© Semiconductor Components Industries, LLC, 2010
August, 2010 Rev. 2
Publication Order Number:
BAT54CXV3/D
1
BAT54CXV3T1G
Dual Series Schottky
Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
Extremely Fast Switching Speed
Low Forward Voltage 0.35 V (Typ) @ IF = 10 mAdc
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TJ = 125°C unless otherwise noted)
Rating Symbol Value Unit
Reverse Voltage VR30 V
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
PF240
1.9
mW
mW/°C
Forward Current (DC) IF200 Max mA
NonRepetitive Peak Forward
Current, tp < 10 msec
IFSM 600 mA
Repetitive Peak Forward Current
Pulse Wave = 1 sec, Duty Cycle =
66%
IFRM 300 mA
Junction Temperature TJ55 to 125 °C
Storage Temperature Range Tstg 55 to +150 °C
Thermal Resistance,
JunctiontoAmbient (Note 1)
RJA 525 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR5 board with minimum mounting pad.
30 VOLT
DUAL COMMON CATHODE
SCHOTTKY BARRIER
DIODES
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SC89
CASE 463C
STYLE 3
3
CATHODE
1
ANODE
2
ANODE
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1
1
3
2
Device Package Shipping
ORDERING INFORMATION
MARKING
DIAGRAM
BAT54CXV3T1G SC89
(PbFree)
3000 / Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
5C = Device Code
M = Date Code
G= PbFree Package
(Note: Microdot may be in either location)
5CM G
G
BAT54CXV3T1G
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (EACH DIODE)
Characteristic Symbol Min Typ Max Unit
Reverse Breakdown Voltage
(IR = 10 A)
V(BR)R 30 V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
CT7.6 10 pF
Reverse Leakage
(VR = 25 V)
IR0.5 2.0 Adc
Forward Voltage
(IF = 0.1 mAdc)
VF0.22 0.24 Vdc
Forward Voltage
(IF = 30 mAdc)
VF0.41 0.5 Vdc
Forward Voltage
(IF = 100 mAdc)
VF0.52 0.8 Vdc
Reverse Recovery Time
(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc, Figure 1)
trr 5.0 ns
Forward Voltage
(IF = 1.0 mAdc)
VF0.29 0.32 Vdc
Forward Voltage
(IF = 10 mAdc)
VF0.35 0.40 Vdc
Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
+
10 V 2 k
820
0.1 F
DUT
VR
100 H
0.1 F
50 OUTPUT
PULSE
GENERATOR
50 INPUT
SAMPLING
OSCILLOSCOPE
trtpT
10%
90%
IF
IR
trr T
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
IF
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
BAT54CXV3T1G
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3
CT
, TOTAL CAPACITANCE (pF)
100
0.0 0.1
VF
, FORWARD VOLTAGE (VOLTS)
0.2 0.3 0.4 0.5
10
1.0
0.1
85°C
10
0
VR, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001
510
15 20 25
0
VR, REVERSE VOLTAGE (VOLTS)
51015 30
Figure 2. Forward Voltage
Figure 3. Leakage Current
Figure 4. Total Capacitance
40°C
25°C
TA = 150°C
0.6
55°C
150°C
125°C
100
1000
30
2520
IR, REVERSE CURRENT (A) IF
, FORWARD CURRENT (mA)
14
12
10
8
6
4
2
0
TA = 125°C
TA = 85°C
TA = 25°C
BAT54CXV3T1G
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4
PACKAGE DIMENSIONS
1.10
0.043
0.53
0.020
0.50
0.020
0.53
0.020
SC89, 3LEAD
CASE 463C03
ISSUE C
G
M
0.08 (0.003) X
D3 PL
J
X
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 463C01 OBSOLETE, NEW STANDARD 463C02.
A
B
Y
12
3
N
2 PL
K
C
TSEATING
PLANE
DIM
A
MIN NOM MIN NOM
INCHES
1.50 1.60 1.70 0.059
MILLIMETERS
B0.75 0.85 0.95 0.030
C0.60 0.70 0.80 0.024
D0.23 0.28 0.33 0.009
G0.50 BSC
H0.53 REF
J0.10 0.15 0.20 0.004
K0.30 0.40 0.50 0.012
L1.10 REF
M−−− −−− 10 −−−
N−−− −−− 10 −−−
S1.50 1.60 1.70 0.059
0.063 0.067
0.034 0.040
0.028 0.031
0.011 0.013
0.020 BSC
0.021 REF
0.006 0.008
0.016 0.020
0.043 REF
−−− 10
−−− 10
0.063 0.067
MAX MAX
_
_
_
_
M
S
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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BAT54CXV3/D
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