Performance Data:
Specification:
BGA Heat Sink
Model :
No.5, Min Lung Road, Yang Mei
Taiwan, R.O.C.
Tel : 886-3-4728155
Fax : 88 6 - 3- 4725979
E-m ail : sales@malic o.co m .tw
Heat Source Size : Uniform
MBA27002 Series
For 27x27 Chip set MBA27002 Series
3.Technology: Precision Forging
4.Finish: Oxygenless Treament
Pa r t no . Height Fi n s hape Bas e
Clip
Weight
MBA27002- 12 P/2.6- Y, BU, O 27.9g
MBA27002- 15 P/2.6- Y, BU, O 30.9g
MBA27002- 20 P/2.6- Y, BU, O 35.9g
MBA27002- 25 P/2.6- Y, BU, O 40.9g
1.Material:
Heat Sink : CU1100
Clip : Plastic (UL94-V0)
2.Heat sink dimension :
Foot print : 27x27mm
5. Clip available:
Chip set thickness
3.0-3.6mm Y-Yellow colored clip
1.4-2.0mm BU - Blue colored clip
0.5-1.1mm O- Orange colored clip
0.0
0.6
1.2
1.8
2.4
3.0
3.6
4.2
4.8
5.4
6.0
6.6
7.2
0 100 200 300 400 500 600 700 800 900 1000
Air Velocity (LFM)
Rsa (oC/W)
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
0.22
0.24
Pressure drop (in- H2O)
Thermal resistance MBA27002-12PCU/ 2.6
Thermal resistance MBA27002-15PCU/ 2.6
Thermal resistance MBA27002-20PCU/ 2.6
Thermal resistance MBA27002-25PCU/ 2.6
Pressure drop MBA27002-12PCU/2.6
Pressure drop MBA27002-15PCU/2.6
Pressure drop MBA27002-20PCU/2.6
Pressure drop MBA27002-25PCU/2.6
