TDA9801/V1,112 - NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1998 May 06

File under Integrated Circuits, IC02

1999 Aug 26

INTEGRATED CIRCUITS

TDA9801

Single standard VIF-PLL

demodulator and FM-PLL detector

1999 Aug 26 2

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

FEATURES

•Suitable for negative vision modulation

•Applicable for IF frequencies of 38.9, 45.75 and

58.75 MHz

•Gain controlled wide-band Vision Intermediate

Frequency (VIF) amplifier (AC-coupled)

•True synchronous demodulation with active carrier

regeneration (ultra-linear demodulation, good

intermodulation figures, reduced harmonics and

excellent pulse response)

•Peak sync pulse AGC

•Video amplifier to match sound trap and sound filter

•AGC output voltage for tuner with fixed resistor for

takeover point setting

•AFC detector without extra reference circuit

•Alignment-free FM-PLL detector with high linearity

•Stabilizer circuit for ripple rejection and to achieve

constant output signals

•5 to 9 V positive supply voltage range

•Low power consumption of 300 mW at 5 V supply

voltage.

GENERAL DESCRIPTION

TheTDA9801(T)isamonolithicintegratedcircuitforvision

and sound IF signal processing in TV and VTR sets and

multimedia front-ends.

ORDERING INFORMATION

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA9801 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1

TDA9801T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1999 Aug 26 3

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

QUICK REFERENCE DATA

Notes

1. Values of video and sound parameters can be decreased at VP= 4.5 V.

2. S/N is the ratio of the black-to-white amplitude to the black level noise voltage (RMS value) at pin CVBS.

B = 5 MHz weighted in accordance with

“CCIR 567”

at a source impedance of 50 Ω.

3. Measurements taken with SAW filter G1962; VSB modulation; fvideo > 0.5 MHz; loop bandwidth BL = 60 kHz.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPsupply voltage note 1 4.5 5.0 9.9 V

IPsupply current VP= 9 V 52 61 70 mA

Vi(sens)(VIF)(rms) sensitivity of VIF input signal

(RMS value) −1 dB video at output;

fPC = 38.9 or 45.75 MHz −50 90 µV

Vi(max)(rms) maximum input voltage

(RMS value) +1 dB video at output;

fPC = 38.9 or 45.75 MHz 70 150 −mV

GIF IF gain control fPC = 38.9 or 45.75 MHz 64 70 dB

Vo(CVBS)(p-p) CVBS output voltage

(peak-to-peak value) VP= 5 V 1.7 2.0 2.3 V

Bv(−3dB) −3 dB video bandwidth CL< 20 pF; RL>1kΩ68−MHz

S/NWweighted signal-to-noise ratio VP= 5 V; note 2 56 60 −dB

αIM(0.92/1.1) intermodulation attenuation at

f = 0.92 or 1.1 MHz for BLUE 56 62 −dB

αIM(2.76/3.3) intermodulation attenuation at

f = 2.76 or 3.3 MHz for BLUE 56 62 −dB

αH(sup) harmonics suppression in video

signal note 3 35 40 −dB

Vo(AF)(max)(rms) maximum output AF signal

handling voltage (RMS value) THD < 1.5% 0.8 −−V

amb ambient temperature −20 −+70 °C

1999 Aug 26 4

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

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BLOCK DIAGRAM

ndbook, full pagewidth

VP = 5 V (9 V)

20 16

INTERNAL

REFERENCE

VOLTAGE

TRAVELLING

WAVE

DIVIDER

AFC

DETECTOR

AGC

DETECTOR

VCO

3-STAGE

IF-AMPLIFIER

FREQUENCY

DETECTOR

AND PHASE

DETECTOR

AGC

TUNER

AGC

tuner AGC

takeover

point

TDA9801

VIDEO

DEMODULATOR VIDEO

AMPLIFIER

314 11

BUFFER AMPLIFIER

AND NOISE CLIPPER

FM-PLL

DETECTOR

LIMITER

AMPLIFIER

1 V (p-p)

sound

mute

switch

SOUND

TRAP SOUND

FILTER

sound

mute

video and

intercarrier

n.c.

MHA879

TPLL

2fPC

VP VCO2 VCO1 AFC

DAF

CDAF

CVBS

2 V (p-p)

SIVIVSOMUTEAGC

CAGC

TAGCTOP

RTOP

ADJ

VIF2

VIF1

GND

Fig.1 Block diagram.

