ADC121S655 12-Bit, 200 kSPS to 500 kSPS, Differential Input, Micro Power A/D Converter General Description Features The ADC121S655 is a 12-bit, 200 kSPS to 500 kSPS sampling Analog-to-Digital (A/D) converter that features a fully differential, high impedance analog input and an external reference. The reference voltage can be varied from 1.0V to VA, with a corresponding resolution between 244V and VA divided by 4096. The output serial data is binary 2's complement and is compatible with several standards, such as SPITM, QSPITM, MICROWIRETM, and many common DSP serial interfaces. The differential input, low power consumption, and small size make the ADC121S655 ideal for direct connection to transducers in battery operated systems or remote data acquisition applications. Operating from a single 5V supply, the supply current when operating at 500 kSPS is typically 1.8 mA. The supply current drops down to 0.3 A typically when the ADC121S655 enters power-down mode. The ADC121S655 is available in the MSOP-8 package. Operation is guaranteed over the industrial temperature range of -40C to +105C and clock rates of 3.2 MHz to 8 MHz. True Differential Inputs Guaranteed performance from 200 kSPS to 500 kSPS External Reference Wide Input Common-Mode Voltage Range SPITM/QSPITM/MICROWIRETM/DSP compatible Serial Interface Key Specifications Conversion Rate INL DNL Offset Error Gain Error SINAD Power Consumption at VA = 5V -- Active, 500 kSPS -- Active, 200 kSPS -- Power-Down 200 kSPS to 500 kSPS 0.95 LSB (max) 0.85 LSB (max) 3.0 LSB (max) 5.5 LSB (max) 70 dB (min) 9 mW (typ) 7 mW (typ) 1.5 W (typ) Applications Automotive Navigation Portable Systems Medical Instruments Instrumentation and Control Systems Motor Control Direct Sensor Interface Pin-Compatible Alternatives by Speed All devices are pin compatible. Resolution 12-bit Specified for Sample Rate Range of: 50 to 200 ksps 200 to 500 ksps 500 ksps to 1 Msps ADC121S625 ADC121S655 ADC121S705 Connection Diagram 30010505 TRI-STATE(R) is a trademark of National Semiconductor Corporation. MICROWIRETM is a trademark of National Semiconductor Corporation. QSPITM and SPITM are trademarks of Motorola, Inc. (c) 2007 National Semiconductor Corporation 300105 www.national.com ADC121S655 12-Bit, 200 kSPS to 500 kSPS, Differential Input, Micro Power A/D Converter May 2007 ADC121S655 Ordering Information Temperature Range Description Top Mark ADC121S655CIMM Order Code -40C to +105C 8-Lead MSOP Package, 1000 Units Tape & Reel X2AC ADC121S655CIMMX -40C to +105C 8-Lead MSOP Package, 3500 Units Tape & Reel X2AC ADC121S705EB Evaluation Board Block Diagram 30010502 Pin Descriptions and Equivalent Circuits Pin No. Symbol Description 1 VREF Voltage Reference Input. A voltage reference between 1V and VA must be applied to this input. VREF must be decoupled to GND with a minimum ceramic capacitor value of 1 F. A bulk capacitor value of 10 F in parallel with the 1 F is recommended for enhanced performance. 2 +IN Non-Inverting Input. +IN is the positive analog input for the differential signal applied to the ADC121S655. 3 -IN Inverting Input. -IN is the negative analog input for the differential signal applied to the ADC121S655. 4 GND Ground. GND is the ground reference point for all signals applied to the ADC121S655. 5 CS Chip Select Bar. CS is active low. The ADC121S655 is in Normal Mode when CS is LOW and Power-Down Mode when CS is HIGH. A conversion begins on the fall of CS. 6 DOUT Serial Data Output. The conversion result is provided on DOUT. The serial data output word is comprised of 4 null bits and 12 data bits (MSB first). During a conversion, the data is output on the falling edges of SCLK and is valid on the rising edges. 7 SCLK Serial Clock. SCLK is used to control data transfer and serves as the conversion clock. 