© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 4 1Publication Order Number:
SA571/D
SA571
Compandor
The SA571 is a versatile low cost dual gain control circuit in which
either channel may be used as a dynamic range compressor or
expandor. Each channel has a full−wave rectifier to detect the average
value of the signal, a linerarized temperature−compensated variable
gain cell, and an operational amplifier.
The SA571 is well suited for use in cellular radio and radio
communications systems, modems, telephone, and satellite
broadcast/receive audio systems.
Features
Complete Compressor and Expandor in one IChip
Temperature Compensated
Greater than 110 dB Dynamic Range
Operates Down to 6.0 VDC
System Levels Adjustable with External Components
Distortion may be Trimmed Out
Dynamic Noise Reduction Systems
Voltage Controlled Amplifier
Pb−Free Packages are Available*
Applications
Cellular Radio
High Level Limiter
Low Level Expandor − Noise Gate
Dynamic Filters
CD Player
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
RECT CAP 1
RECT IN 1
DG CELL IN 1
GND
RECT CAP 2
DG CELL IN 2
RECT IN 2
VCC
D, and N Packages*
1
2
3
4
5
6
7
89
10
11
12
13
14
16
15
INV. IN 1
RES. R3 1
OUTPUT 1
THD TRIM 1
INV. IN 2
RES. R3 2
OUTPUT 2
THD TRIM 2
TOP VIEW
*
SOL − Released in Large SO Package Only.
PIN CONNECTIONS
S
ee detailed ordering and shipping information in the package
d
imensions section on page 9 of this data sheet.
ORDERING INFORMATION
PDIP−16
N SUFFIX
CASE 648
16 1
16
SOIC−16 WB
D SUFFIX
CASE 751G
1
MARKING
DIAGRAMS
16
1
SA571D
AWLYYWWG
16
1
SA571N
AWLYYWWG
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
SA571
http://onsemi.com
2
VARIABLE
GAIN
THD TRIM
RECT CAP
1.8V
INVERTER IN
OUTPUT
+
RECTIFIER
Figure 1. Block Diagram
DG IN
RECT IN
VREF
R2 20kW
R1 10kW
R3 20kW
R4 30kW
R3
MAXIMUM RATINGS
Rating Symbol Value Unit
Maximum Operating Voltage VCC 18 VDC
Operating Ambient Temperature Range TA−40 to +85 °C
Operating Junction Temperature TJ150 °C
Power Dissipation PD400 mW
Thermal Resistance, Junction−to−Ambient N Package
D Package
RqJA 75
105
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
SA571
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS (VCC = +15 V, TA = 25°C, unless otherwise noted)
Characteristic Symbol Test Conditions Min Typ Max Unit
Supply Voltage VCC 6.0 18 V
Supply Current ICC No Signal 4.2 4.8 mA
Output Current Capability IOUT ±20 mA
Output Slew Rate SR ±.5 V/ms
Gain Cell Distortion (Note 2) Untrimmed
Trimmed 0.5
0.1 2.0 %
Resistor Tolerance ±5±15 %
Internal Reference Voltage 1.65 1.8 1.95 V
Output DC Shift (Note 3) Untrimmed ±90 ±150 mV
Expandor Output Noise No Signal, 15 Hz−20 kHz
(Note 1) 20 60 mV
Unity Gain Level (Note 5) 1.0 kHz −1.5 0 +1.5 dBm
Gain Change (Notes 2 and 4) ±0.1 dB
Reference Drift (Note 4) +2.0, −25 +20, −50 mV
Resistor Drift (Note 4) −40°C to +85°C +10, −12 %
Tracking Error
(Measured Relative to Value at Unity Gain)
Equals [VO − VO (unity gain)] dB − V2dBm
Rectifier Input,
VCC = +6.0 V
V2 = +6.0 dBm, V1 = 0 dB
V2 = −30 dBm, V1 = 0 dB
+0.2
+0.2 −1.0, +1.5
dB
Channel Separation 60 dB
1. Input to V1 and V2 grounded.
2. Measured at 0 dBm, 1.0 kHz.
3. Expandor AC input change from no signal to 0 dBm.
4. Relative to value at TA = 25°C.
5. 0 dBm = 775 mVRMS.
SA571
http://onsemi.com
4
Circuit Description
The SA571 compandor building blocks, as shown in the
block diagram, are a full−wave rectifier , a variable gain cell,
an operational amplifier and a bias system. The arrangement
of these blocks in the IC result in a circuit which can perform
well with few external components, yet can be adapted to
many diverse applications.
