ 0.030 0.040 G H 0.13 (0.005) M T A B M M N, P, N-14, P2 SUFFIX CASE 646-06 Plastic Package ISSUE L 14 8 1 7 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. B A F 14 DIM A B C D F G H J K L M N L 1 C J N H DP2, N, P, PC SUFFIX CASE 648-08 Plastic Package ISSUE R MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC --- 10_ 0.76 1.01 G D SEATING PLANE K M 9 1 8 B F C 16 L S 1 -T- SEATING PLANE K H G D J 16 PL 0.25 (0.010) MOTOROLA ANALOG IC DEVICE DATA MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A- 16 INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 M T A M M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 13-5 B, P, P2, V SUFFIX CASE 648C-03 Plastic Package (DIP-16) ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. INTERNAL LEAD CONNECTION BETWEEN 4 AND 5, 12 AND 13. -A- 16 9 1 8 -B- L NOTE 5 16 C 1 -T- M N SEATING PLANE K E F J G D 16 PL 0.13 (0.005) 16 PL 0.13 (0.005) M T A M T B MILLIMETERS MIN MAX 18.80 21.34 6.10 6.60 3.69 4.69 0.38 0.53 1.27 BSC 1.02 1.78 2.54 BSC 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION A AND B DOES NOT INCLUDE MOLD PROTRUSION. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 (0.010). 6. ROUNDED CORNER OPTIONAL. R 16 9 1 8 -B- M P L F 16 J 1 C -T- SEATING PLANE S K H G D 13 PL 0.25 (0.010) P SUFFIX CASE 649-03 Plastic Package ISSUE D P M T B A S L B 1 12 J H F C N 1 K G D SEATING PLANE INCHES MIN MAX 0.740 0.760 0.245 0.260 0.145 0.175 0.015 0.021 0.050 0.070 0.100 BSC 0.050 BSC 0.008 0.015 0.120 0.140 0.295 0.305 0_ 10 _ 0.200 BSC 0.300 BSC 0.015 0.035 MILLIMETERS MIN MAX 18.80 19.30 6.23 6.60 3.69 4.44 0.39 0.53 1.27 1.77 2.54 BSC 1.27 BSC 0.21 0.38 3.05 3.55 7.50 7.74 0_ 10 _ 5.08 BSC 7.62 BSC 0.39 0.88 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 13 Q DIM A B C D F G H J K L M P R S S A 24 13-6 INCHES MIN MAX 0.740 0.840 0.240 0.260 0.145 0.185 0.015 0.021 0.050 BSC 0.040 0.70 0.100 BSC 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.040 -A- P SUFFIX CASE 648E-01 Plastic Package (DIP-16) ISSUE O 24 DIM A B C D E F G J K L M N M DIM A B C D F G H J K L M N P Q MILLIMETERS MIN MAX 31.50 32.13 13.21 13.72 4.70 5.21 0.38 0.51 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.30 2.92 3.43 14.99 15.49 --- 10 0.51 1.02 0.13 0.38 0.51 0.76 INCHES MIN MAX 1.240 1.265 0.520 0.540 0.185 0.205 0.015 0.020 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.012 0.115 0.135 0.590 0.610 --- 10 _ 0.020 0.040 0.005 0.015 0.020 0.030 MOTOROLA ANALOG IC DEVICE DATA A, B, N, P SUFFIX CASE 707-02 Plastic Package ISSUE C 18 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 10 B 1 9 A L C 18 DIM A B C D F G H J K L M N 1 K N F H D G J M SEATING PLANE P SUFFIX CASE 710-02 Plastic Package ISSUE B 1 28 DIM A B C D F G H J K L M N 15 B 14 1 L C A N G F D M K NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 1 40 21 B 1 20 L A C N J F MOTOROLA ANALOG IC DEVICE DATA INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15_ 0.020 0.040 SEATING PLANE 40 G MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15_ 0.51 1.02 J P SUFFIX CASE 711-03 Plastic Package ISSUE C H INCHES MIN MAX 0.875 0.915 0.240 0.260 0.140 0.180 0.014 0.022 0.050 0.070 0.100 BSC 0.040 0.060 0.008 0.012 0.115 0.135 0.300 BSC 0_ 15 _ 0.020 0.040 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 28 H MILLIMETERS MIN MAX 22.22 23.24 6.10 6.60 3.56 4.57 0.36 0.56 1.27 1.78 2.54 BSC 1.02 1.52 0.20 0.30 2.92 3.43 7.62 BSC 0_ 15_ 0.51 1.02 D K DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 51.69 52.45 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15_ 0.51 1.02 INCHES MIN MAX 2.035 2.065 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15_ 0.020 0.040 M SEATING PLANE 13-7 F, P, P-3 SUFFIX CASE 724-03 Plastic Package (NDIP-24) ISSUE D NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. 