1999 Aug 26 5

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

PINNING

SYMBOL PIN DESCRIPTION

VIF1 1 VIF differential input 1

VIF2 2 VIF differential input 2

TOP 3 tuner AGC TakeOver Point (TOP)

connection

ADJ 4 phase adjust connection

MUTE 5 sound mute switch connection

TPLL 6 PLL time constant connection

CVBS 7 CVBS (positive) video output

n.c. 8 not connected

AF 9 AF output

DAF 10 AF ampliﬁer decoupling capacitor

connection

SI 11 sound intercarrier input

TAGC 12 tuner AGC output

VSO 13 video and sound intercarrier output

VI 14 buffer ampliﬁer video input

AFC 15 AFC output

VCO1 16 VCO1 reference circuit for 2fPC

VCO2 17 VCO2 reference circuit for 2fPC

GND 18 ground supply (0 V)

AGC 19 AGC detector capacitor connection

VP20 supply voltage (+5 V) Fig.2 Pin configuration.

handbook, halfpage

VIF1

VIF2

TOP

ADJ

MUTE

TPLL

CVBS

n.c.

DAF

AGC

GND

VCO2

AFC

VCO1

VSO

TAGC

10 11

TDA9801

MHA880

1999 Aug 26 6

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

FUNCTIONAL DESCRIPTION

3-stage IF ampliﬁer

The VIF amplifier consists of three AC-coupled differential

amplifier stages (see Fig.1). Each differential stage

comprises a feedback network controlled by emitter

degeneration.

AGC detector, IF AGC and tuner AGC

The automatic control voltage to maintain the video output

signal at a constant level is generated in accordance with

the transmission standard. Since the TDA9801(T) is

suitable for negative modulation only the peak sync pulse

level is detected.

TheAGCdetectorchargesanddischargescapacitorCAGC

to set the IF amplifier and tuner gain. The voltage on

capacitor CAGC is transferred to an internal IF control

signal, and is fed to the tuner AGC to generate the tuner

AGC output current on pin TAGC (open-collector output).

The tuner AGC takeover point level is set at pin TOP. This

allows the tuner to be matched to the SAW filter in order to

achieve the optimum IF input level.

Frequency detector and phase detector

The VIF amplifier output signal is fed into a frequency

detector and into a phase detector. During acquisition the

frequency detector produces a DC current proportional to

the frequency difference between the input and the VCO

signal. After frequency lock-in the phase detector

produces a DC current proportional to the phase

difference between the VCO and the input signal. The DC

current of either frequency detector or phase detector is

converted into a DC voltage via the loop filter which

controls the VCO frequency.

Video demodulator

The true synchronous video demodulator is realized by a

linear multiplier which is designed for low distortion and

widebandwidth.ThevisionIFinputsignalis multiplied with

the ‘in phase’ component of the VCO output.

The demodulator output signal is fed via an integrated

low-pass filter (fg= 12 MHz) for suppression of the carrier

harmonics to the video amplifier.

VCO, AFC detector and travelling wave divider

The VCO operates with a symmetrically connected

reference LC circuit, operating at the double vision carrier

frequency. Frequency control is performed by an internal

variable capacitor diode.

The voltage to set the VCO frequency to the actual double

vision carrier frequency is also amplified and converted for

the AFC output current.

The VCO signal is divided-by-2 with a Travelling Wave

Divider (TWD) which generates two differential output

signals with a 90 degree phase difference independent of

the frequency.

Video ampliﬁer

The composite video amplifier is a wide bandwidth

operational amplifier with internal feedback. A nominal

positive video signal of 1 V (p-p) is present at pin VSO.

Buffer ampliﬁer and noise clipper

The input impedance of the 7 dB wideband CVBS buffer

amplifier (with internal feedback) is suitable for ceramic

sound trap filters. Pin CVBS provides a positive video

signal of 2 V (p-p). Noise clipping is provided internally.

Sound demodulation

LIMITER AMPLIFIER

The FM sound intercarrier signal is fed to pin SI and

through a limiter amplifier before it is demodulated.

The result is high sensitivity and AM suppression.

The limiter amplifier consists of 7 stages which are

internally AC-coupled in order to minimizing the DC offset.

FM-PLL DETECTOR

The FM-PLL demodulator consists of an RC oscillator,

loop filter and phase detector. The oscillator frequency is

locked on the FM intercarrier signal from the limiter

amplifier. As a result of this locking, the RC oscillator is

frequency modulated. The modulating voltage (AF signal)

is used to control the oscillator frequency. By this, the

FM-PLL operates as an FM demodulator.

AF AMPLIFIER

The audio frequency amplifier with internal feedback is

designed for high gain and high common-mode rejection.

The low-level AF signal output from the FM-PLL

demodulator is amplified and buffered in a low-ohmic

audiooutput stage.An externaldecoupling capacitorCDAF

removes the DC voltage from the audio amplifier input.

By using the sound mute switch (pin MUTE) the AF

amplifier is set in the mute state.

