1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
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NPN Silicon
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage VCES 30 Vdc
CollectorBase Voltage VCB 40 Vdc
EmitterBase Voltage VEB 10 Vdc
Collector Current — Continuous IC1.0 Adc
Total Power Dissipation @ TA = 25°C
Derate above 25°CPD625
12 mW
mW/°C
Total Power Dissipation @ TC = 25°C
Derate above 25°CPD1.5
12 Watts
mW/°C
Operating and Storage Junction
Temperature Range TJ, Tstg 55 to +150 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to
Ambient R
q
JA 200 °C/W
Thermal Resistance, Junction to Case R
q
JC 83.3 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage
(IC = 2.0 mAdc, VBE = 0) V(BR)CES 30 Vdc
CollectorBase Breakdown Voltage
(IC = 10
m
Adc, IE = 0) V(BR)CBO 40 Vdc
EmitterBase Breakdown Voltage
(IE = 100 nAdc, IC = 0) V(BR)EBO 10 Vdc
Collector Cutoff Current
(VCE = 30 Vdc) ICES 500 nAdc
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0) ICBO 100 nAdc
Emitter Cutoff Current
(VEB = 10 Vdc, IC = 0) IEBO 100 nAdc
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by BC517/D
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SEMICONDUCTOR TECHNICAL DATA
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CASE 29–04, STYLE 17
TO–92 (TO–226AA)
123
Motorola, Inc. 1996
COLLECTOR 1
BASE
2
EMITTER 3
BC517
2 Motorola Small–Signal Transistors, FETs and Diodes Device Data
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued)
Characteristic Symbol Min Typ Max Unit
ON CHARACTERISTICS(1)
DC Current Gain
(IC = 20 mAdc, VCE = 2.0 Vdc) hFE 30,000
CollectorEmitter Saturation V oltage
(IC = 100 mAdc, IB = 0.1 mAdc) VCE(sat) 1.0 Vdc
BaseEmitter On Voltage
(IC = 10 mAdc, VCE = 5.0 Vdc) VBE(on) 1.4 Vdc
SMALL–SIGNAL CHARACTERISTICS
CurrentGain — Bandwidth Product(2)
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz) fT 200 MHz
1. Pulse Test: Pulse Width
v
2.0%.
2. fT = |hfe| ftest
RSin
enIDEAL
TRANSISTOR
Figure 1. Transistor Noise Model
BC517
3
Motorola Small–Signal Transistors, FETs and Diodes Device Data
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25°C)
Figure 2. Noise Voltage
f, FREQUENCY (Hz)
50
100
200
500
20
Figure 3. Noise Current
f, FREQUENCY (Hz)
Figure 4. Total Wideband Noise Voltage
RS, SOURCE RESISTANCE (k
)
Figure 5. Wideband Noise Figure
RS, SOURCE RESISTANCE (k
)
5.0
50
70
100
200
30
10
20
1.0
10
10
20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
2.0
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
BANDWIDTH = 1.0 Hz
RS
0
IC = 1.0 mA
100
µ
A
10
µ
A
BANDWIDTH = 1.0 Hz
IC = 1.0 mA
100
µ
A
10
µ
A
en, NOISE VOLTAGE (nV)
in, NOISE CURRENT (pA)
2.0 5.0 10 20 50 100 200 500 100
0
BANDWIDTH = 10 Hz TO 15.7 kHz
IC = 10
µ
A
100
µ
A
1.0 mA
8.0
10
12
14
6.0
0
4.0
1.0 2.0 5.0 10 20 50 100 200 500 100
0
2.0
BANDWIDTH = 10 Hz TO 15.7 kHz
10
µ
A
100
µ
A
IC = 1.0 mA
VT, T OTAL WIDEBAND NOISE VOLTAGE (nV)
NF, NOISE FIGURE (dB)