24 1 -A- 24 13 1 12 -B- L C -T- NOTE 1 K SEATING PLANE N E G M J F D 0.25 (0.010) H, P, DP SUFFIX CASE 738-03 Plastic Package ISSUE E 24 PL 0.25 (0.010) 24 PL T A M M INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 DIM A B C D E F G J K L M N T B M M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. -A- 20 11 1 10 B DIM A B C D E F G J K L M N L C 20 1 -T- K SEATING PLANE J F M T A C 0.25 H M B M 1 4 8 B 1 h e q SEATING PLANE 0.10 A1 B 0.25 13-8 X 45 _ A C M C B S A S M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. 5 E T B M M D 8 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 20 PL 0.25 (0.010) A INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 20 PL 0.25 (0.010) D D, D1, D2 SUFFIX CASE 751-05 Plastic Package (SO-8, SOP-8) ISSUE R M N E G MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 L DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ MOTOROLA ANALOG IC DEVICE DATA D SUFFIX CASE 751A-03 Plastic Package (SO-14) ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 14 8 -B- 1 P 7 PL 0.25 (0.010) 7 M B M 14 1 R X 45 _ G F C -T- 0.25 (0.010) M J M K D 14 PL SEATING PLANE T B A S S DIM A B C D F G J K M P R 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B- 1 P 8 PL 0.25 (0.010) 8 M B S G 16 1 K R F X 45 _ C SEATING PLANE D J M 16 PL 0.25 (0.010) DW, FP SUFFIX CASE 751D-04 Plastic Package (SO-20L, SO-20) ISSUE E INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 -A- D SUFFIX CASE 751B-05 Plastic Package (SO-16) ISSUE J -T- MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 T B M A S S -A- 20 10X P 0.010 (0.25) 1 M B M 10 20X J D 0.010 (0.25) M T A B S S 20 F 1 R C -T- 18X MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 G MOTOROLA ANALOG IC DEVICE DATA K SEATING PLANE INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 -B- DIM A B C D F G J K M P R X 45 _ DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 M 13-9 DW SUFFIX CASE 751E-04 Plastic Package (SO-24L, SOP (16+4+4)L) ISSUE E -A- 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 13 -B- 12X P 0.010 (0.25) 1 M B M 12 24X 24 D J 0.010 (0.25) 1 T A M B S S DIM A B C D F G J K M P R F R X 45 _ C -T- M SEATING PLANE DW SUFFIX CASE 751F-04 Plastic Package (SO-28L, SOIC-28) ISSUE E K G 22X 1 -A- 15 14X -B- 1 P 0.010 (0.25) M B M 14 M 28X D R 0.010 (0.25) M T A B S S X 45 _ C 26X -T- G F SEATING PLANE K DW SUFFIX CASE 751G-02 Plastic Package (SO-16L, SOP-16L, SOP-8+8L) ISSUE A -B- 8X P 0.010 (0.25) M B M 8 16X MILLIMETERS MIN MAX 17.80 18.05 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.01 10.55 0.25 0.75 J D 16 1 0.010 (0.25) M T A S B S F R X 45 _ C -T- 14X 13-10 G INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 1 DIM A B C D F G J K M P R J -A- 16 INCHES MIN MAX 0.601 0.612 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 28 28 MILLIMETERS MIN MAX 15.25 15.54 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.05 10.55 0.25 0.75 K SEATING PLANE M DIM A B C D F G J K M P R MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 MOTOROLA ANALOG IC DEVICE DATA D SUFFIX CASE 751K-01 Plastic Package (SO-16) ISSUE O 16 1 16 S -A- -B- 0.25 (0.010) M B 9 P 1 M_ F DIM A B C D F G J K M P R 8 G R X 45 _ C -T- K J 0.25 (0.010) DW SUFFIX CASE 751N-01 Plastic Package (SOP-16L) ISSUE O SEATING PLANE 14 X D M T A B S S -A- 9 -B- 1 0.010 (0.25) P M B M 8 16 13X 1 J D 0.010 (0.25) M T A