1999 Aug 26 7

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Notes

1. Machine model class B (L = 2.5 µH).

THERMAL CHARACTERISTICS

CHARACTERISTICS

VP=5V; T

amb =25°C; see Table 1 for input frequencies and picture-to-sound carrier ratios; Vi(VIF)(rms) = 10 mV (sync

pulse level); IF input from 50 Ω via broadband transformer 1 : 1; DSB video modulation; 10% residual carrier; video

signal in accordance with

“CCIR, line 17”

“NTC-7 Composite”

; measurements taken in test circuit of Fig.12; unless

otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage IP= 70 mA; Tamb =70°C;

maximum chip temperature

125 °C for TDA9801 0 9.9 V

128 °C for TDA9801T 0 9.9 V

Vnvoltage on

pins VIF1, VIF2, AFC and AGC 0 VPV

pin TAGC −13.2 V

tsc(max) maximum short-circuit time to ground or VP−10 s

Tstg storage temperature −25 +150 °C

Tamb ambient temperature −20 +70 °C

Ves electrostatic handling voltage note 1 −300 +300 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air

TDA9801 73 K/W

TDA9801T 85 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply: pin VP

VPsupply voltage note 1 4.5 5.0 9.9 V

IPsupply current VP= 5 V 51 60 70 mA

VP= 9 V 52 61 70 mA

Vision IF input: pins VIF1 and VIF2

Vi(sens)(VIF)(rms) sensitivity of VIF input

voltage (RMS value) −1 dB video at output

fPC = 38.9 or 45.75 MHz −50 90 µV

fPC = 58.75 MHz −60 100 µV

Vi(max)(rms) maximum VIF input voltage

(RMS value) 1 dB video at output

fPC = 38.9 or 45.75 MHz 70 150 −mV

fPC = 58.75 MHz 80 160 −mV

VIDC input voltage 3.0 3.4 3.8 V

1999 Aug 26 8

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

∆Vint internal IF amplitude

difference between picture

and sound carrier

within AGC range −0.7 1 dB

GIF IF gain control see Fig.6

fPC = 38.9 or 45.75 MHz 64 70 −dB

fPC = 58.75 MHz 62 68 −dB

BIF(−3dB) −3 dB IF bandwidth upper limit cut-off

frequency 70 100 −MHz

Ri(dif) differential input resistance note 2 1.7 2.2 2.7 kΩ

Ci(dif) differential input

capacitance note 2 1.2 1.7 2.5 pF

VCO and video demodulator; note 3

fVCO(max) maximum VCO frequency for carrier regeneration;

f=2f

125 130 −MHz

∆fVCO/∆T VCO frequency variation

with temperature free running; IAFC =0;

note 4 −−±20 ×10−6K−1

VVCO(rms) VCO voltage swing

(RMS value) measured between

pins VCO1 and VCO2

fPC = 38.9 MHz −120 −mV

fPC = 45.75 MHz −100 −mV

fPC = 58.75 MHz −80 −mV

fcr(PC) picture carrier capture

frequency range negative 1.4 1.8 −MHz

positive 1.4 1.8 −MHz

tacq acquisition time BL = 60 kHz; note 5 −−30 ms

Vi(sens)(VIF)(rms) sensitivity of VIF input

(RMS value) PLL still locked;

maximum IF gain; note 6 −50 90 µV

C/N = 10 dB; note 7 −100 140 µV

Ioffset(TPLL) offset current at pin TPLL note 8 −−±2.0 µA

Video ampliﬁer output (sound carrier off): pin VSO

Vo(VSO)(p-p) VSO output voltage

(peak-to-peak value) see Fig.5

VP= 5 V 0.90 1.0 1.25 V

VP= 9 V 0.95 1.1 1.25 V

Vsync sync pulse voltage level 1.35 1.5 1.6 V

Vv(clu) upper video clipping

voltage level VP−1.1 VP−1−V

Vv(cll) lower video clipping voltage

level −0.7 0.9 V

Vo(intc)(rms) intercarrier output voltage

(RMS value) sound carrier on; note 9 −32 −mV

Rooutput resistance note 2 −−10 Ω

Ibias DC bias current for internal emitter-follower

at pin VSO 1.8 2.5 −mA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Aug 26 9

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Io(sink)(max) maximum AC and DC

output sink current 1.4 −− mA

Io(source)(max) maximum AC and DC

output source current 2.0 −− mA

Bv(−3dB) −3 dB video bandwidth CL< 50 pF; RL>1kΩ710−MHz

αH(sup) harmonics suppression in

video signal CL< 50 pF; RL>1kΩ;

note 10 35 40 −dB

PSRRVSO power supply ripple

rejection at pin VSO see Fig.7 32 35 −dB

Buffer ampliﬁer and noise clipper input: pin VI

Riinput resistance 2.6 3.3 4.0 kΩ

Ciinput capacitance 1.4 2 3.0 pF

VIDC input voltage pin VI not connected 1.5 1.8 2.1 V

Buffer ampliﬁer output: pin CVBS

Gvvoltage gain note 11 6 7 7.5 dB

Bv(−3dB) −3 dB video bandwidth CL< 20 pF; RL>1kΩ811−MHz

Vo(v)(p-p) video output voltage

(peak-to-peak value) sound carrier off;

see Fig.12 1.7 2.0 2.3 V

Vv(clu) upper video clipping

voltage level 3.9 4.0 −V

Vv(cll) lower video clipping voltage

level −1.0 1.1 V

Vsync sync pulse voltage level −1.35 −V

Rooutput resistance −−10 Ω

Ibias DC bias current internal emitter-follower at

pin CVBS 1.8 2.5 −mA

Io(sink)(max) maximum AC and DC

output sink current 1.4 −− mA

Io(source)(max) maximum AC and DC

output source current 2.4 −− mA

Measurements from VIF inputs to CVBS output (330 Ωconnected between pins VSO and VI, sound carrier off)