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
BC517
4 Motorola Small–Signal Transistors, FETs and Diodes Device Data
SMALL–SIGNAL CHARACTERISTICS
Figure 6. Capacitance
VR, REVERSE VOLTAGE (VOL TS)
5.0
7.0
10
20
3.0
Figure 7. High Frequency Current Gain
IC, COLLECTOR CURRENT (mA)
Figure 8. DC Current Gain
IC, COLLECTOR CURRENT (mA)
Figure 9. Collector Saturation Region
IB, BASE CURRENT (
µ
A)
2.0
200 k
5.0
0.04
4.0
2.0
1.0
0.8
0.6
0.4
0.2
TJ = 25
°
C
C, CAPACITANCE (pF)
1.5
2.0
2.5
3.0
1.0
0.5
|hfe|, SMALL–SIGNAL CURRENT GAIN
hFE, DC CURRENT GAIN
VCE, COLLECTOR–EMITTER VOLTAGE (VOL TS)
0.1 0.2 0.4 1.0 2.0 4.0 10 20 40
Cibo
Cobo
0.5 1.0 2.0 0.5 10 20 50 100 200 500
VCE = 5.0 V
f = 100 MHz
TJ = 25
°
C
100 k
70 k
50 k
30 k
20 k
10 k
7.0 k
5.0 k
3.0 k
2.0 k 7.0 10 20 30 50 70 100 200 300 500
TJ = 125
°
C
25
°
C
–55
°
CVCE = 5.0 V
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
TJ = 25
°
C
IC = 10 mA 50 mA 250 mA 500 mA
Figure 10. “On” Voltages
IC, COLLECTOR CURRENT (mA)
Figure 11. Temperature Coefficients
IC, COLLECTOR CURRENT (mA)
1.6
5.0
1.0
V, VOLTAGE (VOLTS)
1.4
1.2
1.0
0.8
0.6 7.0 10 20 30 50 70 100 200 300 500
VBE(sat) @ IC/IB = 1000
RV, TEMPERATURE COEFFICIENTS (mV/ C)
°
θ
TJ = 25
°
C
VBE(on) @ VCE = 5.0 V
VCE(sat) @ IC/IB = 1000
2.0
3.0
4.0
5.0
6.05.0 7.0 10 20 30 50 70 100 200 300 500
25
°
C TO 125
°
C
–55
°
C TO 25
°
C
*R
q
VC FOR VCE(sat)
q
VB FOR VBE
25
°
C TO 125
°
C
–55
°
C TO 25
°
C
*APPLIES FOR IC/IB
hFE/3.0
BC517
5
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Figure 12. Thermal Response
t, TIME (ms)
1.0
r(t), TRANSIENT THERMAL
2.0 5.01.00.50.20.1
RESIST ANCE (NORMALIZED)
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01 20 5010 200 500100 1.0 k 2.0 k 5.0 k 10 k
Figure 13. Active Region Safe Operating Area
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.0 k
0.4
700
500
300
200
100
70
50
30
20
10 0.6 1.0 2.0 4.0 6.0 10 20 40
IC, COLLECTOR CURRENT (mA)
TA = 25
°
C
D = 0.5
0.2
0.1 0.05 SINGLE PULSE
SINGLE PULSE
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
Z
θ
JC(t) = r(t)
R
θ
JC TJ(pk) – TC = P(pk) Z
θ
JC(t)
Z
θ
JA(t) = r(t)
R
θ
JA TJ(pk) – TA = P(pk) Z
θ
JA(t)
1.0 ms
100
µ
s
TC = 25
°
C
1.0 s
Design Note: Use of Transient Thermal Resistance Data
FIGURE A
tP
PPPP
t1
1/f
DUTY CYCLE
+
t1f
+
t1
tP
PEAK PULSE POWER = PP
BC517
6 Motorola Small–Signal Transistors, FETs and Diodes Device Data
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
F
B
K
G
HSECTION X–X
C
V
D
N
N
XX
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.022 0.41 0.55
F0.016 0.019 0.41 0.48
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 ––– 12.70 –––
L0.250 ––– 6.35 –––
N0.080 0.105 2.04 2.66
P––– 0.100 ––– 2.54
R0.115 ––– 2.93 –––
V0.135 ––– 3.43 –––
1
STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
CASE 029–04
(TO–226AA)
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BC517/D
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