S B S F R X 45 _ C -T- S K 9X MOTOROLA ANALOG IC DEVICE DATA SEATING PLANE M MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.368 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. T 16 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5 DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R S T MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 2.54 BSC 3.81 BSC INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 0.100 BSC 0.150 BSC G 13-11 CASE 762-01 Plastic Medium Power Package (SIP-9) ISSUE C 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. Q 0.25 (0.010) T A M 1 M -A- -C- U V M X S W E Y R B 9 1 -T- N SEATING PLANE K D M T C 9 PL 0.25 (0.010) FN SUFFIX CASE 775-02 Plastic Package (PLCC-20) ISSUE C 0.25 (0.010) J H G F M T A M Y BRK -N- 0.007 (0.180)M T L-M S N S 0.007 (0.180)M T L-M S N U S D -L- Z -M- W 20 D 1 V G1 X 0.010 (0.250)S T L-M S N S VIEW D-D A 0.007 (0.180)M T L-M S N S R 0.007 (0.180)M T L-M S N S Z H C 0.007 (0.180)M T L-M S N S E G 0.004 (0.100) J -T- SEATING PLANE VIEW S G1 0.010 (0.250)S T L-M S N 13-12 K1 K F S VIEW S 0.007 (0.180)M T L-M S N MILLIMETERS MIN MAX 22.40 23.00 6.40 6.60 3.45 3.65 0.40 0.55 9.35 9.60 1.40 1.60 2.54 BSC 1.51 1.71 0.360 0.400 3.95 4.20 30 _BSC 2.50 2.70 3.15 3.45 13.60 13.90 1.65 1.95 22.00 22.20 0.55 0.75 2.89 BSC 0.65 0.75 2.70 2.80 INCHES MIN MAX 0.873 0.897 0.252 0.260 0.135 1.143 0.015 0.021 0.368 0.377 0.055 0.062 0.100 BSC 0.059 0.067 0.014 0.015 0.155 0.165 30_BSC 0.099 0.106 0.124 0.135 0.535 0.547 0.064 0.076 0.866 0.874 0.021 0.029 0.113 BSC 0.025 0.029 0.106 0.110 NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). 1 B M DIM A B C D E F G H J K M N Q R S U V W X Y S DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 --- MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 --- MOTOROLA ANALOG IC DEVICE DATA FN SUFFIX CASE 776-02 Plastic Package (PLCC-28) ISSUE D 1 0.007 (0.180) B T L-M M N S T L-M S S Y BRK -N- 0.007 (0.180) U M N S D Z -M- -L- W 28 D X G1 0.010 (0.250) T L-M S N S S V 1 VIEW D-D A 0.007 (0.180) R 0.007 (0.180) M T L-M S N S C M T L-M S N 0.007 (0.180) H Z M T L-M N S S S K1 E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) -T- T L-M S N S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA ANALOG IC DEVICE DATA 0.007 (0.180) M T L-M S N S VIEW S DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10_ 0.410 0.430 0.040 --- MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10_ 10.42 10.92 1.02 --- 13-13 FN SUFFIX CASE 777-02 Plastic Package (PLCC) ISSUE C 0.007(0.180) M T B L-M 0.007(0.180) M T U N S L-M S S N S 1 -N- Y D BRK Z -M- -L- G1 0.010 (0.25) X VIEW D-D V 44 W 1 D 0.007(0.180) M T L-M S N S R 0.007(0.180) M T L-M S N S T 0.007(0.180) M T H A S L-M S L-M S N S N N S S K1 Z K J C F E 0.007(0.180) M T 0.004 (0.10) -T- SEATING G 0.010 (0.25) S T L-M S N NOTES: 1. DATUMS -L-, -M-, AND -N- ARE DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. M SUFFIX CASE 803C PRELIMINARY Plastic Package DIM A B C E F G H J K R U V W X Y Z G1 K1 VIEW S S 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). 