Vo(CVBS)(p-p) CVBS output voltage

(peak-to-peak value) VP= 5 V 1.7 2.0 2.3 V

VP= 9 V 1.8 2.2 2.6 V

∆Vo(CVBS) deviation of CVBS output

voltage at B/G standard

50 dB gain control −−0.5 dB

30 dB gain control −−0.1 dB

∆Vo(bl) black level tilt gain variation; note 12 −−1%

dif differential gain

“CCIR, line 330”

“NTC-7 Composite”

−25 %

dif differential phase

“CCIR, line 330”

“NTC-7 Composite”

−2 4 deg

Bv(−3dB) −3 dB video bandwidth CL< 20 pF; RL>1kΩ68−MHz

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Aug 26 10

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

S/NWweighted signal-to-noise

ratio see Fig.3; note 13

VP=5V 56 60 −dB

VP=9V 55 59 −dB

αIM(0.92/1.1) intermodulation attenuation

at f = 0.92 or 1.1 MHz see Fig.4; note 14

for BLUE 56 62 −dB

for YELLOW 58 64 −dB

αIM(2.76/3.3) intermodulation attenuation

at f = 2.76 or 3.3 MHz see Fig.4; note 14

for BLUE 56 62 −dB

for YELLOW 57 63 −dB

∆Vr(PC)(rms) residual picture carrier

(RMS value) fundamental wave −110 mV

harmonics −110 mV

H(sup) harmonics suppression in

video signal note 10 35 40 −dB

PSRRCVBS power supply ripple

rejection at pin CVBS see Fig.7 25 28 −dB

AGC detector output: pin AGC

tres response time at 50 dB amplitude step of

input signal

for increasing step −110 ms

for decreasing step −50 100 ms

Ich charging current note 12 0.82 1.1 1.38 mA

Idch discharging current 16 22 28 µA

Vogain control output voltage see Fig.6

maximum gain 0 −− V

minimum gain −−V

−0.7 V

Tuner AGC

Vi(VIF)(rms) VIF input voltage

(RMS value) for onset tuner takeover

point

minimum level with

RTOP =22kΩ−−5mV

maximum level with

RTOP =0Ω50 −− mV

QVi(VIF)(rms) accuracy level of tuner

takeover point (RMS value) RTOP =13kΩ;

TAGC = 0.4 mA 7−14 mV

∆Vi(VIF)/∆T variation of tuner takeover

point with temperature ITAGC = 0.4 mA −0.02 0.06 dB/K

∆GIF IF slip by automatic gain

control tuner gain current from

20 to 80% −68 dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Aug 26 11

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

TUNER AGC OUTPUT:PIN TAGC

Vmax maximum voltage from external source;

note 2 −−13.2 V

Vsat saturation voltage ITAGC = 1.7 mA −−0.2 V

Isink sink current see Fig.6

no tuner gain reduction −0.1 0.3 µA

maximum tuner gain

reduction 1.7 2.0 2.6 mA

AFC detector: pin AFC; note 15

CRstps control steepness equal to ∆IAFC/∆fVIF

see Table 2

fPC = 38.9 MHz −0.5 −0.75 −1.0 µA/kHz

fPC = 45.75 MHz −0.4 −0.65 −0.9 µA/kHz

fPC = 58.75 MHz −0.3 −0.55 −0.8 µA/kHz

∆f/∆T frequency variation with

temperature IAFC = 0; note 4 −−±20 ×106K−1

Vooutput voltage without external

components; see Fig.8

upper limit VP−0.5 VP−0.3 −V

lower limit −0.3 0.5 V

Iooutput current see Fig.8

source current 150 200 250 µA

sink current 150 200 250 µA

∆Ir(v)(p-p) residual video modulation

current

(peak-to-peak value)

−20 30 µA

Sound mute switch: pin MUTE; note 16

VIL LOW-level input voltage mute on 0 −0.8 V

VIH HIGH-level input voltage mute off 1.5 −VPV

IIL LOW-level input current VMUTE =0V −−300 −360 µA

αmute mute attenuation VMUTE =0V 70 80 −dB

∆Voffset(MUTE) DC offset voltage at

pin MUTE at switching to mute on

state (plop) −100 500 mV

FM sound limiter ampliﬁer input: pin SI; note 17

Vi(FM)(rms) FM input voltage

(RMS value)