8 VA Power Supply input. A voltage source between 4.5V and 5.5V must be applied to this input. VA must be decoupled to GND with a ceramic capacitor value of 1 F in parallel with a bulk capacitor value of 10 F. www.national.com 2 -40C TA +105C Supply Voltage, VA +4.5V to +5.5V Reference Voltage, VREF 1.0V to VA Input Common-Mode Voltage, VCM See Figure 8 (Sect 2.3) Digital Input Pins Voltage Range 0 to VA Clock Frequency 3.2 MHz to 8 MHz Differential Analog Input Voltage -VREF to +VREF If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Analog Supply Voltage VA Voltage on Any Pin to GND Input Current at Any Pin (Note 3) Package Input Current (Note 3) Power Consumption at TA = 25C ESD Susceptibility (Note 5) Human Body Model Machine Model Charge Device Model Junction Temperature Storage Temperature (Notes 1, 2) Operating Temperature Range -0.3V to 6.5V -0.3V to (VA +0.3V) 10 mA 50 mA See (Note 4) Package Thermal Resistance 2500V 250V 750V +150C -65C to +150C Package JA 8-lead MSOP 200C / W Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging. (Note 6) ADC121S655 Converter Electrical Characteristics (Note 8) The following specifications apply for VA = +4.5V to 5.5V, VREF = 2.5V, fSCLK = 3.2 to 8 MHz, fIN = 100 kHz, CL = 25 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX; all other limits are at TA = 25C. Symbol Parameter Conditions Typical Limits Units (Note 7) STATIC CONVERTER CHARACTERISTICS 12 Bits INL Resolution with No Missing Codes Integral Non-Linearity 0.6 0.95 LSB (max) DNL Differential Non-Linearity 0.4 0.85 LSB (max) OE Offset Error -0.5 3.0 LSB (max) Positive Full-Scale Error -0.5 2.3 LSB (max) Negative Full-Scale Error -1.0 5 LSB (max) Gain Error +1.0 5.5 LSB (max) 72.3 70 dBc (min) FSE GE DYNAMIC CONVERTER CHARACTERISTICS SINAD Signal-to-Noise Plus Distortion Ratio fIN = 100 kHz, -0.1 dBFS SNR Signal-to-Noise Ratio fIN = 100 kHz, -0.1 dBFS 72.9 71 dBc (min) THD Total Harmonic Distortion fIN = 100 kHz, -0.1 dBFS -81.4 -74 dBc (max) SFDR Spurious-Free Dynamic Range fIN = 100 kHz, -0.1 dBFS 84.4 74 dBc (min) ENOB Effective Number of Bits fIN = 100 kHz, -0.1 dBFS 11.7 11.3 bits (min) -3 dB Full Power Bandwidth Differential Output at 70.7%FS with Input FS Input Single-Ended Input FPBW 26 MHz 22 MHz ANALOG INPUT CHARACTERISTICS VIN Differential Input Range IDCL DC Leakage Current CINA Input Capacitance CMRR Common Mode Rejection Ratio VREF Reference Voltage Range VIN = VREF or VIN = -VREF -VREF V (min) +VREF V (max) 1 A (max) In Track Mode 17 pF In Hold Mode 3 pF See the Specification Definitions for the test condition 76 dB 3 1.0 V (min) VA V (max) www.national.com ADC121S655 Operating Ratings Absolute Maximum Ratings (Notes 1, 2) ADC121S655 Symbol IREF Parameter Reference Current Conditions Typical Limits Units (Note 7) CS low, fSCLK = 8 MHz, fS = 500 kSPS, output = FF8h 28 A CS low, fSCLK = 3.2 MHz, fS = 200 kSPS, output = FF8h 12 A 0.12 A CS high, fSCLK = 0 DIGITAL INPUT CHARACTERISTICS VIH Input High Voltage 2.6 3.6 V (min) VIL Input Low Voltage 2.5 1.5 V (max) IIN Input Current CIND Input Capacitance VIN = 0V or VA 1 A (max) 2 4 pF (max) ISOURCE = 200 A VA - 0.12 VA - 0.2 V (min) ISOURCE = 1 mA VA - 0.16 ISINK = 200 A 0.01 ISINK = 1 mA 0.05 DIGITAL OUTPUT CHARACTERISTICS VOH Output High Voltage VOL Output Low Voltage IOZH, IOZL TRI-STATE Leakage Current Force 0V or VA COUT TRI-STATE Output Capacitance Force 0V or VA 0.4 V (max) V 2 Output Coding V 1 A (max) 4 pF (max) Binary 2'S Complement POWER SUPPLY CHARACTERISTICS VA Analog Supply Voltage IVA Supply Current, Normal Mode (Normal)) (Operational) IVA (PD) fSCLK = 8 MHz, fS = 500 kSPS, fIN = 100 kHz 1.8 fSCLK = 3.2 MHz, fS = 200 kSPS, fIN = 100 kHz 1.4 Supply Current, Power Down Mode (CS fSCLK = 8 MHz high) fSCLK = 0 (Note 8) PWR Power Consumption, Normal Mode (Normal)) (Operational) 4.5 V (min) 5.5 V (max) 2.2 mA (max) mA 32 0.3 A (max) 2 A (max) fSCLK = 8 MHz, fS = 500 kSPS, fIN = 100 kHz, VA = 5.0V 9 mW fSCLK = 3.2 MHz, fS = 200 kSPS, fIN = 100 kHz, VA = 5.0V 7 mW 200 W 1.5 W -85 dB PWR (PD) Power Consumption, Power Down Mode fSCLK = 8 MHz, VA = 5.0V (CS high) fSCLK = 0, VA = 5.0V PSRR Power Supply Rejection Ratio See the Specification Definitions for the test condition AC ELECTRICAL CHARACTERISTICS fSCLK Maximum Clock Frequency fSCLK Minimum Clock Frequency fS Maximum Sample Rate tACQ 16 8 0.8 3.2 MHz (max) 1000 500 kSPS (min) 2.5 SCLK cycles (min) 3.0 SCLK cycles (max) 13 SCLK cycles Track/Hold Acquisition Time tCONV Conversion Time tAD Aperture Delay www.national.com See the Specification Definitions 4 MHz (min) 6 ns (Note 8) The following specifications apply for VA = +4.5V to 5.5V, VREF = 2.5V, fSCLK = 3.2 MHz to 8 MHz, CL = 25 pF, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25C. Symbol Parameter Conditions Typical Limits Units 5 ns (min) 5 ns (min) 2.5 ns (min) tCSH CS Hold Time after an SCLK rising edge tCSSU CS Setup Time prior to an