11 K -B- 1 1 10 S 10 PL 0.13 (0.005) M B M N C E MILLIMETERS MIN MAX 17.40 17.65 17.40 17.65 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 16.51 16.66 16.51 16.66 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 15.50 16.00 1.02 --- J G 20 INCHES MIN MAX 0.685 0.695 0.685 0.695 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.650 0.656 0.650 0.656 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.610 0.630 0.040 --- NOTES: 6 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER SIDE. 10 DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- -F- 20 S VIEW S PLANE G1 L-M D 20 PL 0.13 (0.005) M T B 0.10 (0.004) L S -T- A S SEATING PLANE M DIM A B C D E F G H J K L M N S MILLIMETERS MIN MAX 12.35 12.80 5.10 5.45 1.95 2.05 0.35 0.50 --- 0.81 12.40* 1.15 1.39 0.59 0.81 0.18 0.27 1.10 1.50 0.05 0.20 0_ 10 _ 0.50 0.85 7.40 8.20 INCHES MIN MAX 0.486 0.504 0.201 0.215 0.077 0.081 0.014 0.020 --- 0.032 0.488* 0.045 0.055 0.023 0.032 0.007 0.011 0.043 0.059 0.001 0.008 0_ 10 _ 0.020 0.033 0.291 0.323 *APPROXIMATE 13-14 MOTOROLA ANALOG IC DEVICE DATA TV SUFFIX CASE 821C-04 Plastic Package (15-Pin ZIP) ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION. AT MAXIMUM MATERIAL CONDITION. 1 15 SEATING PLANE -T- C E M -Q- B DIM A B C D E G H J K L M R S U V Y -P- U Y K V A R S H PIN 15 PIN 1 L G 15X D 15X 0.010 (0.254) T SUFFIX CASE 821D-03 Plastic Package ISSUE C T P Q M S J 0.024 (0.610) M T 15 SEATING PLANE -T- C B E -P- U DIM A B C D E F G H J K Q R U Y A R K PIN 1 Y PIN 15 G 7X 15X MILLIMETERS MIN MAX 17.374 17.627 19.914 20.116 4.395 4.597 0.610 0.787 1.473 1.574 1.270 BSC 4.293 BSC 0.458 0.609 17.780 18.034 5.080 BSC 3.760 3.835 10.567 10.820 3.988 4.242 2.667 2.921 22.047 REF 15.875 16.231 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DELETED 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION. AT MAXIMUM MATERIAL CONDITION. 1 Q -L- INCHES MIN MAX 0.684 0.694 0.784 0.792 0.173 0.181 0.024 0.031 0.058 0.062 0.050 BSC 0.169 BSC 0.018 0.024 0.700 0.710 0.200 BSC 0.148 0.151 0.416 0.426 0.157 0.167 0.105 0.115 0.868 REF 0.625 0.639 H F D 0.010 (0.254) 15X M T P L MOTOROLA ANALOG IC DEVICE DATA S J 0.024 (0.610) M INCHES MIN MAX 0.681 0.694 0.784 0.792 0.173 0.181 0.024 0.031 0.058 0.062 0.016 0.023 0.050 BSC 0.110 BSC 0.018 0.024 1.078 1.086 0.148 0.151 0.416 0.426 0.110 BSC 0.503 REF MILLIMETERS MIN MAX 17.298 17.627 19.914 20.116 4.395 4.597 0.610 0.787 1.473 1.574 0.407 0.584 1.270 BSC 2.794 BSC 0.458 0.609 27.382 27.584 3.760 3.835 10.567 10.820 2.794 BSC 12.776 REF T 13-15 FTB SUFFIX CASE 824D-01 Plastic Package (TQFP-44) ISSUE O 1 L -T-, -U-, -Z- -Z- 44 34 11 T-U G AE DETAIL AA M V S AE PLATING F BASE METAL EEEE CCCC CCCC EEEE J 23 12 0.20 (0.008) DETAIL AA 0.05 (0.002) Z AC Z S T-U 0.20 (0.008) M B L S -U- AB Z -T- S 33 1 22 N D 0.20 (0.008) A 0.20 (0.008) AB T-U M S Z S S Z S M AC T-U S Z S SECTION AE-AE 0.05 (0.002) T-U S 0.20 (0.008) M AC T-U M C -AB- E 0.10 (0.004) -AC- H Y R K W X VIEW AD 13-16 DETAIL AD Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U- AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.530 (0.021). MILLIMETERS DIM MIN MAX A 9.950 10.050 B 9.950 10.050 C 1.400 1.600 D 0.300 0.450 E 1.350 1.450 F 0.300 0.400 G 0.800 BSC H 0.050 0.150 J 0.090 0.200 K 0.450 0.550 L 8.000 BSC M 12_REF N 0.090 0.160 Q 1_ 5_ R 0.100 0.200 S 11.900 12.100 V 11.900 12.100 W 0.200 REF X 1.000 REF Y 12_REF INCHES MIN MAX 0.392 0.396 0.392 0.396 0.055 0.063 0.012 0.018 0.053 0.057 0.012 0.016 0.031 BSC 0.002 0.006 0.004 0.008 0.018 0.022 0.315 BSC 12_REF 0.004 0.006 1_ 5_ 0.004 0.008 0.469 0.476 0.469 0.476 0.008 REF 0.039 REF 12_REF MOTOROLA ANALOG IC DEVICE DATA FB SUFFIX CASE 824E-02 Plastic Package (QFP) ISSUE A 44 1 S 0.20 (0.008) M -L-, -M-, -N- T L-M S N S H L-M S N S A 0.20 (0.008) M 0.05 (0.002) L-M PIN 1 IDENT J1 44 G J1 34 VIEW Y 33 1 G 11 40X S T L-M M J 0.20 (0.008) VIEW Y BASE METAL B1 D M T L-M S N S SECTION J1-J1 44 PL 22 -N- M VIEW P C E -H- W Y q1 R DATUM PLANE EEE CCC CCC EEE 0.20 (0.008) 23 12 F PLATING V S 0.20 (0.008) M B -M- 0.05 (0.002) N -L- H L-M N N S S 3 PL -H- R K A1 C1 VIEW P