SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 1 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680
3.5x2.8 mm INFRARED EMITTING DIODE
Part Number: AA3528F3S
Features
zMechanically and spectrally matched to the phototransistor.
zPackage : 1500pcs / reel.
zMoisture sensitivity level : level 3.
zRoHS compliant.
Description
F3 Made with Gallium Arsenide Infrared Emitting diodes.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 2 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diame-
ter of the nozzle should be as large as possible.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 3 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680
Selection Guide
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Radiant Intensity/ luminous flux: +/-15%.
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Note:
1. Forward Voltage: +/-0.1V.
Note:
1. 1/100 Duty Cycle, 10μs Pulse Width.
Part No. Dice Lens Type
Po (mW/sr) [2]
@ 20mA
Viewing
Angle [1]
Min. Typ. 2θ1/2
AA3528F3S F3 (GaAs) Water Clear 1.6 4 120°
Parameter P/N Symbol Typ. Max. Units Test Conditions
Forward Voltage [1] F3 VF 1.2 1.6 V IF=20mA
Reverse Current F3 IR 10 uA VR = 5V
Capacitance F3 C 90 pF VF=0V;f=1MHz
Peak Spectral Wavelength F3 λP 940 nm IF=20mA
Spectral Bandwidth F3 Δλ1/2 50 nm IF=20mA
Parameter Symbol F3 Units
Power dissipation PD 80 mW
DC Forward Current IF 50 mA
Peak Forward Current [1] iFS 1.2 A
Reverse Voltage VR 5 V
Operating Temperature TA -40 To +85 °C
Storage Temperature TSTG -40 To +85 °C
SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 4 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680
AA3528F3S
SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 5 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680
AA3528F3S
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Tape Specifications
(Units : mm)
Reel Dimension
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
SPEC NO: DSAL0863 REV NO: V.2 DATE: APR/09/2011 PAGE: 6 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201004680
PACKING & LABEL SPECIFICATIONS AA3528F3S