“CCIR468-4”

S/N = 40 dB; see Fig.10 −200 300 µV

αAM = 40 dB; f = 1 kHz;

m = 0.3 −1−mV

Vi(FM)(max)(rms) maximum FM input

handling voltage

(RMS value)

200 −− mV

VIDC input voltage 2.3 2.6 2.9 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Aug 26 12

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Riinput resistance note 2 480 600 720 Ω

αAM AM suppression AM signal: f = 1 kHz;

m = 0.3; see Fig.9 46 50 −dB

fres(−3dB) frequency response −3 dB points of lower and

upper limits of IF sound

cut-off frequency

3.5 −10 MHz

FM-PLL sound detector and AF ampliﬁer; note 17

fcr(PLL) catching range of PLL upper limit 7 −− MHz

lower limit −−4 MHz

fhr(PLL) holding range of PLL upper limit 8 −− MHz

lower limit −−3.5 MHz

tacq acquisition time −−4µs

∆f

AF audio frequency deviation THD < 1.5%; note 18 −−±50 kHz

BAF(−3dB) −3 dB audio frequency

bandwidth 95 120 −kHz

THD total harmonic distortion 27 kHz FM deviation;

R3 = 0 Ω; note 18 −0.25 0.5 %

S/NWweighted signal-to-noise

ratio

“CCIR 468-4”

; see Fig.10 50 55 −dB

∆Vr(SC)(rms) residual sound carrier

(RMS value) fundamental wave and

harmonics −−75 mV

AUDIO OUTPUT:PIN AF

Vo(AF)(rms) AF output voltage

(RMS value) ∆fAF =±27 kHz;

B/G standard; see Fig.10 400 500 600 mV

∆fAF =±25 kHz;

M standard; see Fig.10 370 460 550 mV

Vo(AF)(max)(rms) maximum AF output

handling voltage

(RMS value)

THD < 1.5% 0.8 −− V

∆V

o(AF)/∆T AF output voltage variation

with temperature −3×10−37×10−3dB/K

Rooutput resistance note 2 −200 −Ω

Lload resistance AC-coupled at pin AF 2.2 −− kΩ

o(sink/source)(max) maximum sink or source

output current AC and DC −−1.5 mA

VODC output voltage 2.1 2.5 2.9 V

PSRRAF power supply ripple

rejection at pin AF R3 = 0 Ω; see Fig.7;

note 18 24 30 −dB

DECOUPLING CAPACITOR:PIN DAF

VDAF DC voltage at decoupling

capacitor voltage depends on VCO

frequency; note 19 1.5 −3.3 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Aug 26 13

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Notes

1. Values of video and sound parameters can be decreased at VP= 4.5 V.

2. Thisparameteris nottestedduring productionandis only givenas application informationfor designing thetelevision

receiver.

3. Conditions for video demodulator:

a) Loopbandwidth: BL = 60 kHz, natural frequency fn= 15 kHz, damping factor d = 2, calculated with grey level and

FPLL input level

b) Resonance circuit of VCO: Qo> 50, see Table 2 for the value of the external capacitor C; CVCO = 8.5 pF, loop

voltage is approximately 2.6 V at VP= 5 V and approximately 2.7 V at VP=9V.

4. Temperature coefficient of the external LC circuit is equal to zero.

5. Vi(VIF)(rms) = 10 mV; ∆f = 1 MHz (VCO frequency offset related to fPC); white picture video modulation.

6. Vi(VIF) signal for nominal video signal.

7. Broadband transformer at the VIF input (see Fig.12). The C/N ratio at the VIF input for ‘lock-in’ is defined as the VIF

input signal (RMS value of sync pulse level) related to a superimposed 5 MHz band-limited white noise signal

(RMS value). The video modulation is for white picture.

8. The offset current is measured between pin TPLL and half of the supply voltage (VP= 2.5 V) under the conditions:

a) no input signal at VIF inputs

b) IF amplifier gain at minimum (VAGC =V

) and pin ADJ is left open-circuit.

9. The intercarrier output signal is superimposed to the video signal at pin VSO and can be calculated by the following

formula:

where

a) 1.0 V (p-p) = video output signal as reference

b) = correction term for RMS value

c) = sound-to-picture carrier ratio at VIF inputs in dB

d) 6 dB = correction term of internal circuitry

e) ±2 dB = tolerance of video output and intercarrier output amplitude Vo(intc)(rms).

f) Example for SAW filter G1962:

sound shelf value = 20 dB,

Measurements from VIF input to AF output; notes 20 and 21; see Fig.13

S/NWweighted signal-to-noise

ratio

“CCIR 468-4”

black picture (sync only) 46 52 −dB

white picture 42 48 −dB

colour bar 40 46 −dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Vo(intc)(rms) 1.0 V (p-p) 1

-----------

×10

Vi(SC)

Vi(PC)

--------------- (dB) 6 dB 2 dB±+

------------------------------------------------------------------

×=

-----------

Vi(SC)

Vi(PC)

--------------- (dB)

Vi(SC)

Vi(PC)

--------------- 27 dB–Vo(intc)(rms) 32 mV (typical value)=⇒=

1999 Aug 26 14

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

10. Measurements taken with SAW filter G1962; VSB modulation; fvideo > 0.5 MHz; loop bandwidth BL = 60 kHz.

11. The 7 dB buffer amplifier gain accounts for 1 dB loss in the sound trap. The buffer output signal is typical 2 V (p-p).