MOTOROLA ANALOG IC DEVICE DATA R1 R2 q2 DATUM PLANE 0.01 (0.004) -T- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.530 (0.021). DIM A B C D E F G J K M S V W Y A1 B1 C1 R1 R2 q1 q2 MILLIMETERS INCHES MIN MAX MIN MAX 9.90 10.10 0.390 0.398 9.90 10.10 0.390 0.398 2.00 2.21 0.079 0.087 0.30 0.45 0.0118 0.0177 2.00 2.10 0.079 0.083 0.30 0.40 0.012 0.016 0.80 BSC 0.031 BSC 0.13 0.23 0.005 0.009 0.65 0.95 0.026 0.037 5_ 10 _ 5_ 10_ 12.95 13.45 0.510 0.530 12.95 13.45 0.510 0.530 0.000 0.210 0.000 0.008 5_ 10 _ 5_ 10 _ 0.450 REF 0.018 REF 0.130 0.005 0.170 0.007 1.600 REF 0.063 REF 0.130 0.300 0.005 0.012 0.130 0.300 0.005 0.012 5_ 10 _ 5_ 10 _ 0_ 7_ 0_ 7_ 13-17 FB SUFFIX CASE 840F-01 Plastic Package ISSUE O 64 1 L -Z- 64 49 S S T-U 48 T-U 1 -T-, -U-, -Z- -U- DETAIL AA S S AC Z M G DETAIL AA 33 S 16 AE V 0.20 (0.008) -T- AE 0.20 (0.008) M 0.050 (0.002) B Z L AB Z P 32 Z 17 S S Z S F M C SECTION AE-AE -AB- Y D J E H EEE CC EEE CC EEE CC EEE CC EEE N S Z AC T-U S AC T-U M S M 0.20 (0.008) BASE METAL 0.20 (0.008) A 0.20 (0.008) M AB T-U 0.050 (0.002) T-U 0.10 (0.004) -AC- DETAIL AD Q R K W X DETAIL AD 13-18 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U- AND -Z- TO BE DETERMINED AT DATUM PLANE -AC-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). MILLIMETERS DIM MIN MAX A 9.950 10.050 B 9.950 10.050 C 1.400 1.600 D 0.170 0.270 E 1.350 1.450 F 0.170 0.230 G 0.500 BSC H 0.050 0.150 J 0.090 0.200 K 0.450 0.550 7.500 BSC L M 12 REF N 0.090 0.160 0.250 BSC P Q 1 5 R 0.100 0.200 S 11.900 12.100 V 11.900 12.100 0.200 REF W 1.000 REF X 12 REF Y INCHES MIN MAX 0.392 0.396 0.392 0.396 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BSC 0.002 0.006 0.004 0.008 0.018 0.022 0.295 BSC 12 REF 0.004 0.006 0.010 BSC 5 1 0.004 0.008 0.469 0.476 0.469 0.476 0.008 REF 0.039 REF 12 REF MOTOROLA ANALOG IC DEVICE DATA DM SUFFIX CASE 846A-02 Plastic Package (Micro-8) ISSUE C 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. -A- -B- K PIN 1 ID G D 8 PL 0.08 (0.003) -T- M T B S A S SEATING PLANE 0.038 (0.0015) C H MOTOROLA ANALOG IC DEVICE DATA J DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 --- 1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 --- 0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 L 13-19 FB SUFFIX CASE 848B-04 Plastic Package (TQFP-52) ISSUE C 1 52 L 39 27 S D S V B -A-, -B-, -D- 0.20 (0.008) 0.20 (0.008) M L B M C A-B S S B H A-B -B- -A- 0.05 (0.002) A-B DETAIL A D 26 40 DETAIL A 14 52 1 13 -D- B 0.20 (0.008) M H A-B F S D S S D S 0.05 (0.002) A-B J V 0.20 (0.008) M C A-B N BASE METAL M_ C D DETAIL C 0.02 (0.008) E -H- M C A-B S D S SECTION B-B DATUM PLANE 0.10 (0.004) H M_ G U_ R Q_ K T W X DETAIL C 13-20 -C- SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIM A B C D E F G H J K L M N Q R S T U V W X MILLIMETERS MIN MAX 9.90 10.10 9.90 10.10 2.10 2.45 0.22 0.38 2.00 2.10 0.22 0.33 0.65 BSC --- 0.25 0.13 0.23 0.65 0.95 7.80 REF 5_ 10_ 0.13 0.17 0_ 7_ 0.13 0.30 12.95 13.45 0.13 --- 0_ --- 12.95 13.45 0.35 0.45 1.6 REF INCHES MIN MAX 0.390 0.398 0.390 0.398 0.083 0.096 0.009 0.015 0.079 0.083 0.009 0.013 0.026 BSC --- 0.010 0.005 0.009 0.026 0.037 0.307 REF 5_ 10 _ 0.005 0.007 0_ 7_ 0.005 0.012 0.510 0.530 0.005 --- 0_ --- 0.510 0.530 0.014 0.018 0.063 REF MOTOROLA ANALOG IC DEVICE DATA FB SUFFIX CASE 848D-03 Plastic Package ISSUE C 52 1 4X 4X TIPS 0.20 (0.008) H L-M N 0.20 (0.008) T L-M N 52 40 1 CL 39 3X VIEW -X- X=L, M, N AB Y -L- AB -M- B B1 VIEW Y V V1 27 14 26 J -N- A1 S1 EEE CCC EEE CCC EEE BASE METAL F PLATING 13 G 0.13 (0.005) M D T L-M U S N S A SECTION AB-AB S ROTATED 90_ CLOCKWISE 4X C 2 0.10 (0.004) T -H- -T- SEATING PLANE 4X 3 VIEW AA 0.05 (0.002) S W 1 2XR R1 0.25 (0.010) C2 GAGE PLANE K C1 E Z VIEW AA MOTOROLA ANALOG IC DEVICE DATA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46 (0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07 (0.003). DIM A A1 B B1 C C1 C2 D E F G J K R1 S S1 U V V1 W Z 1 2 3 MILLIMETERS MIN MAX 10.00 BSC 5.00 BSC 10.00 BSC 5.00 BSC --- 1.70 0.05 0.20 1.30 1.50 0.20 0.40 0.75 0.45 0.22 0.35 0.65 BSC 0.07 0.20 0.50 REF 0.08 0.20 12.00 BSC 6.00 BSC 0.09 0.16 12.00 BSC 6.00 BSC 0.20 REF 1.00 REF 0_ 7_ --- 0_ 12 _ REF 5_ 13 _ INCHES MIN MAX 0.394 BSC 0.197 BSC 0.394 BSC 0.197 BSC --- 0.067 0.002 0.008 0.051 0.059 0.008 0.016 0.018 0.030 0.009 0.014 0.026 BSC 0.003 0.008 0.020 REF 0.003 0.008 0.472 BSC 0.236 BSC 0.004 0.006 0.472 BSC 0.236 BSC 0.008 REF 0.039 REF 0_ 7_ --- 0_ 12 _ REF 5_ 13 _ 13-21 B SUFFIX CASE 858-01 Plastic Package ISSUE O 42 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010). -A- 42 22 -B- 1 21 DIM A B C D F G H J K L M N L H C -T- SEATING PLANE N G F D 42 PL K 0.25 (0.010) M T A M J 42 PL 0.25 (0.010) S M T B INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.032 0.046 0.070 BSC 0.300 BSC 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 0.81 1.17 1.778 BSC 7.62 BSC 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15 _ 0.51 1.02 S B SUFFIX CASE 859-01 Plastic Package (SDIP) ISSUE O 56 1 -A- 56 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010) 29 -B- 1 28 L H C -T- K SEATING PLANE G F D 56 PL 0.25 (0.010) 13-22 E M T A S N J M 56 PL 0.25 (0.010) M T B DIM A B C D E F G H J K L M N INCHES MIN MAX 2.035 2.065 0.540 0.560 0.155 0.200 0.014 0.022 0.035 BSC 0.032 0.046 0.070 BSC 0.300 BSC 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 51.69 52.45 13.72 14.22 3.94 5.08 0.36 0.56 0.89 BSC 0.81 1.17 1.778 BSC 7.62 BSC 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15 _ 0.51 1.02 S MOTOROLA ANALOG IC DEVICE DATA FB, FTB SUFFIX CASE 873-01 Plastic Package (TQFP-32) ISSUE A 1 L S D S H A-B V P B M S D S 0.20 (0.008) B B 0.20 (0.008) L M -B- -A- 0.05 (0.002) A-B 16 C A-B 17 24 25 -A-, -B-, -D- DETAIL A DETAIL A 32 9 1 8 F BASE METAL -D- A 0.20 (0.008) C A-B M D S S 0.05 (0.002) A-B N J S 0.20 (0.008) M H A-B D S S D 0.20 (0.008) M M C A-B D S S DETAIL C SECTION B-B VIEW ROTATED 90 _CLOCKWISE C E -H- -C- SEATING PLANE H M G DATUM PLANE 0.01 (0.004) U T R -H- DATUM PLANE K X DETAIL C MOTOROLA ANALOG IC DEVICE DATA Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIM A B C D E F G H J K L M N P Q R S T U V X MILLIMETERS MIN MAX 6.95 7.10 6.95 7.10 1.40 1.60 0.273 0.373 1.30 1.50 0.273 --- 0.80 BSC --- 0.20 0.119 0.197 0.33 0.57 5.6 REF 6_ 8_ 0.119 0.135 0.40 BSC 5_ 10_ 0.15 0.25 8.85 9.15 0.15 0.25 5_ 11_ 8.85 9.15 1.00 REF INCHES MIN MAX 0.274 0.280 0.274 0.280 0.055 0.063 0.010 0.015 0.051 0.059 0.010 --- 0.031 BSC --- 0.008 0.005 0.008 0.013 0.022 0.220 REF 6_ 8_ 0.005 0.005 0.016 BSC 5_ 10_ 0.006 0.010 0.348 0.360 0.006 0.010 5_ 11_ 0.348 0.360 0.039 REF 13-23 T SUFFIX CASE 894-03 Plastic Package (23-Pin SZIP) ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 1 23 C E B -N- L U K Y P F V M S H A R W -T- 23X PIN 1 0.024 (0.610) PIN 23 G 23X D 0.010 (0.254) 13-24 M T Q J SEATING PLANE S N M T DIM A B C D E F G H J K L M N P R S U V W Y INCHES MIN MAX 0.684 0.694 1.183 1.193 0.175 0.179 0.026 0.031 0.058 0.062 0.165 0.175 0.050 BSC 0.169 BSC 0.014 0.020 0.625 0.639 0.770 0.790 0.148 0.152 0.148 0.152 0.390 BSC 0.416 0.424 0.157 0.167 0.105 0.115 0.868 REF 0.200 BSC 0.700 0.710 MILLIMETERS MIN MAX 17.374 17.627 30.048 30.302 4.445 4.547 