3.5x2.8 mm INFRARED EMITTING DIODE Part Number: AA3528F3S Features Description z Mechanically and spectrally matched to the phototransistor. F3 Made with Gallium Arsenide Infrared Emitting diodes. z Package : 1500pcs / reel. z Moisture sensitivity level : level 3. z RoHS compliant. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 1 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680 Selection Guide Part No. AA3528F3S Dice Po (mW/sr) [2] @ 20mA Lens Type F3 (GaAs) Water Clear Viewing Angle [1] Min. Typ. 21/2 1.6 4 120 Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Radiant Intensity/ luminous flux: +/-15%. Electrical / Optical Characteristics at TA=25C Parameter P/N Symbol Typ. Max. Units Test Conditions Forward Voltage [1] F3 VF 1.2 1.6 V IF=20mA Reverse Current F3 IR 10 uA VR = 5V Capacitance F3 C 90 pF VF=0V;f=1MHz Peak Spectral Wavelength F3 P 940 nm IF=20mA Spectral Bandwidth F3 1/2 50 nm IF=20mA Note: 1. Forward Voltage: +/-0.1V. Absolute Maximum Ratings at TA=25C Parameter Symbol F3 Units Power dissipation PD 80 mW DC Forward Current IF 50 mA Peak Forward Current [1] iFS 1.2 A Reverse Voltage VR 5 V Operating Temperature TA -40 To +85 C TSTG -40 To +85 C Storage Temperature Note: 1. 1/100 Duty Cycle, 10s Pulse Width. SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680 AA3528F3S SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680 AA3528F3S Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) Reel Dimension Tape Specifications (Units : mm) SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680 PACKING & LABEL SPECIFICATIONS AA3528F3S SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 6 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680