If no sound trap is applied a resistor of 330 Ω must be connected between pins VSO and VI.

12. The leakage current of CAGC should not exceed 1 µA. Larger currents will increase the tilt.

13. S/N is the ratio of the black-to-white amplitude to the black level noise voltage (RMS value) at pin CVBS.

B = 5 MHz weighted in accordance with

“CCIR 567”

at a source impedance of 50 Ω.

14. The intermodulation figures are defined:

αIM(0.92/1.1) value at 0.92 (or 1.1) MHz referenced to black or white signal

αIM(2.76/3.3) value at 2.76 (or 3.3) MHz referenced to colour carrier.

15. To match the AFC output signal to different tuning systems a current source output is provided (see Fig.8).

16. The no mute state is also valid when pin MUTE is not connected.

17. The input signal is provided by an external generator with 50 Ω source impedance, AC-coupled with a 10 nF

capacitor, fmod = 1 kHz and 27 kHz (54% FM deviation) of audio reference. A VIF input signal is not permitted.

Pin AGC has to be connected to the supply voltage. Measurements are taken at 50 µs de-emphasis (75 µs at the

M standard).

18. To allow a higher frequency deviation, the value of resistor R3 on pin DAF (see Fig.13) has to be increased.

However, the AF output signal must not exceed 0.5 V (nominal value) for THD = 0.2%. R3 = 4.7 kΩprovides −6dB

amplification.

19. The leakage current of the 2.2 µF decoupling capacitor should not exceed 100 nA.

20. For all S/N measurements the used vision IF modulator has to meet the following specifications:

a) Incidental phase modulation for black-to-white jump less than 0.5 degrees

b) AF performance, measured with the television demodulator AMF2 (audio output, weighted S/N ratio), better than

60 dB (deviation 27 kHz) for white picture video modulation.

21. Input signal according to B/G standard of Table 1:

a) Input: Vi(VIF)(rms) = 10 mV, VSB modulation and 10% residual carrier

b) Reference: FM deviation = 27 kHz and measurements are taken at 50 µs de-emphasis.

Table 1 Input frequencies and carrier ratios

SYMBOL DESCRIPTION STANDARD UNIT

B/G M/N M

fPC picture carrier frequency 38.9 45.75 58.75 MHz

fSC sound carrier frequency 33.4 41.25 54.25 MHz

PC/SC picture-to-sound carrier ratio 13 7 7 dB

αIM 0.92 1.1⁄()

20 Voat 4.4 (3.58) MHz

Voat 0.92 (1.1) MHz

-------------------------------------------------------





3.6 dB+log=

αIM 2.76 3.3⁄()

20 Voat 4.4 (3.58) MHz

Voat 2.76 (3.3) MHz

-------------------------------------------------------





log=

1999 Aug 26 15

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Fig.3 Video output weighted signal-to-noise ratio

as a function of the VIF input voltage.

handbook, halfpage

−60 −40 −20 20

0.06 0.6 6 60060

MHB507

S/NW

(dB)

Vi(VIF)(rms)(dB)

Vi(VIF)(rms)(mV)

Fig.4 Input signal conditions for intermodulation

measurements.

handbook, halfpage

SC CC PC SC CC PC

BLUE YELLOW

27 dB

13.2 dB

3.2 dB

27 dB

13.2 dB 10 dB

MED685 - 1

SC = sound carrier level, with respect to sync pulse level.

CC = chrominance carrier level, with respect to sync pulse level.

PC = picture carrier level, with respect to sync pulse level.

Sound shelf attenuation: 20 dB.

Fig.5 Video signal levels on output pin VSO

(sound carrier off).

handbook, halfpage

1.5 V

1.8 V

2.5 V white level

2.6 V zero carrier level

black level

sync level

B/G and M/N standard

MHA889

1999 Aug 26 16

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Fig.6 IF AGC gain control and tuner AGC output current as a function of the tuner AGC detector voltage.

handbook, full pagewidth

−10 0

GIF

(dB)

0.2

0.6

1.0

1.4

1.8

2.0

1234

MHB510

ITAGC

(mA)

VAGC (V)

(1)

(3) (4)

(2)

(1) GIF (IF gain control).