0.660 0.787 1.473 1.574 4.191 4.445 1.270 BSC 4.293 BSC 0.356 0.508 15.875 16.231 19.558 20.066 3.760 3.861 3.760 3.861 9.906 BSC 10.566 10.770 3.988 4.242 2.667 2.921 22.047 REF 5.080 BSC 17.780 18.034 S MOTOROLA ANALOG IC DEVICE DATA FTA SUFFIX CASE 932-02 Plastic Package (TQFP-48) ISSUE D 1 48 P 4X 0.200 (0.008) AB T-U Z 9 DETAIL Y A A1 48 37 AE 1 AE 36 -T- -U- B V B1 12 25 13 V1 -T-, -U-, -Z- DETAIL Y 24 -Z- S1 M_ TOP & BOTTOM S R 4X 0.200 (0.008) AC T-U Z GAUGE PLANE 0.250 (0.010) C E 0.080 (0.003) AC G -AB- W H Q_ -AC- AD K DETAIL AD X CCC EEE CCC EEE CCC BASE METAL N J F D 0.080 (0.003) M AC T-U S Z S SECTION AE-AE MOTOROLA ANALOG IC DEVICE DATA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BASIC 0.050 0.150 0.090 0.200 0.500 0.700 12 _REF 0.090 0.160 0.250 BASIC 1_ 5_ 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.276 BSC 0.138 BSC 0.276 BSC 0.138 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BASIC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BASIC 1_ 5_ 0.006 0.010 0.354 BSC 0.177 BSC 0.354 BSC 0.177 BSC 0.008 REF 0.039 REF 13-25 D2T SUFFIX CASE 936-03 Plastic Package ISSUE B 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 3 TERMINAL 4 K U A S B V H F 1 2 3 DIM A B C D E F G H J K L M N P R S U V J D G 0.010 (0.254) M T -T- OPTIONAL CHAMFER E C M L INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN P N R D2T SUFFIX CASE 936A-02 Plastic Package (D2PAK) ISSUE A 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 5 TERMINAL 6 U A V S K B H 1 2 3 4 5 DIM A B C D E G H K L M N P R S U V D 0.010 (0.254) M T G -T- OPTIONAL CHAMFER E C M N INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN L P R 13-26 MOTOROLA ANALOG IC DEVICE DATA 20 DT, DTB SUFFIX CASE 948E-02 Plastic Package (TSSOP-20) ISSUE A 1 20X 0.15 (0.006) T U M 20 L/2 2X K REF 0.10 (0.004) S T U V S K K1 IIII IIII IIII S J J1 11 B L PIN 1 IDENT 0.25 (0.010) N 10 1 0.15 (0.006) T U SECTION N-N -U- M S A -V- N F DETAIL E C G D -W- H 0.100 (0.004) -T- SEATING DTB SUFFIX 16 CASE 948F-01 Plastic Package (TSSOP-16, TSSOP-16L) ISSUE O 1 16X K REF 0.10 (0.004) M T U S V S CCC EEE CCC EEE CCC S K K1 2X L/2 16 9 J1 B -U- L SECTION N-N J PIN 1 IDENT. 8 1 S M A -V- N F DETAIL E C 0.10 (0.004) -T- SEATING PLANE MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ -W- H D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N 0.25 (0.010) 0.15 (0.006) T U DIM A B C D F G H J J1 K K1 L M DETAIL E PLANE 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. G DETAIL E MOTOROLA ANALOG IC DEVICE DATA 13-27 DTB SUFFIX CASE 948G-01 Plastic Package (TSSOP-14) ISSUE O 14 1 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S S N 2X 14 L/2 0.25 (0.010) 8 M B -U- L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A -V- EEE CCC CCC EEE K1 J J1 SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE 13-28 D G H DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MOTOROLA ANALOG IC DEVICE DATA DTB SUFFIX CASE 948H-01 Plastic Package ISSUE O 24 1 24X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S 2X 24 L/2 B -U- L PIN 1 IDENT. 12 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. 13 S A -V- DIM A B C D F G H J J1 K K1 L M C 0.10 (0.004) -T- SEATING PLANE G D H MILLIMETERS MIN MAX 7.70 7.90 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.303 0.311 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ -W- DETAIL E N 0.25 (0.010) K EEE CCC CCC EEE M K1 J1 N F SECTION N-N J MOTOROLA ANALOG IC DEVICE DATA DETAIL E 13-29 DTB SUFFIX CASE 948J-01 Plastic Package (TSSOP-8) ISSUE O 8 1 0.15 (0.006) T U NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. K REF 8x 0.10 (0.004) S M T U V S S K 2X L/2 EE CCC CCC EE K1 8 5 J J1 B -U- L PIN 1 IDENT. SECTION N-N 4 1 N 0.25 (0.010) 0.15 (0.006) T U S A -V- M N F DETAIL E -W- C 0.10 (0.004) -T- SEATING PLANE G D SEE DETAIL E H M SUFFIX CASE 967-01 Plastic Package (EIAJ-20) ISSUE O INCHES MIN MAX 0.114 0.122 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 1 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c A1 b 0.13 (0.005) MILLIMETERS MIN MAX 2.90 3.