The full−wave rectifier rectifies the input current which
flows from the rectifier input, to an internal summing node
which is biased at VREF. The rectified current is averaged on
an external filter capacitor tied to the CRECT terminal, and
the average value of the input current controls the gain of t he
variable gain cell. The gain will thus be proportional to the
average value of the input signal for capacitively−coupled
voltage inputs as shown in the following equation. Note that
for capacitively−coupled inputs there is no offset voltage
capable of producing a gain error. The only error will come
from the bias current of the rectifier (supplied internally)
which is less than 0.1 mA.
GT|VIN *VREF |avg
R1
or
GT|V
IN |avg
R1
The speed with which gain changes to follow changes in
input signal levels is determined by the rectifier filter
capacitor. A small capacitor will yield rapid response but
will not fully filter low frequency signals. Any ripple on th e
gain control signal will modulate the signal passing through
the variable gain cell. In an expander or compressor
application, this would lead to third harmonic distortion, so
there i s a trade−off to be made between fast attack and decay
times and distortion. For step changes in amplitude, the
change in gain with time is shown by this equation.
t+10kW CRECT
G(t) +(Ginitial *Gfinal)e
*t
t)Gfinal
The variable gain cell is a current−in, current−out device
with the ratio IOUT/IIN controlled by the rectifier. IIN is the
current which flows from the DG input to an internal
summing node biased at VREF. The following equation
applies for capacitively−coupled inputs. The output current,
IOUT, is fed to the summing node of the op amp.
IIN +VIN *VREF
R2+VIN
R2
A compensation scheme built into the DG cell
compensates for temperature and cancels out odd harmonic
distortion. The only distortion which remains is even
harmonics, and they exist only because of internal offset
voltages. The THD trim terminal provides a means for
nulling the internal offsets for low distortion operation.
The operational amplifier (which is internally
compensated) has the non−inverting input tied to VREF, and
the inverting input connected to the DG cell output as well
as brought out externally. A resistor, R 3, is brought out from
the summing node and allows compressor or expander gain
to be determined only by internal components.
The output stage is capable of ±20 mA output current.
This allows a +13 dBm (3.5 VRMS) output into a 300 W load
which, with a series resistor and proper transformer, can
result in +13 dBm with a 600 W output impedance.
A bandgap reference provides the reference voltage for all
summing nodes, a regulated supply voltage for the rectifier
and DG cell, and a bias current for the DG cell. The low
tempco of this type of reference provides very stable biasing
over a wide temperature range.
The typical performance characteristics illustration
shows the basic input−output transfer curve for basic
compressor or expander circuits.
+20
+10
0
−10
−20
−30
−40
−50
−60
−70
−80
−40 −30 −20 −10 0 +10
COMPRESSOR OUTPUT LEVEL
OR
EXPANDOR INPUT LEVEL (dBm)
COMPRESSOR INPUT LEVEL OR EXPANDOR
Figure 2. Basic Input−Output Transfer Curve
OUTPUT LEVEL (dBm)
13
3, 14
2, 15
4 1, 16
200pF
Figure 3. Typical Test Circuit
V1
V2
VO
VCC = 15V
VREF
DG
10mF
0.1mF
2.2mF
2.2mF
20kW
10kW
2.2mF
5, 12
8.2kW
8, 9
30kW
20kW
6, 11
7, 10
+
SA571
http://onsemi.com
5
INTRODUCTION
Much interest has been expressed in high performance
electronic gain control circuits. For non−critical
applications, an integrated circuit operational
transconductance amplifier can be used, but when
high−performance is required, one has to resort to complex
discrete circuitry with many expensive, well−matched
components. This paper describes an inexpensive integrated
circuit, the SA571 Compandor, which offers a pair of high
performance gain control circuits featuring low distortion
(<0.1%), high signal−to−noise ratio (90 dB), and wide
dynamic range (110 dB).
Circuit Background
The SA571 Compandor was originally designed to satisfy
the requirements of the telephone system. When several
telephone channels are multiplexed onto a common line, the
resulting signal−to−noise ratio is poor and companding is
used to allow a wider dynamic range to be passed through
the channel. Figure 4 graphically shows what a compandor
can do for the signal−to−noise ratio of a restricted dynamic
range channel. The input level range of +20 to −80 dB is
shown undergoing a 2−to−1 compression where a 2.0 dB
input level change is compressed into a 1.0 dB output level
change by the compressor. The original 100 dB of dynamic
range is thus compressed to a 50 dB range for transmission
through a restricted dynamic range channel. A
complementary expansion on the receiving end restores the
original signal levels and reduces the channel noise by as
much as 45 dB.