(2) RTOP =22kΩ.

(3) RTOP =13kΩ.

(4) RTOP =0Ω.

Fig.7 Power supply ripple rejection condition.

handbook, full pagewidth

MHA884

TDA9801

VP = 5 V 100 mV

(fripple = 70 Hz)

1999 Aug 26 17

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Fig.8 AFC measurement conditions and typical characteristics.

a. VP= 5 V. b. VP=9V.

handbook, halfpage

MHA887

TDA9801 15 AFC 22 kΩ

22 kΩ

VP = 5 V VP = 5 V

IAFC VAFC

handbook, halfpage

MHA888

TDA9801 15 AFC 62 kΩ

62 kΩ

VP = 9 V VP = 9 V

IAFC VAFC

handbook, halfpage

MHB508

1.5

4.5

7.5

VAFC

(V)

38.3 38.6 38.9 39.2 39.5

−150

−100

−50

100

IAFC

(µA)

150

(source current)

(sink current)

f (MHz)

handbook, halfpage

MHB509

1.25

2.5

3.75

38.3 38.6 38.9 39.2 39.5

−225

−150

−75

150

225

(source current)

(sink current)

f (MHz)

VAFC

(V)

IAFC

(µA)

1999 Aug 26 18

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Fig.9 AM suppression (typical value) of the FM limiter amplifier as a function of the input voltage.

handbook, full pagewidth

−100

−80

−60

−40

−20

MHA885

10−11Vi(SI) (mV)

10 102103

αAM

(dB)

Fig.10 AF output signal and signal-to-noise ratio as a function of the input voltage.

(1) Signal-to-noise ratio (weighted).

(2) AF output signal (typical value).

handbook, full pagewidth

460

480

500

520

540

MHA886

11010

10−1103

Vi(SI) (mV)

S/NW

(dB)

(1)

(2)

Vo(AF)(rms)

(mV)

1999 Aug 26 19

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Fig.11 Front-end level diagram.

(1) Depends on TOP.

handbook, full pagewidth

100

120

VHF/UHF IF IF amplifier, demodulator

and video

tuner SAW filter TDA9801

video

1 V (p-p)

IF gain range

64 (<70) dB

10−3

TOP

6 dB IF slip

antenna input

(dBµV)

40 dB

RF gain

64 dB

IF AGC

10−2

10−1

IF signals

(RMS value)

(V)

(1)

tuner gain

control range

MHA883

0.66 × 10−3

0.66 × 10−4

0.66 × 10−5

10−4

10−5

SAW insertion

loss 20 dB

SAW insertion

loss 20 dB

1999 Aug 26 20

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

INTERNAL CIRCUITRY

PIN SYMBOL DC VOLTAGE (V) EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

1 VIF1 3.4

2 VIF2 3.4

3 TOP 0 to 1.9

4 ADJ 0 to 0.4

1.1 kΩ

400 µA

1.1 kΩ

MHB511

3.6 V

400 µA

20 kΩ30 kΩ

MHB512

1.9 V

39 kΩ

3.6 V

MHB513

5 kΩ

16 kΩ

18 kΩ

3.6 V

1999 Aug 26 21

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

5 MUTE 0 to VP

6 TPLL 1.5 to 4.0

7 CVBS sync pulse level:

1.35

8 n.c. −

PIN SYMBOL DC VOLTAGE (V) EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

25 µA

2.5 µA

mute

MHB514

200 µA

VCO

MHB515

+6.4

kΩ1.5 pF

2.5 mA

MHB516

1999 Aug 26 22

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

9 AF 2.5

10 DAF 1.5 to 3.3

11 SI 2.6

12 TAGC 0 to 13.2

13 VSO sync pulse level:

1.5

PIN SYMBOL DC VOLTAGE (V) EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

2.4 mA

MHB517

5 kΩ

57 kΩ

5 kΩ

MHB518

190 µA

5.5 kΩ5.5 kΩ

670 Ω

15 pF

3.6 V

MHB519

MHB520

15 V

20 kΩ

11.5 kΩ

10 µF

3.6 V

100 Ω

2 kΩ

MHB521

2.5 mA

1999 Aug 26 23

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

14 VI 1.8

15 AFC 0.3 to VP−0.3

16 VCO1 2.7

17 VCO2 2.7

PIN SYMBOL DC VOLTAGE (V) EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

MHB522

5 kΩ

6.6 kΩ

2 kΩ

3.6 V

++ +

1 kΩ

200 µA

1 kΩ

MHB523

420 Ω

500 µA2.8 V

MHB524

420 Ω50 Ω

1999 Aug 26 24

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

18 GND 0

19 AGC 1.5 to 4.0

20 VPVP

PIN SYMBOL DC VOLTAGE (V) EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

MHB525

13.5 V

20 µA

1 mA

MHB526

MHB525

13.5 V

1999 Aug 26 25

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

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TEST AND APPLICATION INFORMATION

ndbook, full pagewidth

TDA9801

234567 89

20 19 18 17 16 15 14 13 12

2.2 µF

390 Ω

0.1 µF

takeover

point

13 kΩ

CVBS

2 V (p-p)

sound

mute

2.2 µF

10 nF

VP = 5 V (9 V) AFC

tuner AGC

1 V (p-p)

10 µF

22 kΩ

video and intercarrier

0.1 µF

560 Ω

330 Ω

vision

IF 1:1

50 Ω

n.c.