SCLK rising edge tDH DOUT Hold time after an SCLK Falling edge 7 tDA DOUT Access time after an SCLK Falling edge 18 22 ns (max) tDIS DOUT Disable Time after the rising edge of CS (Note 10) 20 ns (max) 20 ns (max) 25 ns (min) 25 ns (min) tEN DOUT Enable Time after the falling edge of CS tCH SCLK High Time tCL SCLK Low Time tr DOUT Rise Time 7 ns tf DOUT Fall Time 7 ns 8 Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified. Note 3: When the input voltage at any pin exceeds the power supplies (that is, VIN < GND or VIN > VA), the current at that pin should be limited to 10 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to five. Note 4: The absolute maximum junction temperature (TJmax) for this device is 150C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (JA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax - TA)/JA. The values for maximum power dissipation listed above will be reached only when the ADC121S655 is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided. Note 5: Human body model is a 100 pF capacitor discharged through a 1.5 k resistor. Machine model is a 220 pF capacitor discharged through 0 . Charge device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. Note 6: Reflow temperature profiles are different for lead-free packages. Note 7: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level). Note 8: Data sheet min/max specification limits are guaranteed by design, test, or statistical analysis. Note 9: While the maximum sample rate is fSCLK/16, the actual sample rate may be lower than this by having the CS rate slower than fSCLK/16. Note 10: tDIS is the time for DOUT to change 10% while being loaded by the Timing Test Circuit. Timing Diagrams 30010501 FIGURE 1. ADC121S655 Single Conversion Timing Diagram 5 www.national.com ADC121S655 ADC121S655 Timing Specifications ADC121S655 30010504 FIGURE 2. ADC121S655 Continuous Conversion Timing Diagram 30010510 FIGURE 6. Valid CS Assertion Times 30010508 FIGURE 3. Timing Test Circuit 30010512 30010506 FIGURE 7. Voltage Waveform for tDIS FIGURE 4. DOUT Rise and Fall Times 30010511 FIGURE 5. DOUT Hold and Access Times www.national.com 6 APERTURE DELAY is the time between the fourth falling edge of SCLK and the time when the input signal is acquired or held for conversion. COMMON MODE REJECTION RATIO (CMRR) is a measure of how well in-phase signals common to both input pins are rejected. To calculate CMRR, the change in output offset is measured while the common mode input voltage is changed from 2V to 3V. CMRR = 20 LOG ( Common Input / Output Offset) CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input voltage to a digital word. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The specification here refers to the SCLK. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. GAIN ERROR is the deviation from the ideal slope of the transfer function. It is the difference between Positive FullScale Error and Negative Full-Scale Error and can be calculated as: PSRR = 20 LOG (Offset / VA) SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including harmonics or d.c. SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding d.c. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the desired signal amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral component is any signal present in the output spectrum that is not present at the input and may or may not be a harmonic. TOTAL HARMONIC DISTORTION (THD) is the ratio of the rms total of the first five harmonic components at the output to the rms level of the input signal frequency as seen at the output, expressed in dB. THD is calculated as Gain Error = Positive Full-Scale Error - Negative Full-Scale Error INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative full scale (1/2 LSB below the first code transition) through positive full scale (1/2 LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC121S655 is guaranteed not to have any missing codes. NEGATIVE FULL-SCALE ERROR is the difference between the differential input voltage at which the output code transi- where Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the RMS power in the first 5 harmonic frequencies. THROUGHPUT TIME is the minimum time required between the start of two successive conversion. 