The significant circuits in a compressor or expander are
the rectifier and the gain control element. The phone system
requires a simple full−wave averaging rectifier with good
accuracy, since the rectifier accuracy determines the (input)
output level tracking accuracy. The gain cell determines the
distortion and noise characteristics, and the phone system
specifications here are very loose. These specs could have
been met with a simple Operational Transconductance
Multiplier, or OTA, but the gain of an OTA is proportional
to temperature and this is very undesirable. Therefore, a
linearized transconductance multiplier was designed which
is insensitive to temperature and offers low noise and low
distortion performance. These features make the circuit
useful in audio and data systems as well as in
telecommunications systems.
Basic Hook−up and Operation
Figure 5 shows the block diagram of one half of the chip,
(there are two identical channels on the IC). The full−wave
averaging rectifier provides a gain control current, IG, for the
variable gain (DG) cell. The output of the DG cell is a current
which is fed to the summing node of the operational
amplifier. Resistors are provided to establish circuit gain and
set the output DC bias.
The circuit is intended for use in single power supply
systems, so the internal summing nodes must be biased at
some voltage above ground. An internal band gap voltage
reference provides a very stable, low noise 1.8 V reference
denoted V REF. The non−inverting input of the op amp is tied
to V REF, and the summing nodes of the rectifier and DG cell
(located at the right of R1 and R2) have the same potential.
The THD trim pin is also at the VREF potential.
INPUT
LEVEL
COMPRESSION
EXPANSION
OUTPUT
LEVEL
NOISE
+20
0dB
−40
−80
−20
0dB
−40
−80
Figure 4. Restricted Dynamic Range Channel
VCC PIN 13
GND PIN 4
OUTPUT
7,10
VREF
1.8V
R4
30kW
1,16
CRECT
R1
10kW
2,15
RECTIN
GIN
3,14 20kW
R220kW
R36,11 5,12
INVIN
R3
THD TRIM8,9
IG
DG
Figure 5. Chip Block Diagram (1 of 2 Channels)
+
SA571
http://onsemi.com
6
Figure 6 shows how the circuit is hooked up to realize an
expandor. The input signal, VIN, is applied to the inputs of
both the rectifier and the DG cell. When the input signal
drops by 6 . 0 d B , t h e g a i n control current will drop by a factor
of 2, and so the gain will drop 6.0 dB. The output level at
VOUT will thus drop 12 dB, giving us the desired 2−to−1
expansion.
+
GAIN +ǒ2R
3VIN (avg)
R1R2IBǓ2
NOTE:
IB = 140mA
*EXTERNAL COMPONENTS
VIN VOUT
VREF
DG
*CIN1
*CIN2
*CRECT
R
3
R4
R1
R2
Figure 6. Basic Expander
Figure 7 shows the hook−up for a compressor. This is
essentially a n expandor placed in the feedback loop of the op
amp. The DG cell is setup to provide AC feedback only, so
a separate DC feedback loop is provided by the two RDC and
CDC. The values of RDC will determine the DC bias at the
output of the op amp. The output will bias to:
VOUT DC +ǒ1)RDC1 )RDC2
R4ǓVREF
VOUT DC +ǒ1)RDCTOT
30kWǓ1.8V
The output of the expander will bias up to:
VOUT DC +ǒ1)R3
R4ǓVREF
VOUT DC +ǒ1)20kW
30kWǓ1.8V +3.0V
The output will bias to 3.0 V when the internal resistors are
used. External resistors may be placed in series with R3,
(which will af fect the gain), or in parallel with R4 to raise the
DC bias to any desired value.
NOTE: GAIN +ǒR1R2IB
2R3VINavgǓ1
2
IB = 140mA
*EXTERNAL COMPONENTS
VIN
CIN
CF
R1
R2
R3VOUT
DG
*
CRECT *
RDC *RDC *
CDC *
VREF
R4
Figure 7. Basic Compressor
*
+
Circuit Details − Rectifier
Figure 8 shows the concept behind the full−wave
averaging rectifier. The input current to the summing node
of the op amp, VIN/R1, is supplied by the output of the op
amp. If we can mirror the op amp output current into a
unipolar current, we will have an ideal rectifier. The output
current is averaged by R5, CR, which set the averaging time
constant, and then mirrored with a gain of 2 to become IG,
the gain control current.