MHA881

22 kΩ

(62 kΩ)

VIF1 VIF2 ADJTOP MUTE CVBSTPLL AF DAF

TAGCVI SIVSOAFCVCO2 VCO1GNDAGC

(1)

Fig.12 Test circuit.

(1) See Table 2.

1999 Aug 26 26

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

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dbook, full pagewidth

TDA9801

234567 8910

20 19 18 17 16 15 14 13 12

2.2 µF

390 Ω

0.1 µF

takeover

point

13 kΩ

IF input

sound

mute

vision

IF 50 ΩSAW

filter

G1962

2.2

kΩ

22 nF

2.2 µF

10 nF

VP = 5 V (9 V) AFC

tuner AGC

1 V (p-p)

10 µF

22 kΩ

video and intercarrier

0.1 µFΩ

560

(62 kΩ)

µH

sound

trap

sound

filter

n.c.

330 Ω

MHA882

22 kΩ

(62 kΩ)

TOP MUTE

TAGCAFCVCO2 VCO1GND

R3(3)

R2(2)

R1(2)

12 V (9 V)(2)

CVBS

2 V (p-p)

VIF1 VIF2 ADJ CVBSTPLL AF DAF

VI SIVSOAGC

(1)

Fig.13 Application circuit.

(1) See Table 2.

(2) Depends on tuner.

(3) See note 18 of Chapter “Characteristics”.

1999 Aug 26 27

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Table 2 Oscillator circuit for different TV standards

PARAMETER EUROPE USA JAPAN

IF frequency 38.9 MHz 45.75 MHz 58.75 MHz

VCO frequency 77.8 MHz 91.5 MHz 117.5 MHz

Oscillator circuit

Toko coil 5KM 369SNS-2010Z 5KMC V369SCS-2370Z MC139 NE545SNAS100108

Philips ceramic

capacitor 2222 632 51828 inside coil 15 pF (SMD; size: 0805)

MGG099

(3)(2)(1)

(1) CVCO = 8.5 pF.

(2) C = 8.2 ±0.25 pF.

(3) L = 251 nH.

MGG099

(3)(2)(1)

(1) CVCO = 8.5 pF.

(2) C = 10 ±0.25 pF.

(3) L = 163 nH.

MGG099

(3)(2)(1)

(1) CVCO = 8.5 pF.

(2) C = 15 ±0.25 pF.

(3) L = 78 nH.

1999 Aug 26 28

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

PACKAGE OUTLINES

UNIT A

max. 1 2 b1cD E e M

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT146-1 92-11-17

95-05-24

min. A

max. bZ

max.

1.73

1.30 0.53

0.38 0.36

0.23 26.92

26.54 6.40

6.22 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 2.04.2 0.51 3.2

0.068

0.051 0.021

0.015 0.014

0.009 1.060

1.045 0.25

0.24 0.14

0.12 0.010.10 0.30 0.32

0.31 0.39

0.33 0.0780.17 0.020 0.13

SC603

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)

(1) (1)

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

1999 Aug 26 29

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 13.0

12.6 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

detail X

0.25

075E04 MS-013AC

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.51

0.49 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

vMA

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

95-01-24

97-05-22

1999 Aug 26 30

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

SOLDERING

Introduction

Thistextgivesavery brief insighttoacomplextechnology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-holeandsurfacemountcomponentsaremixedon

one printed-circuit board. However, wave soldering is not

always suitable for surface mount ICs, or for printed-circuit

boards with high population densities. In these situations

reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

tothe printed-circuit boardby screen printing,stencilling or

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

WAVE SOLDERING

Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswithleadsonfoursides,the footprint must

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

1999 Aug 26 31

Philips Semiconductors Product speciﬁcation

Single standard VIF-PLL demodulator

and FM-PLL detector TDA9801

Suitability of IC packages for wave, reﬂow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

MOUNTING PACKAGE SOLDERING METHOD

WAVE REFLOW(1) DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) −suitable

Surface mount BGA, SQFP not suitable suitable −

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,

SMS not suitable(3) suitable −

PLCC(4), SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended(4)(5) suitable −

SSOP, TSSOP, VSO not recommended(6) suitable −

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999 67

Philips Semiconductors – a worldwide company

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

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Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PTPhilipsDevelopmentCorporation,Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands 545004/02/pp32 Date of release: 1999 Aug 26 Document order number: 9397 750 05292