Connectors Sockets Pin Sockets
Socket Length : 6.53 mm [ .257 in ]
Hole Size (Recommended) : 1.57 mm [ .062 in ]
Solder Process Feature : None
Socket Sleeve Style : Closed Bottom
Wire Size (AWG): 22 – 20
ORDER SAMPLES
Compatible Parts & Tooling
TE Internal #: 5050864-1
TE Internal Description: SOCKET,MIN-SPR SN-
AU SER-3
5050864-1
Pin Sockets, Socket Length .257 in [6.53 mm], Hole Size (Recommended) 1.57 mm [.062 in],
None, Closed Bottom, 22 – 20 AWG, .326 – .518 mm²
Digital Datasheet
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Product Drawings
SOCKET,MIN-SPR SN-AU SER-3
SOCKET,MIN-SPR SN-AU SER-3
English
CAD Files
3D PDF
3D_CVM_CVM_5050864-1_O.pdf
3D
Customer View Model
ENG_CVM_CVM_5050864-1_O.2d_dxf.zip
English
ENG_CVM_CVM_5050864-1_O.3d_igs.zip
English
ENG_CVM_CVM_5050864-1_O.3d_stp.zip
English
Product
Specifications
Product Specification
ENG_SS_108-14008_H_108-14008.pdf
English
Please review product documents or contact us for the latest agency approval
information. Please Note: Use the Product Drawing for all design activity.
Documents
Features
Product Compliance
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Product Type
Features
Socket Sleeve Style : Closed Bottom
Connector System : Cable-to-Board
Sealable : No
Connector & Contact Terminates To : Printed Circuit Board
Product Type : Contact
Profile : Zero
Wire/Cable Type : Discrete Wire
Body Features
Sleeve Plating Material : Tin
Sleeve Material : Copper
Contact Features
Contact Base Material : Beryllium Copper
Contact Current Rating (Max) (A): 6.5
Contact Type : Socket
Contact Spring Plating Thickness : .762 µm [ 30 µin ]
Contact Spring Plating Material : Gold
Contact Mating Area Plating Thickness : 30 µm [ 30 µin ]
Contact Transmits (Typical) : Signal (Data)/Power
Socket Type : Discrete
Termination
Features
Termination Method to Printed Circuit Board :
Through Hole - Press-Fit
Termination Method to Wire & Cable : Solder
Insertion Method : Hand/Semi-Automatic/Automatic
Dimensions
Socket Length : 6.53 mm [ .257 in ]
Hole Size (Recommended) : 1.57 mm [ .062 in ]
Wire Size (AWG): 22 – 20
Wire Size (mm²): .326 – .518
Mating Pin Diameter Range : .66 – .84 mm [ .026 – .033 in ]
PCB Thickness (Recommended) :
.79 – 3.18 mm [ .031 – .125 in ]
Usage Conditions Operating Temperature Range : -65 – 125 °C [ -85 – 257 °F ]
Operation/Application
Solder Process Feature : None
Circuit Application : Power & Signal
Packaging
Features
Packaging Method : Bag, Loose Piece
Packaging Quantity : 2000
Other Spring Material : Beryllium Copper
Statement of
Compliance
Statement of Compliance pdf