CRIG
R1
VIN
V+
I = VIN / R1
Figure 8. Rectifier Concept
R5
10kW
+
SA571
http://onsemi.com
7
Figure 9 shows the rectifier circuit in more detail. The op
amp is a one−stage op amp, biased so that only one output
device is on at a time. The non−inverting input, (the base of
Q1), which is shown grounded, is actually tied to the internal
1.8 V, VREF. The inverting input is tied to the op amp output,
(the emitters of Q5 and Q6), and the input summing resistor
R1. The single diode between the bases of Q5 and Q6 assures
that only one device is on at a time. To detect the output
current of the op amp, we simply use the collector currents
of the output devices Q5 and Q6. Q6 will conduct when the
input swings positive and Q5 conducts when the input
swings negative. The collector currents will be in error by
the a of Q5 or Q6 on negative or positive signal swings,
respectively. ICs such as this have typical NPN bs of 200
and PNP bs of 40. The as of 0.995 and 0.975 will produce
errors of 0.5% on negative swings and 2.5% on positive
swings. The 1.5% average of these errors yields a mere 0.13
dB gain error.
V+
Q1Q2
Q3
Q4
Q7
Q5
Q6Q8Q9
CR
D1
I1I2
VIN
V−
IG+2VIN avg
R1
NOTE:
Figure 9. Simplified Rectifier Schematic
R1
10kW
RS
10kW
At very low input signal levels the bias current of Q2,
(typically 50 nA), will become significant as it must be
supplied b y Q 5. Another low level error can be caused by DC
coupling into the rectifier. If a n o ffset voltage exists between
the VIN input pin and the base of Q2, an error current of
VOS/R1 will be generated. A mere 1.0 mV of offset will
cause an input current of 100 nA which will produce twice
the error of the input bias current. For highest accuracy, the
rectifier should be coupled capacitively. At high input levels
the b of the PNP Q6 will begin to suffer, and there will be an
increasing error until the circuit saturates. Saturation can be
avoided by limiting the current into the rectifier input to
250 mA. If necessary, an external resistor may be placed in
series with R1 to limit the current to this value. Figure 10
shows the rectifier accuracy vs. input level at a frequency of
1.0 kHz.
ERROR GAIN dB
+1
0
−1 −40 −20 0
RECTIFIER INPUT dBm
Figure 10. Rectifier Accuracy
At very high frequencies, the response of the rectifier will
fall off. The roll−off will be more pronounced at lower input
levels due to the increasing amount of gain required to
switch between Q5 or Q6 conducting. The rectifier
frequency response for input levels of 0 dBm, −20 dBm, and
−40 dBm is shown in Figure 11. The response at all three
levels is flat to well above the audio range.
0
3
10k 1MEG
INPUT = 0dBm
−20dBm
−40dBm
FREQUENCY (Hz)
GAIN ERROR (dB)
Figure 11. Rectifier Frequency Response vs.
Input Level
SA571
http://onsemi.com
8
Variable Gain Cell
Figure 12 is a diagram of the variable gain cell. This is a
linearized two−quadrant transconductance multiplier. Q1,
Q2 and the op amp provide a predistorted drive signal for the
gain control pair, Q3 and Q4. The gain is controlled by IG and
a current mirror provides the output current.
Q1Q2Q3Q4
NOTE:
I2 (= 2I1)
280mAIG
IIN
VIN
R2
20k
I1
140mA
V+
V−
IOUT +IG
I1IIN +IGVIN
I2R2
Figure 12. Simplified DG Cell Schematic
+
The op amp maintains the base and collector of Q1 at
ground potential (VREF) by controlling the base of Q2. The
input current IIN (= VIN/R2) is thus forced to flow through
Q1 along with the current I1, so IC1 = I1 + IIN. Since I2 has
been set at twice the value of I1, the current through Q2 is:
I2 − (I1 + IIN) = I1 − IIN = IC2.
The op amp has thus forced a linear current swing between
Q1 and Q2 by providing the proper drive to the base of Q2.
This drive signal will be linear for small signals, but very
non−linear for lar ge signals, since it is compensating for the
non−linearity o f the dif ferential pair, Q1 and Q2, under large
signal conditions.
The key to the circuit is that this same predistorted drive
signal is applied to the gain control pair, Q3 and Q4. When
two differential pairs of transistors have the same signal
applied, their collector current ratios will be identical
regardless of the magnitude of the currents. This gives us:
IC1
IC2 +IC4
IC3 +I1)IIN
I1*IIN
plus the relationships IG = I C3 + I C4 and IOUT = I C4 − IC3 will
yield the multiplier transfer function,
IOUT +IG
I1IIN +VIN
R2
IG
I1
This equation is linear and temperature−insensitive, but it
assumes ideal transistors.