7 www.national.com ADC121S655 tions from negative full scale to the next code and -VREF + 0.5 LSB OFFSET ERROR is the difference between the differential input voltage at which the output code transitions from code 000h to 001h and 1/2 LSB. POSITIVE FULL-SCALE ERROR is the difference between the differential input voltage at which the output code transitions to positive full scale and VREF minus 1.5 LSB. POWER SUPPLY REJECTION RATIO (PSRR) is a measure of how well a change in supply voltage is rejected. PSRR is calculated from the ratio of the change in offset error for a given change in supply voltage, expressed in dB. For the ADC121S655, VA is changed from 4.5V to 5.5V. Specification Definitions ADC121S655 Typical Performance Characteristics VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = 8 MHz, fIN = 100 kHz unless otherwise stated. DNL - 500 kSPS INL - 500 kSPS 30010521 30010522 DNL vs. VA INL vs. VA 30010523 30010524 OFFSET ERROR vs. VA GAIN ERROR vs. VA 30010574 www.national.com 30010577 8 VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = DNL vs. VREF INL vs. VREF 30010518 30010519 OFFSET ERROR vs. VREF GAIN ERROR vs. VREF 30010556 30010558 DNL vs. SCLK FREQUENCY INL vs. SCLK FREQUENCY 30010525 30010526 9 www.national.com ADC121S655 Typical Performance Characteristics 8 MHz, fIN = 100 kHz unless otherwise stated. ADC121S655 Typical Performance Characteristics VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = 8 MHz, fIN = 100 kHz unless otherwise stated. OFFSET ERROR vs. SCLK FREQUENCY GAIN ERROR vs. SCLK FREQUENCY 30010575 30010578 DNL vs. SCLK DUTY CYCLE INL vs. SCLK DUTY CYCLE 30010527 30010528 OFFSET ERROR vs. SCLK DUTY CYCLE GAIN ERROR vs. SCLK DUTY CYCLE 30010576 www.national.com 30010579 10 VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = DNL vs. TEMPERATURE INL vs. TEMPERATURE 30010529 30010530 OFFSET ERROR vs. TEMPERATURE GAIN ERROR vs. TEMPERATURE 30010557 30010559 SNR vs. VA THD vs. VA 30010531 30010532 11 www.national.com ADC121S655 Typical Performance Characteristics 8 MHz, fIN = 100 kHz unless otherwise stated. ADC121S655 Typical Performance Characteristics VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = 8 MHz, fIN = 100 kHz unless otherwise stated. SINAD vs. VA SFDR vs. VA 30010533 30010534 SNR vs. VREF THD vs. VREF 30010535 30010536 SINAD vs. VREF SFDR vs. VREF 30010537 www.national.com 30010538 12 VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = SNR vs. SCLK FREQUENCY THD vs. SCLK FREQUENCY 30010539 30010540 SINAD vs. SCLK FREQUENCY SFDR vs. SCLK FREQUENCY 30010541 30010542 SNR vs. SCLK DUTY CYCLE THD vs. SCLK DUTY CYCLE 30010543 30010544 13 www.national.com ADC121S655 Typical Performance Characteristics 8 MHz, fIN = 100 kHz unless otherwise stated. ADC121S655 Typical Performance Characteristics VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = 8 MHz, fIN = 100 kHz unless otherwise stated. SINAD vs. SCLK DUTY CYCLE SFDR vs. SCLK DUTY CYCLE 30010545 30010546 SNR vs. INPUT FREQUENCY THD vs. INPUT FREQUENCY 30010547 30010548 SINAD vs. INPUT FREQUENCY SFDR vs. INPUT FREQUENCY 30010549 www.national.com 30010550 14 VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = SNR vs. TEMPERATURE THD vs. TEMPERATURE 30010570 30010571 SINAD vs. TEMPERATURE SFDR vs. TEMPERATURE 30010572 30010573 SUPPLY CURRENT vs. SCLK FREQUENCY SUPPLY CURRENT vs. TEMPERATURE 30010555 30010554 15 www.national.com ADC121S655 Typical Performance Characteristics 8 MHz, fIN = 100 kHz unless otherwise stated. ADC121S655 Typical Performance Characteristics VA = 5.0V, VREF = 2.5V, TA = +25C, fSAMPLE = 500 kSPS, fSCLK = 8 MHz, fIN = 100 kHz unless otherwise stated. REF. CURRENT vs. SCLK FREQUENCY REF. CURRENT vs. TEMPERATURE 30010552 30010551 SPECTRAL RESPONSE - 500 kSPS 30010514 www.national.com 16 The ADC121S655 analog-to-digital converter uses a successive approximation register (SAR) architecture based upon capacitive redistribution containing an inherent sample/hold function. The architecture and process allow the ADC121S655 to acquire and convert an analog signal at sample rates up to 500 kSPS while consuming very little power. The ADC121S655 requires an external reference, external clock, and a single +5V power source that can be as low as +4.5V. The external reference can be any voltage between 1V and VA. The value of the reference voltage determines the range of the analog input, while the reference input current depends