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ 20 20 13-30 DIM A B C D F G H J J1 K K1 L M M 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.81 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.032 MOTOROLA ANALOG IC DEVICE DATA FTB SUFFIX CASE 976-01 Plastic Package (TQFP-20) ISSUE O 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT DATUM PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 1 4X 9 0.200 (0.008) AB T-U Z A A1 20 DETAIL Y 16 15 1 -T- -U- V B1 V1 11 5 6 10 -Z- S1 MILLIMETERS MIN MAX 4.000 BSC 2.000 BSC 4.000 BSC 2.000 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.650 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_REF 0.090 0.160 0.250 BSC 1_ 5_ 0.150 0.250 6.000 BSC 3.000 BSC 6.000 BSC 3.000 BSC 0.200 REF 1.000 REF DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X B S 4X 0.200 (0.008) AB T-U Z DETAIL AD CCCC EEEE EEEE CCCC EEEE CCCC J -AB- INCHES MIN MAX 0.157 BSC 0.079 BSC 0.157 BSC 0.079 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.026 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BSC 1_ 5_ 0.006 0.010 0.236 BSC 0.118 BSC 0.236 BSC 0.118 BSC 0.008 REF 0.039 REF -AC- N F D 0.080 (0.003) AC 0.080 (0.003) M_ S AC T-U S Z S SECTION AE-AE TOP & BOTTOM R -T-, -U-, -Z- C E AE W H K X DETAIL AD MOTOROLA ANALOG IC DEVICE DATA Q_ AE GAUGE PLANE 0.250 (0.010) G DETAIL Y 13-31 FTA SUFFIX CASE 977-01 Plastic Package ISSUE O 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT DATUM PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 1 4X 9 0.200 (0.008) AB T-U Z A A1 24 -T- DETAIL Y 19 18 1 -U- V DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X B V1 13 6 B1 12 7 -Z- S1 S 4X 0.200 (0.008) AB T-U Z MILLIMETERS MIN MAX 4.000 BSC 2.000 BSC 4.000 BSC 2.000 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_REF 0.090 0.160 0.250 BSC 1_ 5_ 0.150 0.250 6.000 BSC 3.000 BSC 6.000 BSC 3.000 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.157 BSC 0.079 BSC 0.157 BSC 0.079 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BSC 1_ 5_ 0.006 0.010 0.236 BSC 0.118 BSC 0.236 BSC 0.118 BSC 0.008 REF 0.039 REF DETAIL AD -T-, -U-, -Z- -AB- -AC- AE AE 0.080 (0.003) AC M_ TOP & BOTTOM R C E J W H K X Q_ CCCC EEEE EEEE CCCC EEEE CCCC P G DETAIL Y N F GAUGE PLANE D 0.250 (0.010) 0.080 (0.003) S AC T-U S Z S DETAIL AD SECTION AE-AE 13-32 MOTOROLA ANALOG IC DEVICE DATA N SUFFIX CASE 1212-01 Plastic Package (SOT-23) ISSUE O 1 A B D 5 E A2 0.05 S NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM C IS A SEATING PLANE. A1 4 1 2 L 3 E1 L1 B C 5X 0.10 C B M A S C S e e1 H SUFFIX CASE 1213-01 Plastic Package (SOT-89) ISSUE O DIM A1 A2 B C D E E1 e e1 L L1 MILLIMETERS MIN MAX 0.00 0.10 1.00 1.30 0.30 0.50 0.10 0.25 2.80 3.00 2.50 3.10 1.50 1.80 0.95 BSC 1.90 BSC 0.20 --- 0.45 0.75 1 A D A2 C B D1 E1 E L1 B 0.10 B1 e M C B S A S 2X 0.10 M C B S A S C NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUM C IS A SEATING PLANE. DIM A2 B B1 C D D1 E E1 e e1 L1 MILLIMETERS MIN MAX 1.40 1.60 0.37 0.57 0.32 0.52 0.30 0.50 4.40 4.60 1.50 1.70 --- 4.25 2.40 2.60 1.50 BSC 3.00 BSC 0.80 --- e1 MOTOROLA ANALOG IC DEVICE DATA 13-33