If the transistors are not perfectly matched, a parabolic,
non−linearity is generated, which results in second
harmonic distortion. Figure 13 gives an indication of the
magnitude of the distortion caused by a given input level and
offset voltage. The distortion is linearly proportional to the
magnitude of the offset and the input level. Saturation of the
gain cell occurs at a +8 dBm level. At a nominal operating
level of 0 dBm, a 1.0 mV offset will yield 0.34% of second
harmonic distortion. Most circuits are somewhat better than
this, which means our overall o ffsets are typically about mV.
The distortion is not affected by the magnitude of the gain
control current, and it does not increase as the gain is
changed. This second harmonic distortion could be
eliminated by making perfect transistors, but since that
would be difficult, we have had to resort to other methods.
A trim pin has been provided to allow trimming of the
internal offsets to zero, which effectively eliminated second
harmonic distortion. Figure 14 shows the simple trim
network required.
4
3
2
1
.34 −6 0 +6
4mV
3mV
2mV
1mV
INPUT LEVEL (dBm)
% THD
Figure 13. DG Cell Distortion vs. Offset Voltage
3.6V
V
CC
R
6.2kW
To THD Trim
200pF
Figure 14. THD Trim Network
20kW
SA571
http://onsemi.com
9
Figure 15 shows the noise performance of the DG cell.
The maximum output level before clipping occurs in the
gain cell is plotted along with the output noise in a 20 kHz
bandwidth. Note that the noise drops as the gain is reduced
for the first 20 dB of gain reduction. At high gains, the signal
to noise ratio is 90 dB, and the total dynamic range from
maximum signal to minimum noise is 110 dB.
VCA GAIN (0dB)
+20
OUTPUT (dBm)
0
−20
−40
−60
−80
−100
−40 −20 0
MAXIMUM
SIGNAL LEVEL
NOISE IN
20kHz BW
90dB
110dB
Figure 15. Dynamic Range
Control signal feedthrough is generated in the gain cell by
imperfect device matching and mismatches in the current
sources, I 1 and I2. When no input signal is present, changing
IG will cause a small output signal. The distortion trim is
effective in nulling out any control signal feedthrough, but
in general, the null for minimum feedthrough will be
different than the null in distortion. The control signal
feedthrough can be trimmed independently of distortion by
tying a current source to the DG input pin. This effectively
trims I1. Figure 16 shows such a trim network.
Figure 16. Control Signal Feedthrough
R−SELECT FOR
3.6V
470kW
TO PIN 3 OR 14
100kW
VCC
Operation Amplifier
The main op amp shown in the chip block diagram is
equivalent to a 741 with a 1.0 MHz bandwidth. Figure 17
shows the basic circuit. Split collectors are used in the input
pair to reduce gM, so that a small compensation capacitor of
just 10 pF may be used. The output stage, although capable
of output currents in excess of 20 mA, is biased for a low
quiescent current to conserve power. When driving heavy
loads, this leads to a small amount of crossover distortion.
Q1Q2
Q4
Q3
I1I2Q6
D1
D2
Q2
CC
+IN
−IN OUT
Figure 17. Operational Amplifier
ORDERING INFORMATION
Device Description Temperature Range Shipping
SA571D 16−Pin Plastic Small Outline (SO−16 WB) Package −40 to +85°C47 Units / Rail
SA571DG 16−Pin Plastic Small Outline (SO−16 WB) Package
(Pb−Free) −40 to +85°C47 Units / Rail
SA571DR2 16−Pin Plastic Small Outline (SO−16 WB) Package −40 to +85°C1000 / Tape & Reel
SA571DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package
(Pb−Free) −40 to +85°C1000 / Tape & Reel
SA571N 16−Pin Plastic Dual In−Line Package (PDIP−16) −40 to +85°C25 Units / Rail
SA571NG 16−Pin Plastic Dual In−Line Package (PDIP−16)
(Pb−Free) −40 to +85°C25 Units / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
SA571
http://onsemi.com
10
PACKAGE DIMENSIONS5
SOIC−16 WB
D SUFFIX
CASE 751G−03
ISSUE C
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B S
T
16 9
81
hX 45_
M
B
M
0.25
H8X
E
B
A
eT
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D10.15 10.45
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
q0 7
__
PDIP−16
N SUFFIX
CASE 648−08
ISSUE T NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
−T−
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
SA571
http://onsemi.com
11
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
SA571/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.