SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Convert TTL Voltage Levels to MOS Levels
D
High Sink-Current Capability
D
Input Clamping Diodes Simplify System
Design
D
Open-Collector Drivers for Indicator Lamps
and Relays
D
Inputs Fully Compatible With Most TTL
Circuits
description
These TTL hex inverter buffers/drivers feature
high-voltage open-collector outputs for interfacing
with high-level circuits (such as MOS) or for
driving high-current loads (such as lamps or
relays), and also are characterized for use as
inverter buffers for driving TTL inputs. The
SN5406 and SN7406 have minimum breakdown
voltages of 30 V. The SN5416 and SN7416 have
minimum breakdown voltages of 15 V. The
maximum sink current is 30 mA for the SN5406
and SN5416, and 40 mA for the SN7406 and
SN7416.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
Tube SN7406D
7406
SOIC D
Tape and reel SN7406DR
7406
SOIC
–
D
Tube SN7416D
7416
0°C to 70°CTape and reel SN7416DR
7416
PDIP N
Tube
SN7406N SN7406N
PDIP
–
N
Tube
SN7416N SN7416N
SOP – NS Tape and reel SN7406NSR SN7406
CDIP J
Tube SNJ5406J SNJ5406J
CDIP
–
J
Tube SNJ5416J SNJ5416J
–55°C to 125°C
CDIP W
Tube SNJ5406W SNJ5406W
CDIP
–
W
Tube SNJ5416W SNJ5416W
LCCC – FK Tube SNJ5406FK SNJ5406FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN5406, SN5416 ...J OR W PACKAGE
SN7406 . . . D, N, OR NS PACKAGE
SN7416 ...D OR N PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
3212019
910111213
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
SN5406 . . . FK PACKAGE
(TOP VIEW)
1Y
1A
NC
6A 6A
3Y
GND
NC CC
V
4Y
NC – No internal connection
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1A
2A
3A
4A
5A
6A
1Y
2Y
3Y
4Y
5Y
6Y
1
3
5
9
11
13
2
4
6
8
10
12
Y = A
schematic (each buffer/driver)
Resistor values shown are nominal.
6 kΩ
Input A Output Y
GND
VCC
1.4 kΩ
1.6 kΩ
100 Ω
1 kΩ
2 kΩ
’06, ’16
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO (see Notes 1 and 2): SN5406, SN7406 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN5416, SN7416 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 3): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. This is the maximum voltage which should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
SN5406
SN5416 SN7406
SN7416 UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 4.5 5 5.5 4.75 5 5.25 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VOH
High level out
p
ut voltage
’06 30 30
V
V
OH
High
-
level
output
voltage
’16 15 15
V
IOL Low-level output current 30 40 mA
TAOperating free-air temperature –55 125 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS
†
SN5406
SN5416 SN7406
SN7416 UNIT
MIN TYP‡MAX MIN TYP‡MAX
VIK VCC = MIN, II = –12 mA –1.5 –1.5 V
IOH VCC = MIN, VIL = 0.8 V, VOH = §0.25 0.25 mA
VOL
VCC = MIN
VIH =2V
IOL = 16 mA 0.4 0.4
V
V
OL
V
CC =
MIN
,
V
IH =
2
V
IOL = 0.7 0.7
V
IIVCC = MAX, VI = 5.5 V 1 1 mA
IIH VCC = MAX, VIH = 2.4 V 40 40 µA
IIL VCC = MAX, VIL = 0.4 V –1.6 –1.6 mA
ICCH VCC = MAX 30 48 30 48 mA
ICCL VCC = MAX 32 51 32 51 mA
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡All typical values are at VCC = 5 V, TA = 25°C.
§VOH = 30 V for ’06 and 15 V for ’16.
IOL = 30 mA for SN54’ and 40 mA for SN74’.
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER FROM
(INPUT) TO
(OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT
tPLH
R110Ω
C15pF
10 15
ns
tPHL
R
L =
110
Ω
,
C
L =
15
p
F
15 23
ns
SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL
(see Note A)
RL
Test Point
VCC
LOAD CIRCUIT
1.5 V 1.5 V
High-Level
Pulse
1.5 V 1.5 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PULSE WIDTHS
NOTES: A. CL includes probe and jig capacitance.
B. In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 7 ns, tf≤ 7 n s.
D. The outputs are measured one at a time with one input transition per measurement.
1.5 V 1.5 V
Input
tPLH
In-Phase
Output
3 V
0 V
1.5 V 1.5 V VOH
VOL
tPHL
1.5 V 1.5 V VOH
VOL
tPHL tPLH
Out-of-Phase
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Figure 1. Load Circuit and Voltage Waveforms
IMPORTANT NOTICE
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/00801BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/00801BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5406J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN5416J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN7406D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN7406N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN7406N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7406NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN7406NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7406NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN7416N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7416NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN7416NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN7416NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN7416NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ5406FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ5406J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ5406W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ5416J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ5416W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN7406DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN7406DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN7406NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN7416DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN7416NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN7406DR SOIC D 14 2500 333.2 345.9 28.6
SN7406DR SOIC D 14 2500 346.0 346.0 33.0
SN7406NSR SO NS 14 2000 346.0 346.0 33.0
SN7416DR SOIC D 14 2500 346.0 346.0 33.0
SN7416NSR SO NS 14 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004