upon the conversion rate. The external clock can take on values as indicated in the Electrical Characteristics Table of this data sheet. The duty cycle of the clock is essentially unimportant, provided the minimum clock high and low times are met. The minimum clock frequency is set by internal capacitor leakage. Each conversion requires 16 SCLK cycles to complete. If less than 12 bits of conversion data are required, CS can be brought high at any point during the conversion. This procedure of terminating a conversion prior to completion is often referred to as short cycling. The analog input is presented to the two input pins: +IN and -IN. Upon initiation of a conversion, the differential input at these pins is sampled on the internal capacitor array. The inputs are disconnected from the internal circuitry while a conversion is in progress. The digital conversion result is clocked out by the SCLK input and is provided serially, most significant bit first, at the DOUT pin. The digital data that is provided at the DOUT pin is that of the conversion currently in progress. With CS held low after the conversion is complete, the ADC121S655 continuously converts the analog input. The digital data on DOUT can be clocked into the receiving device on the SCLK rising edges. See the Digital Interface section and timing diagram for more information. 2.0 ANALOG SIGNAL INPUTS The ADC121S655 has a differential input, and the effective input voltage that is digitized is (+IN) - (-IN). As is the case with all differential input A/D converters, operation with a fully differential input signal or voltage will provide better performance than with a single-ended input. Yet, the ADC121S655 can be presented with a single-ended input. The current required to recharge the input sampling capacitor will cause voltage spikes at +IN and -IN. Do not try to filter out these noise spikes. Rather, ensure that the transient settles out during the acquisition period (three SCLK cycles after the fall of CS). 2.1 Differential Input Operation With a fully differential input voltage or signal, a positive full scale output code (0111 1111 1111b or 7FFh) will be obtained when (+IN) - (-IN) VREF - 1.5 LSB. A negative full scale code (1000 0000 0000b or 800h) will be obtained when (+IN) - (-IN) -VREF + 0.5 LSB. This ignores gain, offset and linearity errors, which will affect the exact differential input voltage that will determine any given output code. 2.2 Single-Ended Input Operation For single-ended operation, the non-inverting input (+IN) of the ADC121S655 should be driven with a signal or voltages that have a maximum to minimum value range that is equal to or less than twice the reference voltage. The inverting input (-IN) should be biased at a stable voltage that is halfway between these maximum and minimum values. Since the design of the ADC121S655 is optimized for a differential input, the performance degrades slightly when driven with a single-ended input. Linearity characteristics such as INL and DNL typically degrade by 0.1 LSB and dynamic characteristics such as SINAD typically degrades by 2 dB. Note that single-ended operation should only be used if the performance degradation (compared with differential operation) is acceptable. 1.0 REFERENCE INPUT The externally supplied reference voltage sets the analog input range. The ADC121S655 will operate with a reference voltage in the range of 1V to VA. As the reference voltage is reduced, the range of input voltages corresponding to each digital output code is reduced. That is, a smaller analog input range corresponds to one LSB (Least Significant Bit). The size of one LSB is equal to twice the reference voltage divided by 4096. When the LSB size goes below the noise floor of the ADC121S655, the noise will span an increasing number of codes and overall performance will suffer. For example, dynamic signals will have their SNR degrade, while D.C. measurements will have their code uncertainty increase. Since the noise is Gaussian in nature, the 17 www.national.com ADC121S655 effects of this noise can be reduced by averaging the results of a number of consecutive conversions. Additionally, since offset and gain errors are specified in LSB, any offset and/or gain errors inherent in the A/D converter will increase in terms of LSB size as the reference voltage is reduced. The reference input and the analog inputs are connected to the capacitor array through a switch matrix when the input is sampled. Hence, the only current required at the reference and at the analog inputs is a series of transient spikes. Lower reference voltages will decrease the current pulses at the reference input and will slightly decrease the average input current. The reference current changes only slightly with temperature. See the curves, "Reference Current vs. SCLK Frequency" and "Reference Current vs. Temperature" in the Typical Performance Curves section for additional details. Functional Description ADC121S655 a high impedance state when CS is high and is active when CS is low; thus CS acts as an output enable. During the first three cycles of SCLK, the ADC121S655 is in acquisition mode (tACQ), acquiring the input voltage. For the next thirteen SCLK cycles (tCONV), the conversion is accomplished and the data is clocked out. SCLK falling edges one through four clock out leading zeros while falling edges five through sixteen clock out the conversion result, MSB first. If there is more than one conversion in a frame (continuous conversion mode), the ADC121S655 will re-enter acquisition mode on the falling edge of SCLK after the N*16th rising edge of SCLK and re-enter the conversion mode on the N*16+4th falling edge of SCLK as shown in Figure 2. "N" is an integer value. The ADC121S655 can enter acquisition mode under three different conditions. The first condition involves CS going low (asserted) with SCLK high. In this case, the ADC121S655 enters acquisition mode on the first falling edge of SCLK after CS is asserted. In the second condition, CS goes low with SCLK low. Under this condition, the ADC121S655 automatically enters acquisition mode and the falling edge of CS is seen as the first falling edge of SCLK. In the third condition, CS and SCLK go low simultaneously and the ADC121S655 enters acquisition mode. While there is no timing restriction with respect to the falling edges of CS and SCLK, see Figure 6 for setup and hold time requirements for the falling edge of CS with respect to the rising edge of SCLK. 2.3 Input Common Mode Voltage The allowable input common mode voltage (VCM) range depends upon the supply and reference voltages used for the ADC121S655. The ranges of VCM are depicted in Figure 8 and Figure 9. The minimum and maximum common mode voltages for differential and single-ended operation are shown in Table 1. 30010561 FIGURE 8. VCM range for Differential Input operation 3.1 CS Input The CS (chip select bar) input is CMOS compatible and is active low. The ADC121S655 is in normal mode when CS is low and power-down mode when CS is high. CS frames the conversion window. The falling edge of CS marks the beginning of a conversion and the rising of CS marks the end of a conversion window. Multiple conversions can occur within a given conversion frame with each conversion requiring sixteen SCLK cycles. 3.2 SCLK Input The SCLK (serial clock) is used as the conversion clock and to clock out the conversion results. This input is CMOS compatible. Internal settling time requirements limit the maximum clock frequency while internal capacitor leakage limits the minimum clock frequency. The ADC121S655 offers guaranteed performance with the clock rates indicated in the electrical table. 30010562 3.3 Data Output The output data format of the ADC121S655 is two's complement, as shown in Table 2. This table indicates the ideal output code for the given input voltage and does not include the effects of offset, gain error, linearity errors, or noise. Each data output bit is sent on the falling edge of SCLK. While most receiving systems will capture the digital output bits on the rising edge of SCLK, the falling edge of SCLK may be used to capture each bit if the minimum hold time (tDH) for DOUT is acceptable. See Figure 5 for DOUT hold and access times. DOUT is enabled on the falling edge of CS and disabled on the rising edge of CS. If CS is raised prior to the 16th falling edge of SCLK, the current conversion is aborted and DOUT will go into its high impedance state. A new conversion will begin when CS is taken LOW. FIGURE 9. VCM range for single-ended operation TABLE 1. Allowable VCM Range Input Signal Differential Single-Ended Minimum VCM Maximum VCM VREF / 2 VA - VREF / 2 VREF VA - VREF 3.0 SERIAL DIGITAL INTERFACE The ADC121S655 communicates via a synchronous 3-wire serial interface as shown in the Timing Diagram section. CS, chip select, initiates conversions and frames the serial data transfers. SCLK (serial clock) controls both the conversion process and the timing of serial data. DOUT is the serial data output pin, where a conversion result is sent as a serial data stream, MSB first. A serial frame is initiated on the falling edge of CS and ends on the rising edge of CS. The ADC121S655's DOUT pin is in www.national.com 18 Analog Input (+IN) - (-IN) 2's 2's 2's Complement Comp. Comp. Binary Output Hex Code Dec Code VREF - 1.5 LSB 0111 1111 1111 7FF 2047 + 0.5 LSB 0000 0000 0001 001 1 - 0.5 LSB 0000 0000 0000 000 0 0V - 1.5 LSB 1111 1111 1111 FFF -1 -VREF + 0.5 LSB 1000 0000 0000 800 -2048 5.0 TIMING CONSIDERATIONS Proper operation requires that the fall of CS not occur simultaneously with a rising edge of SCLK. If the fall of CS occurs during the rising edge of SCLK, the data might be clocked out one bit early. Whether or not the data is clocked out early depends upon how close the CS transition is to the SCLK transition, the device temperature, and characteristics of the individual device. To ensure that the data is always clocked out at a given time (the 5th falling edge of SCLK), it is essential that the fall of CS always meet the timing requirement specified in the Timing Specification table. Applications Information OPERATING CONDITIONS We recommend that the following conditions be observed for operation of the ADC121S655: -40C TA +105C +4.5V VA +5.5V 1V VREF VA 3.2 MHz fCLK 8 MHz VCM: See Section 2.3 6.0 PCB LAYOUT AND CIRCUIT CONSIDERATIONS For best performance, care should be taken with the physical layout of the printed circuit board. This is especially true with a low reference voltage or when the conversion rate is high. At high clock rates there is less time for settling, so it is important that any noise settles out before the conversion begins. 4.0 POWER CONSUMPTION The architecture, design, and fabrication process allow the ADC121S655 to operate at conversion rates up to 500 kSPS while consuming very little power. The ADC121S655 consumes the least amount of power while operating in power down mode. For applications where power consumption is critical, the ADC121S655 should be operated in power down mode as often as the application will tolerate. To further reduce power consumption, stop the SCLK while CS is high. 6.1 Power Supply Any ADC architecture is sensitive to spikes on the power supply, reference, and ground pins. These spikes may originate from switching power supplies, digital logic, high power devices, and other sources. Power to the ADC121S655 should be clean and well bypassed. A 0.1 F ceramic bypass capacitor and a 1 F to 10 F capacitor should be used to bypass the ADC121S655 supply, with the 0.1 F capacitor placed as close to the ADC121S655 package as possible. 4.1 Short Cycling Another way of saving power is to short cycle the conversion process. This is done by pulling CS high after the last required bit is received from the ADC121S655 output. This is possible because the ADC121S655 places the latest converted data bit on DOUT as it is generated. If only 8-bits of the conversion result are needed, for example, the conversion can be terminated by pulling CS high after the 8th bit has been clocked out. Halting the conversion after the last needed bit is outputted is called short cycling. Short cycling can be used to lower the power consumption in those applications that do not need a full 12-bit resolution, or where an analog signal is being monitored until some condition occurs. For example, it may not be necessary to use the full 12-bit resolution of the ADC121S655 as long as the signal being monitored is within certain limits. In some circumstances, the conversion could be terminated after the first few bits. This will lower power consumption in the converter since the ADC121S655 spends more time in power down mode and less time in the conversion mode. 6.2 Voltage Reference The reference source must have a low output impedance and needs to be bypassed with a minimum capacitor value of 0.1 F. A larger capacitor value of 1 F to 10 F placed in parallel with the 0.1 F is preferred. While the ADC121S655 draws very little current from the reference on average, there are higher instantaneous current spikes at the reference input that must settle out while SCLK is high. Since these transient spikes can be as high as 20 mA, it is important that the reference circuit be capable of providing this much current and settle out during the first three clock periods (acquisition time). The reference input of the ADC121S655, like all A/D converters, does not reject noise or voltage variations. Keep this in mind if the reference voltage is derived from the power supply. Any noise and/or ripple from the supply that is not rejected by the external reference circuitry will appear in the digital results. The use of an active reference source is recommended. The LM4040 and LM4050 shunt reference families and the LM4132 and LM4140 series reference families are excellent choices for a reference source. 4.2 Burst Mode Operation Normal operation of the ADC121S655 requires the SCLK frequency to be sixteen times the sample rate and the CS rate to be the same as the sample rate. However, in order to minimize power consumption in applications requiring sample rates below 200 kSPS, the ADC121S655 should be run with an SCLK frequency of 8 MHz and a CS rate as slow as the system requires. When this is accomplished, the ADC121S655 is operating in burst mode. The ADC121S655 enters into power down mode at the end of each conversion, minimizing power consumption. This causes the converter to spend the longest possible time in power down mode. Since 6.3 Power and Ground Planes A single ground plane and the use of two or more power planes is recommended. The power planes should all be in the same board layer and will define the analog, digital, and high power board areas. Lines associated with these areas should always be routed within their respective areas. The GND pin on the ADC121S655 should be connected to the ground plane at a quiet point. Avoid connecting the GND pin too close to the ground point of a microprocessor, microcontroller, digital signal processor, or other high power digital device. 19 www.national.com ADC121S655 power consumption scales directly with conversion rate, minimizing power consumption requires determining the lowest conversion rate that will satisfy the requirements of the system. TABLE 2. Ideal Output Code vs. Input Voltage ADC121S655 7.2 Pressure Sensor Figure 11 shows an example of interfacing a pressure sensor to the ADC121S655. A digital-to-analog converter (DAC) is used to bias the pressure sensor. The DAC081S101 provides a means for dynamically adjusting the sensitivity of the sensor. A shunt reference voltage of 2.5V is used as the reference for the ADC121S655. The ADC121S655, DAC081S101, and the LM4040 are all powered from the same voltage source. 7.0 APPLICATION CIRCUITS The following figures are examples of the ADC121S655 in typical application circuits. These circuits are basic and will generally require modification for specific circumstances. 7.1 Data Acquisition Figure 10 shows a typical connection diagram for the ADC121S655 operating at a supply voltage of +5V. A 5 to 10 ohm resistor is shown between the supply pin of the ADC121S655 and the microcontroller to low pass filter any high frequency noise present on the supply line. The reference pin, VREF, is connected to a 2.5V shunt reference, the LM4040-2.5, to define the analog input range of the ADC121S655 independent of supply variation on the +5V supply line. The VREF pin should be de-coupled to the ground plane by a 0.1 uF ceramic capacitor and a tantalum capacitor of at least 4.7 uF. It is important that the 0.1 uF capacitor be placed as close as possible to the VREF pin while the placement of the tantalum capacitor is less critical. It is also recommended that the supply pin of the ADC121S655 be decoupled to ground by a 1 uF capacitor. 30010563 FIGURE 10. Low cost, low power Data Acquisition System 30010566 FIGURE 11. Interfacing the ADC121S655 for a Pressure Sensor www.national.com 20 ADC121S655 Physical Dimensions inches (millimeters) unless otherwise noted 8-Lead MSOP Order Number ADC121S655CIMM NS Package Number MUA08A 21 www.national.com ADC121S655 12-Bit, 200 kSPS to 500 kSPS, Differential Input, Micro Power A/D Converter Notes THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. 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